MX23L6423 64M-BIT PAGE MODE MASK ROM FEATURES PIN DESCRIPTION • Bit organization - 8M x 8 (byte mode) - 4M x 16 (word mode) • Fast access time - Random access:90ns (max.) - Page access:25ns (max.) • Page size - 8 words per page • Current - Operating:20mA - Standby:15uA • Supply voltage - 3.0V ~ 3.6V for 90ns speed - 2.7V ~ 3.6V for 100ns speed • Package - 48 pin TSOP (12mm x 20mm) - 48 ball mini BGA • Temperature - 0 ~ 70°C Symbol Pin Function A0~A21 Address Inputs D0~D14 Data Outputs D15/A-1 D15 (Word Mode)/ LSB Address (Byte Mode) CE# Chip Enable Input OE# Output Enable Input Byte# Word/ Byte Mode Selection VCC Power Supply Pin VSS Ground Pin NC No Connection PIN CONFIGURATION 48 TSOP (Top View) A15 A14 A13 A12 A11 A10 A9 A8 A19 A20 NC NC A21 NC NC A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX23L6423 (Normal Type) 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# VSS D15 /A-1 D7 D14 D6 D13 D5 D12 D4 VCC D11 D3 D10 D2 D9 D1 D8 D0 OE# VSS CE# A0 REV. 1.3 , NOV. 17, 2004 P/N:PM0976 1 MX23L6423 48 mini BGA (Top View, Ball Down) A1 A2 A3 A4 A5 A6 A3 A7 NC NC A9 A13 B1 B2 B3 B4 B5 B6 A4 A17 NC NC A8 A12 C1 C2 C3 C4 C5 C6 A2 A6 A18 A21 A10 A14 D1 D2 D3 D4 D5 D6 A1 A5 A20 A19 A11 E1 E2 E3 E4 E5 E6 A0 D0 D2 D5 D7 A16 F1 F2 F3 F4 F5 F6 CE# D8 D10 D12 D14 BYTE# G1 G2 G3 G4 G5 G6 OE# D9 D11 Vcc D13 D15/A-1 H1 H2 H3 H4 H5 H6 Vss D1 D3 D4 D6 Vss A15 8.0 mm 6.0 mm ORDER INFORMATION Part No. MX23L6423TC-90 MX23L6423TC-10 MX23L6423XC-90 MX23L6423XC-10 Speed 90ns 100ns 90ns 100ns Package 48 pin TSOP 48 pin TSOP 48 ball mini BGA 48 ball mini BGA Grade Commercial Commercial Commercial Commercial Note: Commercial grade temperature: 0 ~ 70°C P/N:PM0976 REV. 1.3, NOV. 17, 2004 2 MX23L6423 MODE SELECTION CE# H L L L OE# X H L L Byte# X X H L D15/A-1 X X Output Input D0~D7 High Z High Z D0~D7 D0~D7 D8~D15 High Z High Z D8~D15 High Z Mode Word Byte Power Stand-by Active Active Active ABSOLUTE MAXIMUM RATINGS Item Voltage on any Pin Relative to VSS Ambient Operating Temperature Storage Temperature Symbol VIN Topr Tstg Ratings -0.3V to 3.9V 0°C to 70°C -65°C to 125°C DC CHARACTERISTICS (Ta = 0°°C ~ 70°°C, VCC = 2.7V~3.6V) Item Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current Operating Current Symbol VOH VOL VIH VIL ILI ILO ICC MIN. 2.4V 2.2V -0.3V - MAX. 0.4V VCC+0.3V 0.8V 5uA 5uA 20mA Standby Current (CMOS) Input Capacitance Output Capacitance ISTB CIN COUT - 15uA 10pF 10pF Conditions IOH = -400uA IOL = 1.6mA 0V, VCC 0V, VCC f=5MHz, CE#=VIL, OE#=VIH all output open CE#>VCC-0.2V Ta = 25°C, f = 1MHZ Ta = 25°C, f = 1MHZ AC CHARACTERISTICS (Ta = 0°°C ~ 70°°C, VCC = 2.7V~3.6V) Item Symbol Read Cycle Time Address Access Time Chip Enable Access Time Page Access Time Output Enable Time Output Hold After Address Output High Z Delay tRC tAA tCE tPA tOE tOH tHZ 23L6423-90 MIN. MAX. 90ns 90ns 90ns 25ns 25ns 0ns 20ns 23L6423-10 MIN. MAX. 100ns 100ns 100ns 30ns 30ns 0ns 20ns Note: 1. Output high-impedance delay (tHZ) is measured from OE# or CE# going high, and this parameter guaranteed by design over the full voltage and temperature operating range - not tested. 2. VCC=3.0V~3.6V for 90ns speed grade. P/N:PM0976 REV. 1.3, NOV. 17, 2004 3 MX23L6423 AC Test Conditions Input Pulse Levels Input Rise and Fall Times Input Timing Level Output Timing Level Output Load 0V~ 3.0V 5ns 1.5V 1.5V See Figure IOH (load)=-0.4mA DOUT IOL (load)=1.6mA C<100pF Note:No output loading is present in tester load board. Active loading is used and under software programming control. Output loading capacitance includes load board's and all stray capacitance. TIMING DIAGRAM RANDOM READ ADD ADD ADD ADD tRC tCE CE# tOE OE# tOH tAA VALID DATA VALID tHZ VALID PAGE READ VALID ADD A3-A21 (A-1),A0,A1,A2 2’nd ADD 1’st ADD tAA DATA 3’rd ADD tPA VALID VALID P/N:PM0976 VALID REV. 1.3, NOV. 17, 2004 4 MX23L6423 PACKAGE INFORMATION P/N:PM0976 REV. 1.3, NOV. 17, 2004 5 MX23L6423 P/N:PM0976 REV. 1.3, NOV. 17, 2004 6 MX23L6423 REVISION HISTORY Revision No. 1.1 1.2 1.3 Description To added Package -- 48 ball mini BGA Remove "Preliminary" on page 1 1. Changed BGA from 8x9 to 6x8 P/N:PM0976 Page P1,2 P1 P2,6 Date JAN/03/2003 MAY/12/2003 NOV/17/2004 REV. 1.3, NOV. 17, 2004 7 MX23L6423 Macronix's products are not designed, manufactured, or intended for use for any high risk applications in which the failure of a single component could cause death, personal injury, severe physical damage, or other substantial harm to persons or property, such as life-support systems, high temperature automotive, medical, aircraft and military application. 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