APPLICATION NOTE Macronix MX25L6435E and MX25L6436E Serial Flash Comparison 1. Introduction This application note compares the MX25L6435E and MX25L6436E 64Mb 3V serial NOR flash. The document does not provide detailed information on each individual device, but highlights the similarities and differences between them. The comparison covers the general features, performance, command sets and device ID. In comparison with the MX25L6436E, the MX25L6435E supports new features, such as 2READ mode (1-2-2, Single I/O Command input - Dual I/O Address input - Dual I/O Data output) and 4READ mode (1-4-4, Single I/O Command input - Quad I/O Address input - Quad I/O Data output). MX25L6435E supports a new TB (Top/Bottom) bit function, which enables Block Protection beginning at either the top or bottom of the memory array. The MX25L6435E also has a HOLD pin added and is available in not only the 8-SOP and 16-SOP packages, but comes in a smaller 8-WSON package and a 24-TFBGA package as well. The information provided in this document is based on datasheets listed in Section 8. Newer versions of the datasheets may override the contents of this document. Please refer to the contents and comparison tables below for more details. P/N: AN183 1 REV. 1, SEP. 13, 2012 APPLICATION NOTE 2. General Features The MX25L6435E has a new TB (Top/Bottom) bit located in Configuration Register Bit 3. By controlling the T/B bit, memory blocks can be selected for protection beginning at either the top or bottom of the memory array. The MX25L6435E supports two additional read modes: 2READ mode and 4READ mode. The MX25L6435E has the same or improved performance in all read modes. The MX25L6435E also has a HOLD pin added and is available in not only the 8-SOP and 16-SOP packages, but comes in a smaller 8-WSON and 24-TFBGA packages as well. These features are summarized in Table 2-1. Table 2-1: Feature Comparison Feature MX25L6435E MX25L6436E Voltage 2.7~3.6 V 2.7~3.6 V Interface x1, x2, x4 x1, x2, x4 Packages 16-SOP (300mil) 8-SOP (209mil) 8-WSON (6x5mm) 24-TFBGA (6x8mm) 16-SOP (300mil) 8-SOP (209mil) 8-WSON (8x6mm) -40°C ~ +85°C -40°C ~ +85°C 4KB / 32KB or 64KB 4KB / 32KB or 64KB Fast Read (1-1-1) 104MHz 104MHz Normal Read 50MHz 50MHz DREAD (1-1-2) (Dual Output) 86MHz 70MHz QREAD (1-1-4) (Quad Output) 86MHz 75MHz 2READ(1-2-2) 86MHz -- 4READ(1-4-4) Up to 104MHz -- 104MHz 20MHz Yes. for 4READ mode only -- Yes Yes 4Kbits 4Kbits BP3~BP0 BP3~BP0 T/B (Top/Bottom)bit Yes -- Individual Protection Individual Sector/Block Protect Individual Sector/Block Protect HOLD# Yes -- SFDP Yes Yes Operating Temperature Range Sector / Block Clock Rate (max.) 4PP Configurable Dummy Cycle Continuous Program (CP) Mode Secured OTP Data Protection P/N: AN183 Block Protection 2 REV. 1, SEP. 13, 2012 APPLICATION NOTE 3. Performance Both devices have similar power and timing as shown in Table 3-1. Table 3-1: Performance Comparison Parameter Symbol MX25L6435E MX25L6436E tCH 104MHz: 4.5ns 50MHz: 9ns 104MHz: 4.5ns 50MHz: 9ns tCL 104MHz: 4.5ns 50MHz: 9ns 104MHz: 4.5ns 50MHz: 9ns Byte 12us(typ.) ; 300us(max.) 9us(typ.) ; 300us(max.) Page 1.4ms(typ.) ; 5ms(max.) 1.4ms(typ.) ; 5ms(max.) Sector 60ms(typ.) ; 300ms(max.) 60ms(typ.) ; 300ms(max.) Block 32KB:0.5s(typ.); 2s(max.) 64KB:0.7s(typ.); 2s(max.) 32KB:0.5s(typ.); 2s(max.) 64KB:0.7s(typ.); 2s(max.) Chip 50s (typ.) / 80s(max.) 50s (typ.) / 80s(max.) Clock High/Low Time Program Time Erase Time CS# Active Setup Time tSLCH 4ns(min.) 5ns(min.) CS# Not Active Setup Time tSHCH 4ns(min.) 5ns(min.) CS# Active Hold Time tCHSH 4ns(min.) 5ns(min.) CS# Not Active Hold Time tCHSL 4ns(min.) 5ns(min.) CS# Deselect Time tSHSL Read=15ns(min.) ; Write=50ns(min.) Read=15ns(min.) ; Write=50ns(min.) VCC Standby ISB1 80uA(max.) 50uA(max.) Deep Power Down ISB2 40uA(max.) 20uA(max.) 35mA (104MHz, 4 I/O) 25mA (86MHz, 4 I/O) 19mA (104MHz, 1 I/O) 20mA (86MHz, 2 I/O) 10mA (33MHz, 1 I/O) 22mA (75MHz, 4 I/O) 19mA (104MHz, 1 1/O) 17mA (70MHz, 2 I/O) 10mA (33MHz, 1 I/O) VCC Read Current ICC1 P/N: AN183 VCC Program Current ICC2 25mA 25mA VCC WRSR Current ICC3 20mA 20mA VCC Sector Erase Current ICC4 25mA 25mA VCC Chip Erase Current ICC5 25mA 20mA 3 REV. 1, SEP. 13, 2012 APPLICATION NOTE 4. Package and Pin-out Comparison Figure 4-1 shows the common packages and the pin-out assignments for the two devices. With the exception of the added HOLD# pin function on the MX25L6435E, both devices have the same footprint and pinout. When migrating from the 36E to the 35E, if the HOLD#/SIO3 pin is currently N/C (not connected) it can be left unconnected as the HOLD# pin is internal pull high. Figure 4-1: Packages and Pin-outs 16-PIN SOP (300mil) MX25L6435E HOLD#/SIO3 VCC NC NC NC NC CS# SO/SIO1 MX25L6436E NC/SIO3 VCC NC NC NC NC CS# SO/SIO1 MX25L6435E CS# SO/SIO1 WP#/SIO2 GND MX25L6436E CS# SO/SIO1 WP#/SIO2 GND MX25L6435E CS# SO/SIO1 WP#/SIO2 GND MX25L6436E CS# SO/SIO1 WP#/SIO2 GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 MX25L6435E SCLK SI/SIO0 NC NC NC NC GND WP#/SIO2 MX25L6436E SCLK SI/SIO0 NC NC NC NC GND WP#/SIO2 MX25L6435E VCC HOLD#/SIO3 SCLK SI/SIO0 MX25L6436E VCC NC/SIO3 SCLK SI/SIO0 MX25L6435E VCC HOLD#/SIO3 SCLK SI/SIO0 MX25L6436E VCC NC/SIO3 SCLK SI/SIO0 8-PIN SOP (200mil) 1 2 3 4 8 7 6 5 8-WSON 1 2 3 4 8 7 6 5 24-Ball TFBGA (6x8 mm) (MX25L6435E only) 4 NC VCC WP#/SIO2 HOLD#/SIO3 NC NC NC GND NC SI/SIO0 NC NC NC SCLK CS# SO/SIO1 NC NC NC NC NC NC NC NC A B C D E 3 2 1 P/N: AN183 4 F REV. 1, SEP. 13, 2012 APPLICATION NOTE 5. Command Set Comparison Table 5-1 shows that the command set remain the same with the exception of the additional 2READ and 4READ (BBh and EBh, added to the 35E). The MX25L6435E does not have the Clear Security Register Fail Flags command (30h) to clear the E_FAIL or P_FAIL flags as the MX25L6436E does. The MX25L6435E clears these flags automatically at the beginning of the next command sequence. Table 5-1: Command Set Comparison Command Write Read Erase Program Security Register Secured OTP SO output Deep Power Down Block Lock Clear SR Block Protect Read P/N: AN183 WREN WRDI WRSR RDID RDSR READ RDSFDP Fast Read 2READ 4READ DREAD QREAD RES REMS REMS2 REMS4 SE BE BE32K CE 4PP PP CP RDSCUR WRSCUR ENSO EXSO ESRY DSRY DP RDP SBLK SBULK GBLK GBULK CLSR RDBLOCK 5 MX25L6435E MX25L6436E 06h 04h 01h 9Fh 05h 03h 5A 0Bh BBh EBh 3Bh 6Bh Abh 90h EFh DFh 20h D8h 52h 60h or C7h 38h 02h ADh 2Bh 2Fh B1h C1h 70h 80h B9h ABh 36h 39h 7Eh 98h -3Ch 06h 04h 01h 9Fh 05h 03h 5A 0Bh --38h 6Bh Abh 90h EFh DFh 20h D8h 52h 60h or C7h 38h 02h ADh 2Bh 2Fh B1h C1h 70h 80h B9h ABh 36h 39h 7Eh 98h 30h 3Ch REV. 1, SEP. 13, 2012 APPLICATION NOTE 6. Device ID Code Comparison Table 6-1 shows that the Manufacturer and Device IDs have not changed. Table 6-1: ID Code Comparison Command Type RDID Command MX25L6435E M ID Type Density M ID Type Density C2 20 17 C2 20 17 RES Command REMS MX25L6436E Electronic ID Electronic ID 16 16 M ID Device ID M ID Device ID C2 16 C2 16 7. Summary The MX25L6435E is backwards compatible with most of the common commands and features of the MX25L6436E. Additionally, the supported package types have identical footprints and nearly identical pin-out definitions. 8. References Table 8-1 shows the datasheet versions used for comparison in this application note. For the most current Macronix specification, please refer to the Macronix Website at http://www.macronix.com Table 8-1: Datasheet Version P/N: AN183 Datasheet Location Date Issued Version MX25L6435E Macronix Website Sep. 2012 1.0 MX25L6436E Macronix Website Apr. 2010 1.9 6 REV. 1, SEP. 13, 2012 APPLICATION NOTE Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2012. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Audio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. P/N: AN183 7 REV. 1, SEP. 13, 2012