0.5mm, 0.65mm 0.5mm, 0.65mm Pitch Giga-snaP

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0.5mm, 0.65mm
Pitch Giga-snaP™
Emulation, System Development,
Field Upgrade, Production
Socket Adapters
High Performance
IC Sockets And
Test Adaptors
IP, Dec2013
Application Need
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• In-circuit emulation of a system board that has 0.5mm and
0.65mm pitch array pattern.
• Test and debug of a system development board that has
0.5mm and 0.65mm pitch area array devices such as BGA,
LGA.
• Debugging production board that has 0.5mm and 0.65mm
pitch area array devices such as BGA, LGA.
• Reworking 0.5mm and 0.65mm pitch BGA devices by
removing from the board (both development and production)
and reattaching to the target land pattern.
IP, Dec2013
• Upgrading production systems that has 0.5mm and 0.65mm
pitch BGA devices.
Solution – Chip Size Adapters
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Plug and Play Giga-snaP™ Adapters
An economical and reliable alternative to soldering
BGA devices directly to the motherboard.
Same footprint as BGA device.
RoHS compliant materials.
Soldering very similar to IC package using conventional methodology and
no external hardware required.
RoHS compliant materials.
PCB can be reflowed with Giga-snaP™ assembled (withstands
multiple reflow cycles).
Compact, low-profile design maximizes PC board space in
system development.
Access to BGA pads for in-circuit emulation, test and interconnection.
Connection via Gold plated terminals that has optimized
insertion/extraction force for reliability and robustness.
IP, Dec2013
Shortest interconnect length enables high speed applications.
Giga-snaP™ Interconnect
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DUT
Top adapter substrate
High temperature plastic
Terminal pins
360 Brass
Gold plated
BeCu Contact
Gold plated
Bottom socket substrate
High temperature plastic
IP, Dec2013
0.5mm Pitch Giga-snaP™ Contact
Typical Characteristics
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Contact resistance < 20 mΩ
Self Inductance <0.79nH
Bandwidth >20.1GHz @-1dB
Mutual Capacitance <0.088pF
Insertion force 16grams per pin
Extraction force 7grams per pin
Operating temperature -55 to +160° C
Insertion/Extraction cycles >100
Current rating 3A per contact
IP, Dec2013
Mechanical Characterization
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Insertion and Extraction Force Data
18.0
16.0
14.0
Force per pin (gms)
12.0
Extraction force #1
Extraction force #2
10.0
Insertion force #1
8.0
Insertion force #2
6.0
4.0
2.0
0.0
0
IP, Dec2013
1
2
3
4
5
6
Number of cycles
7
8
9
10
Electrical Characterization
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Contact Resistance Data
0.5mm Gigasnap, room temperature, endurance data
0.02
0.018
Contact resistance per pin, (ohms)
0.016
0.014
0.012
0.01
0.008
0.006
0.004
0.002
0
0
IP, Dec2013
10
20
30
40
50
# of insertions
60
70
80
90
100
Mechanical Characterization +160C
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BGA153 GigaSnap 0.5mm Test @ 160°C
25.00
Resistance Per contact ((mOhms)
20.00
15.00
10.00
5.00
0.00
0
66
143
167
Hours
IP, Dec2013
238
260
Mechanical Characterization -55C
17.000
Room temperature
Brought back to
Room temperature
- empty Nitrogen tank
16.500
16.000
Resistnace Per Contact (Milli Ohms)
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15.500
15.000
14.500
14.000
13.500
13.000
12.500
12.000
0
IP, Dec2013
1
17
19
21
23
23
23
25
39
41
Time ( Hours)
44
45
47
61
63
65
67
68
Electrical Characterization AC
IP, Dec2013
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Electrical Characterization DC
IP, Dec2013
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High Volume Manufacturing
IP, Dec2013
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Pick & Place SMT Line,
Reflow Oven
Stencil/Screen Printer,
Tape & Reel Packaging
CNC & Screw Machines
Optical Inspection Unit
Value Proposition
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Proven solution for automobile applications due to extreme
temperature capability.
Shortest electrical path, proven solution for high speed digital and
RF applications (excellent bandwidth >20GHz).
Reliable and Robust due to low and stable contact resistance
throughout life cycle.
Low insertion and extraction force for ease of operation.
Established processes eliminate non-value added steps in the
manufacturing sequence which enables low cost for end customers.
Established manufacturing flow which enables short lead time for
various order sizes.
Pick & Place, Tape & Reel support for end users.
No substrate warping, No CTE mismatch, Co-planarity <100µm.
Component heat dissipation does not affect solder connection.
Solders same as the IC it emulates.
IP, Dec2013