260-Pin BGA Package Drawing (Package K) Ø Ø Ø 0.08 S C 0.08 S C A S B S 0.50~Ø0.70(260x) 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T U V W Y 19.00 17.40 ± 0.05 12.60 ± 0.05 B A 1.00 14.00 ± 0.05 12.00 SEATING PLANE 0.40~0.60 Ball Pitch: 1.00 Substrate Thickness: Ball Diameter: 0.60 Mold Thickness: 0.51 — 0.15 C 2.10 + 0.2/–0.3 0.05 C 4–R0.5 (MAX) 0.50 + 0.03 0.10 C HEAT SPREADER // 1.09 REF 0.05(4X) 0.51 REF 22.00 ± 0.05 1.00 PIN #1 CORNER