STEVAL-TDR001V1 2 stage RF power amp: PD84001 + PD54003L-E + LPF N-channel enhancement-mode lateral MOSFETs Feature ■ Excellent thermal stability ■ Frequency: 380 - 512 MHz ■ Supply voltage: 7.2 V ■ Output power: 4 W ■ Current < 1.6 A ■ Input power < 10 dBm ■ Harmonics level < -70 dBc ■ Load mismatch 20:1 ■ VAPC 5 V max ■ Beo free amplifier ■ RoHS compliant Mechanical specification: L = 40 mm, W = 20 mm Description Table 1. The STEVAL-TDR001V1 is a two stage RF power amplifier which includes a low pass output filter for harmonics rejection specifically designed for portable two-way UHF radio communication. March 2009 Device summary Order code STEVAL-TDR001V1 Rev 1 1/17 www.st.com 17 Contents STEVAL-TDR001V1 Contents 1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 Circuit schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6.1 PowerFLAT™ mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6.1.1 6.2 Thermal pad and via design SOT-89 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6.2.1 7 2/17 Mounting indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 STEVAL-TDR001V1 Electrical data 1 Electrical data 1.1 Maximum ratings Table 2. Absolute maximum ratings Symbol VDD ID TCASE TA 2 Parameter Value Unit Supply voltage 15 V Drain current 2.5 A -20 to +85 °C +55 °C Operating case temperature Max. ambient temperature Electrical characteristics TA = +25 °C, VDD = 7.2 V, VAPC adjusted Table 3. Symbol Freq. PIN Electrical specification Test conditions Frequency range @ POUT = 4 W Min. Typ. 380 Unit 512 MHz 10 ITOTAL @ POUT = 4 W and PIN = 10 dBm PAE @ POUT = 4 W and PIN = 10 dBm 36% - 40% VAPC @ POUT = 4 W and PIN = 10 dBm 4.5 Harmonics @ POUT = 4 W Max. dBm 1.6 A 5 V -70 dBc 3/17 Typical performance STEVAL-TDR001V1 3 Typical performance Figure 1. Current consumption vs frequency Figure 2. p 1.8 p Output power vs frequency q y 40 VDD=5V VDD=7V VDD=9V 39 1.7 38 1.6 37 36 Pout (dBm) Current (A) 1.5 1.4 35 34 1.3 33 1.2 32 Pin = 10dBm Vdd = 7.2V Pout = 4W 1.1 1 360 380 400 420 440 460 480 500 31 Vapc = 4.6V Pin = 10dBm 30 360 520 380 400 420 Frequency (MHz) Figure 3. 440 460 480 500 520 540 Freq (MHz) Gain vs frequency Figure 4. 30 Input return loss vs frequency 0 28 -2 26 -4 24 -6 20 IRL (dB) Gain (dB) 22 18 16 Vdd = 7.2V Pin = 10dBm Vapc = 4.6V 14 -8 -10 -12 12 -14 10 6 300 350 400 450 Frequency (MHz) 4/17 Vdd = 7.2V Pin = 10dBm Vapc = 4.6V -16 8 500 550 600 -18 300 350 400 450 Frequency (MHz) 500 550 600 STEVAL-TDR001V1 Typical performance Figure 5. Low pass filter - insertion loss -5 -15 S21(dB) -25 -35 -45 -55 -65 -75 1.0E+08 3.0E+08 5.0E+08 7.0E+08 9.0E+08 1.1E+09 1.3E+09 1.5E+09 1.3E+09 1.5E+09 F(Hz) Figure 6. Low pass filter - input return loss Low pass filter - Input Return Loss 0 -5 S11(dB) -10 -15 -20 -25 -30 -35 1.0E+08 3.0E+08 5.0E+08 7.0E+08 9.0E+08 1.1E+09 F(Hz) 5/17 Typical performance Table 4. STEVAL-TDR001V1 Part list Designator Value Quantity Manufacturer Part code Size C1 1 µF 1 Murata GRM1885F51C105ZA01 603 C1F 2.2 pF 1 Murata GRM1885C1H2R2CZ01 603 C2, C3, C4 120 pF 3 Murata GRM1885C1H121JA01 603 C2F, C3F 3.3 pF 2 Murata GRM1885C1H3R3CZ01 603 C4F, C5F 2.2 pF 2 Murata GRM1885C1H2R2CZ01 603 C5, C6 1 µF 2 Murata GRM1885F51C105ZA01 603 C6F 4.7 pF 1 Murata GRM1885C1H4R7CZ01 603 C7 120 nF 1 Murata GRM1885C1H121JA01 603 C7F, C8F 3.9 pF 2 Murata GRM1885C1H3R9CZ01 603 C8, C10 470 pF 2 Murata GRM1885C1H471JA01 603 C9 470 pF 1 Murata GRM1885C1H471JA01 603 C9F 1.2 pF 1 Murata GRM1885C1H1R2CZ01 603 C11 15 pF 1 Murata GRM1885C1H150JA01 603 C12 4.7 pF 1 Murata GRM1885C1H4R7CZ01 603 C13 18 pF 1 Murata GRM1885C1H180JA01 603 C14 39 pF 1 Murata GRM1885C1H390JA01 603 C15, C16 18 pF 2 Murata GRM1885C1H180JA01 603 C17 15 pF 1 Murata GRM1885C1H150JA01 603 C18 NC 1 Murata GRM1885C1H471JA01 603 1 Phoenix contact 1725685 2.54mm, 5 poli 1 Coilcraft 0603HC-24NX_BW 603 5 Coilcraft 1606-10_, 1606_10 1606 DC-Con L1 24 nH L1F, L2, L2F, L3F, 12.55 nH L4F L3, L4 3.6 nH 2 Coilcraft 0603HC-3N6X_BW 603 L5 2.55 nH 1 Coilcraft 0906-3_ 906 PD54003L-E 1 STMicroelectronics PD54003L-E PD84001 1 STMicroelectronics PD84001 R1 300 Ω 1 Tyco/electronics neohn CRG series thick film chip 603 R2, R5 3 kΩ 2 Tyco/electronics neohn CRG series thick film chip 603 R3, R6 15 kΩ 2 Tyco/electronics neohn CRG series thick film chip 603 R4 1.5 kΩ 1 Tyco/electronics neohn CRG series thick film chip 603 RF In, RF Out, RF Out PA 3 SUB 6/17 1 FR-4 H=20 mil h=10 oz TL1 50 1 L=6.88 mm W=0.92 mm TL2 50 1 L=9.8 mm W=0.92 mm TL3 1 L=9.8 mm W=0.92 mm TL4 1 50 Ω STEVAL-TDR001V1 4 Circuit layout Circuit layout Figure 7. Test fixture component layout 7/17 Circuit schematic 5 8/17 STEVAL-TDR001V1 Circuit schematic Figure 8. Circuit schematic Figure 9. Filter schematic STEVAL-TDR001V1 6 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 9/17 Package mechanical data 6.1 STEVAL-TDR001V1 PowerFLAT™ mechanical data Table 5. PowerFLAT™ mechanical data mm inch Dim. Min. Typ. Max. A 0.90 A1 0.02 A3 0.24 Typ. Max. 1.00 0.035 0.039 0.05 0.001 0.002 0.009 AA 0.15 0.25 0.35 0.006 0.01 0.014 b 0.43 0.51 0.58 0.017 0.020 0.023 c 0.64 0.71 0.79 0.025 0.028 0.031 D 5.00 0.197 d 0.30 0.011 E 5.00 0.197 E2 2.49 2.57 2.64 0.098 0.101 e 1.27 0.050 f 3.37 0.132 g 0.74 0.03 h 0.21 0.008 Figure 10. PowerFLAT™ package dimensions 10/17 Min. 0.104 STEVAL-TDR001V1 Table 6. Package mechanical data PowerFLAT™ tape and reel dimensions mm. inch Dim. Min. Typ Max. Min. Typ Max. Ao 5.15 5.25 5.35 0.12 0.13 0.13 Bo 5.15 5.25 5.35 0.12 0.13 0.13 Ko 1.0 1.1 1.2 0.02 0.02 0.02 Figure 11. PowerFLAT™ tape and reel 11/17 Package mechanical data 6.1.1 Mounting indications Figure 12. Standard SMD mounting 12/17 STEVAL-TDR001V1 STEVAL-TDR001V1 6.2 Package mechanical data Thermal pad and via design SOT-89 Thernal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device. The via pattern is based on thru-hole vias with 0.203 mm to 0.330 mm finished hole size on a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Figure 13. Pad layout details 13/17 Package mechanical data 6.2.1 STEVAL-TDR001V1 Soldering profile Figure 14 shows the recommeded solder for devices that have Pb-free terminal plating and where a Pb-free solder is used. Figure 14. Recommended solder profile Figure 15 shows the recommeded solder for devices with Pb-free terminal plating used with leaded solder, or for devices with leaded terminal plating used with a leaded solder. Figure 15. Recommended solder profile for leaded devices 14/17 STEVAL-TDR001V1 Package mechanical data Figure 16. Reel information 15/17 Revision history 7 STEVAL-TDR001V1 Revision history Table 7. 16/17 Document revision history Date Revision 16-Mar-2009 1 Changes Initial release. STEVAL-TDR001V1 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 17/17