I547/I747 Series 2.5 mm x 3.2 mm Ceramic Package SMD TCXO Product Features: Applications: Low Jitter, Non-PLL Based Output Clipped Sinewave Analog Compensation Available 0.5 ppm Stability 3.20±0.10 GPS Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 Marking Frequency 10Mhz to 52 Mhz Frequency Tolerance @ 25 C 2.0 ppm after second reflow 2.50±0.10 1.00 max 1.80 Frequency Stability Vs Temperature Vs Supply Voltage ( 5%) Vs Load (10%) Output Level Clipped Sinewave Output Load Clipped Sinewave See Frequency Stability Table 0.2 ppm Max. .0.2 ppm Max. 0.8 V p-p Min. 0.60 1 2 4 3 0.60 0.85 10K Ohms / 10 pF 2.40 0.1 ppm / C Frequency Slope (2C steps from -20 C to +70 C) Start Time (90% of Vp-p) 3.0 mS Max. Aging 1 ppm / Year Max. Supply Voltage See Supply Voltage Table , tolerance 5% Current 1.5 mA Max Voltage Control (I747) Operating 1.5 VDC 1.0 VDC, 5.0 ppm Min. Storage -40 C to +85 C Phase Noise (typical) -87 dBc/Hz @ 10 Hz -112 dBc/Hz @ 100 Hz -135 dBc/Hz @ 1KHz -145 dBc/Hz @ 10 Khz Package I547 (Clipped Sinewave TCXO) I747 (Clipped Sinewave TCVCXO) 2.00 1.30 1.20 Suggested Land Pattern See Operating Temperature Table Pin 1 Pin 2 Pin 3 Pin 4 Pin Connections Volt Control or N/C Ground Output Voltage Supply Dimensions in mm Part Number Guide Sample Part Number: I547-1Q3-20.000 Mhz Operating Temperature FrequencyStability vs Temperature Supply Voltage 7 = 0 C to +50 C **Y = 0.5 ppm 3 = 3.3 V 1 = 0 C to +70 C **N = 1.0 ppm 7 = 3.0 V 3 = -20 C to +70 C **O = 1.5 ppm 2 = 2.7 V 5 = -30 C to +85 C **P = 2.0 ppm 1 = 1.8 V 2 = -40 C to +85 C Q = 2.5 ppm Frequency - 20.000 MHz R = 3.0 ppm J = 5.0 ppm NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. ** Not available for all temperature ranges. ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 06/18/15_H Page 1 of 2 I547/I747 Series 2.5 mm x 3.2 mm Ceramic Package SMD TCXO Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metallization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 8 +/-.3 4 +/-.2 3.5 +/-.2 9 +/-1 or 12 +/-3 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: I – Datcode (yww) Line 2: ●(Pin 1 Designator) XXXXXX(Internal Crystal Code) PROPRIETARY AND CONFIDENTIAL THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION, AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE NOR USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM ILSI America. ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 06/18/15_H Page 2 of 2