VISHAY VITRAMON www.vishay.com Ceramic Capacitors Tech Note TN-0029 Vishay Vitramon MLCC End Termination By Eli Bershadsky and Dmitry Kan Sn: 100 % tin plate matte finish (W, X, Y) or Sn / Pb tin / lead plate matte finish with a minimum of 4 % lead (L, S, Z) AgPd: silverpalladium Figure 1 Termination codes: F, M, E Sn60 / Pb40 solder coat finish with minimum of 4 % lead Sn: 100 % tin plate matte finish Sn: 100 % tin plate matte finish Nonmagnetic Ni: nickel plate barrier Ni: nickel plate barrier Ni: nickel plate barrier Polymer Cu: copper barrier Ag: silver Ag: silver Ag: silver Ag: silver Figure 2 Termination codes: L, S, W, X, Y, Z Figure 3 CDR termination code: U Figure 4 Termination code: B Figure 5 Termination code: N Figure 6 Termination code: C TERMINATION DEFINITION ACCEPTED ASSEMBLY METHODS F, M (3) Fired, thick film, silver / palladium Conductive epoxy / reflow solder (5) E (2) Fired, thick film, silver / palladium Conductive epoxy N Fired, thick film, non magnetic material Conductive epoxy C (6) Copper with an outer layer of 100 % tin plate matte finish for multi-solder mounting Wave solder (1) / reflow solder / vapor phase reflow W (3), X, Y (3) Fired, thick film silver, covered by 100 % nickel barrier plate with an outer layer of 100 % tin plate matte finish for multi-solder mounting Wave solder (1) / reflow solder / vapor phase reflow L, S (3), Z (3) Fired, thick film silver, cover by 100 % nickel barrier plate with an outer layer of tin / lead plate matte finish with a minimum of 4 % lead for multi-solder mounting Wave solder (1) / reflow solder / vapor phase reflow U (4) Fired, thick film silver, cover by 100 % nickel barrier plate with an outer layer of tin / lead plate finish matte with a minimum of 4 % lead for Sn60 / Pb40 solder coat Wave solder (1) / reflow solder / vapor phase reflow B Fired, thick film silver, cured thick film polymer silver, covered by 100 % nickel barrier plate with an outer layer of 100 % tin plate matte finish for multi-solder mounting Wave solder (1) / reflow solder / vapor phase reflow Notes (1) Case sizes 1111, 1210 to 1812 with a thickness > 0.049" (1.24 mm) and case sizes 1825 and larger should NOT be wave soldered. (2) Termination code “E” is for conductive epoxy assembly, contact [email protected] for availability. (3) CDR, DSCC, and MIL-PRF-123 part numbers only. (4) CDR “U” termination code: Base metallization-barrier metal-solder coated (tin/lead alloy, with a minimum of 4 % lead). Solder has a melting point of + 200 °C or less. Solder coat thickness is a minimum of 60 microinches. • Solder iron techniques are not recommended. For more information on soldering visit www.vishay.com/doc?45034. • Contact [email protected] with respect to specific part number requirements. (5) Terminations code “F” and “M” may exhibit high wetting angles and lower fillet heights as compared to barrier plate terminations such as X-term. Contact [email protected] with respect to specific requirements. (6) For “C” termination solder coverage should be at least 90 % of the terminal critical areas in soldering. Revision: 19-May-16 Document Number: 45063 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TECHNICAL NOTE TERMINATION CODE FROM PART NUMBERING Tech Note TN-0029 www.vishay.com Vishay Vitramon Vishay Vitramon MLCC End Termination MLCC END TERMINATION PHYSICAL CHARACTERISTICS THICK FILM END TERMINATION BARRIER TERMINATION TERMINATION FINISH P/N TERM CODE MATERIAL THICKNESS (INCHES) Ni PLATE THICKNESS (MICROINCHES) Sn PLATE THICKNESS (MICROINCHES) Sn/Pb PLATE THICKNESS (MICROINCHES) Sn/Pb SOLDER COAT THICKNESS (MICROINCHES) CONTENT OF LEAD F, M Ag / Pd 0.001 min. n/a n/a n/a n/a n/a E Ag / Pd 0.001 min. n/a n/a n/a n/a n/a N Ag / Pd 0.0012 min. n/a n/a n/a n/a n/a C Ag 0.001 min. n/a 100 min. n/a n/a n/a W, X, Y Ag 0.001 min. 50 min. 100 min. n/a n/a n/a L, S, Z Ag 0.001 min. 50 min. n/a 100 min. n/a 4 % min. U Ag 0.001 min. 50 min. n/a n/a 60 min. 4 % min. B Polymer 0.003 min. 50 min. 100 min. n/a n/a n/a Notes • Element definition: Ag = silver, Pd = palladium, Ni = nickel, Sn = tin, Pb = lead • n/a = not applicable Document Number: 45063 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TECHNICAL NOTE Revision: 19-May-16