SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M01 8-pin plastic SOP (FPT-8P-M01) 8-pin plastic SOP (FPT-8P-M01) Lead pitch 1.27 mm Package width × package length 5.3 × 6.35 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 2.25 mm MAX Weight 0.10 g Code (Reference) P-SOP8-5.3×6.35-1.27 Note 1) *1 : These dimensions include resin protrusion. Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder. +0.25 +.010 +0.03 *1 6.35 –0.20 .250 –.008 0.17 –0.04 +.001 8 .007 –.002 5 *2 5.30±0.30 7.80±0.40 (.209±.012) (.307±.016) INDEX Details of "A" part +0.25 2.00 –0.15 +.010 .079 –.006 1 1.27(.050) "A" 4 0.47±0.08 (.019±.003) 0.13(.005) (Mounting height) 0.25(.010) 0~8˚ M 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) +0.10 0.10 –0.05 +.004 .004 –.002 (Stand off) 0.10(.004) C 2002 FUJITSU LIMITED F08002S-c-6-7 Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0212