2N7635-GA Normally – OFF Silicon Carbide Junction Transistor Features Package RoHS Compliant 225°C maximum operating temperature Electrically Isolated Base Plate Gate Oxide Free SiC Switch Exceptional Safe Operating Area Excellent Gain Linearity Compatible with 5 V TTL Gate Drive Temperature Independent Switching Performance Low Output Capacitance Positive Temperature Coefficient of RDS,ON Suitable for Connecting an Anti-parallel Diode VDS = 600 V RDS(ON) = 425 mΩ ID (Tc = 25°C) = 10 A hFE (Tc = 25°C) = 110 D G S TO – 257 (Isolated Base-plate Hermetic Package) Advantages Applications Compatible with Si MOSFET/IGBT Gate Drive ICs > 20 µs Short-Circuit Withstand Capability Lowest-in-class Conduction Losses High Circuit Efficiency Minimal Input Signal Distortion High Amplifier Bandwidth Down Hole Oil Drilling Geothermal Instrumentation Solenoid Actuators General Purpose High-Temperature Switching Amplifiers Solar Inverters Switched-Mode Power Supply (SMPS) Power Factor Correction (PFC) Table of Contents Section I: Absolute Maximum Ratings ...........................................................................................................1 Section II: Static Electrical Characteristics ....................................................................................................2 Section III: Dynamic Electrical Characteristics .............................................................................................2 Section IV: Figures ...........................................................................................................................................3 Section V: Driving the 2N7635-GA ..................................................................................................................6 Section VI: Package Dimensions ....................................................................................................................9 Section VII: SPICE Model Parameters ......................................................................................................... 10 Section I: Absolute Maximum Ratings Parameter Drain – Source Voltage Continuous Drain Current Continuous Gate Current Symbol VDS ID IG Turn-Off Safe Operating Area RBSOA Short Circuit Safe Operating Area SCSOA Reverse Gate – Source Voltage Reverse Drain – Source Voltage Power Dissipation Storage Temperature VSG VSD Ptot Tstg Dec 2014 Conditions VGS = 0 V TJ = 225°C, TC = 25 °C TVJ = 225°C, IG = 0.5 A, Clamped Inductive Load TVJ = 225°C, IG = 0.5 A, VDS = 400 V, Non Repetitive TC = 25 °C, tp > 100 ms Value 600 10 0.5 ID,max = 10 @ VDS ≤ VDSmax Unit V A A >20 µs 30 25 47 -55 to 225 V V W °C http://www.genesicsemi.com/high-temperature-sic/high-temperature-sic-junction-transistors/ Notes A Pg 1 of 9 2N7635-GA Section II: Static Electrical Characteristics Parameter Symbol Conditions Min. Value Typical 90 60 425 800 1180 3.45 3.22 110 80 Max. Unit Notes mΩ Fig. 5 V Fig. 7 – Fig. 5 μA Fig. 8 A: On State Drain – Source On Resistance RDS(ON) ID = 4 A, Tj = 25 °C ID = 4 A, Tj = 175 °C ID = 4 A, Tj = 220 °C Gate – Source Saturation Voltage VGS,sat ID = 5 A, ID/IG = 40, Tj = 25 °C ID = 5 A, ID/IG = 30, Tj = 175 °C hFE VDS = 5 V, ID = 5 A, Tj = 25 °C VDS = 5 V, ID = 5 A, Tj = 220 °C Drain Leakage Current IDSS VDS = 600 V, VGS = 0 V, Tj = 25 °C VDS = 600 V, VGS = 0 V, Tj = 175 °C VDS = 600 V, VGS = 0 V, Tj = 220 °C Gate Leakage Current ISG VSG = 20 V, Tj = 25 °C DC Current Gain B: Off State 0.1 1 10 20 nA C: Thermal Thermal resistance, junction - case 4.18 RthJC °C/W Section III: Dynamic Electrical Characteristics Parameter Symbol Conditions Min. Value Typical Unit Notes 310 17 2.8 pF pF µJ Fig. 9 Fig. 9 Fig. 10 pF Max. A: Capacitance and Gate Charge Input Capacitance Reverse Transfer/Output Capacitance Output Capacitance Stored Energy Effective Output Capacitance, time related Effective Output Capacitance, energy related Gate-Source Charge Gate-Drain Charge Gate Charge - Total B: Switching VGS = 0 V, VD = 600 V, f = 1 MHz VDS = 600 V, f = 1 MHz VGS = 0 V, VDS = 600 V, f = 1 MHz Coss,tr ID = constant, VGS = 0 V, VDS = 0…400 V 27 Coss,er VGS = 0 V, VDS = 0…400 V 21 pF QGS QGD QG VGS = -5…3 V VGS = 0 V, VDS = 0…400 V 3 11 14 nC nC nC 14.5 Ω 0.37 5 46 75 19 10 46 115 18 24 8 32 31 9 40 Ω ns ns ns ns ns ns ns ns µJ µJ µJ µJ µJ µJ QGS + QGD 1 Internal Gate Resistance – zero bias Internal Gate Resistance – ON Turn On Delay Time Fall Time, VDS Turn Off Delay Time Rise Time, VDS Turn On Delay Time Fall Time, VDS Turn Off Delay Time Rise Time, VDS Turn-On Energy Per Pulse Turn-Off Energy Per Pulse Total Switching Energy Turn-On Energy Per Pulse Turn-Off Energy Per Pulse Total Switching Energy 1 Ciss Crss/Coss EOSS f = 1 MHz, V = 50 mV, V = 0 V, DS RG(INT-ZERO) V = 0 V, T AC GS j = 175 ºC RG(INT-ON) VGS > 2.5 V, VDS = 0 V, Tj = 175 ºC td(on) Tj = 175 ºC, VDS = 400 V, tf ID = 4 A, Resistive Load Refer to Section V for additional td(off) driving information. tr td(on) tf Tj = 225 ºC, VDS = 400 V, ID = 4 A, Resistive Load td(off) tr Eon Tj = 175 ºC, VDS = 400 V, ID = 4 A, Inductive Load Eoff Refer to Section V. Etot Eon Tj = 225 ºC, VDS = 400 V, Eoff ID = 4 A, Inductive Load Etot Fig. 11 Fig. 12 Fig. 11 Fig. 12 Fig. 11 Fig. 12, Fig. 11 Fig. 12 – All times are relative to the Drain-Source Voltage VDS Dec 2014 http://www.genesicsemi.com/high-temperature-sic/high-temperature-sic-junction-transistors/ Pg 2 of 9 2N7635-GA Section IV: Figures A: Static Characteristic Figure 1: Typical Output Characteristics at 25 °C Figure 2: Typical Output Characteristics at 175 °C Figure 3: Typical Output Characteristics at 220 °C Figure 4: Drain-Source Voltage vs. Gate Current Figure 5: DC Current Gain and Normalized On-Resistance vs. Temperature Figure 6: DC Current Gain vs. Drain Current Dec 2014 http://www.genesicsemi.com/high-temperature-sic/high-temperature-sic-junction-transistors/ Pg 3 of 9 2N7635-GA Figure 7: Typical Gate – Source Saturation Voltage Figure 8: Typical Blocking Characteristics B: Dynamic Characteristic Figures Figure 9: Input, Output, and Reverse Transfer Capacitance Figure 10: Output Capacitance Stored Energy Figure 11: Typical Switching Times and Turn On Energy Losses vs. Temperature Figure 12: Typical Switching Times and Turn Off Energy Losses vs. Temperature Dec 2014 http://www.genesicsemi.com/high-temperature-sic/high-temperature-sic-junction-transistors/ Pg 4 of 9 2N7635-GA Figure 13: Typical Hard Switched Device Power Loss vs. Switching Frequency 2 Dec 2014 Figure 14: Turn-Off Safe Operating Area http://www.genesicsemi.com/high-temperature-sic/high-temperature-sic-junction-transistors/ Pg 5 of 9 2N7635-GA Section V: Driving the 2N7635-GA The 2N7635-GA is a current controlled SiC transistor which requires a positive gate current for turn-on and to remain in on-state. It may be driven by different drive topologies depending on the intended application. Table 1: Estimated Power Consumption and switching frequencies for various Gate Drive topologies. Gate Drive Power Switching Drive Topology Consumption Frequency Simple TTL High Low Constant Current Medium Medium High Speed – Boost Capacitor Medium High High Speed – Boost Inductor Low High Proportional Lowest Medium Pulsed Power Medium N/A A: Simple TTL Drive The 2N7635-GA may be driven by 5 V TTL logic using a simple current amplification stage. The current amplifier output current must meet or exceed the steady state gate current, I G,steady, required to operate the 2N7635-GA. An external gate resistor RG, shown in the Figure 15 topology, sets IG,steady to the required level which is dependent on the SJT drain current I D and DC current gain hFE, RG may be calculated from the equation below. The value of VEC,sat can be taken from the PNP datasheet, a partial list of high-temperature PNP and NPN transistors options is given below. High-temperature MOSFETs may also be used in the topology. Inverting Current Boost Stage 5V SiC SJT PNP TTL Gate Signal D IG,steady 0/5V TTL i/p inverted 0/5V TTL o/p G RG S NPN Figure 15: Simple TTL Gate Drive Topology Table 2: Partial List of High-Temperature BJTs for TTL Gate Driving Dec 2014 BJT Part Number Type Tj,max (°C) PHPT60603PY PHPT60603NY 2N2222 2N6730 2N2905 2N5883 2N5885 PNP NPN NPN PNP PNP PNP NPN 175 175 200 200 200 200 200 http://www.genesicsemi.com/high-temperature-sic/high-temperature-sic-junction-transistors/ Pg 6 of 9 2N7635-GA B: High Speed Driving For ultra high speed 2N7635-GA switching (tr, tf < 20 ns) while maintaining low gate drive losses the supplied gate current should include a positive current peak during turn-on, a negative voltage peak during turn-off, and continuous gate current IG to remain on. An SJT is rapidly switched from its blocking state to on-state, when the necessary gate charge for turn-on, QG, is supplied by a burst of high gate current until the gate-source capacitance, CGS, and gate-drain capacitance, CGD, are fully charged. Ideally, the burst should terminate when the drain voltage has fallen to its on-state value in order to avoid unnecessary drive losses. A negative voltage peak is recommended for the turn-off transition in order to ensure that the gate current is not being supplied under high dV/dt due to the Miller effect. While satisfactory turn off can be achieved with VGS = 0 V, a negative VGS value may be used in order to speed up the turn-off transition. B:1: High Speed, Low Loss Drive with Boost Capacitor The 2N7635-GA may be driven using a High Speed, Low Loss Drive with Boost Capacitor topology in which multiple voltage levels, a gate resistor, and a gate capacitor are used to provide current peaks at turn-on and turn-off for fast switching and a continuous gate current while in on-state. As shown in Figure 16, in this topology two gate driver ICs are utilized. An external gate resistor RG is driven by a low voltage driver to supply the continuous gate current throughout on-state.and a gate capacitor CG is driven at a higher voltage level to supply a high current peak at turn-on and turn-off. A 3 kV isolated evaluation gate drive board (GA03IDDJT30-FR4) from GeneSiC Semiconductor utilizing this topology is commercially available for high and low-side driving, its datasheet provides additional details about this drive topology. VGH CG Gate Signal IG G VGL D Gate SiC SJT S RG Figure 16: High Speed, Low Loss Drive with Boost Capacitor Topology B:2: High Speed, Low Loss Drive with Boost Inductor A High Speed, Low-Loss Driver with Boost Inductor is also capable of driving the 2N7635-GA at high-speed. It utilizes a gate drive inductor instead of a capacitor to provide the high-current gate current pulses IG,on and IG,off. During operation, inductor L is charged to a specified I G,on current value then made to discharge IL into the SJT gate pin using logic control of S 1, S2, S3, and S4, as shown in Figure 17. After turn on, while the device remains on the necessary steady state gate current IG,steady is supplied from source VCC through RG. Please refer to the article “A current-source concept for fast and efficient driving of silicon carbide transistors” by Dr. Jacek Rąbkowski for additional information on this driving topology.3 VCC S1 VCC S2 L VEE S3 SiC SJT D G RG S4 S VEE Figure 17: High Speed, Low-Loss Driver with Boost Inductor Topology 3 – Archives of Electrical Engineering. Volume 62, Issue 2, Pages 333–343, ISSN (Print) 0004-0746, DOI: 10.2478/aee-2013-0026, June 2013 Dec 2014 http://www.genesicsemi.com/high-temperature-sic/high-temperature-sic-junction-transistors/ Pg 7 of 9 2N7635-GA C: Proportional Gate Current Driving A proportional gate drive topology may be beneficial for applications in which the 2N7635-GA will operate over a wide range of drain current conditions to lower the gate drive power consumption. A proportional gate driver relies on instantaneous drain current ID feedback to vary the steady state gate current IG,steady supplied to the 2N7635-GA. C:1: Voltage Controlled Proportional Driver A voltage controlled proportional driver relies on a gate drive integrated circuit to detect the 2N7635-GA drain-source voltage VDS during onstate to sense ID. The integrated circuit will then increase or decrease I G in response to ID. This allows IG and gate drive power consumption to reduce while ID is low or for IG to increase when ID increases. A high voltage diode connected between the drain and sense protects the integrated circuit from high-voltage when blocking. A simplified version of this topology is shown in Figure 18. Additional information will be available in the future at http://www.genesicsemi.com/references/product-notes/. HV Diode Sense Gate Signal Proportional Gate Current Driver Signal D G Output IG,steady SiC SJT S Figure 18: Simplified Voltage Controlled Proportional Driver C:2: Current Controlled Proportional Driver The current controlled proportional driver relies on a low-loss transformer in the drain or source path to provide feedback of the 2N7635-GA drain current during on-state to supply IG,steady into the gate. IG,steady will increase or decrease in response to ID at a fixed forced current gain which is set be the turns ratio of the transformer, hforce = ID / IG = N2 / N1. 2N7635-GA is initially tuned-on using a gate current pulse supplied into an RC drive circuit to allow I D current to begin flowing. This topology allows IG,steady and the gate drive power consumption to reduce while ID is relatively low or for IG,steady to increase when ID increases. A simplified version of this topology is shown in Figure 19. Additional information will be available in the future at http://www.genesicsemi.com/references/product-notes/. N2 SiC SJT Gate Signal D G S N3 N1 N2 Figure 19: Simplified Current Controlled Proportional Driver Dec 2014 http://www.genesicsemi.com/high-temperature-sic/high-temperature-sic-junction-transistors/ Pg 8 of 9 2N7635-GA Section VI: Package Dimensions TO-257 PACKAGE OUTLINE Ø 0.150 (3.81) 0.140 (3.56) 0.665 (16.89) 0.645 (16.38) 0.537 (13.64) 0.527 (13.39) 1.132 (28.75) 1.032 (26.21) 0.2 (5.08) 0.19 (4.82) 0.045 (1.14) 0.035 (0.89) 0.420 (10.67) 0.410 (10.41) 1 0.43 (10.92) 0.41 (10.41) 2 3 0.12 (3.05) BSC 0.1 (2.54) BSC 2 places 0.035 (0.89) 0.025 (0.63) 3 places NOTE 1. CONTROLLED DIMENSION IS INCH. DIMENSION IN BRACKET IS MILLIMETER. 2. DIMENSIONS DO NOT INCLUDE END FLASH, MOLD FLASH, MATERIAL PROTRUSIONS Revision History Date Revision Comments 2014/12/12 2014/08/23 2014/03/20 6 5 4 Updated Electrical Characteristics Updated Electrical Characteristics Updated Gate Drive Section 2014/02/11 2013/12/19 3 2 Updated Electrical Characteristics Updated Gate Drive Section 2013/11/18 2012/08/24 1 0 Updated Electrical Characteristics Initial release Supersedes Published by GeneSiC Semiconductor, Inc. 43670 Trade Center Place Suite 155 Dulles, VA 20166 GeneSiC Semiconductor, Inc. reserves right to make changes to the product specifications and data in this document without notice. GeneSiC disclaims all and any warranty and liability arising out of use or application of any product. No license, express or implied to any intellectual property rights is granted by this document. Unless otherwise expressly indicated, GeneSiC products are not designed, tested or authorized for use in life-saving, medical, aircraft navigation, communication, air traffic control and weapons systems, nor in applications where their failure may result in death, personal injury and/or property damage. Dec 2014 http://www.genesicsemi.com/high-temperature-sic/high-temperature-sic-junction-transistors/ Pg 9 of 9 2N7635-GA Section VII: SPICE Model Parameters This is a secure document. Please copy this code from the SPICE model PDF file on our website (http://www.genesicsemi.com/images/hit_sic/sjt/2N7635-GA_SPICE.pdf) into LTSPICE (version 4) software for simulation of the 2N7635-GA. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.3 $ * $Date: 12-DEC-2014 $ * * GeneSiC Semiconductor Inc. * 43670 Trade Center Place Ste. 155 * Dulles, VA 20166 * * COPYRIGHT (C) 2014 GeneSiC Semiconductor Inc. * ALL RIGHTS RESERVED * * These models are provided "AS IS, WHERE IS, AND WITH NO WARRANTY * OF ANY KIND EITHER EXPRESSED OR IMPLIED, INCLUDING BUT NOT LIMITED * TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A * PARTICULAR PURPOSE." * Models accurate up to 2 times rated drain current. * .model 2N7635 NPN + IS 9.8338E-48 + ISE 1.0733E-26 + EG 3.23 + BF 130 + BR 0.55 + IKF 200 + NF 1 + NE 2. + RB 14.5 + IRB 0.002 + RBM 0.37 + RE 0.231 + RC 0.16 + CJC 1.37E-10 + VJC 3.150960833 + MJC 0.43821105 + CJE 2.97E-10 + VJE 2.901930244 + MJE 0.475141754 + XTI 3 + XTB -0.45 + TRC1 1.50E-02 + VCEO 600 + ICRATING 10 + MFG GeneSiC_Semiconductor * * End of 2N7635-GA SPICE Model Dec 2014 http://www.genesicsemi.com/high-temperature-sic/high-temperature-sic-junction-transistors/ Pg1 of 1