PCAN www.vishay.com Vishay Dale Thin Film High Power Aluminum Nitride, Wraparound Surface Mount, Precision Thin Film Chip Resistor (up to 6 W) FEATURES • • • • • • High thermal conductivity aluminum nitride substrate Power rating up to 6.0 W Resistance range 30 to 175 Resistor tolerance to ± 0.1 % TCR to ± 25 ppm/°C Flame resistant UL 94 V-0 APPLICATIONS • Power supplies PCAN series chip resistors are designed on aluminum nitride ceramic substrates with enlarged backside terminations to reduce the thermal resistance between the topside resistor layer and the solder joint on the end users circuit assembly. Actual power handling capability is limited by the end user mounting process. As with any high power chip resistor the ability to remove the heat is critical to the overall performance of the device. • Power switching • Braking system TYPICAL PERFORMANCE ABSOLUTE TCR 25 TOL. 0.1 STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Nichrome - 30 to 175 - Material Resistance Range TCR: Absolute 25 ppm/°C (standard) and 100 ppm/°C - Tolerance: Absolute 0.1 %, 0.25 %, 0.5 %, 1.0 % and 5.0 % -55 °C to +150 °C 2.0 W to 6.0 W (1) Maximum at +70 °C Stability: Absolute R 1.0 % 1000 h at +70 °C Voltage Coefficient < 0.1 ppm/V - Working Voltage 75 V to 200 V - Operating Temperature Range -55 °C to +155 °C - Storage Temperature Range -55 °C to +155 °C - Power Rating: Resistor Noise < -30 dB - Shelf Life Stability: Absolute ± 0.01 % 1 year at +25 °C Note (1) Dependant on component mounting by user. COMPONENT RATINGS POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE () 1206 CASE SIZE 2000 (2) 200 30 to 175 2512 6000 (2) 200 30 to 175 Notes • 0603 and 0805 case size under engineering qualification. (2) Dependant on component mounting by user. Revision: 07-Aug-14 Document Number: 60125 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PCAN www.vishay.com Vishay Dale Thin Film ENVIRONMENTAL TESTS ENVIRONMENTAL TEST LIMITS MIL-PRF-55342 CHARACTERISTIC “H” TYPICAL VISHAY PERFORMANCE ± 50 ppm/°C ± 25 ppm/°C Resistance temperature characteristic Maximum ambient temperature at rated wattage +70 °C +70 °C Maximum ambient temperature at power derating +150 °C +150 °C Thermal shock ± 0.25 % ± 0.10 % Low temperature operation ± 0.25 % ± 0.10 % Short time overload ± 0.1 % ± 0.10 % High temperature exposure ± 0.2 % ± 0.10 % Resistance to soldering heat ± 0.25 % ± 0.10 % Moisture resistance ± 0.4 % ± 0.50 % Life at +70 °C for 1000 h ± 0.5 % ± 1.00 % DIMENSIONS in inches D T D W T E L L LENGTH L WIDTH W THICKNESS T MIN./MAX. TOP PAD D 1206 0.126 ± 0.008 0.063 ± 0.005 0.015 ± 0.003 0.020 + 0.005/- 0.010 0.040 ± 0.005 2512 0.259 + 0.009/- 0.015 0.124 ± 0.005 0.015 ± 0.003 0.020 ± 0.005 0.050 ± 0.005 CASE SIZE BOTTOM PAD E LAND PATTERN DIMENSIONS in inches 1206 Land Pattern 0.1730 2512 Land Pattern 0.2910 0.0710 0.1260 0.0220 0.0755 0.1090 0.0910 STANDARD MATERIAL SPECIFICATIONS Resistive element Nichrome Substrate material Aluminum nitride Terminations (Tin/lead) Terminations (Lead (Pb)-free) Revision: 07-Aug-14 Tin/lead solder over nickel barrier Tin/silver/copper (Sn96.5/Ag3.0/Cu0.5) solder over nickel barrier Document Number: 60125 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PCAN www.vishay.com Vishay Dale Thin Film PCAN1206 CHIP TEMP VS. APPLIED POWER PCAN2512 CHIP TEMP VS. APPLIED POWER 12.0 12.0 10.0 30 Ω 8.0 Applied Power (W) Applied Power (W) 10.0 175 Ω 6.0 4.0 2.0 0.0 30 Ω 150 Ω 8.0 6.0 4.0 2.0 70 150 Chip Surface Temperature Temperature (°C) 0.0 200 Note • Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate test card surface temperature of 85 °C. • Thermal imaging was conducted under ambient conditions resulting in a steady state test card surface temperature of 85 °C over the full range of power levels. • Thermal imaging and load life testing was conducted mounting one device to a 1.6" x 3.7" test card with 3.5 mil copper plating on both surfaces. Thermal vias on 50 mil centers were utilized for heat transfer between surfaces of the test card. 70 150 Chip Surface Temperature Temperature (°C) 200 Note • Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate test card surface temperature of 85 °C. DERATING CURVE Percent of Rated Power 100 80 60 40 20 0 0 70 125 155 Ambient Temperature °C Revision: 07-Aug-14 Document Number: 60125 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PCAN www.vishay.com Vishay Dale Thin Film GLOBAL PART NUMBER INFORMATION New Global Part Numbering: PCAN1206H1000BBT1 P C A N 1 GLOBAL MODEL CASE SIZE TCR CHARACTERISTIC PCAN 1206 2512 E = ± 25 ppm/°C H = ± 50 ppm/°C K = ± 100 ppm/°C 2 0 6 1 0 0 0 RESISTANCE TOLERANCE TERMINATION The first 3 digits are significant figures and the last digit specifies the number of zeros to follow. “R” designates the decimal point. B = ± 0.1 % C = ± 0.25 % D = ± 0.5 % F = ± 1.0 % G = ± 2.0 % B = Wraparound Sn/Pb solder w/ nickel barrier S = Wraparound lead (Pb)-free solder (e1) RoHS compliant G = Wraparound Au, over Ni (gold) termination epoxy bondable RoHS compliant (e4) Example: 10R0 = 10 1000 = 100 Revision: 07-Aug-14 H B B T 1 PACKAGING BS = BULK 100 min., 1 mult WS = WAFFLE 100 min., 1 mult W0 = 100 pc min. waffle, 1 mult WI = 100 min., 1 mult (package unit single lot date code) TAPE AND REEL T0 = 100 min., 100 mult T1 = 1000 min., 1000 mult T3 = 300 min., 300 mult T5 = 500 min., 500 mult TF = Full reel TS = 100 min., 1 mult TI = 100 min., 1 mult (item single lot date code) TP = 100 min., 1 mult (package unit single lot date code) Document Number: 60125 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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