Engineering Ultra Low Power System on Chip Sensors Steve Grady – Cymbet Scott Hanson – Ambiq Micro Jim Magos – Cardinal Components Key Trends Driving Micro SoC Sensors Ultra Low Power Processors Smart Devices and Sensors Everywhere Wireless is pervasive Integration with other components Miniaturization Eco-Friendly and Renewable Energy Key Trends Drive New Technologies in Many Areas • • • • New innovative products are smarter, smaller and wireless Smart devices with status indications There will be billions of new networked smart devices Industrial, Medical, Security, Transportation, Environmental... EH-Powered Autonomous Wireless Sensor Block Diagram Sensor (e.g., temperature, pressure, occupancy) Energy Harvesting Power Supply ΔT Motion EM Field Energy Manager RTC/Timer “Energy Aware” Communications and Control Input Power Light MCU + Radio EH Transducer Electrical Interface Discrete Components IC - Energy Conversion Battery Management Power Management Rechargeable Energy Storage Device System on Chip Sensors Sensor Types Oxygen Sensor Hall Effect Components A to D Position Sensor D to A Micro-C Seismometer Micro-P Soil Moisture Speed Sensor Water Sensor Particle Air Speed Inclinometer RTC TCXO Altimeter VCXO GPS Depth Gauge FPGA Accelerometer Crystal Solid State Battery Gravimeter Gyroscopic Level Shifter Bluetooth EEPROM Multiplayer Encryption Trends Driving Need for Innovative Energy Storage TRENDS Ultra Low Power Processors Smart Devices and Sensors Everywhere Wireless is pervasive Integration with other components Miniaturization Eco-Friendly and Renewable Energy CURRENT SOLUTIONS Bulky Size/Metal “coin” package Cannot be integrated with other electronics 60 mm wireless devices annually Complete 10 year HP: 1 Low energy for Space used 800mm Micro wireless component Solar powered trillion machines in a - Toxic Chemicals sensorssensor with s Pennies sensors Not in Eco-Friendly package power to dollars 5 years Transportation Safety Issues Rechargeable solid State Batteries EnerChips on Silicon Wafers Protective Coating Solid State Cathode Current Collector Solid State Electrolyte Charging Discharging • EnerChip™ Rechargeable Solid State Batteries are created on Silicon wafers using standard semiconductor fabrication processes and device packaging techniques • As the battery is charged, ions move from the cathode through the solid electrolyte to the current collector. As the battery discharges, the reverse is true. • EnerChips are 150 microns thick – less than two human hairs – and are 1/20th the thickness of a comparable battery. Key Technical Battery Requirements High Cycle Life Flat Output Voltage Profile Capacity with Cycling 70 60 Capacity (µAh) 50 4.2V 4.15V 40 4.1V 4.3V 30 4.0V 20 10 0 0 100 200 300 400 500 600 700 800 900 1000 Discharge Cycle # Fast and Simple Charge Low Self-Discharge Charge Current & Charge Capacity vs, Charge Time Percent of Charge 3.5 3.0 80 2.5 60 2.0 1.5 40 1.0 20 0.5 0 10 20 30 Time (Minutes) 40 50 60 0 15 14 Charge Loss % 4.0 100 0 Self-Discharge 4.5 Charge Current/ Battery Capacity 120 13 12 11 Non-Recoverable 10 9 8 7 6 Recoverable 5 4 3 2 1 0 1 2 3 Stand Time (Years) 4 5 Solid State Batteries are Safe Assembly, Transport, Use and Disposal Rechargeable solid state batteries are the only energy storage solution that satisfies all the following global environmental and safety regulations and certifications: • • • • • • • • • • • • • RoHS China RoHS REACH CE Mark UL - Underwriters Laboratory JEDEC IC Packaging Standards and Tape and Reel EIA Standards IEC, NEMA/ANSI United Nations Transportation Air Safety Regulations WEEE Waste Electrical and Electronic Equipment Directive EU Battery Directive MSDS and OSHA Information Solid State Battery End-of-life Disposal Instructions In vitro/In vivo Biocompatibility Test Standards for Cytotoxicity Packaging Options Side-by-Side EnerChip and ICs with Wire Bond Solid State Batteries are a unique solution for customer applications requiring a small energy storage device integrated directly into the system EnerChips support many different device configurations using standard wire bond or solder bump attachment Applications in the this market include: Stacking EnerChip and ICs using Wire Bond EnerChip Bare Die µController, Sensor, RTC Stacking EnerChip and ICs using solder bump Flip Chip • Sensor Systems on Chip • Security and tamper detection devices • Electronic fuses for various devices • Medical devices – ophthalmic, implantable, patches EnerChip and ICs in System On Chip Sensor SoC Packaging Roadmap EnerChip Solid State Batteries in Bare Die form are the ideal devices for integrating energy storage in emerging System in 3D Packaged Systems EnerChips using wire bonding, solder bumps for flip chip or eventually Thru Silicon Vias can be integrated into Systems in Package, Package on Package, TSV stacks and other 3D configurations EnerChip Bare Die Location Examples Solving the Power Problem System Software Architecture System Hardware Architecture Hardware Components The focus of today’s presentation Power must be optimized all levels of the design hierarchy Conventional Super-threshold Voltage Threshold Voltage (i.e., Noise Floor) Sub-threshold Voltage Building ULP Components with Sub-threshold Threshold Voltage (i.e., Noise Floor) Time Sub-threshold enables energy reductions on the order of 1.82/0.52=13X The Limits of Sub-threshold Inverter Operation at 65mV SRAM Cell Operation at 70 mV Deep sub-threshold operation is possible, but significant challenges exist The Challenges of Sub-threshold 1E-4 Vdd=1.2V Ion/Ioff~800,000 1E-5 ID (A) 1E-6 1E-7 Vdd=250mV Ion/Ioff~800 1E-8 1E-9 1E-10 1E-11 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Vgs (V) On-to-off current ratio is reduced dramatically The Challenges of Sub-threshold 1E-4 1E-5 ID (A) 1E-6 Limited Vth sensitivity at high Vdd 1E-7 1E-8 1E-9 ~14X change in current for ∆Vth=100mV 1E-10 1E-11 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Vgs (V) Current is exponentially sensitive to process, voltage, and temperature Addressing the Challenges with SPOT 2012 processor 244µm 122µm memory 305µm 181µm 2005 2006 2007 2009 2010 • SPOT: Sub-threshold Power Optimized Technology • Standard manufacturing process • Circuit, architecture, and test methodology that enables robust sub-threshold operation • Proven over 8 years of development AM18XX: A SPOT-Based RTC VCC VBAT nCE SDI SCL SDA/O Power Control Analog Compare I2C/SPI Interface Calibration Engine XO 100ths Seconds Minutes Hours Days Weekdays Months Years Alarms XT Osc Divider RC Osc Divider Timer WDT XI Control RAM WDI EXTI nEXTR Int/Clock Reset FOUT/nIRQ PSW/nIRQ2 nTIRQ CLKOUT/nIRQ3 nRST VSS SPOT enables unprecedented power of only 15-55nA A Typical Use Case SPOT enables a 5X increase in battery life VDD VOUT VCC VBAT VCC I2C/SPI EnerChip with Integrated Power Management + AM1805 RTC XO nIRQ MCU _ IRQ XI VSS VSS VSS Incumbent System SPOT-Based System EnerChip Power Management Current 35nA 20nA RTC Current 150nA 21nA Life for 12µAh battery* 4 days 20 days * EnerChip CBC012 battery under 41nA load is an 18uAh equivalent Sensor SoC - What’s Needed? • • • • • • • • • Looking for reduction in system size Systems incorporating energy harvesting techniques Low power small wireless systems Wireless sensor nodes Short time back up power Self powered systems Embedded power systems needing time logs, datalogs Embedded processing systems Any system that maintains RTC during power outage Real Time Plus Concept Integration Real Time Clock Solid State Battery Configuration Options Battery Recharging Circuit I2 C RTC Crystal Real Time Plus – RTC + Battery + XTAL Traditional Design Approach Real Time Plus Solution 78% smaller surface area Type Length Width Square mm Area PCB with CR2032 30.0 32.0 960 CRTP 12.4 17.4 216 78% RTPlus SoC Components Real Time Clock Temperature Compensation Industrial Temperature Range -40 to +850C RoHS Complaint Calendar tracks year and leap year Clock tracks seconds, minutes and hours in 24 hour format Interrupt Output Programmable Alarm and Universal Timer Extremely Accurate i.e., @250C, + 2 PPM 8 Bytes of Ram and 2 Bytes EEPROM for Customer Application Battery Solid State Battery RoHS Compliant Rechargeable with on board trickle charge circuit Package Application Examples Wireless sensors and RFID tags Consumer appliances Energy Harvesting Time Keeping Metering Telemedicine Time stamping Smart energy Military surveillance High quality Crystal I2C Interface Bus SMD 10.3 x 12.7 mm 12.4 x 15.1 mm 12.4 x 17.8 mm CRTP Series Power Holdover CRTPN05 4 days CRTPA12 20 days CRTPA50 90 days Creating a Sensor SoC – Modu-FlexTM Example Typical System Before Modu-FlexTM After Modu-FlexTM Sensors Battery Backup Recharging Circuit Modu-Flex Analog Processing (ADC) P O W E R Micro P, or Micro C Memory Analog Processing (ADC) RTC Crystal Control Logic Oscillator Analog Processing (DAC) Output Driver, switches P O W E R Micro P, or Micro C Memory Control Logic Analog Processing (DAC) Output Driver, switches Sensor SoC Package Innovation uC Crystal RTC EEPROM Osc Battery uC Charge Temp Sensor D/A A/D Output Driver Switch Sensor SoC Integrated Package Modu-Flex is a RoHS compliant (including the battery), CMOS low-power, real-time clock/calendar module with built-in Thermometer, Digital Temperature Compensation circuitry (DTCXO), a solid-state battery back up for the RTC, and single or dual output oscillator circuit (1 to 200 MHz) Real Time Clock—High Accuracy 2 PPM TCXO Crystal Applications: • Automotive: Solid State Battery Re-charging circuit Oscillator single output • Metering: • Outdoor: Temperature Sensor I2C Flexibility CRTP Modu-Flex Car Radio / GPS and Tracking Systems / Dashboard / Engine Controller / Car Mobile & Entertainment Systems / Tachometers E-meter / Heating Counter ATM & POS systems / Surveillance & Safety systems / Ticketing systems • All Types Portable and battery operated devices • Industrial Automation, Robotics, Controls • Consumer Gaming, Set top box, Data Storage • White goods Refrigerators, Dishwasher, Washers Benefits: Integration, any frequency from 1 to 200 MHz, small physical size, simplifies design, custom options available, factory configurable in 48 hours Sensor SoC Creation Process Customer Concept Design Flexible Manufacturing Integrated Solution Prototype-Small Volume Flip Chip Item Conformal Plastic Mold Coating Wire Sweep Die 2 Die 2 Epoxy 2 Die 1 Base with Epoxy 1 gold termination Stack Die Hard PCB Flex PCB Hard PCB Volume Packaging Customizable System Options Customizable System Options Continued Touch Sensing • CapSense capacitive sensing (buttons, sliders) • Touchscreens • Trackpads • Proximity sensing Other sensing • Position • Accelerometer • Water • Speed • Inclinometer • UV • Pressure Fan/Motor Control • AC motor • DC motor • Fan • Fuel pump • Instrument gauges DACs • 6-, 8-, and 9-bit • 6- and 8-bit multiplying Filters • 2-pole low-pass • 2-pole band-pass • Modulators • Peak detectors Amplifiers • Programmable gain • Instrumentation • Comparators Timers/Counters • 8-, 16-, and 24-bit Pulse-Width Modulators • 8-, 16-, and 24-bit Coming soon GPS Bluetooth Zigbee IrDA Modu-Flex is a flexible module that Integrates peripherals into a single component A fast, reliable way for companies to take their design and integrate for production with a low NRE custom offerings and solutions. Combining IC Bare Die into SoC Cymbet EnerChip RTC CBC34803 example AM0803 • Integrate Ambiq AM0803 (I2C) with Cymbet EnerChip CBC005 and CBC910 power mgmt IC • Miniature Land Grid Array (LGA) module or possibly BGA package • Wire bond in this case, but could also use flip chip style attachment using bumped bare die • CBC34813 uses AM0813 (SPI) RTPLUS and EnerChip RTC Integrated Solutions Examples Ambiq RTC + 5uAh EnerChip + PMIC + Xtal Oscillator using Packaged parts – 8 mm x 10 mm Ambiq RTC + 5uAh EnerChip + PMIC using bare die – 5 mm x 5 mm Summary • Key Industry Trends and Application Requirements are driving the need for highly integrated Sensor Systems on Chip designs • Ultra-low power electronics with Sub-threshold Power Optimized technologies are now available • Solid State Batteries provide ideal energy storage • Innovative packaging techniques enable optimized footprint and volume • Optimized Sensor SoCs are available today