www.ironwoodelectronics.com 0.5mm, 0.65mm Pitch Giga-snaP™ Emulation, System Development, Field Upgrade, Production Socket Adapters High Performance IC Sockets And Test Adaptors IP, Dec2013 Application Need www.ironwoodelectronics.com • In-circuit emulation of a system board that has 0.5mm and 0.65mm pitch array pattern. • Test and debug of a system development board that has 0.5mm and 0.65mm pitch area array devices such as BGA, LGA. • Debugging production board that has 0.5mm and 0.65mm pitch area array devices such as BGA, LGA. • Reworking 0.5mm and 0.65mm pitch BGA devices by removing from the board (both development and production) and reattaching to the target land pattern. IP, Dec2013 • Upgrading production systems that has 0.5mm and 0.65mm pitch BGA devices. Solution – Chip Size Adapters www.ironwoodelectronics.com Plug and Play Giga-snaP™ Adapters An economical and reliable alternative to soldering BGA devices directly to the motherboard. Same footprint as BGA device. RoHS compliant materials. Soldering very similar to IC package using conventional methodology and no external hardware required. RoHS compliant materials. PCB can be reflowed with Giga-snaP™ assembled (withstands multiple reflow cycles). Compact, low-profile design maximizes PC board space in system development. Access to BGA pads for in-circuit emulation, test and interconnection. Connection via Gold plated terminals that has optimized insertion/extraction force for reliability and robustness. IP, Dec2013 Shortest interconnect length enables high speed applications. Giga-snaP™ Interconnect www.ironwoodelectronics.com DUT Top adapter substrate High temperature plastic Terminal pins 360 Brass Gold plated BeCu Contact Gold plated Bottom socket substrate High temperature plastic IP, Dec2013 0.5mm Pitch Giga-snaP™ Contact Typical Characteristics www.ironwoodelectronics.com Contact resistance < 20 mΩ Self Inductance <0.79nH Bandwidth >20.1GHz @-1dB Mutual Capacitance <0.088pF Insertion force 16grams per pin Extraction force 7grams per pin Operating temperature -55 to +160° C Insertion/Extraction cycles >100 Current rating 3A per contact IP, Dec2013 Mechanical Characterization www.ironwoodelectronics.com Insertion and Extraction Force Data 18.0 16.0 14.0 Force per pin (gms) 12.0 Extraction force #1 Extraction force #2 10.0 Insertion force #1 8.0 Insertion force #2 6.0 4.0 2.0 0.0 0 IP, Dec2013 1 2 3 4 5 6 Number of cycles 7 8 9 10 Electrical Characterization www.ironwoodelectronics.com Contact Resistance Data 0.5mm Gigasnap, room temperature, endurance data 0.02 0.018 Contact resistance per pin, (ohms) 0.016 0.014 0.012 0.01 0.008 0.006 0.004 0.002 0 0 IP, Dec2013 10 20 30 40 50 # of insertions 60 70 80 90 100 Mechanical Characterization +160C www.ironwoodelectronics.com BGA153 GigaSnap 0.5mm Test @ 160°C 25.00 Resistance Per contact ((mOhms) 20.00 15.00 10.00 5.00 0.00 0 66 143 167 Hours IP, Dec2013 238 260 Mechanical Characterization -55C 17.000 Room temperature Brought back to Room temperature - empty Nitrogen tank 16.500 16.000 Resistnace Per Contact (Milli Ohms) www.ironwoodelectronics.com 15.500 15.000 14.500 14.000 13.500 13.000 12.500 12.000 0 IP, Dec2013 1 17 19 21 23 23 23 25 39 41 Time ( Hours) 44 45 47 61 63 65 67 68 Electrical Characterization AC IP, Dec2013 www.ironwoodelectronics.com Electrical Characterization DC IP, Dec2013 www.ironwoodelectronics.com High Volume Manufacturing IP, Dec2013 www.ironwoodelectronics.com Pick & Place SMT Line, Reflow Oven Stencil/Screen Printer, Tape & Reel Packaging CNC & Screw Machines Optical Inspection Unit Value Proposition www.ironwoodelectronics.com Proven solution for automobile applications due to extreme temperature capability. Shortest electrical path, proven solution for high speed digital and RF applications (excellent bandwidth >20GHz). Reliable and Robust due to low and stable contact resistance throughout life cycle. Low insertion and extraction force for ease of operation. Established processes eliminate non-value added steps in the manufacturing sequence which enables low cost for end customers. Established manufacturing flow which enables short lead time for various order sizes. Pick & Place, Tape & Reel support for end users. No substrate warping, No CTE mismatch, Co-planarity <100µm. Component heat dissipation does not affect solder connection. Solders same as the IC it emulates. IP, Dec2013