Preliminary APPLICATION NOTE Migrating MX30UF2G16(18)AB to MX30UF2G16(18)AC 1. Introduction This application note is a guide for migrating the Macronix MX30UF2G16(18)AB to the MX30UF2G16(18)AC. The document does not provide detailed information on the individual 1.8V, 2Gb NAND non-volatile memory devices, but highlights the major similarities and differences between them. The comparison covers the general features, performance, command codes and other differences. The information in this document is based on datasheets listed in Section 8. Newer versions of the datasheets may override the contents of this document. 2. General Features Both flash device families have similar features and functions as shown in Table 2-1. Feature differences are highlighted in Bold Italic type in the table. Table 2-1. Key Feature Comparison Part Name MX30UF2G16(18)AB MX30UF2G16(18)AC 1.7V-1.95V 1.7V-1.95V x16 (x8) x16 (x8) -40°C to 85°C -40°C to 85°C ONFI 1.0 Compliant ONFI 1.0 Compliant Page Size (1K+32)W (2K+64)B (1K+32)W (2K+64)B Block Size (64K + 2K)W (128K +4K)B (64K +2K)W (128K +4K)B Cache Read Supported Supported Cache Program Supported Supported ECC requirement 4bit/256W 4bit/528B 4bit/256W 4bit/528B OTP 30 Pages 30 Pages ONFI Standard ONFI Standard By setting Boundary Address By setting BPx Bits Voltage Bus Width Operating Temperature Interface Unique ID Block Protection P/N: AN0391 Guaranteed Good Blocks at Shipping Block #0 Data Retention 10 Years 10 Years Endurance 100K Cycles 100K Cycles Packages 48TSOP (12x20mm) 63-VFBGA (9x11mm) 48TSOP (12x20mm) 48-VFBGA (6x8mm) 1 Block#0 REV. 1, JUL. 09, 2015 Preliminary APPLICATION NOTE 3. Electrical Performance Both flash device families have similar performance as shown in Table 3-1. Performance differences are highlighted in Bold Italic type in the table. Table 3-1. Key Performance Comparison Part Name Performance Access Time Random (tR) Cache Read Busy time Sequential (tRC) Page Program Partial-Page Programs P/N: AN0391 Min. Typ. Max. Min. Typ. - - 25us - - 25us - 2 25us - 5 25us - - 25ns - - 25ns Max. 320us 600us - 320us 600us - 5us 700us - 5us 600us Block - 1ms 3.5ms - 1ms 3.5ms Standby (TTL) - - 1mA - - 1mA Standby (CMOS) - 10uA 50uA - 10uA 50uA Active Read - 20mA 30mA - 20mA 30mA Active Program - 23mA 30mA - 23mA 30mA Active Erase - 23mA 30mA - 23mA 30mA Input Leakage - - +/- 10uA - - +/- 10uA Output Leakage - - +/- 10uA - - +/- 10uA NOP - - 4 cycles - - 4 cycles Busy time Current Consumption MX30UF2G16(18)AC - Program Time Cache Program Erase Time MX30UF2G16(18)AB 2 REV. 1, JUL. 09, 2015 Preliminary APPLICATION NOTE 4. Command Set Command sets are the same except for Block Protection related commands (23h, 24h, 2Ah, 2Ch) which are not supported by the MX30UF2G16(18)AC (highlighted in Bold Italic type in Table 4-1). If Write Protection is not used, then the command sets are the same. Table 4-1. Command Set Part Name Command Description MX30UF2G16(18)AB MX30UF2G16(18)AC 1st cmd Cycle 2nd cmd Cycle 1st cmd Cycle 2nd cmd Cycle Read 00h 30h 00h 30h Random Data Input 85h - 85h - Random Read Data Output 05h E0h 05h E0h Cache Read Begin 00h 31h 00h 31h Cache Read Sequential 31h - 31h - Cache Read End 3Fh Read ID 90h - 90h - Parameter Page Read (ONFI) ECh - ECh - Read Unique ID (ONFI) EDh - EDh - Set Features (ONFI) EFh - EFh - Get Features (ONFI) EEh - EEh - Reset FFh - FFh - Page Program 80h 10h 80h 10h Cache Program 80h 15h 80h 15h Block Erase 60h D0h 60h D0h Block Un-Protect Lower 23h - - - Block Un-Protect Upper 24h - - - Block Protect 2Ah - - - Block Solid-Protect 2Ch - - - Status Read 70h - 70h - Status Enhanced Read (ONFI) 78h - 78h - Block Protection Status Read 7Ah - 7Ah - 3Fh Two-plane Program (ONFI) 80h-11h-80h-10h 80h-11h-80h-10h Two-plane Cache Program (ONFI) 80h-11h-80h-15h 80h-11h-80h-15h Two-plane Block Erase (ONFI) 60h-D1h-60h-D0h 60h-D1h-60h-D0h Note: The IO15-IO8 should be "0" while writing command code for the x16 NAND device. P/N: AN0391 3 REV. 1, JUL. 09, 2015 Preliminary APPLICATION NOTE Write Protection Comparison The entire array of either part can be hardware write protected if the WP# pin is held low for greater than 100ns. For the MX30UF2G16(18)AB, if the PT pin is high at power-on, the whole chip is protected, and the Block Protect command set is enabled. To unprotect, use 23h-24h + block address with invert bit and WP# pin high. To re-protect all unprotected blocks, use 2Ah command. To prevent any further changes in Block Protection status, issue “Solid Protect” command = 2Ch with PT pin high and WP# pin high (only way to unlock is the next power cycle). For the MX30UF2G16(18)AC, if the PT pin is high at power-up, the entire chip comes up protected by volatile BP bits = 1. We can unprotect and re-protect portions of the array if WP# =1 and using the “Set Feature” command EFh with Feature Address = A0h and BP bits data value. We can lock the BP bits by setting the “SP” Solid Protect Bit = 1, and the only way to unlock is the next power cycle. The SP bit can be set = 1, similar to setting the BP bits, using SetFeature command = EFh with feature address = A0h+data. To verify the subfeature data is set correctly, we can Read the data value with GetFeature command EEh + Feature Address A0h. (to read BP bit setting). We can check if block is protected or if SP bit is set, using “Block Protect Status Read” command = 7Ah + Block Address. Please see appropriate device datasheet for more detailed description of Write Protect regions and command sequence. Set Feature Operation The feature address of the feature set operation is different. The MX30UF2G16(18)AB uses 01h for timing mode setting, 80h for I/O drive strength configuration, and 81h for R/B# pull-down strength configuration, all of which are not supported by MX30UF2G16(18)AC. The MX30UF2G16(18)AC defines A0h for block protection operation which the MX30UF2G16(18)AB does not. The differences are highlighted in Bold Italic type in the Table 4-2. Please refer to the Macronix datasheet for additional details. Table 4-2: Definition of Feature Address Feature description Feature Address MX30UF2G16(18)AB MX30UF2G16(18)AC Timing Mode Setting Programmable I/O Drive Strength 01h N/A 80h N/A Programmable R/B# pull-down Strength 81h N/A Array Operation Mode 90h 90h N/A A0h 00h, 02-7Fh, 82h-8Fh, 91h-FFh 00h-8Fh, 91h-9Fh, A1h-FFh Block Protection Operation Reserved 5. Status Register Comparison Status Register bit functions are identical. 6. Package Pin/Ball Definition The MX30UF2G16(18)AB can be replaced by the MX30UF2G16(18)AC without pin conflicts. Additionally, both devices have the same physical dimensions when the 12x20mm 48-TSOP package is used. The 48-VFBGA of the MX30UF2G16AC-XQI can be used to replace the 63-VFBGA of the MX30UF2G16AB-XKI. This is because the 48 signal pins in the center of both packages are the same (same ball signal assignment, ball pitch, and similar ball size). Only the No Connects in the corners of the 63-VFBGA (used for mechanical support) are different, as shown in Figure 6-3. P/N: AN0391 4 REV. 1, JUL. 09, 2015 Preliminary APPLICATION NOTE Figure 6-1. Ball assignment of 63-VFBGA (9x11mm) MX30UF2G16AB-XKI 1 2 A NC NC B NC 3 4 5 6 8 7 C WP# ALE Vss CE# WE# R/B# D Vcc 1 RE# CLE NC NC NC E NC NC NC NC NC NC F NC NC NC NC Vss 1 NC G NC 1 Vcc PT I/O13 I/O15 NC H I/O8 I/O0 I/O10 I/O12 I/O14 Vcc J I/O9 IO1 I/O11 Vcc IO5 IO7 K Vss IO2 IO3 IO4 I/O6 Vss 9 10 NC NC NC NC 1 2 4 5 A WP# ALE Vss CE# WE# R/B# B Vcc RE# CLE NC NC NC C NC NC NC NC NC NC NC NC NC NC Vss NC NC Vcc PT I/O13 I/O15 NC F I/O8 I/O0 I/O10 I/O12 I/O14 Vcc G I/O9 IO1 I/O11 Vcc IO5 IO7 H Vss IO2 IO3 IO4 I/O6 Vss D E L NC NC NC NC M NC NC NC NC Figure 6-3. Bottom view of 63-VFBGA (9x11mm) P/N: AN0391 Figure 6-2.Ball assignment of 48-VFBGA (6x8mm) MX30UF2G16AC-XQI 5 3 6 Figure 6-4. Bottom view of 48-VFBGA (6x8mm) REV. 1, JUL. 09, 2015 Preliminary APPLICATION NOTE Table 6. VFBGA Package Physical Dimension Symbol MX30UF2G16(18)AB MX30UF2G16(18)AC Unit (mm) Min. Nom. Max. Min. Nom. Max. A1 Ball Diameter b D D1 E E1 Ball Pitch e 0.25 0.30 0.40 0.25 0.30 0.35 0.40 0.45 0.50 0.35 0.40 0.45 8.90 9.00 9.10 5.90 6.00 6.10 -7.2 --4.00 -- 10.90 11.00 11.10 7.90 8.00 8.10 -8.80 --5.60 -- -0.80 --0.80 -- 7. Device Identification The ID codes of the MX30UF2G16(18)AB and MX30UF2G16(18)AC are identical. 8. Reference Table 8-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix website at http://www.macronix.com. Table 8-1 Datasheet Versions Datasheet Location Date Issued Revision MX30UF2G16(18)AB Website Mar. 2015 Rev. 1.2 MX30UF2G16(18)AC Website Jun. 2015 Rev. 0.01 9. Summary The Macronix MX30UF2G16(18)AB and MX30UF2G16(18)AC NAND flash share the same basic Read, Program, and Erase commands. Both are ONFI compliant, and have the same block, page, spare area size, and same 4-bit ECC requirement. There are differences in the Write Protection implementation that will require firmware changes--if the feature is used. If the 48-TSOP package is used, there are no changes to package size or pinout. If the VFBGA package is used, while signal ball locations are identical, mechanical supports have been eliminated to create a smaller package form factor. Please review your physical PCB footprint to ensure that no changes are need to use the smaller 48-VFBGA. 10. Part Number Cross-Reference Table 10-1: Part Number Cross Reference Bus Width x8 x16 Package Part Number Migrating Part Number 48-TSOP MX30UF2G18AB-TI MX30UF2G18AB-XKI (63-VFBGA) MX30UF2G16AB-XKI (63-VFBGA) MX30UF2G18AC-TI MX30UF2G18AC-XQI (48-VFBGA) MX30UF2G16AC-XQI (48-VFBGA) VFBGA VFBGA 11.Revision History P/N: AN0391 Revision No. Description Page Date Rev. 1 Initial Release All JUL.09, 2015 6 REV. 1, JUL. 09, 2015 Preliminary APPLICATION NOTE Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2015. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Audio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. P/N: AN0391 7 REV. 1, JUL. 09, 2015