APPLICATION NOTE Migrating from MX30LF1G08AA to MX30LF1G18AC 1. Introduction This application note is a guide for migrating from the Macronix MX30LF1G08AA to the MX30LF1G18AC SLC 3V NAND Flash. The document does not provide detailed information on the individual devices, but highlights the major similarities and differences between them. The comparison covers the general features, performance, command codes and other differences. The information in this document is based on datasheets listed in Section 8. Newer versions of the datasheets may override the contents of this document. 2. General Features Both flash device families have similar features and functions as shown in Table 2-1. Feature differences are highlighted in Bold Italic type in the table. Table 2-1. Key Feature Comparison Part Name MX30LF1G08AA MX30LF1G18AC 2.7V-3.6V 2.7V-3.6V x8 x8 -40°C~85°C -40°C~85°C -- ONFI 1.0 Compliant (2K+64)B (2K+64)B (128K +4K)B (128K +4K)B (2K+64)B (2K+64)B 1bit/528B 4bit/528B OTP -- 30 Pages Unique ID -- ONFI Standard Block Protection -- Yes Guaranteed Good Blocks at Shipping Block#0 Block#0 Data Retention 10 Years 10 Years Endurance 100K Cycles 100K Cycles Packages 48TSOP (12x20mm) 63-VFBGA (9x11mm) 48TSOP (12x20mm) 63-VFBGA (9x11mm) Voltage Bus Width Operating Temperature Interface Page Size Block Size Cache Read/Program (note) ECC requirement Note: The Cache Read Operation is different; please refer to the individual datasheets. P/N: AN0351 1 REV. 2, APR. 15, 2015 APPLICATION NOTE 3. Electrical Performance Both flash device families have similar performance as shown in Table 3-1. Performance differences are highlighted in Bold Italic type in the table. Table 3-1. Key Performance Comparison Part Name Performance Access Time Program Time Erase Time Random (tR) Cache Read Busy time (note) Sequential MX30LF1G18AC Min. Typ. Max. Min. Typ. Max. - - 25us - - 25us - - 5us - - - 30ns 20ns 3.5us - 25us - Page Program - 250us 700us - 300us 600us Cache Program Busy time - 4us 700us - 5us 600us Block - 2ms 3ms - 1ms Standby (TTL) - - 1mA - - Standby (CMOS) - 10uA 50uA - 10uA 50uA Active Read - 15mA 30mA - 15mA 30mA Active Program - 15mA 30mA - 15mA 30mA - 15mA 30mA - 15mA 30mA Current Consumption Active Erase Partial-Page Programs MX30LF1G08AA 3.5ms 1mA Power-up Current (Including POR Current) - - - - - 50mA Input Leakage - - +/- 10uA - - +/- 10uA Output Leakage - - +/- 10uA - - +/- 10uA NOP - - 4 cycles - - 4 cycles Note: The Cache Read Operation is different; please refer to the individual datasheets P/N: AN0351 2 REV. 2, APR. 15, 2015 APPLICATION NOTE 4. Command Set Command sets are similar as shown in Table 4-1. Command differences are highlighted in Bold Italic type in the table. Table 4-1. Command Set Part Name Command Description MX30LF1G08AA MX30LF1G18AC 1st cmd Cycle 2nd cmd Cycle 1st cmd Cycle 2nd cmd Cycle Read 00h 30h 00h 30h Random Data Input 85h - 85h - 05h E0h 05h E0h 00h 31h - - Cache Read Random - - 00h 31h Cache Read Sequential - - 31h - 34h - 3Fh - 90h - 90h - Parameter Page Read (ONFI) - - ECh - Read Unique ID (ONFI) - - EDh - Get Features (ONFI) - - EEh - Set Features (ONFI) - - EFh - Reset FFh - FFh - Page Program 80h 10h 80h 10h Cache Program 80h 15h 80h 15h Block Erase 60h D0h 60h D0h Read Status Resister 70h - 70h - - - 7Ah - Random Read Data Output Cache Read Begin Cache Read End (note) (note) Read ID Block Protection Status Read OTP Area Access - Set Feature followed by normal read/ program command Note: The Cache Read Operation is different; please refer to the individual datasheets P/N: AN0351 3 REV. 2, APR. 15, 2015 APPLICATION NOTE 5. Status Register Comparison Status Register bit functions are the same (Table 5-1). Please refer to the Macronix datasheet for additional details. Table 5-1. Status Register Comparison Part Number MX30LF1G08AA MX30LF1G18AC SR[0] SR[1] SR[2] Program/Erase Pass or Fail Cache Program Pass or Fail Not Used Program/Erase Pass or Fail Cache Program Pass or Fail Not Used SR[3] Not Used Not Used SR[4] Not Used Ready/Busy for Internal Controller Program/Erase/Read Operation Ready/Busy Write Protect Not Used Ready/Busy for Internal Controller Program/Erase/Read Operation Ready/Busy Write Protect SR[5] SR[6] SR[7] 6. Package Pin Definition The MX30LF1G08AA can be replaced by the MX30LF1G18AC without pin conflicts. Because the only difference is the PT (Protection) pin #38 of the MX30LF1G18AC 48-TSOP (or ball G5 of the 63-VFBGA) (which has an internal weak pull-down), the user does not need to do anything if the protection feature will not be used. Additional VCC/VSS pins which have been added for ONFI compatibility are not a concern, as they are not internally bonded. Package physical dimensions are the same. For detailed information, please refer to the individual datasheets. Table 6-1. 48-TSOP/ 63-VFBGA Package Pin/Ball Definition P/N: AN0351 Part Name MX30LF1G08AA MX30LF1G18AC #48 pin/ F7 ball NC VSS(might not be bonded, just for ONFI compatibility) #39 pin/ G4 ball NC VCC(might not be bonded, just for ONFI compatibility) #38 pin/ G5 ball NC PT (protection) #35 pin/ G3 ball DNU #34 pin/ D3 ball NC VCC(might not be bonded, just for ONFI compatibility) #25 pin NC VSS(might not be bonded, just for ONFI compatibility) NC 4 REV. 2, APR. 15, 2015 APPLICATION NOTE 7. Device Identification The Device ID lengths of the MX30LF1G08AA and the MX30LF1G18AC differ by one byte. The ID of the MX30LF1G08AA begins with a one-byte Manufacturer Code followed by a three-byte Device ID. The ID of the MX30LF1G18AC begins with a one-byte Manufacturer Code followed by a four-byte Device ID. The ID codes of the MX30LF1G08AA and the MX30LF1G18AC are identical except for the last two bytes indicating differences in Sequential Read cycle time and the ECC requirement (Table 7-1 Device Identification). Table 7-1. Device Identification Part Name MX30LF1G08AA MX30LF1G18AC C2h/F1h/80h/1Dh C2h/F1h/80h/95h/02h Byte 0 Manufacturer ID Manufacturer ID Byte 1 Device ID Device ID bit 1- 0 Number of Die per CE Number of Die per CE bit 3 - 2 Cell Structure Cell Structure bit 5 - 4 Number of Concurrently Programmed Pages Number of Concurrently Programmed Pages bit 6 Interleaved Programming between multiple devices Interleaved Programming between multiple devices bit 7 Cache program Cache program bit 1- 0 Page Size Page Size bit 2 Spare Area Size Spare Area Size bit 7, 3 Sequential Read Cycle Time, (bit7, bit3= 0,1) Sequential Read Cycle Time (bit7, bit3= 1,0) bit 5 - 4 Block Size (Excluding spare area) Block Size (Excluding spare area) bit 6 Organization Organization bit 1- 0 - ECC level requirement, 4-bit ECC required (bit1:0=10b) bit 3 - 2 - Plane number bit 6 - 4 - Plane Size (Excluding spare area) bit 7 - Reserved ID Code ID Definition Byte 2 Byte 3 Byte 4 8. Reference Table 8-1 shows the datasheet versions used for comparison in this application note. For the most updated, detailed Macronix specification, please contact Macronix Sales. Table 8-1. Datasheet Versions Datasheet P/N: AN0351 Location Date Issued Revision MX30LF1G08AA Website Sept. 2014 Rev. 1.5 MX30LF1G18AC Website Feb. 2015 Rev. 1.0 5 REV. 2, APR. 15, 2015 APPLICATION NOTE 9. Summary The Macronix MX30LF1G08AA and MX30LF1G18AC NAND flash share the same basic Read, Program, and Erase commands and have compatible pinouts. The newly defined “PT” function on pin-38/ball-G5 of the MX30LF1G18AC can be left floating if the function is not needed or used. The Cache Read operation is different which will require software modification when migrating to the MX30LF1G18AC. In addition, migrating to the MX30LF1G18AC may require firmware modifications to accommodate differences in ECC requirements. 10. Part Number Cross-Reference Table 10-1. Part Number Cross Reference Bus Width Voltage x8 3V Package Part Number Migrating Part Number 48-TSOP MX30LF1G08AA-TI MX30LF1G18AC-TI 63-VFBGA MX30LF1G08AA-XKI MX30LF1G18AC-XKI 11. Revision History Table 11-1. Revision History Revision No. REV. 1 REV. 2 Description Initial Release of Advanced Information Version 1. Removed Memory cell array item from Table 2-1. 2. Removed Advanced Information title P/N: AN0351 Page Date ALL Nov. 30, 2014 1 Apr. 15, 2015 ALL 3. Improved ICC of Read/Program from 20mA to 15mA in Table 3-1. 2 4. Align the ID byte name of Table 7-1 as Datasheet of MX30LF1G18AC 5 6 REV. 2, APR. 15, 2015 APPLICATION NOTE Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2015. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Audio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. P/N: AN0351 7 REV. 2, APR. 15, 2015