KR Electronics, Inc. KR Electronics, Inc www.krfilters.com Suggested Reflow Profile Peak: 230°C (within 10 sec) > 221°C 180°C 150°C 90 ± 30 sec 25 ± 5 sec Notes 1. Avoid touching any solderable surfaces or contamina ng surfaces to assure solderability. 2. Avoid forcing the filter into place. 3. Units may be cleaned via solvent based, aqueous, semi‐aqueous, and alcohol based systems. Be sure to complete‐ ly dry the units as any entrapped moisture will affect the electrical performance. If an aqueous wash is used, a bake may be required. 4. A typical reflow profile is provided above. The actual profile is not as important as ensuring a defect free process. The most important parameter is to not exceed the peak temperature to prevent internal reflow. 5. The units are assembled using SN95SB5 high temperature solder. KR Electronics recommends that customers use a SAC solder with a mel ng point of 217°C or an equivalent during installa on for signal and ground connec ons. 6. Control the rate of hea ng and cooling to prevent thermal cracking of the devices. Hea ng or cooling, should not exceed a rate of 200°C per minute. Spikes must not exceed 100°C maximum for any opera on. Avoid forced cool‐ ing or contact with heat sinks, such as conveyor belts, metal tables or cleaning solu ons, before the units reach room temperatures. KR Electronics, Inc. 91 Avenel Street Avenel, NJ 07001 © 2013, KR Electronics, Inc. Lead Free Reflow Profile, Rev 0, December 1, 2013 Web Email Phone Fax www.krfilters.com [email protected] (732) 636-1900 (732) 636-1982 Page 1