HT3021-10
Ambient Light Sensor with I C Interface
2
Feature
Applications
• Operating Voltage: 2.7V~5.5V
• Backlight control for TFT LCD display
• Operating Temperature: -40˚C~85˚C
• Contrast enhancement for electronic signboard
• Human eye type spectral response with 15-bit
effective resolution
• Residential and commercial lighting management
• Ambient light monitoring for daylight and artificial
light
• Linear response over full operating range: An output value proportional to ambient light
• High dynamic sensing range
General Description
• Support lighting ripple rejection function for
50Hz/60Hz
The HT3021-10 device is an ambient light sensor
which provides ambient light measurements with
a response similar to the human eye response. The
overall operation together with the digital output for
this device is implemented using a two-wire I2C serial
interface which supports two transfer modes with a
frequency of 100kHz and 400kHz respectively. This
device is specially designed for applications in which
the ambient light measurement is used to control the
display backlighting such as laptop computers, PDAs,
camcorders, and GPS systems. This device is also
suitable for applications which are used as the contrast
control in LED signs and displays, camera exposure
control, lighting controls, etc.
• Support I C interface with two transfer mode:
Standard mode (100kHz), Fast mode (400kHz)
2
• Low Power Consumption when operating
• Support Power Down Mode
• Package Type: SMD
Block Diagram
Data
Register
VDD
VSS
SCL
SDA
ADRS
Photodiode
Current Amplifier
Integrator
&
A/D Converter
I2C Interface
Integration Time
Controller
Device Address
Configuration
Internal
Oscillator
REXT
Rev. 1.20
1
July 29, 2014
HT3021-10
Pad Description
Pad Name
Description
Type
Serial Data Input/Output pin
Serial Data Input/Output for 2-wire I2C interface
SDA
I/O
SCL
I
Serial Clock Input pin
Serial Clock Input for 2-wire I2C interface
ADRS
I
Device Address Select pin
This pin can be kept in a high, low or floating state to determine the I2C device address
REXT
I
External Resistor Input
This pin is connected to an external resistor when the internal oscillator is used
VDD
—
Positive power supply
VSS
—
Negative power supply, ground
Absolute Maximum Ratings
Supply Voltage .............................VSS-0.3V~VSS+6.0V
Storage Temperature .............................. -40°C~100°C
Output Voltage .....................................VSS-0.3V~6.0V
Operating Temperature ........................... −40°C~85°C
Digital Output Current .......................... -10mA~10mA
ESD Tolerance in Human Body Mode (HBM) �����2kV
Note: These are stress ratings only. Stresses exceeding the range specified under ″Absolute Maximum Ratings″
may cause substantial damage to the device. Functional operation of this device at other conditions beyond
those listed in the specification is not implied and prolonged exposure to extreme conditions may affect
device reliability. The ambient thermal resistance must be equal to or less than 50°C/W in applications.
Electrical Characteristics
Symbol
Parameter
VDD=3.3V; Ta=25˚C
Test Conditions
Min.
Typ.
Max.
Unit
—
2.7
—
5.5
V
VDD
Conditions
VDD
Operating Voltage
—
IDD
Operating Current
—
—
—
0.4
0.5
mA
ISTB
Standby Current
—
Power Down Mode
—
0.01
0.1
μA
VOL
Output Low Voltage for SDA
—
IO=4mA
—
—
0.4
V
Full Scale
—
—
tINT=100ms (note)
—
68000
Detection Limit
—
32767 count
—
lux.
Note: The tINT means the integration time period.
Rev. 1.20
2
July 29, 2014
HT3021-10
Optical Specifications
Symbol
Ta=25˚C
Test Conditions
Parameter
VDD
Conditions
—
Min.
Typ. Max. Unit
λP
Peak Sensitivity Wavelength
3.3V
—
550
—
nm
RFLU
Response to Fluorescent
3.3V EV=100 lux.; tINT=100ms
64
80
96
count
RDRK
Response in Dark Environment
3.3V EV=0 lux.; tINT=100ms
—
0
1
count
Note: 1. Fluorescent light is used as light source. White LED is substituted in mass production.
2. The actual photocurrent depends upon the package and optical design.
3. The tINT means the integration time period.
D.C. Characteristics of I2C Interface
Symbol
Parameter
Test Condition
Standard Mode
Fast Mode
Min.
Max.
Min.
Max.
Unit
VDD
Operating Voltage
—
2.7
5.5
2.7
5.5
VIH
Input High Voltage
—
2.0
—
2.0
—
V
VHYS
Hysteresis of Schmitt trigger input VDD>2V
0.05×VDD
—
0.05×VDD
—
V
VOL
Output Low Voltage
(Open drain structure)
VDD>2V; IOL=3mA
0
0.4
0
0.4
V
VNL
Noise Margin at Low level
Including hysteresis
0.1×VDD
—
0.1×VDD
—
V
VNH
Noise Margin at High level
Including hysteresis
0.2×VDD
—
0.2×VDD
—
V
IIN
Input current for I/O pins
VIN=0.1×VDD~0.9×VDD
-10
10
-10
10
μA
CIN
Capacitance for I/O pins
—
—
10
—
10
pF
CB
Capacitive load for each bus line
—
—
400
—
400
pF
Rev. 1.20
3
V
July 29, 2014
HT3021-10
A.C. Characteristics of I2C Interface
Symbol
fSCL
Parameter
Test Condition
Clock frequency
—
Standard
Mode
Fast Mode
Min. Max.
Unit
Min.
Max.
—
100
—
400
kHz
4.7
—
1.3
—
μs
4
—
0.6
—
μs
tBUF
Bus Free time
Time in which the bus must be free before
a new transmission can start
tHD: STA
Start condition hold time
After this period, the first clock pulse is
generated
tLOW
SCL Low time
—
4.7
—
1.3
—
μs
tHIGH
SCL High time
—
4
—
0.6
—
μs
tSU: STA
Start condition setup time Only relevant for repeated START condition
4.7
—
0.6
—
μs
tHD: DAT
Data hold time
—
0
3.45
0
0.9
ns
tSU: DAT
Data setup time
—
250
—
100
—
ns
ns
tR
SDA and SCL rise time
—
—
1000
5
300
tF
SDA and SCL fall time
—
—
300
0.1
300
ns
tSU: STO
Stop condition set-up time
—
4
—
0.6
—
μs
I2C Interface Timing
SDA
tBUF
tSU:DAT
tf
tLOW
tHD:STA
tr
SCL
tHD:STA
S
Rev. 1.20
tHD:DAT
tHIGH
tSU:STA
4
tSU:STO
Sr
P
S
July 29, 2014
HT3021-10
Characteristic Curves
Integration Time (tINT) vs. External resistor (REXT)
Integration Time, tINT (ms)
External Resistor REXT (kΩ)
Supply Current (IDD) vs. Temperature (˚C)
Supply Current, IDD (μA)
Temperature (˚C)
Rev. 1.20
5
July 29, 2014
HT3021-10
Relative Spectral Response
Relative Response (%)
Wavelength (nm)
Functional Description
Integration Mode
This device integrates a photodiode to sense the
ambient visible light. When the photodiode senses the
specific ambient visible light, it will generate certain
photocurrent according to the specific wavelength of
the ambient light. The photocurrent will be integrated
by the internal integrator in a certain integration
period of time and then converted to a 15-bit digital
output using the A/D converter. The converted digital
data is stored in a register word and is read output
using the Read Word command via the two-wire I2C
interface.
The device supports two integration modes; one is the
continuous integration mode and the other is the one
time integration mode. When this device operates in
the continuous integration mode, an external resistor
must be connected on the REXT pin to the internal
oscillator which provides the integration period of
time. However, when the device operates in the one
time integration mode, the external resistor is not
required. The overall operation is controlled using
a two-wire I 2C interface together with the 15-bit
digital data readout. This 15-bit data, converted by the
transfer method implemented in the device, represents
the effective response similar to the dynamic range
response of the human eyes.
Integration Time
When the device is configured to operate in continuous
integration mode, the integration period of time is
determined by the external resistor connected to the
REXT pin together with the internal oscillator. The
maximum illumination detection range is inversely
proportional to the integration time. That means the
higher the illumination detection range is, the shorter
the integration time is.
REXT resistor (kΩ)
Integration Time (ms)
Illumination Detection Range (lux.)
Resolution (lux./count)
50
50
136000
4.16
100
100
68000
2.08
200
200
34000
1.04
300
300
22000
0.69
400
400
17000
0.52
REXT and Integration Time Example for White LED
Rev. 1.20
6
July 29, 2014
HT3021-10
Noise Rejection
Device Address Selection
The integration period of time must be adjusted to
be an integer multiple of the AC noise cycle times to
reject the noise with an AC frequency of both 50Hz
and 60Hz. To determine a suitable integration period
of time, t INT, for both 50Hz and 60Hz power line
signals, user can use the following formula:
This ambient light sensor is an I 2C slave device
of which the device address can be selected using
the external address select pin, ADRS. The device
address is initially set to 0x39H after power on. The
ADRS configuration and the device address selection
is shown in the following table.
tINT=n×(1/60Hz)=m×(1/50Hz), where n and m are
integers
→n/m=6/5
ADRS Pin Configuration
The first example of these two integers for the tINT
integration time to reject the noise of both 50Hz and
60Hz is when n=6 and m=5 respectively. Therefore,
the tINT integration time will be 100ms.
0x39H
Connected to VDD
0x44H
Connected to VSS
0x29H
Device Address Selection
I2C Serial Interface
tINT=6×(1/60Hz)=5×(1/50Hz)=1/10Hz=100ms
Referring to the integration time example table, when
this device operates in continuous integration mode,
the external resistor connected to the REXT pin
should be 100kΩ for 100ms integration time to reject
the noise with a power line frequency of both 50Hz
and 60Hz. When the device operates in one time
integration mode, the master device must control the
integration time to be an integer multiple of 100ms.
I2C Operation
The device supports I2C serial interface. The I2C bus
is for bidirectional, two-line communication between
different ICs or modules. The two lines are a serial
data line, SDA, and a serial clock line, SCL. Both
lines are connected to the positive power supply via
pull-up resistors with a certain value according to
different transfer frequency. When the bus is free,
both lines are high. Devices connected to the bus
must have open-drain or open-collector outputs
to implement a wired-or function. Data transfer is
initiated only when the bus is not busy.
A/D Conversion Data
The sensed photocurrent will be integrated and
then converted to a 15-bit digital data. The data
will be stored in the A/D converter data register
pair, ADRH and ADRL. The least significant 8-bit
data is stored in the ADRL register while the most
significant 7-bit data is stored in the ADRH register.
The most significant bit, D15, of the ADRH register
is a valid bit which is used to indicate whether the
A/D conversion result is available or not. When the
A/D conversion result is not ready, the valid bit,
D15, will be set to zero. After the A/D conversion is
complete, the valid bit will be set to high. The A/D
data register pair can be read using the Read Word
Command of which the protocol will be described in
the corresponding I2C interface section. Note that the
MSB of the ADRL register will first be shifted out
followed by the ADRH register data when the Read
Word Command is executed.
ADRH Register
Device Address
Floating
Data validity
The data on the SDA line must be stable during the
high period of the serial clock. The high or low state
of the data line can only change when the clock signal
on the SCL line is Low as shown in the diagram.
SDA
SCL
Data line stable;
Data valid
Change of data
allowed
ADRL Register
Bit 7
Bit 6~0
Bit 7~0
Valid bit
Data bit 14~8
Data bit 7~0
A/D Conversion Data Register
Rev. 1.20
7
July 29, 2014
HT3021-10
START and STOP conditions
Data Output
by Transmitter
• A high to low transition on the SDA line while SCL
is high defines a START condition.
not acknowledge
Data Output
by Receiver
• A low to high transition on the SDA line while SCL
is high defines a STOP condition.
acknowledge
SCL From
Master
• START and STOP conditions are always generated
by the master. The bus is considered to be busy
after the START condition. The bus is considered
to be free again a certain time after the STOP
condition.
P
START condition
STOP condition
Every byte put on the SDA line must be 8-bit long.
The number of bytes that can be transmitted per
transfer is unrestricted. Each byte has to be followed
by an acknowledge bit. Data is transferred with the
most significant bit, MSB, first.
SCL
S
or
Sr
1
2
7
8
9
ACK
1
2
3-8
9
ACK
clock pulse for
acknowledgement
Device Address Byte
MSB
A6
LSB
A5
A4
A3
A2
A1
A0 R/W
I2C Interface Write Operation
P
Write Byte Operation
Sr
A Command Write Byte operation requires a
START condition, a slave address with an R/W bit, a
command byte and a STOP condition for a command
write operation. After the device receives a START bit
followed by the device address with an R/W bit equal
to 0, the device will compare the received address
value and compare it with the internal configured
device address. Then the acknowledge signal will
be sent by the slave device if the device address is
matched after comparison. Therefore, the master
device can successively send the command byte to
this device and the device will send an acknowledge
bit. The master device will then issue a STOP bit
after it receives the acknowledge bit sent by the
slave device. Note that the communication will be
terminated by the master device issuing a STOP
condition when an acknowledge bit occurs.
P
or
Sr
Acknowledge
• Each byte of eight bits is followed by one
acknowledge bit. This Acknowledge bit is a low
level placed on the bus by the receiver. The master
generates an extra acknowledge related clock pulse.
• A slave receiver which is addressed must generate
an Acknowledge, ACK, after the reception of each
byte.
• The device that acknowledges must pull down the
SDA line during the acknowledge clock pulse so
that it remains stable low during the high period of
this clock pulse.
• A master receiver must signal an end of data to the
slave by generating a not-acknowledge, NACK,
bit on the last byte that has been clocked out of
the slave. In this case, the master receiver must
leave the data line high during the 9th pulse to not
acknowledge. The master will generate a STOP or
repeated START condition.
Rev. 1.20
9
• The device address can be 0x39H, 0x44H or 0x29H
and selected using the ADRS pin. When an address
byte is sent, the device compares the first seven
bits after the START condition. If they match, the
device outputs an Acknowledge on the SDA line.
Byte format
SDA
8
• The slave address byte is the first byte received
following the START condition form the master
device. The first seven bits of the address byte
make up the slave address. The eighth bit defines a
read or write operation to be performed base on the
standpoint of the master device. When the R/W bit
is set to 1, then a read operation is selected. A “0”
selects a write operation.
SCL
S
7
Device Addressing
SDA
SCL
S
2
START
condition
• The bus stays busy if a repeated START (Sr) is
generated instead of a STOP condition. In some
respects, the START(S) and repeated START (Sr)
conditions are functionally identical.
SDA
1
Slave Address
Command byte
R/W
S
A6
A5
A4
A3
A2
A1
A0
0
Write
P
BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0
ACK
ACK
I2C Command Write Byte Operation
8
July 29, 2014
HT3021-10
I2C Interface Read Operation – Read Byte / Read Word Operation
Read Byte Operation
Read Word Operation
A Read Byte operation requires a START condition, a
slave address with an R/W bit, a device data byte and
a STOP condition for a read byte operation. When the
device receives a START bit followed by the device
address with an R/W bit equal to 1, the device will
compare the received address value and compare it
with the internal configured device address. Then the
acknowledge signal will be sent by the slave device if
the device address is matched after comparison. After
the device address compare match occurs, the slave
device will send the data byte to the master device.
Then the master device will issue a non-acknowledge
bit, NACK, followed by a STOP bit to terminate this
communication. Note that the communication will
be terminated by the master device issuing a STOP
condition when a non-acknowledge bit occurs. The
data byte sent out by the slave device is the A/D low
byte data when operating in active mode. However,
the data is the command register content which
is written by the master device when operating in
communication test mode.
A Read Word operation requires a START condition,
a slave address with an R/W bit, two A/D data bytes
and a STOP condition for a read word operation.
When the device receives a START bit followed
by the device address with an R/W bit equal to 1,
the device will compare the received address value
and compare it with the internal configured device
address. Then the acknowledge signal will be sent
by the slave device if the device address is matched
after compared. After the device address compare
match occurs, the slave device will first send the
A/D low byte data followed by the A/D high byte
data each with the MSB being shifted out first to the
master device. Then the master device will issue a
non-acknowledge bit, NACK, followed by a STOP
bit to terminate this communication after it receives
a A/D data word. Note that the communication will
be terminated by the master device issuing a STOP
condition when a non-acknowledge bit occurs.
Slave Address
Device Data output
R/W
S
A6
A5
A4
A3
A2
A1
1
A0
Read
P
BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0
ACK
NACK
I2C Read Byte Operation
Slave Address
A/D Low Byte Data
A/D High Byte Data
BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0
BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0
R/W
S
A6
A5
A4
A3
A2
A1
A0
1
Read
ACK
ACK
Valid bit
P
NACK
I C Read Word Operation
2
Rev. 1.20
9
July 29, 2014
HT3021-10
Device Command Summary
There are several commands which are provided to control the overall operation for the ambient light sensor. Refer
to the accompanying table for more descriptions.
Command Code
Command Function
1xxx_xxxx (binary code)
Power Down command
0x04H
One time integration mode activation command
0x08H
One time integration mode START command
0x30H
One time integration mode STOP command
0x0CH
Continuous integration mode activation command
0x34H
Reserved
Command Summary
Power-Down Command
register will have no effect on any operations. In
power down mode users can use this command to do
the communication test followed by executing the
Read Byte operation via the I2C interface.
This command is used to power down the device.
After power on, the device is initially in this power
down status. When the MSB of the command code is
set to 1, the device will enter the power down mode
and the value written into the internal command
Function
(MSB)
(LSB)
Bit6 Bit5 Bit4 Bit3 Bit2 Bit1
Bit7
Bit0
Power Down Command
1
x
x
x
x
x
x
Note
Can also be used to test the I2C
interface communication.
x
One Time Integration Mode Activation Command
This command is used to activate the one time
integration mode. In one time integration mode,
the integration time is determined by the one time
Function
One Time Integration Mode
Activation Command
integration mode START and STOP command using
the I2C interface.
(MSB)
(LSB)
Bit6 Bit5 Bit4 Bit3 Bit2 Bit1
Bit7
Bit0
0
0
0
0
0
1
0
0
Note
Integration time is determined by the
START/STOP I2C commands.
One Time Integration Mode START Command
This command is used to START the integration
operation when the device is configured to operate in
Function
One Time Integration
Mode START Command
Rev. 1.20
one time integration mode. Note that this command is
not available in continuous integration mode.
(MSB)
(LSB)
Bit6 Bit5 Bit4 Bit3 Bit2 Bit1
Bit7
Bit0
0
0
0
0
1
0
10
0
0
Note
Only available in One Time Integration
mode.
July 29, 2014
HT3021-10
One Time Integration Mode STOP Command
This command is used to STOP the integration
operation when the device is configured to operate
in one time integration mode. When this STOP
command is committed, the valid bit, the MSB of the
Function
A/D conversion data, will automatically be set to 1.
Note that this command is not available in continuous
integration mode.
(MSB)
(LSB)
Bit6 Bit5 Bit4 Bit3 Bit2 Bit1
Bit7
Bit0
One Time Integration
Mode STOP Command
0
0
1
1
0
0
0
0
Note
Only available in One Time
Integration mode.
Continuous Integration Mode Activation Command
This command is used to activate the device to
operate in the continuous integration mode. In
continuous integration mode, the A/D conversion data
register will be updated at the end of each integration
Function
Continuous Integration
Mode Activation Command
Rev. 1.20
period of time which is determined by the internal
oscillator together with the external resistor connected
to the REXT pin. Refer to the integration time section
for more details.
(MSB)
(LSB)
Bit6 Bit5 Bit4 Bit3 Bit2 Bit1
Bit7
Bit0
0
0
0
0
1
11
1
0
0
Note
Integration time is determined by
the internal oscillator together with
the external resistor on REXT pin.
July 29, 2014
HT3021-10
Programming Sequence Example
The procedures of two integration modes are illustrated here with the device address of 0x39H for examples.
Continuous Integration mode
Power On
Issue“Continuous Integration Mode”
“Activation Command”
Send the device address (0x39H) with R/W=0
and then Send a Command Byte (0x0CH)
Issue“Read Word Operation”
to Read A/D Conversion Data
Send the device address (0x39H) with R/W=1
and then wait for two bytes A/D data
The A/D low byte data is first shifted out followed
by the A/D high byte data with MSB shifted first.
Read A/D Low Byte Data &
A/D High Byte Data
No
The MSB of the A/D high byte data is the valid bit.
For the first A/D conversion, if the valid bit is 0, it
means that the conversion is not complete after
being activated.
Valid Bit = 1 ?
After the first A/D conversion,
the valid bit is equal to 1, the A/D data is available,
The A/D data will not be updated until the next
conversion is finished.
Yes
A/D Conversion Data
is available
Note that the valid bit will be“1”before the next
conversion is finished.
A/D Conversion
Terminated?
No
Continue to Perform the integration and
A/D conversion for next integration time period.
Yes
Issue “Power down”Command
Send the device address (0x39H) with R/W=0
and then Send a Command Byte (0x8CH)
Power Down
Rev. 1.20
12
July 29, 2014
HT3021-10
One Time Integration mode
Power On
Issue“One Time Integration Mode”
“Activation Command”
Send the device address (0x39H) with R/W=0
and then Send a Command Byte (0x04H)
Issue“One Time Integration Mode”
“START Command”
Send the device address (0x39H) with R/W=0
and then Send a START Command Byte (0x08H)
An enough period of delay is necessary for A/D
integration.
Issue“One Time Integration Mode”
“STOP Command”
Send the device address (0x39H) with R/W=0
and then Send a STOP Command Byte (0x30H)
Issue“Read Word Operation”
to Read A/D Conversion Data”
Send the device address (0x39H) with R/W=1
and then wait for two bytes A/D conversion data
Read A/D Low Byte Data &
Read A/D High Byte Data
No
Valid Bit = 1 ?
The A/D low byte data is first shifted out followed
by the A/D high byte data with MSB shifted first.
The MSB of the A/D high byte data is the valid bit.
If the valid bit is 0, the STOP command may not
be is received by the device when the integration
time of period is enough.
Yes
A/D Conversion Data
is available
Send the device address (0x39H) with R/W=0
and then Send a Command Byte (0x8CH)
Issue “Power down”Command
Power Down
Rev. 1.20
13
July 29, 2014
HT3021-10
Hardware Design Example
Flat Window Lens Design
The window lens will limit the viewing angle of this
device. The window lens should be placed directly
on the top of the device. The lens thickness should be
kept at a minimum value to minimize the power loss
due to the reflection together with the energy absorbed
in the plastic material. A thickness with a value of
1mm is recommended for a window lens design. The
larger the window lens diameter, the wider the device
viewing angle is. The recommended optical window
dimensions are listed in the table to ensure both 35°
and 45° viewing angle. These dimensions are based
on a window lens thickness of 1mm and a refractive
index of 1.59.
Window Lens
t
DTOTAL
θ: viewing angle
θ
D1
HT3021-10
DLENS
Flat Window Lens
DTOTAL
D1
DLENS @35° Viewing Angle
1.5
0.5
2.25
DLENS @45° Viewing Angle
3.75
2.0
1.0
3.00
4.75
2.5
1.5
3.75
5.75
3.0
2.0
4.30
6.75
3.5
2.5
5.00
7.75
Note: All dimensions are in the unit of millimeter (mm).
Recommended Dimensions for Flat Window Lens Design (t=1mm)
Window with Light Pipe Design
D1 of a value equal to 0.5mm to achieve a better
performance. The light pipe should have a minimum
diameter of 1.5mm to ensure that the whole area of
the sensor will be exposed.
With the same effective device viewing angle, if a
smaller window is desired, a cylindrical transparent
plastic pipe is necessary to trap and focus the light and
then guide the light on the device. The pipe should be
directly places on the top of the device with a distance
DLENS
D2
D2 > 1.5mm
L
Light Pipe
D2
Window Lens
D1
DLENS
t
HT3021-10
Window with Light Pipe
Rev. 1.20
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July 29, 2014
HT3021-10
Application Circuit
VDD
VDD
4.7uF
0.1uF
VDD
SCL
SDA
REXT
CEXT
VSS
100pF
REXT
100KΩ
VSS
VSS
Note: 1. The REXT resistor is not required when the device operates in one time integration mode.
2. The CEXT capacitor is optional for long distance connection when the device operates in continuous
integration mode.
Rev. 1.20
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HT3021-10
Other Considerations
Reliability Test Conditions
Items
Temperature Cycling Test
Test Conditions
Temp.=-30˚C~85˚C
(100min.) (30min.) (100min.)
Hour or Cycle Sample No. Failure No.
100 cycles
30
0
High Temperature & Humidity Storage Temp.=85˚C, 85%RH
500 hours
30
0
Low Temperature Operation Life
Temp.=-30˚C, VDD=3V
500 hours
30
0
High Temperature Operation Life
Temp.=85˚C, VDD=3V
500 hours
30
0
High Temperature Storage
Temp.=85˚C
500 hours
30
0
IR Reflow
170˚C→235˚C→275˚C→180˚C
5 cycles
500
0
Recommended Storage Method
Recommended Solder Profile
It is recommended to store the reels in the dry box
once the aluminum bag, which is used to prevent the
moisture absorption, has been opened. The following
conditions, which can achieve the moisture prevention
level 3, should be observed if the dry boxes are not
available.
• Storage Temperature: 10˚C~30˚C
• Storage Humidity ≤ 60%RH (max.)
• Storage Time ≤ 168 hours (max.)
Reflow Soldering
If there is moisture absorbed by the device, it
is recommended to recover the device to the
original condition using one of the accompanying
recommended drying methods.
Note: 1. Reflow soldering should not be done more
than two times.
2. When soldering, do not put stress on the
ALS devices during heating.
3. After soldering, do not warp the circuit
board.
• 192 hours at 40˚C+ 5˚C/ -0˚C and 5% RH (dry air /
nitrogen)
Necessary Soldering Correction Manually
• 96 hours at 60˚C+ 5˚C and < 5% RH for all device
containers
Temperature:
No more than 350˚C (25W for soldering iron).
• 24 hours at 125˚C+ 5˚C and not suitable for reel or
tubes
Time: Within 5 seconds.
ESD Precaution
Note:
Do not do this more than once for any given pin.
Proper storage and handing procedures should be
followed to prevent ESD damage to the devices
especially when they are removed from the anti-static
bag. Electro-Static Sensitive devices warning labels
are on the packing.
Rev. 1.20
16
July 29, 2014
HT3021-10
Sample Code in C for 8051
. //********** HT3021-10
#include <reg51.h>
#include <intrins.h>
READOUT Sample Code ***********//
#define WR3021 0x72
#define RD3021 0x73
//********************/
sbit SDA=P3^6;
sbit SCL=P3^7;
sbit SPK=P3^4;
unsigned char COMMAND=0xFF;
void Delay400Ms(void);
void Delay100Ms(void);
void I2C_start(void);
void I2C_stop(void);
void I2C_ACK(bit tmp);
unsigned char I2C_read();
void I2C_write(unsigned char tmp);
//*** Power Down Mode ***//
COMMAND=0xff;
I2C_start();
I2C_write(WR3021);
I2C_ACK(1);
I2C_write(COMMAND);
I2C_ACK(1);
I2C_stop();
//*** Continuous Integration Mode ***//
COMMAND=0x0C;
I2C_start();
I2C_write(WR3021);
I2C_ACK(1);
I2C_write(COMMAND);
I2C_ACK(1);
I2C_stop();
Delay400Ms();
//*** One Time Integration Mode 400ms ***//
COMMAND=0x04;
I2C_start();
I2C_write(WR3021);
I2C_ACK(1);
I2C_write(COMMAND);
I2C_stop();
COMMAND=0x08;
I2C_start();
I2C_write(WR3021);
I2C_ACK(1);
I2C_write(COMMAND);
I2C_ACK(1);
Rev. 1.20
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HT3021-10
I2C_stop();
Delay400Ms();
COMMAND=0x30;
I2C_start();
I2C_write(WR3021);
I2C_ACK(1);
I2C_write(COMMAND);
I2C_ACK(1);
I2C_stop();
//*** One Time Integration Mode 100ms ***//
COMMAND=0x04;
I2C_start();
I2C_write(WR3021);
I2C_ACK(1);
I2C_write(COMMAND);
I2C_ACK(1);
I2C_stop();
COMMAND=0x08;
I2C_start();
I2C_write(WR3021);
I2C_ACK(1);
I2C_write(COMMAND);
I2C_ACK(1);
I2C_stop();
Delay100Ms();
COMMAND=0x30;
I2C_start();
I2C_write(WR3021);
I2C_ACK(1);
I2C_write(COMMAND);
I2C_ACK(1);
I2C_stop();
//Read Data//
tmp=tmp2=0;
I2C_start();
I2C_write(RD3021);
I2C_ACK(1);
tmp=I2C_read();
I2C_ACK(0);
tmp2=I2C_read();
I2C_stop();
void Delay400Ms(void)
{
unsigned char TempCycA=5;
unsigned int TempCycB;
while(TempCycA--)
{
TempCycB=7269;
while(TempCycB--);
};
}
Rev. 1.20
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HT3021-10
void Delay100Ms(void)
{
unsigned char TempCycA=5;
unsigned int TempCycB;
while(TempCycA--)
{
//TempCycB=3635;
TempCycB=1817;
while(TempCycB--);
};
}
void I2C_start(void)
{
SDA=1;
_nop_();
SCL=1;
_nop_();
SDA=0;
_nop_();
SCL=0;
_nop_();
}
void I2C_stop(void)
{
SDA=0;
_nop_();
SCL=1;
_nop_();
SDA=1;
_nop_();
SCL=0;
_nop_();
SCL=1;
}
void I2C_ACK(bit tmp)
{
SDA=tmp;
_nop_();_nop_();_nop_();_nop_();_nop_();
SCL=1;
_nop_();_nop_();_nop_();_nop_();_nop_();
SCL=0;
}
unsigned char I2C_read(void)
{
unsigned char i,tmp;
tmp=0;
for(i=0;i<8;i++)
{
SCL=0;
_nop_();
_nop_();
_nop_();
SDA=1;
_nop_();_nop_();_nop_();_nop_();_nop_();
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HT3021-10
SCL=1;
_nop_();_nop_();_nop_();_nop_();_nop_();
tmp<<=1;
if(SDA==1) tmp++;
}
SCL=0;
return tmp;
}
void I2C_write(unsigned char tmp)
{
unsigned char i;
for(i=0;i<8;i++)
{
SCL=0;
_nop_();
_nop_();
_nop_();
SDA=(bit)(tmp&0x80);
tmp<<=1;
_nop_();_nop_();_nop_();_nop_();_nop_();
SCL=1;
_nop_();_nop_();_nop_();_nop_();_nop_();
}
SCL=0;
}
Rev. 1.20
20
July 29, 2014
HT3021-10
Package Type: SMD
Top View
Bottom View
Side View
Pad No.
Pad Name
1
SCL
2
VDD
3
REXT
4
ADRS
5
VSS
6
SDA
Pad Assignment
Note: 1. Dimension unit: mm.
2. All tolerances are limited to ±0.1mm unless otherwise noted.
Rev. 1.20
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HT3021-10
Tape Specifications
Tape Arrangement
Tape Dimension (unit: mm)
Reel Dimension (unit: mm)
Feeding Direction
Note: 1. Empty component pockets are sealed with top cover tape
2. The maximum number of missing lamps is two
3. The Polarity is oriented towards the tape sprocket hole
4. 3000 pcs./Reel
Rev. 1.20
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July 29, 2014
HT3021-10
Packaging Specifications
Reel (3000 pcs.)
Label
Moisture-proof bag
Label
Inside box
Label
Maximum seven reels
Label
Outside box
Maximum four inside boxes
Note: Reeled products (numbers of products are 3000 pcs.) packed in a seal off moisture-proof bag along with a
desiccant one by one, Seven moisture-proof bag of maximums (total maximum number of products 21000
pcs.) packed in an inside box (size: about 238mm×about 194mm×about 102mm) and four inside boxes of
maximum are put in the outside box (size: about 410mm×about 254mm×about 229mm) Together with buffer
material, and it is packed. (Part No., Lot No., Quantity should appear on the label on the moisture-proof bag,
Part No. and Quantity should appear on the label on the cardboard box.) The number of the loading steps of
outside box (cardboard box) has it to three steps.
Rev. 1.20
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HT3021-10
Copyright© 2014 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time
of publication. However, Holtek assumes no responsibility arising from the use of
the specifications described. The applications mentioned herein are used solely
for the purpose of illustration and Holtek makes no warranty or representation that
such applications will be suitable without further modification, nor recommends
the use of its products for application that may present a risk to human life due to
malfunction or otherwise. Holtek's products are not authorized for use as critical
components in life support devices or systems. Holtek reserves the right to alter
its products without prior notification. For the most up-to-date information, please
visit our web site at http://www.holtek.com.tw.
Rev. 1.20
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July 29, 2014