HBT socket presentation

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HBT – Socket for
Lab and ATE
Applications
High Performance
IC Sockets And
Test Adaptors
IP, Oct2012
Application Need
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•Longer tip life
•Minimal plating wear or no plating
•withstands aggressive cleaning
•Minimal Oxide Buildup
•Less Material transfer rates from DUT to Pin tip
•Sharper tips
•stay sharper over time
•Less Cleaning
•Longer Mean Time Between Cleaning Frequency
•Reinstates original performance after cleaning
•Electrical specs
•Same or similar to BeCu alloys
•Less downtime
•Excellent ROI and COO
IP, Oct2012
Solution - HBT Contact
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HBT Contact is an etched contact with outside spring that provides a robust solution for test
applications that include thermal characterization, burn-in, SLT, ATE, etc.
Solution for 0.8mm to 0.40mm (LGA, BGA, QFP packages) in Burn-in & test applications.
Contact technology has 3 part system. Etched top plunger (unique proprietary alloy with no plating
enables longer tip life & less cleaning), etched bottom plunger (standard BeCu with gold plating)
and assembled to a gold plated stainless steel spring to enable reliable interconnect solution with
less downtime.
Stainless
Steel
Spring
Proprietary
alloy
Plunger
IP, Oct2012
BeCu
Plunger
HBT Socket
Features:
Wide temperature range
High current capability
Excellent signal integrity
Low & stable contact resistance
Less cleaning & down time
IP, Oct2012
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Mechanical Property
Comparison
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HBT alloy
HBT Mechanical property: similar to high carbon steel
HBT Electrical property: similar to BeCu
No Oxidation
IP, Oct2012
Life Cycle Comparison
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HBT tip
BeCu tip
Tested with gold plated device simulator. No difference in average Cres.
High standard deviation in BeCu tip due to uneven plating wear.
Cycle
IP, Oct2012
BeCu, Avg Cres
HBT, Avg Cres
0
47mOhms
43 mOhms
100,000
40 mOhms
42 mOhms
250,000
45 mOhms
43 mOhms
500,000
45 mOhms
45 mOhms
AC Data comparison
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BeCu tip
HBT tip
Conductivity of HBT is slightly lower than BeCu which is
reflected in bandwidth data.
At -1 dB
IP, Oct2012
BeCu
HBT
34.6 GHz
31.5 GHz
DC data comparison
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HBT tip
BeCu tip
Conductivity of HBT is slightly lower than BeCu which is reflected in current
carrying data.
Duty Cycle
BeCu
HBT
IP, Oct2012
1%
4.36 A
3.81 A
10%
4.32 A
4.09 A
25%
3.94 A
3.31 A
50%
3.64 A
3.18 A
100%
1.99 A
1.89 A
Life Cycle Comparison
BeCu tip
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HBT tip
Test completed for150K units of actual BGA devices with solder
balls on both type of pins. After testing, used gold plated device
simulator and measured Cres for 100 cycles. Wide Cres variation
in BeCu tip due to solder adhesion and plating wear compared to
minimal Cres variation in HBT tip.
IP, Oct2012
Tip Strength - Deformation
Study in the same socket
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SEM picture of tips shown below were impacted
against hard steel for 500K cycles.
BeCu tip
HBT tip
2000
x
Evidence of tip wear
IP, Oct2012
2000
x
No evidence of tip wear
Contamination Study
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SEM picture of Tips after 500k cycles on Matte Tin, including
cycles with MIPOX cleaning pad @25k Intervals.
BeCu
HBT
No Sn contamination and no wear
on surface
Sn adhesion on worn flat areas as well as
on gold plated surfaces
IP, Oct2012
HBT Value Proposition
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HBT contact enables repeatable
electrical/mechanical performance in all lab and
ATE applications.
Custom socket can be produced using HBT
contact in 4 weeks.
HBT sockets with wide temperature range (-50C
to +150C) are available in same footprint as
elastomer GHz sockets with 31.5GHz
bandwidth.
HBT sockets are robust and can be used in
application demonstration modules for multiple
handling process without contact degradation.
IP, Oct2012