HT77xxSA 200mA PFM Synchronous Step-up DC/DC Converter Features General Description • Low start-up voltage: 0.7V (Typ.) The HT77xxSA devices are a high efficiency PFM synchronous step-up DC-DC converter series which are designed to operate with both wire wound chip power inductors and also with multi-layered chip power inductors. The device series have the advantages of extremely low start-up voltage as well as high output voltage accuracy. Being manufactured using CMOS technology ensures ultra low supply current. Because of their higher operating frequency, up to 500 kHz, the devices have the benefits of requiring smaller outline type lower value external inductors and capacitors. The higher operating frequency also offers the advantages of much reduced audio frequency noise. The devices require only three external components to provide a fixed output voltage of 2.7V, 3.0V, 3.3V or 5.0V. • High efficiency: 2.7V ≤ VOUT ≤ 5.0V upper 90% (Typ.) • High output voltage accuracy: ±2.5% • Output voltage: 2.7V, 3.0V, 3.3V, 5.0V • Output current up to 200mA • Ultra low supply current IDD: 5μA (Typ.) • Low ripple and low noise • Low shutdown current: 0.1μA (Typ.) • TO92, SOT89, SOT23 and SOT23-5 package Applications • Palmtops/PDAs The HT77xxSA devices include an internal oscillator, PFM control circuit, driver transistor, reference voltage unit and a high speed comparator. They employ pulse frequency modulation techniques, to obtain minimum supply current and ripple at light output loading. These devices are available in space saving TO92, SOT89, SOT23 and SOT23-5 packages. For SOT23-5 package types, they also include an internal chip enable function to reduce power consumption when in the shutdown mode. • Portable communicators/Smartphones • Cameras/Camcorders • Battery-powered equipment Selection Table Part No. Output Voltage HT7727SA 2.7V HT7730SA 3.0V HT7733SA 3.3V HT7750SA 5.0V Tolerance Package ±2.5% TO92 SOT89 SOT23 SOT23-5 Block Diagram V O U T L X L X L im ite r L X B u ffe r V re f O S C P F M V O U T C o n tro l C h ip E n a b le G N D C E Rev. 1.00 1 October 04, 2012 HT77xxSA Pin Assignment V O U T 3 F r o n t V ie w 1 2 L X 5 G N D 4 3 T o p V ie w T o p V ie w G N D V O U T L X B o tto m 1 2 3 G N D V O U T L X G N D V O U T L X 1 2 1 2 3 G N D L X C E V O U T N C G N D L X C E V O U T N C V ie w Pin Description Pin No. Pin Name TO92 SOT89 SOT23 SOT23-5 — — — 1 CE 2 2 3 2 VOUT — — — 3 NC 1 1 1 4 GND 3 3 2 5 LX Description Chip enable pin, high active DC/DC converter output monitoring pin No connection Ground pin Switching pin Absolute Maximum Ratings Maximum Input Supply Voltage........................... 6.5V Storage Temperature ........................... -50°C to 125°C Ambient Temperature Range ................ -40°C to 85°C Note: These are stress ratings only. Stresses exceeding the range specified under "Absolute Maximum Ratings" may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Rev. 1.00 2 October 04, 2012 HT77xxSA Electrical Characteristics Symbol Ta= 25°C; VIN= VOUT×0.6; IOUT= 10mA; unless otherwise specified Parameter VIN Input Voltage Test Conditions — Min. Typ. Max. Unit — — 6.0 V ΔVOUT Output Voltage Tolerance -2.5 — +2.5 % VSTART Starting Voltage(Fig.1) VIN : 0 to 2V, IOUT=1mA — 0.7 0.9 V VHOLD Voltage Hold(Fig.1) VIN : 2 to 0V, IOUT=1mA — — 0.7 V IDD1 Supply Current (Fig.2) VS=VOUT+0.5V, Measured at VOUT Pin — 5.0 — μA IDD2 Un-load Supply Current (Fig.1) VIN=VOUT×0.6, IOUT=0mA Measurement at LX — — μA ISHDN Shutdown Current CE=GND ILimit Current Limit (Fig.1) VIH CE High Threshold VIL CE Low Threshold — 0.1 — μA VOUT ≤ 5.0V 650 800 — mA 2.7V ≤ VOUT ≤ 3.3V 500 650 — mA 2.0 — — V — — 0.4 V — 0.05 — μA — 500 — kHz — ILEAK LX Leakage Current (Fig.3) fOSC Oscillator Frequency (Fig.3) VS=5.5V, VX=4V Measurement at the LX pin DOSC Oscillator Duty Cycle (Fig.3) VS=VOUT×0.95 Measurement at the LX pin η Efficiency 2.7V ≤ VOUT ≤ 5.0V, IOUT=10mA — 80 — % — 90 — % Note: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed. L VIN 10uH LX VOUT VOUT HT77xxSA CIN 10uF COUT 10uF GND L: ABC SR0503 10uH CIN=COUT: muRata 10uF Fig.1 VOUT LX LX VS HT77xxSA VOUT VS HT77xxSA 100 GND GND VX Fig.2 Rev. 1.00 Fig.3 3 October 04, 2012 HT77xxSA Application Circuits Without CE Pin VIN L 10μH LX VOUT VOUT HT77xxSA CIN 10μF COUT 10μF GND With CE Pin VIN L 10μH CIN 10μF VIN VOUT Rev. 1.00 CE COUT 10μF GND VOUT LX CE VOUT HT77xxSA L 10μH CIN 10μF VOUT LX VOUT HT77xxSA GND 4 COUT 10μF October 04, 2012 HT77xxSA Functional Description Application Information The HT77xxSA is a constant on time synchronous stepup converter, which uses a pulse frequency modulation (PFM) controller scheme. The PFM control scheme is inherently stable. The required input/output capacitor and inductor selections will not create situations of instability. Inductor Selection Selecting a suitable inductor is an important consideration as it is usually a compromise situation between the output current requirements, the inductor saturation limit and the acceptable output voltage ripple. Lower values of inductor values can provide higher output currents but will suffer from higher ripple voltages and reduced efficiencies. Higher inductor values can provide reduced output ripple voltages and better efficiencies, but will be limited in their output current capabilities. For all inductors it must be noted however that lower core losses and lower DC resistance values will always provide higher efficiencies. The device includes a fully integrated synchronous rectifier which reduces costs (includes reduce L and C sizes, eliminates Schottky diode cost etc.) and board area. A true load disconnect function ensures that the device is completely shutdown. Low Voltage Start-up The devices have a very low start up voltage down to 0.7V. When power is first applied, the synchronous switch will be initially off but energy will be transferred to the load through its intrinsic body diode. The peak inductor current can be calculated using the following equation: I L ( PEAK ) = Shutdown Where During normal device operation, the EN pin should be either high or connected to the VOUT pin or the VIN power source. When the device is in the shutdown mode, that is when the EN pin is pulled low, the internal circuitry will be switched off. During shutdown, the PMOS power transistor will be switched off thus placing the output into a floating condition. VIN = Input Voltage VOUT = Output Voltage IO = Output Current η = Efficiency L = Inductor Capacitor Selection Synchronous Rectification As the output capacitor selected affects both efficiency and output ripple voltage, it must be chosen with care to achieve best results from the converter. Output voltage ripple is the product of the peak inductor current and the output capacitor equivalent series resistance or ESR for short. It is important that low ESR value capacitors are used to achieve optimum performance. One method to achieve low ESR values is to connect two or more filter capacitors in parallel. The capacitors values and rated voltages are only suggested values. A dead time exists between the N channel and P channel MOSFET switching operations. In synchronous rectification, the P channel is replaced by a Schottky diode. Here the P channel switch must be completely off before the N channel switch is switched on. After each cycle, a 30ns delay time is inserted to ensure the N channel switch is completely off before the P channel switch is switched on to maintain a high efficiency over a wide input voltage and output power range. Rev. 1.00 VOUT × IO VIN × (VOUT − VIN ) + VIN × η 2 × VOUT × L 5 October 04, 2012 HT77xxSA Layout Considerations • All tracks should be as wide as possible. • The input and output capacitors should be placed as close as possible to the VIN, VOUT and GND pins. Circuit board layout is a very important consideration for switching regulators if they are to function properly. • A full ground plane is always helpful for better EMI performance. Poor circuit layout may result in related noise problems. In order to minimise EMI and switching noise, note the following guidelines: Rev. 1.00 Top Layer Bottom Layer Top Layer Bottom Layer Top Layer Bottom Layer Top Layer Bottom Layer 6 October 04, 2012 HT77xxSA Typical Performance Characteristics HT7750SA Fig 4. Ripple Voltage vs. Output Current Fig 1. Output Voltage vs. Output Current Fig 2. Efficiency vs. Output Current Fig 5. Load Transient Response (L=10mH, CIN=COUT=10mF, VIN=3.0V) Fig 3. Start-up & Hold-on Voltage Fig 6. Line Transient Response (L=10mH, CIN=COUT=10mF, VIN=3.0V) Rev. 1.00 7 October 04, 2012 HT77xxSA HT7733SA Fig 7. Output Voltage vs. Output Current0% Fig 10. Ripple Voltage vs. Output Current Fig 8. Efficiency vs. Output Current Fig 11. Load Transient Response (L=10mH, CIN=COUT=10mF, VIN=1.98V) Fig 9. Start-up & Hold-on Voltage Fig 12. Line Transient Response (L=10mH, CIN=COUT=10mF, VIN=1.98V) Rev. 1.00 8 October 04, 2012 HT77xxSA HT7730SA Fig 13. Output Voltage vs. Output Current Fig 16. Ripple Voltage vs. Output Current Fig 14. Efficiency vs. Output Current Fig 17. Load Transient Response (L=10mH, CIN=COUT=10mF, VIN=1.8V) Fig 15. Start-up & Hold-on Voltage Fig 18. Line Transient Response (L=10mH, CIN=COUT=10mF, VIN=1.8V) Rev. 1.00 9 October 04, 2012 HT77xxSA Package Information Note that the package information provided here is for consultation purposes only. As this information may be updated at regular intervals users are reminded to consult the Holtek website (http://www.holtek.com.tw/english/ literature/package.pdf) for the latest version of the package information. 3-pin SOT23 Outline Dimensions Symbol Dimensions in inch Min. Nom. Max. A 0.039 ― 0.051 A1 ― ― 0.004 A2 0.028 ― 0.035 b 0.014 ― 0.020 C 0.004 ― 0.010 D 0.106 ― 0.122 E 0.055 ― 0.071 e ― 0.075 ― H 0.102 ― 0.118 L 0.015 ― ― θ 0° ― 9° Symbol Rev. 1.00 Dimensions in mm Min. Nom. Max. A 1.00 ― 1.30 A1 ― ― 0.10 A2 0.70 ― 0.90 b 0.35 ― 0.50 C 0.10 ― 0.25 D 2.70 ― 3.10 E 1.40 ― 1.80 e ― 1.90 ― H 2.60 ― 3.00 L 0.37 ― ― θ 0° ― 9° 10 October 04, 2012 HT77xxSA 5-pin SOT23-5 Outline Dimensions Symbol A Dimensions in inch Min. Nom. Max. 0.039 ― 0.051 A1 ― ― 0.004 A2 0.028 ― 0.035 b 0.014 ― 0.020 C 0.004 ― 0.010 D 0.106 ― 0.122 E 0.055 ― 0.071 e ― 0.075 ― H 0.102 ― 0.118 L 0.015 ― ― θ 0° ― 9° Symbol Rev. 1.00 Dimensions in mm Min. Nom. Max. A 1.00 ― 1.30 A1 ― ― 0.10 A2 0.70 ― 0.90 b 0.35 ― 0.50 C 0.10 ― 0.25 D 2.70 ― 3.10 E 1.40 ― 1.80 e ― 1.90 ― H 2.60 ― 3.00 L 0.37 ― ― θ 0° ― 9° 11 October 04, 2012 HT77xxSA 3-pin SOT89 Outline Dimensions Symbol Dimensions in inch Min. Nom. Max. A 0.173 ― 0.181 B 0.059 ― 0.072 C 0.090 ― 0.102 D 0.035 ― 0.047 E 0.155 ― 0.167 F 0.014 ― 0.019 G 0.017 ― 0.022 H ― 0.059 ― I 55 ― 63 J 14 ― 17 Symbol Rev. 1.00 Dimensions in mm Min. Nom. Max. A 4.39 ― 4.60 B 1.50 ― 1.83 C 2.29 ― 2.59 D 0.89 ― 1.19 E 3.94 ― 4.24 F 0.36 ― 0.48 G 0.43 ― 0.56 H ― 1.50 ― I 1.40 ― 1.60 J 0.36 ― 0.43 12 October 04, 2012 HT77xxSA 3-pin TO92 Outline Dimensions Symbol Min. Nom. Max. A 0.170 ― 0.200 B 0.170 ― 0.200 C 0.500 ― ― D 0.011 ― 0.020 E 0.090 ― 0.110 F 0.045 ― 0.055 G 0.045 ― 0.065 H 0.130 ― 0.160 α 0° ― 10° Symbol A Rev. 1.00 Dimensions in inch Dimensions in mm Min. Nom. Max. 4.32 ― 5.08 B 4.32 ― 5.08 C 12.70 ― ― D 0.28 ― 0.51 E 2.29 ― 2.79 F 1.14 ― 1.40 G 1.14 ― 1.65 H 3.30 ― 4.06 α 0° ― 10° 13 October 04, 2012 HT77xxSA Product Tape and Reel Specifications Reel Dimensions SOT23-3, SOT23-5 Symbol Description Dimensions in mm A Reel Outer Diameter 178.0±1.0 B Reel Inner Diameter 62.0±1.0 C Spindle Hole Diameter 13.0±0.2 D Key Slit Width 2.50±0.25 T1 Space Between Flange 8.4 +1.5/-0.0 T2 Reel Thickness 11.4 +1.5/-0.0 SOT89-3 Symbol Description Dimensions in mm A Reel Outer Diameter 178.0±1.0 B Reel Inner Diameter 62.0±1.0 C Spindle Hole Diameter 13.0±0.2 D Key Slit Width 2.50±0.25 T1 Space Between Flange 8.4 +1.5/-0.0 T2 Reel Thickness 11.4 +1.5/-0.0 Rev. 1.00 14 October 04, 2012 HT77xxSA TO92 Reel Dimensions (Unit: mm) Rev. 1.00 15 October 04, 2012 HT77xxSA Carrier Tape Dimensions SOT23-3, SOT23-5 Symbol Description Dimensions in mm W Carrier Tape Width 8.0±0.3 P Cavity Pitch 4.0±0.1 E Perforation Position 1.75±0.10 F Cavity to Perforation (Width Direction) 3.50±0.05 D Perforation Diameter 1.5 +0.1/-0.00 D1 Cavity Hole Diameter 1.5 +0.1/-0.00 P0 Perforation Pitch P1 Cavity to Perforation (Length Direction) 2.00±0.05 4.0±0.1 A0 Cavity Length 3.15±0.10 B0 Cavity Width 3.2±0.1 K0 Cavity Depth 1.4±0.1 t Carrier Tape Thickness C Cover Tape Width Rev. 1.00 0.20±0.03 5.3±0.1 16 October 04, 2012 HT77xxSA SOT89-3 Symbol Description W Carrier Tape Width Dimensions in mm 12.0+0.3/-0.1 P Cavity Pitch E Perforation Position 1.75±0.10 8.0±0.1 F Cavity to Perforation (Width Direction) 5.50±0.05 D Perforation Diameter 1.5 +0.1/-0.00 D1 Cavity Hole Diameter 1.5 +0.1/-0.00 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 4.8±0.1 B0 Cavity Width 4.5±0.1 K0 Cavity Depth t Carrier Tape Thickness C Cover Tape Width Rev. 1.00 1.8±0.1 0.300±0.013 9.3±0.1 17 October 04, 2012 HT77xxSA Carrier Tape Dimensions TO92 Symbol Description Dimensions in mm I1 Taped Lead Length P Component Pitch 12.7±1.0 (2.5) P0 Perforation Pitch 12.7±0.3 P2 Component to Perforation (Length Direction) 6.35±0.40 F1 Lead Spread 2.5 +0.4/-0.0 F2 Lead Spread 2.5 +0.4/-0.0 Δh Component Alignment W Carrier Tape Width W0 Hold-down Tape Width 6.0±0.5 W1 Perforation Position 9.0±0.5 W2 Hold-down Tape Position H0 Lead Clinch Height 16.0±0.5 H1 Component Height Less than 24.7 D0 Perforation Diameter 0.0±0.1 18.0 +1.0/-0.5 (0.5) 4.0±0.2 t Taped Lead Thickness 0.7±0.2 H Component Base Height 19.0±0.5 Note: Thickness less than 0.38±0.05mm~0.5mm. P0 Accumulated pitch tolerance: ±1mm/20pitches. ( ) Bracketed figures are for reference only. Rev. 1.00 18 October 04, 2012 HT77xxSA Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor (China) Inc. Building No. 10, Xinzhu Court, (No. 1 Headquarters), 4 Cuizhu Road, Songshan Lake, Dongguan, China 523808 Tel: 86-769-2626-1300 Fax: 86-769-2626-1311 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com Copyright© 2012 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek's products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.00 19 October 04, 2012