TSSP57038 www.vishay.com Vishay Semiconductors IR Receiver Modules for Remote Control Systems FEATURES • Up to 2 m for presence sensing • Uses modulated bursts at 38 kHz • 940 nm peak wavelength • PIN diode and sensor IC in one package • Low supply current 22531-1 • Shielding against EMI • Visible light is suppressed by IR filter • Insensitive to supply voltage ripple and noise • Supply voltage: 2.5 V to 5.5 V • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 ORDERING CODE DESCRIPTION Taping: TSSP57038TT2 - top view taped The TSSP57038 is a compact infrared detector module for presence sensing applications. It receives 38 kHz modulated signals and has a peak sensitivity of 940 nm. APPLICATIONS This component has not been qualified according to automotive specifications. TSSP57038TT1 - top view taped • Reflective sensors for hand dryers, towel or soap dispensers, water faucets, toilet flush • Vending machine fall detection • Security and pet gates • Person or object vicinity activation PARTS TABLE Carrier frequency 38 kHz TSSP57038 Package Belobog Pinning 1 = OUT, 2, 3, 6, 7, 8 = GND, 4, 5 = VS Dimensions (mm) 3.95 W x 3.95 H x 0.8 D Mounting SMD Application Presence sensors BLOCK DIAGRAM PRESENCE SENSING +3 V 4, 5 VS IR emitter 33 kΩ 1 Input AMP Band pass Demodulator Envelope signal OUT 38 kHz 2, 3, 6, 7, 8 PIN +3 V GND Out to μC 20445-7 Rev. 1.5, 02-Sep-15 1 Document Number: 82482 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP57038 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS PARAMETER TEST CONDITION SYMBOL VALUE UNIT VS -0.3 to +6 V Supply voltage Supply current IS 5 mA Output voltage VO -0.3 to (VS + 0.3) V Output current IO 5 mA Tj 100 °C Storage temperature range Junction temperature Tstg -25 to +85 °C Operating temperature range Tamb -25 to +85 °C Power consumption Soldering temperature Tamb ≤ 85 °C Ptot 10 mW t ≤ 10 s, 1 mm from case Tsd 260 °C Note • Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability. ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Ev = 0, VS = 5 V ISD 0.55 0.7 0.9 mA Ev = 40 klx, sunlight ISH - 0.8 - mA VS 2.5 - 5.5 V Ev = 0, test signal see fig. 1, IR diode TSAL6200, IF = 400 mA d - 25 - m IOSL = 0.5 mA, Ee = 2 mW/m2, test signal see fig. 1 VOSL - - 100 mV Minimum irradiance Pulse width tolerance: tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1 Ee min. - 0.7 1.2 mW/m2 Maximum irradiance tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1 Ee max. 50 - - W/m2 Directivity Angle of half transmission distance ϕ1/2 - ± 75 - deg Supply current (pin 3) Supply voltage Transmission distance Output voltage low (pin 1) Rev. 1.5, 02-Sep-15 2 Document Number: 82482 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP57038 www.vishay.com Vishay Semiconductors TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Optical Test Signal (IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, t = 10 ms) t tpi * T 10/f0 is recommended for optimal function * tpi Output Signal VO 1) VOH 2) 0.8 ton, toff - Output Pulse Width (ms) Ee 16110 7/f0 < td < 15/f0 tpi - 5/f0 < tpo < tpi + 6/f0 ton 0.7 0.6 0.5 toff 0.4 0.3 0.2 λ = 950 nm, optical test signal, Fig. 3 0.1 0 0.1 VOL td 1) tpo 2) t Fig. 1 - Output Active Low 1000 10 000 1.2 0.8 Input burst length 0.7 0.6 0.5 0.4 0.3 λ = 950 nm, optical test signal, Fig. 1 0.2 1.0 E e min./Ee - Rel. Responsivity tpo - Output Pulse Width (ms) 100 Output pulse width 0.9 0.8 0.6 0.4 f = f0 ± 5 % Δ f(3 dB) = f0/10 0.2 0.0 0.1 1 10 100 1000 10 000 100 000 0.7 Ee - Irradiance (mW/m2) Ee min. - Threshold Irradiance (mW/m2) t 600 µs t = 60 ms 94 8134 Output Signal, (see fig. 4) VOH VOL t on t off t 1.3 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -30 -10 10 30 50 70 90 Tamb - Ambient Temperature (°C) Fig. 3 - Output Function Rev. 1.5, 02-Sep-15 1.1 Fig. 5 - Frequency Dependence of Responsivity Optical Test Signal 600 µs 0.9 f/f0 - Relative Frequency 16925 Fig. 2 - Pulse Length and Sensitivity in Dark Ambient VO 10 Fig. 4 - Output Pulse Diagram 1.0 Ee 1 Ee - Irradiance (mW/m2) Fig. 6 - Sensitivity vs. Ambient Temperature 3 Document Number: 82482 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP57038 www.vishay.com Vishay Semiconductors 1.2 The typical application of this device is a reflective or beam break sensor with active low “detect” or “no detect” information contained in its output. Applications requiring up to 2 m beam break or 1 m reflective range benefit from the lower gain of these sensors because they are less sensitive to stray signal from the emitter, simplifying the mechanical design. 1.0 Example for a sensor hardware: Ee min. - Sensitivity (mW/m2) 2.0 1.8 1.6 1.4 0.8 IR Receiver TSSP6P38 0.6 0.4 0.2 2 3 4 5 Emitter TSAL6200 VS - Supply Voltage (V) Separation to avoid crosstalk by stray light inside the housing Fig. 7 - Sensitivity vs. Supply Voltage There should be no common window in front of the emitter and detector in order to avoid crosstalk via guided light through the window. S(λ)rel - Relative Spectral Sensitivity 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 750 800 850 900 950 1000 1050 1100 1150 λ - Wavelength (nm) Fig. 8 - Relative Spectral Sensitivity vs. Wavelength -20° -10° 0° 10° 20° -30° 30° -40° 40° -50° 50° 60° -60° -70° 70° -80° 80° 0.1 21947 0.3 0.5 0.7 0.9 Fig. 9 - Horizontal Directivity Rev. 1.5, 02-Sep-15 4 Document Number: 82482 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP57038 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 4 x 0.75 = 3 All dimensions in mm Not indicated tolerances ± 0.1 (0.3) (0.3) 0.75± 0.05 0.55 (0.7) (0.95) 0.475 (1.8) technical drawings according to DIN specifications connected internally. It is not necessary to connect externally. (0.4) (0.3) (2) Pins Pinning from Topview GND GND 0.55 (Vs) Vs 3 4 5 (2) (2) (2.75) (0.8)(4x) marking area Drawing refers to following types: TSOP37... / TSOP57... Drawing-No.: 6.550-5315.01-4 Issue: 2; 12.02.14 2 (2) Proposed pad layout from component side (dim. for reference only) (3.95) (3) (3.95) (1)(2.75) Pin 1 Identification (GND) 1 (GND) Pin 1 Identification 3.95 (3.4)(1) 3.95 effective area (1)(1.9) (1) optically Out 0.15 3 6 0.8 1.5 7(2) (GND) 8 (8 x) 0.35± 0.05 (0.35) (4 x) Rev. 1.5, 02-Sep-15 5 Document Number: 82482 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP57038 www.vishay.com Vishay Semiconductors ASSEMBLY INSTRUCTIONS Reflow Soldering Manual Soldering • Reflow soldering must be done within 168 h while stored under a max. temperature of 30 °C, 60 % RH after opening the dry pack envelope • Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 °C • Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured • Handle products only after the temperature has cooled off • Finish soldering within 3 s • Handling after reflow should be done only after the work surface has been cooled off VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE 300 max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 T (°C) 200 max. 20 s 150 max. 100 s max. 120 s 100 max. Ramp Up 3 °C/s max. Ramp Down 6 °C/s 50 0 0 19800 50 100 150 t (s) 200 250 300 max. 2 cycles allowed ORDERING INFORMATION ORDERING CODE TSSP57038..TT1 TSSP57038..TT2 PACKAGING Tape and reel VOLUME (1) MOQ: 1800 pcs MOQ: 7000 pcs REMARKS 3.95 mm x 3.95 mm x 0.75 mm Note (1) MOQ: minimum order quantity Rev. 1.5, 02-Sep-15 6 Document Number: 82482 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP57038 www.vishay.com Vishay Semiconductors TAPING VERSION TSSP57038 DIMENSIONS in millimeters Tape and reel dimensions: Unreel direction TT1 Ø 180 ± 2 = 1800 pcs. TT2 Ø 330 ± 2 = 7000 pcs. Tape position coming out from reel 2± Ø 60 min. Reel size "Y" ØY 0.5 Ø 21 ± 0.8 Ø 13 ± 0.2 Label posted here (12.4) 18.4 max. Empty leader 400 mm min. Parts mounted 100 mm min. with cover tape Leader and trailer tape: Empty trailer 200 mm min. Direction of pulling out Technical drawings according to DIN specifications (Ø 1.5) (2) (5.5) (0.3) (4) Drawing-No.: 9.700-5347.01-4 Issue: 1; 14.11.11 Rev. 1.5, 02-Sep-15 12 ± 0.3 (8) (1.2) (1.75) X 2:1 Not indicated tolerances ± 0.1 7 Document Number: 82482 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP57038 www.vishay.com Vishay Semiconductors LABEL Standard bar code labels for finished goods The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data. VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods) PLAIN WRITING ABBREVIATION LENGTH Item-description - 18 Item-number INO 8 Selection-code SEL 3 BATCH 10 Data-code COD 3 (YWW) Plant-code PTC 2 Quantity QTY 8 Accepted by ACC - Packed by PCK - LOT-/serial-number Mixed code indicator Origin Long bar code top MIXED CODE - xxxxxxx+ Company logo Type Length Item-number N 8 Plant-code N 2 Sequence-number X 3 Quantity N 8 Total length - 21 Short bar code bottom Type Length Selection-code X 3 Data-code N 3 Batch-number X 10 Filter - 1 Total length - 17 DRY PACKING RECOMMENDED METHOD OF STORAGE The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: Aluminum bag • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. Label After more than 168 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: Reel FINAL PACKING 192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air / nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 125 °C + 5 °C not suitable for reel or tubes. The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes. An EIA JEDEC® standard J-STD-020 level 3 label is included on all dry bags. 15973 Rev. 1.5, 02-Sep-15 8 Document Number: 82482 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSSP57038 www.vishay.com Vishay Semiconductors Caution This bag contains MOISTURE-SENSITIVE DEVICES VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS LEVEL 3 The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data. If blank, see adjacent bar code label 1. Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH) 260 2. Peak package body temperature:_______________________°C If blank, see adjacent bar code label BAR CODE PRODUCT LABEL (example) 3. After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be 168 a) Mounted within:___________________hours of factory conditions If blank, see adjacent bar code label ≤30°C/60% RH, or b) Stored per J-STD-033 4. Devices require bake, before mounting, if: a) Humidity Indicator Card reads > 10% for level 2a - 5a devices or >60% for level 2 devices when read at 23±5°C b) 3a or 3b are not met 5. If baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure 22178 Bag Seal Date:_________________________________________ If blank, see adjacent bar code label Note: Level and body temperature defined by IPC/JEDEC J-STD-020 22650 EIA JEDEC standard J-STD-020 level 3 label is included on all dry bags ESD PRECAUTION Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging. Rev. 1.5, 02-Sep-15 9 Document Number: 82482 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000