XG-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR TEST APPLICATIONS 17.2250 Recommended Torque: 10 in. lbs. 43 13.0647 34 2.6650 4.6000 38 86 18.7250 Description: XG-BGA617/BGA216 PoP socket W/ Agilent Probe board Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. XG-BGA-5008 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com WEIGHT: 10.45 MATERIAL: N/A FINISH: N/A STATUS: Released SHEET 1 OF 5 DRAWN BY: V. Panavala SCALE: 3:2 File: XG-BGA-5008 DATE: 8/16/2012 REV. A 18.7250 BACKING PLATE 14.7250±0.0500 (4) 1.25±0.13 1.7625±0.0250 1.25±0.13 1.7625±0.0250 2.54±0.025 0.850±0.025 (2) NON-PLATED ALIGNMENT HOLE 0.40 TYP 0.27 PAD TYP 5.08±0.025 BGA617 A1 Corner 11.2000 1.70±0.05 (4) NON-PLATED MOUNTING HOLE 17.225±0.125 SOCKET BASE Description: Recommmended PCB layout Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. XG-BGA-5008 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com WEIGHT: 10.45 MATERIAL: N/A FINISH: N/A STATUS: Released Target PCB Recommendations Total thickness: 1.5mm min. Plating: Gold or Solder finish SHEET 2 OF 5 DRAWN BY: V. Panavala SCALE: 6:1 File: XG-BGA-5008 DATE: 8/16/2012 REV. A B D 0.10 C E A A1 0.20 C C E DETAIL E SCALE 12 : 1 0.2 A b 0.15 M e DIM A A1 b D E e PIn Count Array A B C 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. MIN 0.11 0.20 12.00 BSC 12.00 BSC 0.40 617 MAX 0.94 0.21 0.30 Description: XG-BGA617/BGA216 PoP socket W/ Agilent Probe board Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. XG-BGA-5008 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com WEIGHT: 10.45 MATERIAL: N/A FINISH: N/A STATUS: Released SHEET 3 OF 5 DRAWN BY: V. Panavala SCALE: 6:1 File: XG-BGA-5008 DATE: 8/16/2012 REV. A 11.2 1.763±0.025 0.850±0.025 (2) NON-PLATED ALIGNMENT HOLE BGA 216 Probe A1 Corner 0.778±0.025 7.105±0.025 3.318±0.025 TOP VIEW 0.4 Typ. 1.763±0.025 14.725±0.025 12 MAX (4) DESCRIPTION: Probe Board Layout Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"],all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. XG-BGA-5008 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com WEIGHT: 10.45 MATERIAL: N/A FINISH: N/A STATUS: Released SHEET: 4 of 5 DRAWN BY: M. Tully SCALE: 2:1 File: XG-BGA-5008 DATE: 8/16/2012 REV. A ITEM NO. 1 10 11 DESCRIPTION Socket Base 12mm POP socket Material 7075-T6 Aluminum Alloy 2 Cflex 12mm 0.4mm pitch BGA617 Kapton Polyimide 3 Ball Guide BGA 12x12mm, 0.4mm Pitch Kapton Polyimide 4 Target PCB BGA617 12x12mm, 5 post Clamshell Backing Plate BGA chip 216pin with 0.4mm Pitch and 29x29 array IC guide 12mm IC Material <not specified> 5 13 6 7 12 1 8 Cflex BGA216 0.4mm pitch 9 Agilent BGA216 Probe board 10 Compression Screw M10 8 Socket Lid 12mm 7075-T6 Alumium Alloy 7075-T6 Aluminum Alloy Dowel pin, 1/32" X 1/2", SS #0-80 X .313 LG, SOC HD CAP SCREW, ALLOY STL, BLK OXIDE Ball Guide BGA216 0.4mm pitch Alloy Steel 16 9 8 6 7 7075-T6 Alumium Alloy Compression Plate #0-80 Shoulder Screw, 0.062" thread length Memory chip BGA216 0.4mm pitch 15 9 Kapton with silver solder balls 12 14 14 Kapton Polyimide/ Cirlex 11 13 17 7075-T6 Aluminum Alloy 17 Stainless Steel (303) Material <not specified> Alloy Steel Kapton Polyimide 17.2250 4.0000 (x4) 3 15 2 1.7000 4 1.6000 3.0000 18.7250 5 16 Description: XG-BGA617/BGA216 PoP socket W/ Agilent Probe board 14.7250 4.6000 Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. XG-BGA-5008 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com WEIGHT: 10.45 MATERIAL: N/A FINISH: N/A STATUS: Released SHEET 5 OF 5 DRAWN BY: V. Panavala SCALE: 3:1 File: XG-BGA-5008 DATE: 8/16/2012 REV. A