Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC

APPLICATION NOTE
Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC
1. Introduction
This application note is a guide for migrating to the Macronix MX30UF2G18AC from the Micron®
MT29F2G08ABBEA 2Gb, 1.8V, x8, NAND flash memory.
The document does not provide detailed information on the individual devices, but highlights the
major similarities and differences between them. The comparison covers the general features,
performance, command codes and other differences.
The information in this document is based on datasheets listed in Section 11. Newer versions of
the datasheets may override the contents of this document.
2. Features
Both flash device families have similar features and functions as shown in Tables 2-1.
Table 2-1: Feature Comparison
Feature
Macronix MX30UF2G18AC
Micron MT29F2G08ABAEA
Vcc Voltage Range
1.7V ~ 1.95V
1.7V ~ 1.95V
Operating Temperature
-40°C ~ 85°C
Interface
-40°C ~ 85°C
ONFI 1.0 Standard
ONFI 1.0 Standard
Block Size
128KB+4KB
128KB+4KB
Bus Width
x8
x8
Page Size
2KB+64B
2KB+64B
Cache Read/Program Size
2KB+64B
2KB+64B
2 Planes x 1024 Blocks/Plane
2 Planes x 1024 Blocks/Plane
4b/528B
N/A
4b/528B
Enabled by command
Yes
Yes
30 pages
Block 0
30 pages
Block 0
(with 4-bit ECC)
(with 1-bit ECC)
ONFI standard
ONFI standard
-
Reset (FFh)
C2h/AAh/90h/15h/06h
2Ch/AAh/90h/15h/06h
ONFI Signature
4Fh/4Eh/46h/49h
4Fh/4Eh/46h/49h
Data Retention
10 Years
10 Years
100K Cycles
100K Cycles
48-TSOP (12x20mm)
48-VFBGA (6x8mm)
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
Plane Size
ECC Requirement
Internal ECC Option
Block Protection
OTP Size
Guaranteed Good Blocks
at Shipping
Unique ID
First Command
ID Code
Endurance
Package
P/N: AN-0373
1
Ver.1, Mar.14, 2015
APPLICATION NOTE
Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC
Performance
Tables 3-1 and 3-2 show Macronix and Micron NAND flash have similar Read/Write performance.
Table 3-1: Read Performance (Read Latency and Sequential Read)
Macronix
MX30UF2G18AC
Micron
MT29F2G08ABBEA
Read Latency time (tR)
25us (max.)
25us (max.)
Sequential Read time (tRC)
25ns (min.)
25ns (min.)
Read Function
Table 3-2: Write Performance (Program and Erase)
Write Function
Page Program time (tPROG)
Block Erase time (tERASE)
Macronix
MX30UF2G18AC
Micron
MT29F2G08ABBEA
320us (typ.) / 600us (max.)
200us (typ.) / 600us (max.)
1ms (typ.) / 3.5ms (max.)
0.7ms (typ.) / 3ms (max.)
4 (max.)
4 (max.)
100,000
100,000
NOP
1
Write/Erase Cycles* (Endurance)
Note: 100K Endurance cycle with ECC protection.
3. DC Characteristics
Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar.
Table 4-1: Read / Write Current
Sequential Read Current (ICC1)
Macronix
MX30UF2G18AC
23mA (typ.) / 30mA (max.)
Micron
MT29F2G08ABBEA
13mA (typ.) / 20mA (max.)
Program Current (ICC2)
23mA (typ.) / 30mA (max.)
10mA (typ.) / 20mA (max.)
Erase Current (ICC3)
15mA (typ.) / 30mA (max.)
10mA (typ.) / 20mA (max.)
Standby Current – CMOS
10uA (typ.) / 50uA (max.)
10uA (typ.) / 50uA (max.)
Macronix
MX30UF2G18AC
Micron
MT29F2G08ABBEA
Input Low Voltage (VIL)
-0.3V (min.) / 0.2VCC (max.)
-0.3V (min.) / 0.2Vcc (max.)
Input High Voltage (VIH)
0.8VCC (min.) /
VCC+0.3V (max.)
0.8Vcc (min.) /
Vcc+0.3V (max.)
Output Low Voltage (VOL)
0.1V (max.)
0.1V (max.)
Output High Voltage (VOH)
VCC-0.1 (min.)
VCC-0.1 (min.)
DC Characteristic
Table 4-2: Input / Output Voltage
DC Characteristic
P/N: AN-0373
2
Ver.1, Mar.14, 2015
APPLICATION NOTE
Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC
5. Package Pin/Ball Definition
The Micron MT29F2G08ABBEA can be replaced by the Macronix MX30UF2G18AC without pin
conflicts. The 48-TSOP pin #38 is designated “PT” which is a Chip Protection function on the
MX30UF2G18AC-TI, and on the MT29F2G08ABBEA it is designated as “LOCK” with a similar
function. If this pin has been left floating or is driven low, then there is no issue as the Macronix
PT pin has a weak internal pull down. This is true for the Macronix 63-VFBGA PT ball E3, and
Micron LOCK ball G5 as well. Tables 5-1 and 5-2 show differences in pin assignments between
the Macronix and Micron devices.
The 48-TSOP Package physical dimensions are similar to each other.
Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison (x8)
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MX30UF2G18AC-TI
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
NC
NC
NC
IO7
IO6
IO5
IO4
NC
VCC*1
PT
VCC
VSS
NC
VCC*1
NC
IO3
IO2
IO1
IO0
NC
NC
NC
VSS*1
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
Pin38: PT
Note:
1. These pins might not be connected internally. However it is recommended to connect
these pins to power(or ground) as designated for ONFI compatibility.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MT29F2G08ABBEAWP
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
DNU
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
VCC*1
LOCK
VCC
VSS
NC
VCC*1
NC
I/O3
I/O2
I/O1
IO0
NC
NC
NC
VSS*1
Pin38: DNU
Pin47: DNU
Table 5-1: 48-TSOP Package Pin Definition
Brand
Macronix
Micron
Part Name
MX30UF2G18AC-TI
MT29F2G08ABBEAWP
#38 pin
PT*1
LOCK
#47 pin
NC
DNU
Note
Pin functions are compatible.
If pins are left unconnected, both
pin functions are compatible
Note: PT pin has internal weak pull low. It enables the protection function if active.
Please refer to the datasheet for more details.
P/N: AN-0373
3
Ver.1, Mar.14, 2015
APPLICATION NOTE
Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC
The 6x8mm 48-VFBGA and 9x11mm 63-VFBGA pinouts and ball pitch are compatible. The ball
diameter of the Macronix 48-VFBGA is 0.40mm, which is smaller than Micron’s 0.45mm ball used
on the 63-VFBGA. For detailed information, please refer to the individual datasheets.
Figure 5-2: 48-VFBGA vs 63-VFBGA Package and Ball Layout Comparison
MX30UF2G18AC-XQI (6 x 8 x 1 mm)
1
2
3
4
5
MT29F2G08ABBEAH4 (9 x 11 x 1 mm)
6
1
2
A
NC
NC
B
NC
3
4
5
6
7
8
A
WP#
ALE
VSS
CE#
WE#
R/B#
C
WP#
ALE
VSS
CE#
WE#
R/B#
B
NC
RE#
CLE
NC
NC
NC
D
VCC
*1
RE#
CLE
NC
NC
NC
C
NC
NC
NC
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
D
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
VSS
*1
NC
E
NC
NC
PT
NC
NC
NC
G
DNU
VCC
*1
LOCK
NC
NC
DNU
F
NC
IO0
NC
NC
NC
VCC
H
NC
I/O0
NC
NC
NC
Vcc
G
NC
IO1
NC
VCC
IO5
IO7
J
NC
I/O1
NC
Vcc
I/O5
I/O7
H
VSS
IO2
IO3
IO4
IO6
VSS
K
Vss
I/O2
I/O3
I/O4
I/O6
Vss
9
10
NC
NC
NC
NC
L
NC
NC
NC
NC
M
NC
NC
NC
NC
E3: PT
G3: DNU
G5: LOCK
G8: DNU
Note:
1. These pins might not be connected internally. However it is recommended to
connect these pins to power(or ground) as designated for ONFI compatibility.
Table 5-2: 63-VFBGA Package Ball Definition
Macronix
Micron
MX30UF2G18AC-XQI
MT29F2G08ABBEAH4
ball E3 = PT*1
ball G5 = LOCK
Note
Pin functions are compatible.
balls E1 and E6 = NC balls G3 and G8 = DNU
If pins are left unconnected,
both pin functions are compatible
Note: PT pin has internal weak pull low. It enables the protection function if active.
Please refer to the datasheet for more details.
P/N: AN-0373
4
Ver.1, Mar.14, 2015
APPLICATION NOTE
Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC
6. Command Set
Basic command sets and status checking methods are similar (Table 6-1 and 6-2). Micron offers
additional non-ONFI two plane commands, as well as a few commands used for block protection
which are not listed in Table 6-2 (see datasheet for details).
Table 6-1: Command Table
Macronix MX30UF2G18AC
1st Cycle
2nd Cycle
85h
05h
E0h
00h
31h
00h
30h
3Fh
90h
FFh
80h
10h
80h
15h
60h
D0h
70h
ECh
EDh
EFh
EEh
78h
7Ah
Micron MT29F2G08ABBEA
1st Cycle
2nd Cycle
85h
05h
E0h
00h
31h
00h
30h
3Fh
90h
FFh
80h
10h
80h
15h
60h
D0h
70h
ECh
EDh
EFh
EEh
78h
7Ah
Table 6-2: Two-Plane Command Table
Macronix MX30UF2G18AC
Command
1st
2nd
3rd
4th
Micron MT29F2G08ABBEA
Command
Random Data Input
Random Data Output
Cache Read Begin
Read Mode
Cache Read End
Read ID
Reset
Page Program
Cache Program
Block Erase
Read Status
Read Parameter Page
Unique ID Read
Set Feature
Get Feature
Status Enhance Read
Block Protection Status Read
ONFI 2 Plane Program
ONFI 2 Plane Cache Program
ONFI 2 Plane Block Erase
P/N: AN-0373
Cycle
Cycle
Cycle
Cycle
1st
Cycle
2nd
Cycle
3rd
Cycle
4th
Cycle
80h
80h
60h
11h
11h
D1h
80h
80h
60h
10h
15h
D0h
80h
80h
60h
11h
11h
D1h
80h
80h
60h
10h
15h
D0h
5
Ver.1, Mar.14, 2015
APPLICATION NOTE
Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC
6-2 Status Register
When a flash Read, Program, or Erase operation is in progress, either the “Ready/Busy#
Pin Checking” or “Status Output Checking” method may be used to monitor the operation.
Both are standard NAND flash algorithms and can be used for both device families. Table
6-3 shows that Status Output content provided by the Read Status command (70h) is
compatible. Table 6-4 shows that Two–plane Status provided by the Status Enhance Read
command (78h) is compatible. If internal ECC is enabled in the Micron device, SR[3]
indicates that up to 4-bits have been corrected and that the page should be rewritten. This
function is not needed for the Macronix device, as it does not support internal ECC
generation. Macronix also provides an internal ECC (or ECC Free) part with a different
part number.
Table 6-3: Status Output
Status Output
Macronix MX30UF2G18AC
SR[0]
PGM/ERS/RAD status: Pass/Fail
Micron MT29F2G08ABBEA
PGM/ERS/READ status: Pass/Fail
SR[1]
Cache Program status: Pass/Fail
Cache Program status: Pass/Fail
SR[2]
Reserved
Reserved
SR[3]
Reserved
Rewrite Recommended
SR[4]
SR[6]
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
SR[7]
Write Protect
Write Protect
SR[5]
Table 6-4: Two-plane Status Output
Status Output
Macronix MX30UF2G18AC
Micron MT29F2G08ABBEA
Selected Plane PGM/ERS/READ
SR[2]
Selected Plane PGM/ERS/READ
status: Pass/Fail
Selected Plane Cache Program status:
Pass/Fail
Reserved
status: Pass/Fail
Selected Plane Cache Program status:
Pass/Fail
Reserved
SR[3]
Reserved
Reserved
SR[4]
SR[6]
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
SR[7]
Write Protect
Write Protect
SR[0]
SR[1]
SR[5]
P/N: AN-0373
6
Ver.1, Mar.14, 2015
APPLICATION NOTE
Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC
7. Read ID Command
The ID codes of the MT29F2G08ABBEA and MX30UF2G18AC are identical except for the first
byte which indicates the Manufacturer (Table 7-1). The same command set is used to read both
IDs.
Table 7-1: Manufacturer and Device IDs
ID code
Macronix MX30UF2G18AC
C2h/AAh/90h/15h/06h
2Ch/AAh/90h/15h/06h
Manufacturer Code
Manufacturer Code
Device Identifier
Device Identifier
bit 1- 0
Number of Die per Chip Enable
Number of Die per Chip Enable
bit 3 - 2
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Program
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Program
Page Size (exclude Spare Area)
Page Size (exclude Spare Area)
Size of Spare Area (Byte per 512Byte)
Size of Spare Area (Byte per 512Byte)
bit 7, 3
Sequential Read Cycle Time (tRC)
Serial Access Time (tRC)
bit 5 - 4
Block Size (exclude Spare Area)
Block Size (exclude Spare Area)
Organization
Organization
bit 1- 0
ECC Level Requirement
ECC Level Requirement
bit 3 - 2
Number of Plane per CE
Number of Plane per CE
bit 6 - 4
Plane Size
Plane Size
bit 7
Reserved
Internal ECC Enabled/Disabled
Value
1st Byte
nd
2 Byte
rd
3
Byte
bit 5 - 4
bit 6
bit 7
bit 1- 0
bit 2
4th
Byte
bit 6
5th
Byte
Micron MT29F2G08ABBEA
P/N: AN-0373
7
Ver.1, Mar.14, 2015
APPLICATION NOTE
Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC
8. Power-Up Timing
Macronix and Micron® power-up sequences are similar, but the timing is slightly different. Although
both devices use 1.7V (VCC min.) as the start point, timing references are different. Check the
system timing to determine if adjustments are needed.
Table 8-1: Power-Up Timing
H/W Timing Characteristic
Vcc (min.) to WE# low
Vcc (min.) to R/B# high
Vcc (min.) to R/B# low
Vcc ramp start to R/B# low
Macronix MX30UF2G18AC
1ms (max.)*1
N/A
10us (max.)
N/A
Micron MT29F2G08ABBEA
N/A
100us (max.)
10us (max.)
50us (min.)
Note: Micron requires Reset command as first command, but Macronix does not.
Macronix requires an initialization delay during power on.
Vcc(min.)
VCC
WE#
R/B#
Figure 8-1: Power-Up Timing
P/N: AN-0373
8
Ver.1, Mar.14, 2015
APPLICATION NOTE
Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC
9. Block Protection
Both NAND flash have the ability to Hardware Write Protect the entire array if the WP# pin is low.
Both flashes also have the ability to lock contiguous groups of blocks, but the methods are
different.
Micron uses their LOCK pin to enable the Block Protect commands at power up, which can be
used to define an address range of blocks to be protected.
Similarly, Macronix uses the PT pin (if high at power-up) to enable BP (Block Protect) bits. If
enabled, the entire array comes up protected by volatile BP bits. The BP bits can be changed to
protect or unprotect different regions of the memory array using the “Set Feature” cmd = EFh with
Feature Adr = A0h and the data value of the BP bit setting. Additionally, we can lock the BP bits by
setting the “SP” Solid Protect Bit = 1. Once the SP bit has been set, the only way to unlock the BP
bits, is with the next power cycle. The SP bit can be set = 1, with the same method used to set the
BP bits, using Set Feature command EFh with feature adr = A0h+data. To verify the Sub-Feature
data is set correctly, we can read the data value with the Get Feature cmd = EEh + Feature Adr
A0h (to read BP bit setting). We can check if a block is protected or if the SP bit is set, using the
“Block Protect Status Read” cmd = 7Ah + Block Address.
10. Summary
Macronix MX30UF2G18AC and Micron® MT29F2G08ABBEA NAND share the same basic Read,
Program, and Erase commands, have similar features and pinouts, have the same Page, Block,
Spare Area size, both require 4bit ECC, and are both ONFI 1.0 compatible. Overall, device
migration may require minimal or no firmware modifications. If the Micron internal ECC generation
function is required, Macronix may offer this function as well, in a different part number (please
contact Macronix sales).
11. References
Table 11-1 shows the datasheet versions used for comparison in this application note. For
the most current, detailed Macronix specification, please refer to the Macronix website at
http://www.macronix.com
Table 11-1: Datasheet Version
Datasheet
Location
MX30UF2G18AC
MT29F2G08ABBEA
Date Issue
Jan. 15, 2015
Oct. 2012
Website
-
Revision
Rev. 0.00
Rev. O
Note: Macronix data sheet is subject to change without notice.
P/N: AN-0373
9
Ver.1, Mar.14, 2015
APPLICATION NOTE
Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC
12. Appendix
Cross Reference Table 12-1 shows basic part number and package information for the Macronix
MX30UF2G18AC and Micron® MT29F2G08ABBEA products.
Table 12-1: Part Number Cross Reference
Macronix Part No.
Micron Part No.
Package
Dimension
12x20mm
Micron 63-VFBGA= 9x11mm
Macronix 48-VFBGA = 6x8mm
MX30UF2G18AC-TI
MT29F2G08ABBEAWP
48-TSOP
MX30UF2G18AC-XQI
MT29F2G08ABBEAH4
VFBGA
13. Revision History
Revision Description
1.0
Initial Release
P/N: AN-0373
Date
Mar. 14, 2015
10
Ver.1, Mar.14, 2015
APPLICATION NOTE
Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC
Except for customized products which have been expressly identified in the applicable agreement,
Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial,
personal, and/or household applications only, and not for use in any applications which may, directly or
indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are
used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said
Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and
Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen
therefrom.
Copyright© Macronix International Co., Ltd. 2015. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit,
NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC,
Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The
names and brands of third party referred thereto (if any) are for identification purposes only.
For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com
P/N: AN-0373
11
Ver.1, Mar.14, 2015