Film Chip Capacitors High Surge Voltage SMD Film Capacitors – CL Series GENERAL DESCRIPTION Film chip capacitor using a naked and stacked construction with metallized Polyethylene Naphtalate film (PEN) Usage of a multitrack technology results to an equivalent serial construction which gives better high voltage surge handling capability. ADVANTAGES APPLICATIONS This new version of our High Voltage SMD range has been developed to withstand high line surges common in telecom application. These capacitors meet the telecom lightning strike protection standards. • • • • • Surge Voltage up to 1500V (10/700 μs) Self healing Safe open failure mode Low ESR Surface Mount (IR/Vapor reflow) solution Outer Layer Termination Plating : 100% matte Sn Ni Barrier Under Termination Silver Epoxy Resin Brass Active Layers : PEN dielectric PERFORMANCE CHARACTERISTICS Climatic Category Capacitance Range Tolerance on CR Nominal Voltages Test Voltage Soldering methods Tangent of Loss Angle at 1kHz (DF) Insulation resistance minimum: IR Temperature range 092515 55/125/56 6.8nF to 33nF ±5%, ±10% 630Vdc 1500V (10/700μ sec.) IR or vapor phase reflow (not suitable for wave soldering) < 100 x 10-4 for C ≤ 0.33μF IR > 1000 MΩ at 20°C for 1 min.charge at 100VDC -55°C to 125°C with voltage derating of 1.25%/ºC between 105ºC and 125ºC 47 Film Chip Capacitors High Surge Voltage SMD Film Capacitors – CL Series CAPACITANCE VALUES (CR) AND NOMINAL VOLTAGES (VR) W H T millimeters (inches) L VOLTAGE Vdc: 630V Capacitance Range (CR) Ordering Code 0.0068μF CL057K0682+ -- 0.0082 CL057K0822+ -- 0.010μF CL057K0103+ -- 0.012 CL057K0123+ -- 0.015 CL057K0153+ -- 0.018 CL057K0183+ -- 0.022 CL957K0223+ -- 0.027 CL957K0273+ -- 0.033μF CL957K0333+ -- 0.080μF *CL967K0803+ -- L 7.20 (0.283) 7.20 (0.283) 7.20 (0.283) 7.20 (0.283) 7.20 (0.283) 7.20 (0.283) 7.20 (0.283) 7.20 (0.283) 7.20 (0.283) 10.5 (0.413) Chip Dimensions *Tolerances (page 6) W H max 6.10 2.40 (0.240) (0.094) 6.10 2.30 (0.240) (0.090) 6.10 2.80 (0.240) (0.110) 6.10 2.40 (0.240) (0.094) 6.10 2.90 (0.240) (0.114) 6.10 3.40 (0.240) (0.134) 10.0 3.00 (0.394) (0.118) 10.0 3.70 (0.394) (0.146) 10.0 4.00 (0.394) (0.158) 9.50 (0.373) 9.10 (0.358) Tape Dimensions T 0.80 (0.032) 0.80 (0.032) 0.80 (0.032) 0.80 (0.032) 0.80 (0.032) 0.80 (0.032) 0.80 (0.032) 0.80 (0.032) 0.80 (0.032) W 24.0 (0.944) 24.0 (0.944) 24.0 (0.944) 24.0 (0.944) 24.0 (0.944) 16.0 (0.629) 16.0 (0.629) 16.0 (0.629) 16.0 (0.629) 0.80 (0.032) 24.0 (0.944) Reel Dimensions P1 K0 A 12.0 3.80 330 (0.472) (0.149) (12.99) 12.0 3.80 330 (0.472) (0.149) (12.99) 12.0 3.80 330 (0.472) (0.149) (12.99) 12.0 3.80 330 (0.472) (0.149) (12.99) 12.0 3.80 330 (0.472) (0.149) (12.99) 12.0 3.80 330 (0.472) (0.149) (12.99) 12.0 4.80 330 (0.472) (0.189) (12.99) 12.0 4.80 330 (0.472) (0.189) (12.99) 12.0 5.23 330 (0.472) (0.206) (12.99) VOLTAGE Vdc: 1000V 16.0 9.40 330 (0.629) (0.369) (12.99) W1 W2 max 24.4 30.4 (0.961) (1.196) 24.4 30.4 (0.961) (1.196) 24.4 30.4 (0.961) (1.196) 24.4 30.4 (0.961) (1.196) 24.4 30.4 (0.961) (1.196) 16.4 22.4 (0.645) (0.881) 16.4 22.4 (0.645) (0.881) 16.4 22.4 (0.645) (0.881) 16.4 22.4 (0.645) (0.881) 24.4 (0.961) 30.4 (1.196) Packaging Unit Reel Pkg Code Bulk 1000 Reel 2250 1000 2250 BC 1000 2250 BC 1000 2250 BC 1000 2250 BC 1000 2250 BC 1000 1300 BC 1000 1300 BC 1000 1100 BC 400 400 BC BC *Dedicated for HID lamp applications For other Values: upon request Replace the + by the tolerance code: J = 5% or K = 10% Replace the -- by the packaging suffix: -- = bulk BC = tape & reel 48 092515 Film Chip Capacitors High Surge Voltage SMD Film Capacitors – CL Series MOUNTING AND SOLDERING RECOMMENDATIONS SOLDERING PROFILE The capacitors can be mounted using infrared and vapor phase soldering following recommended below. They are NOT suitable for wave soldering. All temperature refer to topside of the package, measured on the package body surface. tp Tp 2824 to 2840 3°C / second max Ramp up Tp - 5ºC TL Ts max Temperature (ºC) Profile Feature Ramp-Up (Ts max to Tp) Preheat - Temperature Min (Ts min) - Temperature Min (Ts max) - Time (ts min to ts max) Time maintained above - Temperature (TL) - Time (tL) Peak temperature (Tp) Time within 5°C of peak temperature (tp) Ramp-Down 150°C 200°C 180 sec. max 217°C 75 sec. max 255°C tL Ts min Ramp down tS 0 30 60 90 10 sec. 120 150 180 210 240 270 300 330 Time (seconds) 6°C / sec. *Reflow soldering referring to JEDEC Standard with some limitations *JEDEC J-Std 020C RECOMMENDED SOLDER PASTE THICKNESS For optimum solderability, the recommended soldering paste thickness: 2824: 150 to 200μm 2840: 200 to 300μm C In case of hand soldering, the temperature of the soldering iron should not be above 250°C. Special care must be taken to avoid touching the capacitor body with the iron tip. B PAD DIMENSIONS: millimeters (inches) Size Code Case Size A B C 05 95 2824 2840 6.00 (0.234) 11.2 (0.440) 2.50 (0.098) 2.50 (0.098) 5.70 (0.224) 5.70 (0.224) A RECOMMENDED CLEANING OTHER CAUTIONS To clean flux from the PC board assembly, the recommended products are: ethanol, isopropyl alcohol, and deionized water wash. The cleaning products to avoid are: Toluene, Xylene, Trichloroethylene, Terpene Cleaner EC-7, surface active agent. In case of using another solvent, please contact us. Flame retardancy: the dielectric film is not a flame retardant material. Environment: contact us when chips are used in humid or gas atmosphere and /or when using resin. Recommended handling: do not use edged tools, so not to damage the capacitors. TIN WHISKERS TESTS : JEDEC STANDARD NO 22A121 Stress Type Ref. Spec. Temperature cycling JESD22-A104 Ambient Temperature / Humidity Storage High Temperature / Humidity Storage 092515 Test Conditions -55°C +85(+10/-0)°C air 5 to 10mn soak 3 cycles/hour Analysis Results SEM x 1000 Pass 30+/-2°C - 60+/-3% RH -2000H SEM x 1000 Pass 70+/-5°C - 93+3/-2% RH -1000H SEM x 1000 Pass 49 Film Chip Capacitors High Surge Voltage SMD Film Capacitors – CL Series – RoHS MATERIALS CONTROLLED BY ROHS (PPM BY WEIGHT): Mass / unit (g) Lead Mercury Cadmium CB range RoHS Limit (ppm) Pass/Fail 0 1000 Pass 0 1000 Pass 0 100 Pass Hexavalent Chromium 0 1000 Pass PBB PBDE 0 1000 Pass 0 1000 Pass This product has been tested and found to be compliant with all requirements, provisions, and exemptions of EU Directive 2002/95/EC of the European Parliament and Council of January 27, 2003. On the Restriction of use of certain Hazardous Substances (RoHS) in electrical and electronic equipment and EU Directive 2000/53/EC regarding ELV or End of Life Vehicle. ROHS / ELV STATUS External Plating 100% Matte Sn as standard LEAD-FREE STATUS / MOISTURE SENSITIVITY RANKING Pb Free Reflow Solder compliant, MSL = 3. Reflow soldering referring to Jedec Standard with some limitations. Additional JESD-97 data to be phased in MSL e3 termination. PRODUCT LABELING: PRODUCT TRACEABILITY: (For informational purposes only to be phased in on reel and container.) Full internal material traceability by reference to unique lot number marked on reel and external package. Pb Free: 50 RoHS Compliant: 092515