Package Outline Dimensions

QUAD FLAT NON-LEADED PACKAGE
FUJITSU SEMICONDUCTOR
DATA SHEET
32 PIN PLASTIC
LCC-32P-M19
32-pin plastic QFN
Lead pitch
0.50 mm
Package width 
package length
5.00 mm  5.00 mm
Sealing method
Plastic mold
Mounting height
0.80 mm MAX
Weight
0.06 g
(LCC-32P-M19)
32-pin plastic QFN
(LCC-32P-M19)
3.50±0.10
(.138±.004)
5.00±0.10
(.197±.004)
5.00±0.10
(.197±.004)
3.50±0.10
(.138±.004)
INDEX AREA
0.25
(.010
(3-R0.20)
((3-R.008))
0.50(.020)
+0.05
–0.07
+.002
–.003
)
0.40±0.05
(.016±.002)
1PIN CORNER
(C0.30(C.012))
(TYP)
0.75±0.05
(.030±.002)
0.02
(.001
C
2009-2010 FUJITSU SEMICONDUCTOR LIMITED C32071S-c-1-2
+0.03
–0.02
+.001
–.001
(0.20(.008))
)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering.
FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package
dimensions in this document.
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