Migrating MX30UF2G16(18)AB to MX30UF2G16(18)AC

Preliminary
APPLICATION NOTE
Migrating MX30UF2G16(18)AB to MX30UF2G16(18)AC
1. Introduction
This application note is a guide for migrating the Macronix MX30UF2G16(18)AB to the MX30UF2G16(18)AC.
The document does not provide detailed information on the individual 1.8V, 2Gb NAND non-volatile memory
devices, but highlights the major similarities and differences between them. The comparison covers the general
features, performance, command codes and other differences.
The information in this document is based on datasheets listed in Section 8. Newer versions of the datasheets
may override the contents of this document.
2. General Features
Both flash device families have similar features and functions as shown in Table 2-1. Feature differences are
highlighted in Bold Italic type in the table.
Table 2-1. Key Feature Comparison
Part Name
MX30UF2G16(18)AB
MX30UF2G16(18)AC
1.7V-1.95V
1.7V-1.95V
x16 (x8)
x16 (x8)
-40°C to 85°C
-40°C to 85°C
ONFI 1.0 Compliant
ONFI 1.0 Compliant
Page Size
(1K+32)W
(2K+64)B
(1K+32)W
(2K+64)B
Block Size
(64K + 2K)W
(128K +4K)B
(64K +2K)W
(128K +4K)B
Cache Read
Supported
Supported
Cache Program
Supported
Supported
ECC requirement
4bit/256W
4bit/528B
4bit/256W
4bit/528B
OTP
30 Pages
30 Pages
ONFI Standard
ONFI Standard
By setting Boundary Address
By setting BPx Bits
Voltage
Bus Width
Operating Temperature
Interface
Unique ID
Block Protection
P/N: AN0391
Guaranteed Good Blocks at
Shipping
Block #0
Data Retention
10 Years
10 Years
Endurance
100K Cycles
100K Cycles
Packages
48TSOP (12x20mm)
63-VFBGA (9x11mm)
48TSOP (12x20mm)
48-VFBGA (6x8mm)
1
Block#0
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Preliminary
APPLICATION NOTE
3. Electrical Performance
Both flash device families have similar performance as shown in Table 3-1. Performance differences are
highlighted in Bold Italic type in the table.
Table 3-1. Key Performance Comparison
Part Name
Performance
Access Time
Random (tR)
Cache Read
Busy time
Sequential (tRC)
Page Program
Partial-Page
Programs
P/N: AN0391
Min.
Typ.
Max.
Min.
Typ.
-
-
25us
-
-
25us
-
2
25us
-
5
25us
-
-
25ns
-
-
25ns
Max.
320us
600us
-
320us
600us
-
5us
700us
-
5us
600us
Block
-
1ms
3.5ms
-
1ms
3.5ms
Standby (TTL)
-
-
1mA
-
-
1mA
Standby (CMOS)
-
10uA
50uA
-
10uA
50uA
Active Read
-
20mA
30mA
-
20mA
30mA
Active Program
-
23mA
30mA
-
23mA
30mA
Active Erase
-
23mA
30mA
-
23mA
30mA
Input Leakage
-
-
+/- 10uA
-
-
+/- 10uA
Output Leakage
-
-
+/- 10uA
-
-
+/- 10uA
NOP
-
-
4 cycles
-
-
4 cycles
Busy time
Current
Consumption
MX30UF2G16(18)AC
-
Program Time Cache Program
Erase Time
MX30UF2G16(18)AB
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REV. 1, JUL. 09, 2015
Preliminary
APPLICATION NOTE
4. Command Set
Command sets are the same except for Block Protection related commands (23h, 24h, 2Ah, 2Ch) which are
not supported by the MX30UF2G16(18)AC (highlighted in Bold Italic type in Table 4-1). If Write Protection is
not used, then the command sets are the same.
Table 4-1. Command Set
Part Name
Command Description
MX30UF2G16(18)AB
MX30UF2G16(18)AC
1st cmd
Cycle
2nd cmd
Cycle
1st cmd
Cycle
2nd cmd
Cycle
Read
00h
30h
00h
30h
Random Data Input
85h
-
85h
-
Random Read Data Output
05h
E0h
05h
E0h
Cache Read Begin
00h
31h
00h
31h
Cache Read Sequential
31h
-
31h
-
Cache Read End
3Fh
Read ID
90h
-
90h
-
Parameter Page Read (ONFI)
ECh
-
ECh
-
Read Unique ID (ONFI)
EDh
-
EDh
-
Set Features (ONFI)
EFh
-
EFh
-
Get Features (ONFI)
EEh
-
EEh
-
Reset
FFh
-
FFh
-
Page Program
80h
10h
80h
10h
Cache Program
80h
15h
80h
15h
Block Erase
60h
D0h
60h
D0h
Block Un-Protect Lower
23h
-
-
-
Block Un-Protect Upper
24h
-
-
-
Block Protect
2Ah
-
-
-
Block Solid-Protect
2Ch
-
-
-
Status Read
70h
-
70h
-
Status Enhanced Read (ONFI)
78h
-
78h
-
Block Protection Status Read
7Ah
-
7Ah
-
3Fh
Two-plane Program (ONFI)
80h-11h-80h-10h
80h-11h-80h-10h
Two-plane Cache Program
(ONFI)
80h-11h-80h-15h
80h-11h-80h-15h
Two-plane Block Erase (ONFI)
60h-D1h-60h-D0h
60h-D1h-60h-D0h
Note: The IO15-IO8 should be "0" while writing command code for the x16 NAND device.
P/N: AN0391
3
REV. 1, JUL. 09, 2015
Preliminary
APPLICATION NOTE
Write Protection Comparison
The entire array of either part can be hardware write protected if the WP# pin is held low for greater than 100ns.
For the MX30UF2G16(18)AB, if the PT pin is high at power-on, the whole chip is protected, and the Block Protect
command set is enabled. To unprotect, use 23h-24h + block address with invert bit and WP# pin high.
To re-protect all unprotected blocks, use 2Ah command. To prevent any further changes in Block Protection status,
issue “Solid Protect” command = 2Ch with PT pin high and WP# pin high (only way to unlock is the next power
cycle).
For the MX30UF2G16(18)AC, if the PT pin is high at power-up, the entire chip comes up protected by volatile BP
bits = 1. We can unprotect and re-protect portions of the array if WP# =1 and using the “Set Feature” command EFh
with Feature Address = A0h and BP bits data value. We can lock the BP bits by setting the “SP” Solid Protect Bit =
1, and the only way to unlock is the next power cycle. The SP bit can be set = 1, similar to setting the BP bits, using
SetFeature command = EFh with feature address = A0h+data. To verify the subfeature data is set correctly, we can
Read the data value with GetFeature command EEh + Feature Address A0h. (to read BP bit setting). We can check
if block is protected or if SP bit is set, using “Block Protect Status Read” command = 7Ah + Block Address.
Please see appropriate device datasheet for more detailed description of Write Protect regions and command
sequence.
Set Feature Operation
The feature address of the feature set operation is different. The MX30UF2G16(18)AB uses 01h for timing mode
setting, 80h for I/O drive strength configuration, and 81h for R/B# pull-down strength configuration, all of which are
not supported by MX30UF2G16(18)AC. The MX30UF2G16(18)AC defines A0h for block protection operation which
the MX30UF2G16(18)AB does not. The differences are highlighted in Bold Italic type in the Table 4-2. Please refer
to the Macronix datasheet for additional details.
Table 4-2: Definition of Feature Address
Feature description
Feature Address
MX30UF2G16(18)AB
MX30UF2G16(18)AC
Timing Mode Setting
Programmable I/O Drive Strength
01h
N/A
80h
N/A
Programmable R/B# pull-down Strength
81h
N/A
Array Operation Mode
90h
90h
N/A
A0h
00h, 02-7Fh, 82h-8Fh, 91h-FFh
00h-8Fh, 91h-9Fh, A1h-FFh
Block Protection Operation
Reserved
5. Status Register Comparison
Status Register bit functions are identical.
6. Package Pin/Ball Definition
The MX30UF2G16(18)AB can be replaced by the MX30UF2G16(18)AC without pin conflicts. Additionally,
both devices have the same physical dimensions when the 12x20mm 48-TSOP package is used. The
48-VFBGA of the MX30UF2G16AC-XQI can be used to replace the 63-VFBGA of the MX30UF2G16AB-XKI.
This is because the 48 signal pins in the center of both packages are the same (same ball signal assignment,
ball pitch, and similar ball size). Only the No Connects in the corners of the 63-VFBGA (used for mechanical
support) are different, as shown in Figure 6-3.
P/N: AN0391
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REV. 1, JUL. 09, 2015
Preliminary
APPLICATION NOTE
Figure 6-1. Ball assignment of 63-VFBGA (9x11mm)
MX30UF2G16AB-XKI
1
2
A
NC
NC
B
NC
3
4
5
6
8
7
C
WP#
ALE
Vss
CE#
WE#
R/B#
D
Vcc
1
RE#
CLE
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
Vss
1
NC
G
NC
1
Vcc
PT
I/O13
I/O15
NC
H
I/O8
I/O0
I/O10
I/O12
I/O14
Vcc
J
I/O9
IO1
I/O11
Vcc
IO5
IO7
K
Vss
IO2
IO3
IO4
I/O6
Vss
9
10
NC
NC
NC
NC
1
2
4
5
A
WP#
ALE
Vss
CE#
WE#
R/B#
B
Vcc
RE#
CLE
NC
NC
NC
C
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
Vss
NC
NC
Vcc
PT
I/O13
I/O15
NC
F
I/O8
I/O0
I/O10
I/O12
I/O14
Vcc
G
I/O9
IO1
I/O11
Vcc
IO5
IO7
H
Vss
IO2
IO3
IO4
I/O6
Vss
D
E
L
NC
NC
NC
NC
M
NC
NC
NC
NC
Figure 6-3. Bottom view of 63-VFBGA (9x11mm)
P/N: AN0391
Figure 6-2.Ball assignment of 48-VFBGA (6x8mm)
MX30UF2G16AC-XQI
5
3
6
Figure 6-4. Bottom view of 48-VFBGA (6x8mm)
REV. 1, JUL. 09, 2015
Preliminary
APPLICATION NOTE
Table 6. VFBGA Package Physical Dimension
Symbol
MX30UF2G16(18)AB
MX30UF2G16(18)AC
Unit (mm)
Min.
Nom.
Max.
Min.
Nom.
Max.
A1
Ball Diameter
b
D
D1
E
E1
Ball Pitch
e
0.25
0.30
0.40
0.25
0.30
0.35
0.40
0.45
0.50
0.35
0.40
0.45
8.90
9.00
9.10
5.90
6.00
6.10
-7.2
--4.00
--
10.90
11.00
11.10
7.90
8.00
8.10
-8.80
--5.60
--
-0.80
--0.80
--
7. Device Identification
The ID codes of the MX30UF2G16(18)AB and MX30UF2G16(18)AC are identical.
8. Reference
Table 8-1 shows the datasheet versions used for comparison in this application note. For the most current,
detailed Macronix specification, please refer to the Macronix website at http://www.macronix.com.
Table 8-1 Datasheet Versions
Datasheet
Location
Date Issued
Revision
MX30UF2G16(18)AB
Website
Mar. 2015
Rev. 1.2
MX30UF2G16(18)AC
Website
Jun. 2015
Rev. 0.01
9. Summary
The Macronix MX30UF2G16(18)AB and MX30UF2G16(18)AC NAND flash share the same basic Read,
Program, and Erase commands. Both are ONFI compliant, and have the same block, page, spare area
size, and same 4-bit ECC requirement. There are differences in the Write Protection implementation that will
require firmware changes--if the feature is used. If the 48-TSOP package is used, there are no changes to
package size or pinout. If the VFBGA package is used, while signal ball locations are identical, mechanical
supports have been eliminated to create a smaller package form factor. Please review your physical PCB
footprint to ensure that no changes are need to use the smaller 48-VFBGA.
10. Part Number Cross-Reference
Table 10-1: Part Number Cross Reference
Bus Width
x8
x16
Package
Part Number
Migrating Part Number
48-TSOP
MX30UF2G18AB-TI
MX30UF2G18AB-XKI
(63-VFBGA)
MX30UF2G16AB-XKI
(63-VFBGA)
MX30UF2G18AC-TI
MX30UF2G18AC-XQI
(48-VFBGA)
MX30UF2G16AC-XQI
(48-VFBGA)
VFBGA
VFBGA
11.Revision History
P/N: AN0391
Revision No.
Description
Page
Date
Rev. 1
Initial Release
All
JUL.09, 2015
6
REV. 1, JUL. 09, 2015
Preliminary
APPLICATION NOTE
Except for customized products which have been expressly identified in the applicable agreement, Macronix's products
are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications
only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property
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Copyright© Macronix International Co., Ltd. 2015. All rights reserved, including the trademarks and tradename thereof,
such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE,
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MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.
P/N: AN0391
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REV. 1, JUL. 09, 2015