HD74HC375 Quad. Bistable Latches REJ03D0621-0200 (Previous ADE-205-500) Rev.2.00 Mar 30, 2006 Description This latch is ideally suited for use as temporary storage for binary information between processing units and input/output or indicator units. Information present at a data (D) input is transferred to the Q output when the enable (G) is high and the Q output will follow the data input as long as the enable remains high. When the enable goes low, the information (that was present at the data input at the time the transition occurred) is retained at the Q output until the enable goes high. Features • High Speed Operation: tpd (Data to Q, Q) = 10 ns typ (CL = 50 pF) • High Output Current: Fanout of 10 LSTTL Loads • Wide Operating Voltage: VCC = 2 to 6 V • Low Input Current: 1 µA max • Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C) • Ordering Information Part Name Package Code (Previous Code) PRDP0016AE-B (DP-16FV) PRSP0016DH-B (FP-16DAV) Package Type HD74HC375P DILP-16 pin HD74HC375FPEL SOP-16 pin (JEITA) Package Abbreviation P — FP EL (2,000 pcs/reel) PRSP0016DG-A RP (FP-16DNV) Note: Please consult the sales office for the above package availability. HD74HC375RPEL Taping Abbreviation (Quantity) SOP-16 pin (JEDEC) EL (2,500 pcs/reel) Function Table Inputs Note: Outputs D G Q Q L H H H L H H L X L no change 1. H; High level, L; Low level, X; Irrelevant, Z; High impedance Rev.2.00 Mar 30, 2006 page 1 of 6 no change HD74HC375 Pin Arrangement 1D 1 16 VCC 1Q 2 Q D 1Q 3 Q C Enable 1 to 2 4 2Q 5 Q C 2Q 6 Q D 2D 7 15 4D D Q 14 4Q C Q 13 4Q 12 Enable 3 to 4 C Q 11 3Q D Q 10 3Q GND 8 9 3D (Top view) Absolute Maximum Ratings Item Symbol Ratings Unit Supply voltage range Input / Output voltage VCC VIN, VOUT –0.5 to 7.0 –0.5 to VCC +0.5 V V IIK, IOK IOUT ±20 ±25 mA mA ICC or IGND PT ±50 500 mA mW Input / Output diode current Output current VCC, GND current Power dissipation Storage temperature Tstg –65 to +150 °C Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. Recommended Operating Conditions Item Supply voltage Symbol VCC Ratings 2 to 6 Unit V Input / Output voltage Operating temperature VIN, VOUT Ta 0 to VCC –40 to 85 V °C tr , tf 0 to 1000 0 to 500 ns Input rise / fall time Note: *1 0 to 400 1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics. Rev.2.00 Mar 30, 2006 page 2 of 6 Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V HD74HC375 Electrical Characteristics Ta = 25°C Item Input voltage Symbol VCC (V) VIH VIL Output voltage VOH VOL Ta = –40 to+85°C 2.0 Min 1.5 Typ — Max — Min 1.5 Max — 4.5 6.0 3.15 4.2 — — — — 3.15 4.2 — — 2.0 4.5 — — — — 0.5 1.35 — — 0.5 1.35 6.0 2.0 — 1.9 — 2.0 1.8 — — 1.9 1.8 — 4.5 6.0 4.4 5.9 4.5 6.0 — — 4.4 5.9 — — 4.5 6.0 4.18 5.68 — — — — 4.13 5.63 — — 2.0 4.5 — — 0.0 0.0 0.1 0.1 — — 0.1 0.1 6.0 4.5 — — 0.0 — 0.1 0.26 — — 0.1 0.33 Unit Test Conditions V V V Vin = VIH or VIL IOH = –20 µA IOH = –4 mA IOH = –5.2 mA V Vin = VIH or VIL IOL = 20 µA IOH = 4 mA Input current Iin 6.0 6.0 — — — — 0.26 ±0.1 — — 0.33 ±1.0 IOH = 5.2 mA µA Vin = VCC or GND Quiescent supply current ICC 6.0 — — 4.0 — 40 µA Vin = VCC or GND, Iout = 0 µA Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = 25°C Item Propagation delay time Pulse width Symbol VCC (V) tPLH tPHL 2.0 4.5 6.0 — — 10 — 29 25 — — 36 31 tPLH tPHL 2.0 4.5 — — — 11 160 32 — — 200 40 tw 6.0 2.0 — 80 — — 27 — — 100 34 — 4.5 6.0 16 14 5 — — — 20 17 — — 2.0 4.5 100 20 — 2 — — 125 25 — — 6.0 2.0 17 5 — — — — 21 5 — — 4.5 6.0 5 5 –1 — — — 5 5 — — tTLH tTHL 2.0 4.5 — — — 5 75 15 — — 95 19 Cin 6.0 — — — — 5 13 10 — — 16 10 Setup time tsu Hold time th Output rise/fall time Input capacitance Ta = –40 to +85°C Min — Rev.2.00 Mar 30, 2006 page 3 of 6 Typ — Max 145 Min — Max 180 Unit Test Conditions ns Data to Q or Q ns G to Q or Q ns ns ns ns pF HD74HC375 Test Circuit VCC VCC Output See Function Table Input Pulse Generator Zout = 50 Ω Input Pulse Generator Zout = 50 Ω Enable G Q CL = 50 pF Output Q D CL = 50 pF Note : 1. CL includes probe and jig capacitance. Waveforms • Waveform – 1 tr tf VCC 90 % 90 % Input D 50 % 50 % tW 10 % 50 % 10 % t su 0V th tW t su VCC 90 % 50 % 50 % Enable G 10 % tW t PLH 50 % 50 % 10 % 0V tW t PHL 90 % 90 % 50 % Output Q 50 % 10 % 10 % t TLH t PHL Output Q th tf tr VOL t THL t PLH 90 % 90 % 50 % 10 % t THL 50 % 10 % t TLH Notes: 1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 6 ns, tf ≤ 6 ns Rev.2.00 Mar 30, 2006 page 4 of 6 VOH VOH VOL HD74HC375 • Waveform – 2 tr tf VCC 90 % 50 % 90 % 50 % Input D 10 % 10 % t PLH 0V t PHL 90 % VOH 90 % 50 % 10 % Output Q t PHL 50 % 10 % t TLH VOL t THL t PLH VOH 90 % 90 % 50 % 10 % Output Q 50 % 10 % VOL t TLH t THL Note: 1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 6 ns, tf ≤ 6 ns Package Dimensions JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g D 9 E 16 1 8 b3 0.89 A1 A Z L Reference Symbol e bp θ c e1 ( Ni/Pd/Au plating ) Rev.2.00 Mar 30, 2006 page 5 of 6 e1 D E A A1 bp b3 c θ e Z L Dimension in Millimeters Min Nom Max 7.62 19.2 20.32 6.3 7.4 5.06 0.51 0.40 0.48 0.56 1.30 0.19 0.25 0.31 0° 15° 2.29 2.54 2.79 1.12 2.54 HD74HC375 JEITA Package Code P-SOP16-5.5x10.06-1.27 RENESAS Code PRSP0016DH-B *1 Previous Code FP-16DAV MASS[Typ.] 0.24g D F 16 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 9 *2 c E HE bp Index mark Terminal cross section ( Ni/Pd/Au plating ) 1 8 e Z *3 bp x Reference Symbol M A L1 θ A1 y L Detail F JEITA Package Code P-SOP16-3.95x9.9-1.27 RENESAS Code PRSP0016DG-A *1 Previous Code FP-16DNV D E A2 A1 A bp b1 c c1 θ HE e x y Z L L1 Dimension in Millimeters Min Nom Max 10.06 10.5 5.50 0.00 0.10 0.20 2.20 0.34 0.40 0.46 0.15 0.20 0.25 0° 8° 7.50 7.80 8.00 1.27 0.12 0.15 0.80 0.50 0.70 0.90 1.15 MASS[Typ.] 0.15g D F 16 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 9 c *2 Index mark HE E bp Terminal cross section ( Ni/Pd/Au plating ) 1 Z Reference Symbol 8 e *3 bp x M A L1 A1 θ L y Detail F Rev.2.00 Mar 30, 2006 page 6 of 6 D E A2 A1 A bp b1 c c1 θ HE e x y Z L L1 Dimension in Millimeters Min Nom Max 9.90 10.30 3.95 0.10 0.14 0.25 1.75 0.34 0.40 0.46 0.15 0.20 0.25 0° 8° 5.80 6.10 6.20 1.27 0.25 0.15 0.635 0.40 0.60 1.27 1.08 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145 Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 © 2006. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .6.0