CDHV www.vishay.com Vishay Techno Thick Film Chip Dividers, High Voltage FEATURES • High voltage up to 3000 V • Typical resistance ratios of 250:1, 500:1, etc; maximum resistance ratio of 800:1 Available • Flow solderable • Tape and reel packaging available Available • Termination style: 3-sided wraparound termination or single termination flip chip available • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination material: solder-coated nickel barrier or solder coated non-magnetic terminations standard; gold, palladium silver, platinum gold, platinum silver or platinum palladium gold terminations available • Multiple styles, termination materials and configurations, allow wide design flexibility • Epoxy bondable or wire bondable non-magnetic terminations available • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details. STANDARD ELECTRICAL SPECIFICATIONS GLOBAL MODEL CASE SIZE MAXIMUM WORKING VOLTAGE (1) V 3000 POWER RATING P70 °C W RESISTANCE RANGE (2) TOLERANCE (3) ±% TEMPERATURE COEFFICIENT (4) (-55 °C to +155 °C) ± ppm/°C 100 TCR TRACKING ± ppm/°C CDHV 2512 2512 Contact factory 20M to 20G 1, 2, 5, 10, 20 50 (typical) Notes (1) Continuous working voltage shall be P x R or maximum working voltage, whichever is less. (2) Resistance values below 1 G are calibrated at 100 V , and values of 1 G and above are calibrated at 1000 V . Calibration at other DC DC voltages available upon request. (3) Contact factory for tighter tolerances. (4) Reference only: Not for all values specified. Consult factory for your value. VOLTAGE AND TEMPERATURE COEFFICIENTS OF RESISTANCE CHART TYPICAL RESISTANCE () 20M 150M 800M Note • Contact factory for other ratios. RATIO (TYPICAL) 250:1 300:1 500:1 VCR (ppm/V) 10 10 10 TCR (ppm/°C) -55 °C to +155 °C 100 150 200 GLOBAL PART NUMBER INFORMATION New Global Part Numbering: CDHVAF20M0J2500GFB (preferred part number format) C GLOBAL MODEL D H TERM STYLE CDHV = A = 3-sided CDHV2512 B = Top only V A F TERM MATERIAL 2 0 RESISTANCE VALUE (R1) F = Nickel barrier M = M G = Non-magnetic G = G A = Palladium silver 20M0 = 20 M B = Platinum gold 800M = 800 M C = Gold 1G00 = 1 G D = Platinum silver E = Platinum palladium gold M 0 TOLERANCE F=±1% G=±2% J=±5% K = ± 10 % M = ± 20 % J 2 5 0 0 G F RATIO R1/R2 RATIO TOLERANCE SOLDER TERMINATION 3 digit significant figure, followed by a multiplier 0500 = 50:1 2500 = 250:1 3000 = 300:1 5000 = 500:1 G=±2% H=±3% J=±5% E = Sn100 F = Sn95/Ag5, HSD N = No solder S= Sn62/Pb36/Ag2, HSD T = Sn90/Pb10 Historical Part Numbering: CDHV2512AF2005J2500Ge2 (will continue to be accepted) CDHV2512 A F 2005 J 2500 G B PACKAGING B = Bulk F = T/R (full reel) 1 = T/R (1000 pcs) 5 = T/R (500 pcs) T = T/R (250 pcs min.) W = Waffle tray e2 HISTORICAL TERM TERM RESISTANCE RATIO RATIO SOLDER TOLERANCE MODEL STYLE MATERIAL VALUE (R1) R1/R2 TOLERANCE TERMINATION Note • For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543). Revision: 21-Apr-15 Document Number: 68020 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CDHV www.vishay.com Vishay Techno MECHANICAL SPECIFICATIONS ENVIRONMENTAL SPECIFICATIONS Resistive element Operating temperature Ruthenium oxide Encapsulation Glass Substrate -55 °C to +155 °C Less than 0.5 % change when tested at full rated power Life 96 % alumina Termination Solder-coated nickel barrier or solder coated non-magnetic terminations standard. Gold, palladium silver, platinum gold, platinum silver, platinum palladium gold terminations available. Solder finish Pure tin or tin/lead solder alloys standard. Tin/silver or tin/lead/silver solder alloys available. Note • Reference only: Not for all values specified. Consult factory for your size and value. DIMENSIONS in inches (millimeters) B B L A A C C T T W B Style A A B W A Style B B C A E W Style A Bottom (3-sided wraparound) LENGTH (L) ± 0.006 (0.152) WIDTH (W) ± 0.006 (0.152) THICKNESS (T) ± 0.005 (0.127) A ± 0.005 B ± 0.005 C ± 0.005 E ± 0.005 STYLE A (3-sided wraparound) 0.250 0.126 0.025 0.025 0.025 0.040 0.046 STYLE B (top only) 0.240 0.126 0.025 0.025 0.025 0.040 - TERMINATION Revision: 21-Apr-15 Document Number: 68020 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CDHV www.vishay.com Vishay Techno Rated Power in % DERATING CURVE 120 100 80 60 40 20 0 - 55 - 25 0 25 50 75 100 125 155 175 70 Ambient Temperature in °C Note • (Reference only: Not for all values specified. Consult factory for your specific value.) TYPE TERMINATION MATERIAL Solderable Nickel barrier Solderable Non-magnetic Epoxy bondable/ solderable Wire bondable/ epoxy bondable TERMINATION STYLE TERMINATION STYLE/ MATERIAL CODE SOLDER TERMINATION CODE 3-sided (wraparound) AF Top only (flip chip) BF E or T (standard); F or S (optional) (1) 3-sided (wraparound) AG Top only (flip chip) BG Platinum palladium gold Top only (flip chip) BE N (standard); F or S (optional) (2) Gold Top only (flip chip) BC N Top only (flip chip) BB Palladium silver (3) Epoxy bondable Platinum gold Platinum silver E or T (standard); F or S (optional) (1) BA N BD Notes (1) Standard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T. Hot solder dipped terminations F or S are also available. (2) Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring solderable mounting. (3) While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver. If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for solderability and/or solder joint issues. Revision: 21-Apr-15 Document Number: 68020 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000