RENESAS M306N4FGTFP

Under development
This document is under development and its contents are subject to change
M16C/6N Group (M16C/6N4)
Renesas MCU
REJ03B0003-0240
Rev.2.40
Aug 25, 2006
1. Overview
The M16C/6N Group (M16C/6N4) of MCUs are built using the high-performance silicon gate CMOS process
using the M16C/60 Series CPU core and are packaged in 100-pin plastic molded QFP and LQFP. These
MCUs operate using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of
address space, they are capable of executing instructions at high speed. Being equipped with two CAN
(Controller Area Network) modules in the M16C/6N Group (M16C/6N4), the MCU is suited to drive automotive
and industrial control systems. The CAN modules comply with the 2.0B specification. In addition, this MCU
contains a multiplier and DMAC which combined with fast instruction processing capability, makes it suitable
for control of various OA, communication, and industrial equipment which requires high-speed arithmetic/
logic operations.
1.1 Applications
• Automotive, industrial control systems and other automobile, other (T/V-ver. product)
• Car audio and industrial control systems, other (Normal-ver. product)
Specifications written in this manual are believed to be accurate, but are not
guaranteed to be entirely free of error. Specifications in this manual may be
changed for functional or performance improvements. Please make sure your
manual is the latest edition.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 1 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
1. Overview
1.2 Performance Overview
Table 1.1 lists the Functions and Specifications for M16C/6N Group (M16C/6N4).
Table 1.1 Functions and Specifications for M16C/6N Group (M16C/6N4)
Specification
Item
Normal-ver.
T/V-ver.
CPU
Number of fundamental
91 instructions
instructions
Minimum instruction
41.7 ns (f(BCLK) = 24 MHz,
50.0 ns (f(BCLK) = 20 MHz,
execution time
1/1 prescaler, without software wait) 1/1 prescaler, without software wait)
Operating mode
Single-chip, memory expansion, and microprocessor modes
Address space
1 Mbyte
Memory capacity
Refer to Table 1.2 Product Information
Peripheral Ports
Input/Output: 87 pins, Input: 1 pin
Function
Multifunction timers
Timer A: 16 bits ✕ 5 channels
Timer B: 16 bits ✕ 6 channels
Three-phase motor control circuit
Serial interfaces
3 channels
Clock synchronous, UART, I2C-bus (1), IEBus (2)
1 channel
Clock synchronous
A/D converter
10-bit A/D converter: 1 circuit, 26 channels
D/A converter
8 bits ✕ 2 channels
DMAC
2 channels
CRC calculation circuit
CRC-CCITT
CAN module
2 channels with 2.0B specification
Watchdog timer
15 bits ✕ 1 channel (with prescaler)
Interrupts
Internal: 31 sources, External: 9 sources
Software: 4 sources, Priority levels: 7 levels
Clock generation circuits 4 circuits
• Main clock oscillation circuit (*)
• Sub clock oscillation circuit (*)
• On-chip oscillator
• PLL frequency synthesizer
(*) Equipped with on-chip feedback resistor
Oscillation-stopped detector Main clock oscillation stop and re-oscillation detection function
Electrical
Supply voltage
VCC = 3.0 to 5.5 V (f(BCLK) = 24 MHz, VCC = 4.2 to 5.5 V (f(BCLK) = 20 MHz,
Characteristics
1/1 prescaler, without software wait) 1/1 prescaler, without software wait)
Consumption Mask ROM 20 mA (f(BCLK) = 24 MHz,
18 mA (f(BCLK) = 20 MHz,
current
PLL operation, no division)
PLL operation, no division)
Flash memory 22 mA (f(BCLK) = 24 MHz,
20 mA (f(BCLK) = 20 MHz,
PLL operation, no division)
PLL operation, no division)
Mask ROM 3 µA (f(BCLK) = 32 kHz, Wait mode, Oscillation capacity Low)
Flash memory 0.8 µA (Stop mode, Topr = 25°C)
Flash Memory Programming and erasure voltage 3.0 ± 0.3 V or 5.0 ± 0.5 V
5.0 ± 0.5 V
Version
Programming and erasure endurance 100 times
I/O
I/O withstand voltage
5.0 V
Characteristics Output current
5 mA
Operating Ambient Temperature
-40 to 85°C
T version: -40 to 85°C
V version: -40 to 125°C (option)
Device Configuration
CMOS high-performance silicon gate
Package
100-pin molded-plastic QFP, LQFP
NOTES:
1. I2C-bus is a trademark of Koninklijke Philips Electronics N.V.
2. IEBus is a trademark of NEC Electronics Corporation.
option: All options are on request basis.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 2 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
1. Overview
1.3 Block Diagram
Figure 1.1 shows a Block Diagram.
8
Port P0
8
8
Port P1
Port P3
Three-phase motor
control circuit
CRC calculation circuit (CCITT)
(Polynomial: X16+X12+X5+1)
Watchdog timer
(15 bits)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 3 of 88
ISP
RAM (2)
INTB
PC
FLG
Multiplier
8
Figure 1.1 Block Diagram
A0
A1
FB
ROM (1)
USP
8
NOTES:
1: ROM size depends on MCU type.
2: RAM size depends on MCU type.
R2
R3
SB
Memory
Port P10
D/A converter
(8 bits ✕ 2 channels)
R0L
R1L
CAN module
(2 channels)
Port P9
DMAC
(2 channels)
Clock synchronous serial I/O
(8 bits ✕ 1 channel)
M16C/60 Series CPU core
R0H
R1H
XIN-XOUT
XCIN-XCOUT
PLL frequency synthesizer
On-chip oscillator
7
UART or
Clock synchronous serial I/O
(3 channels)
System clock generation circuit
Port P6
Port P8_5
Output (timer A): 5
Input (timer B): 6
Port P5
8
8
Timer (16 bits)
Port P4
8
Port P8
A/D converter
(10 bits ✕ 8 channels
Expandable up to 26 channels)
8
Port P7
Internal peripheral functions
Port P2
8
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
1. Overview
1.4 Product Information
Table 1.2 lists the Product Information and Figure 1.2 shows the Type Number, Memory Size, and Packages.
Table 1.2 Product Information
As of Aug. 2006
Type No.
ROM Capacity RAM Capacity Package Type (2)
Remarks
M306N4FCFP
128 K + 4 Kbytes 5 Kbytes
PRQP0100JB-A Flash
Normal-ver.
M306N4FCGP
PLQP0100KB-A memory
M306N4FGFP
256 K + 4 Kbytes 10 Kbytes
PRQP0100JB-A version (1)
M306N4FGGP
PLQP0100KB-A
M306N4FCTFP
128 K + 4 Kbytes 5 Kbytes
PRQP0100JB-A
T-ver.
M306N4FCTGP
PLQP0100KB-A
M306N4FGTFP
256 K + 4 Kbytes 10 Kbytes
PRQP0100JB-A
M306N4FGTGP
PLQP0100KB-A
M306N4FCVFP
128 K + 4 Kbytes 5 Kbytes
PRQP0100JB-A
V-ver.
M306N4FCVGP
PLQP0100KB-A
M306N4FGVFP
256 K + 4 Kbytes 10 Kbytes
PRQP0100JB-A
M306N4FGVGP
PLQP0100KB-A
M306N4MC-XXXGP
128 Kbytes
5 Kbytes
PLQP0100KB-A Mask
Normal-ver.
M306N4MG-XXXGP
256 Kbytes
10 Kbytes
PLQP0100KB-A ROM
M306N4MCT-XXXFP
128 Kbytes
5 Kbytes
PRQP0100JB-A version T-ver.
M306N4MCT-XXXGP
PLQP0100KB-A
M306N4MGT-XXXFP
256 Kbytes
10 Kbytes
PRQP0100JB-A
M306N4MGT-XXXGP
PLQP0100KB-A
M306N4MCV-XXXFP
128 Kbytes
5 Kbytes
PRQP0100JB-A
V-ver.
M306N4MCV-XXXGP (D)
PLQP0100KB-A
M306N4MGV-XXXFP
256 Kbytes
10 Kbytes
PRQP0100JB-A
M306N4MGV-XXXGP (D)
PLQP0100KB-A
(D): Under development
NOTES:
1. Data flash memory provides an additional 4 Kbytes of ROM capacity (block A).
2. The correspondence between new and old package types is as follows.
PRQP0100JB-A: 100P6S-A
PLQP0100KB-A: 100P6Q-A
Type No. M30 6N 4 M C T - XXX FP
Package type:
FP : Package PRQP0100JB-A (100P6S-A)
GP: Package PLQP0100KB-A (100P6Q-A)
ROM No.
Omitted on flash memory version
Characteristics
(no) : Normal-ver.
T : T-ver. (Automotive 85°C version)
V : V-ver. (Automotive 125°C version)
ROM capacity:
C : 128 Kbytes
G: 256 Kbytes
Memory type:
M: Mask ROM version
F : Flash memory version
Shows the number of CAN module, pin count, etc.
6N Group
M16C Family
Figure 1.2 Type Number, Memory Size, and Package
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 4 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
1. Overview
1.5 Pin Assignments
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
P1_0/D8
P1_1/D9
P1_2/D10
P1_3/D11
P1_4/D12
P1_5/D13/INT3
P1_6/D14/INT4
P1_7/D15/INT5
P2_0/AN2_0/A0(/D0/-)
P2_1/AN2_1/A1(/D1/D0)
P2_2/AN2_2/A2(/D2/D1)
P2_3/AN2_3/A3(/D3/D2)
P2_4/AN2_4/A4(/D4/D3)
P2_5/AN2_5/A5(/D5/D4)
P2_6/AN2_6/A6(/D6/D5)
P2_7/AN2_7/A7(/D7/D6)
VSS
P3_0/A8(/-/D7)
VCC2
P3_1/A9
P3_2/A10
P3_3/A11
P3_4/A12
P3_5/A13
P3_6/A14
P3_7/A15
P4_0/A16
P4_1/A17
P4_2/A18
P4_3/A19
Figures 1.3 and 1.4 show the Pin Assignment (Top View). Tables 1.3 and 1.4 list the List of Pin Names.
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
M16C/6N Group
(M16C/6N4)
P4_4/CS0
P4_5/CS1
P4_6/CS2
P4_7/CS3
P5_0/WRL/WR
P5_1/WRH/BHE
P5_2/RD
P5_3/BCLK
P5_4/HLDA
P5_5/HOLD
P5_6/ALE
P5_7/RDY/CLKOUT
P6_0/CTS0/RTS0
P6_1/CLK0
P6_2/RXD0/SCL0
P6_3/TXD0/SDA0
P6_4/CTS1/RTS1/CTS0/CLKS1
P6_5/CLK1
P6_6/RXD1/SCL1
P6_7/TXD1/SDA1
P9_6/ANEX1/CTX0
P9_5/ANEX0/CRX0
P9_4/DA1/TB4IN
P9_3/DA0/TB3IN
P9_2/TB2IN/SOUT3
(1) P9_1/TB1IN/SIN3
P9_0/TB0IN/CLK3
BYTE
CNVSS
P8_7/XCIN
P8_6/XCOUT
RESET
XOUT
VSS
XIN
VCC1
P8_5/NMI
P8_4/INT2/ZP
P8_3/INT1
P8_2/INT0
P8_1/TA4IN/U
P8_0/TA4OUT/U
P7_7/TA3IN/CRX1
P7_6/TA3OUT/CTX1
P7_5/TA2IN/W
P7_4/TA2OUT/W
P7_3/CTS2/RTS2/TA1IN/V
P7_2/CLK2/TA1OUT/V
(1) P7_1/RXD2/SCL2/TA0IN/TB5IN
P7_0/TXD2/SDA2/TA0OUT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
P0_7/AN0_7/D7
P0_6/AN0_6/D6
P0_5/AN0_5/D5
P0_4/AN0_4/D4
P0_3/AN0_3/D3
P0_2/AN0_2/D2
P0_1/AN0_1/D1
P0_0/AN0_0/D0
P10_7/AN7/KI3
P10_6/AN6/KI2
P10_5/AN5/KI1
P10_4/AN4/KI0
P10_3/AN3
P10_2/AN2
P10_1/AN1
AVSS
P10_0/AN0
VREF
AVCC
P9_7/ADTRG
NOTE:
1. P7_1 and P9_1 are N channel open-drain pins.
Figure 1.3 Pin Assignments (Top View) (1)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 5 of 88
Package: PRQP0100JB-A (100P6S-A)
Under development
This document is under development and its contents are subject to change.
1. Overview
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
P1_3/D11
P1_4/D12
P1_5/D13/INT3
P1_6/D14/INT4
P1_7/D15/INT5
P2_0/AN2_0/A0(/D0/-)
P2_1/AN2_1/A1(/D1/D0)
P2_2/AN2_2/A2(/D2/D1)
P2_3/AN2_3/A3(/D3/D2)
P2_4/AN2_4/A4(/D4/D3)
P2_5/AN2_5/A5(/D5/D4)
P2_6/AN2_6/A6(/D6/D5)
P2_7/AN2_7/A7(/D7/D6)
VSS
P3_0/A8(/-/D7)
VCC2
P3_1/A9
P3_2/A10
P3_3/A11
P3_4/A12
P3_5/A13
P3_6/A14
P3_7/A15
P4_0/A16
P4_1/A17
M16C/6N Group (M16C/6N4)
76
77
78
79
80
50
49
48
47
46
45
44
43
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
42
41
40
39
38
37
36
35
34
33
32
31
30
M16C/6N Group
(M16C/6N4)
29
28
27
26
100
P4_2/A18
P4_3/A19
P4_4/CS0
P4_5/CS1
P4_6/CS2
P4_7/CS3
P5_0/WRL/WR
P5_1/WRH/BHE
P5_2/RD
P5_3/BCLK
P5_4/HLDA
P5_5/HOLD
P5_6/ALE
P5_7/RDY/CLKOUT
P6_0/CTS0/RTS0
P6_1/CLK0
P6_2/RXD0/SCL0
P6_3/TXD0/SDA0
P6_4/CTS1/RTS1/CTS0/CLKS1
P6_5/CLK1
P6_6/RXD1/SCL1
P6_7/TXD1/SDA1
P7_0/TXD2/SDA2/TA0OUT
P7_1/RXD2/SCL2/TA0IN/TB5IN (1)
P7_2/CLK2/TA1OUT/V
P9_4/DA1/TB4IN
P9_3/DA0/TB3IN
P9_2/TB2IN/SOUT3
(1) P9_1/TB1IN/SIN3
P9_0/TB0IN/CLK3
BYTE
CNVSS
P8_7/XCIN
P8_6/XCOUT
RESET
XOUT
VSS
XIN
VCC1
P8_5/NMI
P8_4/INT2/ZP
P8_3/INT1
P8_2/INT0
P8_1/TA4IN/U
P8_0/TA4OUT/U
P7_7/TA3IN/CRX1
P7_6/TA3OUT/CTX1
P7_5/TA2IN/W
P7_4/TA2OUT/W
P7_3/CTS2/RTS2/TA1IN/V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
P1_2/D10
P1_1/D9
P1_0/D8
P0_7/AN0_7/D7
P0_6/AN0_6/D6
P0_5/AN0_5/D5
P0_4/AN0_4/D4
P0_3/AN0_3/D3
P0_2/AN0_2/D2
P0_1/AN0_1/D1
P0_0/AN0_0/D0
P10_7/AN7/KI3
P10_6/AN6/KI2
P10_5/AN5/KI1
P10_4/AN4/KI0
P10_3/AN3
P10_2/AN2
P10_1/AN1
AVSS
P10_0/AN0
VREF
AVCC
P9_7/ADTRG
P9_6/ANEX1/CTX0
P9_5/ANEX0/CRX0
NOTE:
1. P7_1 and P9_1 are N channel open-drain pins.
Figure 1.4 Pin Assignments (Top View) (2)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 6 of 88
Package: PLQP0100KB-A (100P6Q-A)
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
1. Overview
Table 1.3 List of Pin Names (1)
Pin No. Control
FP GP
Pin
1 99
2 100
3
1
4
2
5
3
6
4
7
5
8
6 BYTE
9
7 CNVSS
10 8 XCIN
11 9 XCOUT
____________
12 10 RESET
13 11 XOUT
14 12 VSS
15 13 XIN
16 14 VCC1
17 15
18 16
19 17
20 18
21 19
22 20
23 21
24 22
25 23
26 24
27 25
28 26
29 27
30 28
31 29
32 30
33 31
34 32
35 33
36 34
37 35
38 36
39 37
40 38
41 39
42 40
43 41
44 42
45 43
46 44
47 45
48 46
49 47
50 48
Port
Interrupt
Pin
P9_6
P9_5
P9_4
P9_3
P9_2
P9_1
P9_0
Timer Pin
UART Pin
Analog CAN Module
Bus Control Pin
Pin
Pin
ANEX1
ANEX0
DA1
DA0
TB4IN
TB3IN
TB2IN
TB1IN
TB0IN
CTX0
CRX0
SOUT3
SIN3
CLK3
P8_7
P8_6
_______
P8_5
P8_4
P8_3
P8_2
P8_1
P8_0
P7_7
P7_6
P7_5
P7_4
P7_3
P7_2
P7_1
P7_0
P6_7
P6_6
P6_5
P6_4
P6_3
P6_2
P6_1
P6_0
P5_7
P5_6
P5_5
P5_4
P5_3
P5_2
P5_1
P5_0
P4_7
P4_6
P4_5
P4_4
NMI
________
INT2
INT1
INT0
ZP
___
TA4IN/U
TA4OUT/U
TA3IN
TA3OUT
____
TA2IN/W
TA2OUT/W
___
TA1IN/V
TA1OUT/V
TA0IN/TB5IN
TA0OUT
CRX1
CTX1
__________ __________
CTS2/RTS2
CLK2
RXD2/SCL2
TXD2/SDA2
TXD1/SDA1
RXD1/SCL1
CLK1
_________ _________ _________
CTS1/RTS1/CTS0/CLKS1
TXD0/SDA0
RXD0/SCL0
CLK0
__________ __________
CTS0/RTS0
FP: PRQP0100JB-A (100P6S-A), GP: PLQP0100KB-A (100P6Q-A)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 7 of 88
________
RDY/CLKOUT
ALE
__________
HOLD
__________
HLDA
BCLK
_____
RD
_________ ________
WRH/BHE
________ ______
WRL/WR
_______
CS3
_______
CS2
_______
CS1
_______
CS0
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
1. Overview
Table 1.4 List of Pin Names (2)
Pin No. Control
FP GP
Pin
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
Port
Interrupt
Pin
Timer Pin
UART Pin
Analog CAN Module
Bus Control Pin
Pin
Pin
P4_3
P4_2
P4_1
P4_0
P3_7
P3_6
P3_5
P3_4
P3_3
P3_2
P3_1
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
P3_0
A8(/-/D7)
VCC2
VSS
P2_7
P2_6
P2_5
P2_4
P2_3
P2_2
P2_1
P2_0
P1_7
P1_6
P1_5
P1_4
P1_3
P1_2
P1_1
P1_0
P0_7
P0_6
P0_5
P0_4
P0_3
P0_2
P0_1
P0_0
P10_7
P10_6
P10_5
P10_4
P10_3
P10_2
P10_1
________
AN2_7
AN2_6
AN2_5
AN2_4
AN2_3
AN2_2
AN2_1
AN2_0
INT5
________
INT4
________
INT3
______
KI3
______
KI2
______
KI1
______
KI0
AN0_7
AN0_6
AN0_5
AN0_4
AN0_3
AN0_2
AN0_1
AN0_0
AN7
AN6
AN5
AN4
AN3
AN2
AN1
AVSS
P10_0
VREF
AVCC
AN0
_____________
P9_7
FP: PRQP0100JB-A (100P6S-A), GP: PLQP0100KB-A (100P6Q-A)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 8 of 88
ADTRG
A7(/D7/D6)
A6(/D6/D5)
A5(/D5/D4)
A4(/D4/D3)
A3(/D3/D2)
A2(/D2/D1)
A1(/D1/D0)
A0(/D0/-)
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
1. Overview
1.6 Pin Functions
Tables 1.5 to 1.7 list the Pin Functions.
Table 1.5 Pin Functions (1)
Signal Name
Power supply
input
Pin Name
VCC1, VCC2,
VSS
I/O Type
Description
I
Apply 4.2 to 5.5 V (T/V-ver.), 3.0 to 5.5 V (Normal-ver.) to the VCC1
Analog power
supply input
Reset input
CNVSS
AVCC, AVSS
RESET
CNVSS
I
I
External data
bus width
select input
BYTE
I
Bus control
pins
D0 to D7
I/O
D8 to D15
I/O
A0 to A19
A0/D0 to A7/D7
O
I/O
A1/D0 to A8/D7
I/O
I
_____________
_______
_______
O
CS0 to CS3
_________ ______
WRL/WR
_________
________
WRH/BHE
______
RD
O
ALE
__________
HOLD
O
I
__________
O
I
HLDA
________
RDY
I: Input
O: Output
and VCC2 pins and 0 V to the VSS pin. The VCC apply condition is
that VCC2 = VCC1 (1).
Applies the power supply for the A/D converter. Connect the AVCC
pin to VCC1. Connect the AVSS pin to VSS.
The MCU is in a reset state when applying “L” to the this pin.
Switches processor mode. Connect this pin to VSS to when after
a reset to start up in single-chip mode. Connect this pin to VCC1
to start up in microprocessor mode.
Switches the data bus in external memory space. The data bus
is 16-bit long when the this pin is held “L” and 8-bit long when
the this pin is held “H”. Set it to either one. Connect this pin to
VSS when single-chip mode.
Inputs and outputs data (D0 to D7) when these pins are set as
the separate bus.
Inputs and outputs data (D8 to D15) when external 16-bit data
bus is set as the separate bus.
Output address bits (A0 to A19).
Input and output data (D0 to D7) and output address bits (A0 to
A7) by time-sharing when external 8-bit data bus are set as the
multiplexed bus.
Input and output data (D0 to D7) and output address bits (A1 to
A8) by time-sharing when external 16-bit data bus are set as the
multiplexed
bus.
_______
_______
_______
_______
Output CS0 to CS3 signals. CS0 to CS3 are chip-select signals
to specify
an external______
space.
________ _________
________
_____
________
_________
Output
WRL,
WRH,
(WR,
BHE), RD signals. WRL and WRH or
________
______
BHE, and WR can be switched by program.
________ _________
_____
• WRL,
WRH, and RD are selected
________
The WRL signal becomes “L” by writing data to an even address
in an
external memory space.
_________
The WRH signal becomes “L” by writing data to an odd address
in an_____
external memory space.
The RD pin signal becomes “L” by reading data in an external
memory
space._____
______ ________
• WR, ______
BHE, and RD are selected
The WR signal becomes “L” by writing data in an external
memory space.
_____
The RD signal becomes “L” by reading data in an external
memory
space.
________
The BHE
signal becomes
“L” by accessing an odd address.
______ ________
_____
Select WR, BHE, and RD for an external 8-bit data bus.
ALE is a signal
to latch the address.
__________
While the HOLD pin is held “L”, the MCU is placed in a hold
state.
__________
In a hold state, HLDA outputs a “L” signal.
________
While applying a “L” signal to the RDY pin, the MCU is placed in
a wait state.
I/O: Input/Output
NOTE:
1. In this manual, hereafter, VCC refers to VCC1 unless otherwise noted.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
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Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
1. Overview
Table 1.6 Pin Functions (2)
Signal Name
Main clock
input
Main clock
output
Sub clock
input
Sub clock
output
BCLK output
Clock output
INT
interrupt input
_______
NMI interrupt
input
Key input
interrupt input
Timer A
I/O Type
Description
XIN
Pin Name
I
XOUT
O
XCIN
I
XCOUT
O
BCLK
CLKOUT
________
________
INT0
to INT5
________
NMI
O
O
I
I
I/O pins for the main clock oscillation circuit. Connect a ceramic
resonator or crystal oscillator between XIN and XOUT (1).
To use the external clock, input the clock from XIN and leave
XOUT open.
I/O pins for a sub clock oscillation circuit. Connect a crystal
oscillator between XCIN and XCOUT (1).
To use the external clock, input the clock from XCIN and leave
XCOUT open.
Outputs the BCLK signal.
The clock of the same
cycle as fC, f8, or f32 is output.
______
Input pins for the_______
INT interrupt.
Input pin for the NMI interrupt.
I
Input pins for the key input interrupt.
______
______
KI0 to KI3
TA0OUT to TA4OUT
TA0IN to TA4IN
ZP
Timer B
TB0IN
to___TB5IN
___
____
Three-phase motor U, U, V, V, W, W
control output
__________
__________
Serial interface CTS0
to
CTS2
__________
__________
RTS0 to RTS2
CLK0 to CLK3
RXD0 to RXD2
SIN3
TXD0 to TXD2
SOUT3
CLKS1
I/O
I
I
I
O
These are timer A0 to timer A4 I/O pins.
These are timer A0 to timer A4 input pins.
Input pin for the Z-phase.
These are timer B0 to timer B5 input pins.
These are Three-phase motor control output pins.
I
O
I/O
I
I
O
O
O
I2C mode
SDA0 to SDA2
SCL0 to SCL2
I/O
I/O
Reference
VREF
These are transmit control input pins.
These are receive control output pins.
These are transfer clock I/O pins.
These are serial data input pins.
These are serial data input pins.
These are serial data output pins.
These are serial data output pins.
This is output pin for transfer clock output from multiple pins
function.
These are serial data I/O pins.
These are transfer clock I/O pins. (however, SCL2 for the
N-channel open drain output.)
Applies the reference voltage for the A/D converter and D/A
I
converter.
voltage input
I
Analog input pins for the A/D converter.
ADTRG
I
This is an A/D trigger input pin.
ANEX0
I/O
ANEX1
I
This is the extended analog input pin for the A/D converter.
D/A converter
DA0, DA1
O
These are the output pins for the D/A converter.
CAN module
CRX0, CRX1
I
These are the input pins for the CAN module.
A/D converter
AN0 to AN7
AN0_0 to AN0_7
AN2_0
to AN2_7
_____________
This is the extended analog input pin for the A/D converter,
and is the output in external op-amp connection mode.
I: Input
These are the output pins for the CAN module.
CTX0, CTX1
O
O: Output
I/O: Input/Output
NOTE:
1. Ask the oscillator maker the oscillation characteristic.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 10 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
1. Overview
Table 1.7 Pin Functions (3)
Signal Name
I/O port
Pin Name
P0_0 to P0_7
I/O Type
Description
8-bit I/O ports in CMOS, having a direction register to select
I/O
P1_0 to P1_7
an input or output.
P2_0 to P2_7
Each pin is set as an input port or output port. An input port
P3_0 to P3_7
P4_0 to P4_7
can be set for a pull-up or for no pull-up in 4-bit unit by
P5_0 to P5_7
(however, P7_1 and P9_1 for the N-channel open drain
P6_0 to P6_7
output.)
program.
P7_0 to P7_7
P8_0 to P8_4
P8_6, P8_7
P9_0 to P9_7
P10_0 to P10_7
Input port
P8_5
_______
I
Input pin for the NMI interrupt.
Pin states can be read by the P8_5 bit in the P8 register.
I: Input
O: Output
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
I/O: Input/Output
page 11 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
2. Central Processing Unit (CPU)
2. Central Processing Unit (CPU)
Figure 2.1 shows the CPU Registers. The CPU has 13 registers. Of these, R0, R1, R2, R3, A0, A1, and FB
configure a register bank. There are two register banks.
b31
b15
b8 b7
b0
R2
R0H (R0's high bits) R0L (R0's low bits)
R3
R1H (R1's high bits) R1L (R1's low bits)
Data Registers (1)
R2
R3
A0
Address Registers (1)
A1
FB
b19
Frame Base Registers (1)
b15
b0
INTBH
Interrupt Table Register
INTBL
The upper 4 bits of INTB are INTBH and the lower 16 bits of INTB are INTBL.
b19
b0
Program Counter
PC
b15
b0
USP
User Stack Pointer
ISP
Interrupt Stack Pointer
SB
Static Base Register
b15
b0
FLG
b15
Flag Register
b8 b7
IPL
U
b0
I
O B S
Z
D C
Carry Flag
Debug Flag
Zero Flag
Sign Flag
Register Bank Select Flag
Overflow Flag
Interrupt Enable Flag
Stack Pointer Select Flag
Reserved Area
Processor Interrupt Priority Level
Reserved Area
NOTE:
1. These registers comprise a register bank. There are two register banks.
Figure 2.1 CPU Registers
2.1 Data Registers (R0, R1, R2, and R3)
The R0 register consists of 16 bits, and is used mainly for transfers and arithmetic/logic operations. R1 to
R3 are the same as R0.
The R0 register can be separated between high (R0H) and low (R0L) for use as two 8-bit data registers.
R1H and R1L are the same as R0H and R0L. Conversely R2 and R0 can be combined for use as a 32-bit
data register (R2R0). R3R1 is analogous to R2R0.
2.2 Address Registers (A0 and A1)
The A0 register consists of 16 bits, and is used for address register indirect addressing and address
register relative addressing. They also are used for transfers and arithmetic/logic operations. A1 is the
same as A0.
In some instructions, A1 and A0 can be combined for use as a 32-bit address register (A1A0).
Rev.2.40 Aug 25, 2006
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Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
2. Central Processing Unit (CPU)
2.3 Frame Base Register (FB)
FB is configured with 16 bits, and is used for FB relative addressing.
2.4 Interrupt Table Register (INTB)
INTB is configured with 20 bits, indicating the start address of an interrupt vector table.
2.5 Program Counter (PC)
PC is configured with 20 bits, indicating the address of an instruction to be executed.
2.6 User Stack Pointer (USP), Interrupt Stack Pointer (ISP)
Stack pointer (SP) comes in two types: USP and ISP, each configured with 16 bits.
Your desired type of stack pointer (USP or ISP) can be selected by the U flag of FLG.
2.7 Static Base Register (SB)
SB is configured with 16 bits, and is used for SB relative addressing.
2.8 Flag Register (FLG)
FLG consists of 11 bits, indicating the CPU status.
2.8.1 Carry Flag (C Flag)
This flag retains a carry, borrow, or shift-out bit that has occurred in the arithmetic/logic unit.
2.8.2 Debug Flag (D Flag)
This flag is used exclusively for debugging purpose. During normal use, set to 0.
2.8.3 Zero Flag (Z Flag)
This flag is set to 1 when an arithmetic operation resulted in 0; otherwise, it is 0.
2.8.4 Sign Flag (S Flag)
This flag is set to 1 when an arithmetic operation resulted in a negative value; otherwise, it is 0.
2.8.5 Register Bank Select Flag (B Flag)
Register bank 0 is selected when this flag is 0; register bank 1 is selected when this flag is 1.
2.8.6 Overflow Flag (O Flag)
This flag is set to 1 when the operation resulted in an overflow; otherwise, it is 0.
2.8.7 Interrupt Enable Flag (I Flag)
This flag enables a maskable interrupt.
Maskable interrupts are disabled when the I flag is 0, and are enabled when the I flag is 1. The I flag is set
to 0 when the interrupt request is accepted.
2.8.8 Stack Pointer Select Flag (U Flag)
ISP is selected when the U flag is 0; USP is selected when the U flag is 1.
The U flag is set to 0 when a hardware interrupt request is accepted or an INT instruction for software
interrupt Nos. 0 to 31 is executed.
2.8.9 Processor Interrupt Priority Level (IPL)
IPL is configured with three bits, for specification of up to eight processor interrupt priority levels from level
0 to level 7.
If a requested interrupt has priority greater than IPL, the interrupt request is enabled.
2.8.10 Reserved Area
When white to this bit, write 0. When read, its content is undefined.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
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Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
3. Memory
3. Memory
Figure 3.1 shows a Memory Map. The address space extends the 1 Mbyte from address 00000h to FFFFFh.
The internal ROM is allocated in a lower address direction beginning with address FFFFFh. For example, a
128-Kbyte internal ROM is allocated to the addresses from E0000h to FFFFFh.
As for the flash memory version, 4-Kbyte space (block A) exists in 0F000h to 0FFFFh. 4-Kbyte space is
mainly for storing data. In addition to storing data, 4-Kbyte space also can store programs.
The fixed interrupt vector table is allocated to the addresses from FFFDCh to FFFFFh. Therefore, store the
start address of each interrupt routine here.
The internal RAM is allocated in an upper address direction beginning with address 00400h. For example, a
5-Kbyte internal RAM is allocated to the addresses from 00400h to 017FFh. In addition to storing data, the
internal RAM also stores the stack used when calling subroutines and when interrupts are generated.
The Special Function Registers (SFRs) are allocated to the addresses from 00000h to 003FFh. Peripheral
function control registers are located here. Of the SFR, any area which has no functions allocated is reserved
for future use and cannot be accessed by user.
The special page vector table is allocated to the addresses from FFE00h to FFFDBh. This vector is used by
the JMPS or JSRS instruction. For details, refer to M16C/60, M16C/20, M16C/Tiny Series Software Manual.
In memory expansion and microprocessor modes, some areas are reserved for future use and cannot be
used by users.
00000h
SFR
00400h
Internal RAM
XXXXXh
FFE00h
Reserved area (1)
0F000h
0FFFFh
10000h
Internal ROM
(data flash) (3)
Special page
vector table
External area
27000h
Reserved area
FFFDCh
BRK instruction
Address match
Single step
External area
Internal ROM (4)
Internal RAM
Capacity
Address XXXXXh
Capacity
Address YYYYYh
5 Kbytes
017FFh
128 Kbytes
E0000h
10 Kbytes
02BFFh
256 Kbytes
C0000h
80000h
YYYYYh
FFFFFh
Undefined instruction
Overflow
28000h
Reserved area (2)
Oscillation stop and re-oscillation
detection / watchdog timer
Internal ROM
(program area) (4)
FFFFFh
DBC
NMI
Reset
NOTES:
1. During memory expansion mode or microprocessor mode, cannot be used.
2. In memory expansion mode, cannot be used.
3. As for the flash memory version, 4-Kbyte space (block A) exists.
4. When using the masked ROM version, write nothing to internal ROM area.
5. Shown here is a memory map for the case where the PM10 bit in the PM1 register is 1 (block A enabled, addresses 10000h to
26FFFh for CS2 area) and the PM13 bit in the PM1 register is 1 (internal RAM area is expanded over 192 Kbytes).
Figure 3.1 Memory Map
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Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
4. Special Function Registers (SFRs)
An SFR (Special Function Register) is a control register for a peripheral function.
Tables 4.1 to 4.16 list the SFR Information.
Table 4.1 SFR Information (1) (3)
Address
0000h
0001h
0002h
0003h
Register
Symbol
After Reset
00000000b (CNVSS pin is "L")
00000011b (CNVSS pin is "H")
00001000b
01001000b
00100000b
00000001b
XXXXXX00b
XX000000b
0004h
Processor Mode Register 0 (1)
PM0
0005h
0006h
0007h
0008h
0009h
000Ah
000Bh
000Ch
000Dh
000Eh
000Fh
0010h
0011h
0012h
0013h
0014h
0015h
0016h
0017h
0018h
0019h
001Ah
001Bh
001Ch
001Dh
001Eh
001Fh
0020h
0021h
0022h
0023h
0024h
0025h
0026h
0027h
0028h
0029h
002Ah
002Bh
002Ch
002Dh
002Eh
002Fh
0030h
0031h
0032h
0033h
0034h
0035h
0036h
0037h
0038h
0039h
003Ah
003Bh
003Ch
003Dh
003Eh
003Fh
Processor Mode Register 1
System Clock Control Register 0
System Clock Control Register 1
Chip Select Control Register
Address Match Interrupt Enable Register
Protect Register
PM1
CM0
CM1
CSR
AIER
PRCR
Oscillation Stop Detection Register (2)
CM2
0X000000b
Watchdog Timer Start Register
Watchdog Timer Control Register
WDTS
WDC
Address Match Interrupt Register 0
RMAD0
XXh
00XXXXXXb
00h
00h
X0h
Address Match Interrupt Register 1
RMAD1
Chip Select Expansion Control Register
PLL Control Register 0
CSE
PLC0
00h
0001X010b
Processor Mode Register 2
PM2
XXX00000b
DMA0 Source Pointer
SAR0
XXh
XXh
XXh
DMA0 Destination Pointer
DAR0
XXh
XXh
XXh
DMA0 Transfer Counter
TCR0
XXh
XXh
DMA0 Control Register
DM0CON
DMA1 Source Pointer
SAR1
XXh
XXh
XXh
DMA1 Destination Pointer
DAR1
XXh
XXh
XXh
DMA1 Transfer Counter
TCR1
XXh
XXh
DMA1 Control Register
DM1CON
00h
00h
X0h
00000X00b
00000X00b
X: Undefined
NOTES:
1. Bits PM00 and PM01 in the PM0 register do not change at software reset, watchdog timer reset and oscillation stop detection reset.
2. Bits CM20, CM21, and CM27 in the CM2 register do not change at oscillation stop detection reset.
3. Blank spaces are reserved. No access is allowed.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
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Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.2 SFR Information (2) (1)
Address
0040h
0041h
0042h
0043h
0044h
0045h
0046h
0047h
0048h
0049h
004Ah
004Bh
004Ch
004Dh
004Eh
004Fh
0050h
0051h
0052h
0053h
0054h
0055h
0056h
0057h
0058h
0059h
005Ah
005Bh
005Ch
005Dh
005Eh
005Fh
0060h
0061h
0062h
0063h
0064h
0065h
0066h
0067h
0068h
0069h
006Ah
006Bh
006Ch
006Dh
006Eh
006Fh
0070h
0071h
0072h
0073h
0074h
0075h
0076h
0077h
0078h
0079h
007Ah
007Bh
007Ch
007Dh
007Eh
007Fh
Register
CAN0/1 Wake-up Interrupt Control Register
CAN0 Successful Reception Interrupt Control Register
CAN0 Successful Transmission Interrupt Control Register
INT3 Interrupt Control Register
Timer B5 Interrupt Control Register
Timer B4 Interrupt Control Register
UART1 Bus Collision Detection Interrupt Control Register
Timer B3 Interrupt Control Register
UART0 Bus Collision Detection Interrupt Control Register
CAN1 Successful Reception Interrupt Control Register
INT5 Interrupt Control Register
CAN1 Successful Transmission Interrupt Control Register
SI/O3 Interrupt Control Register
INT4 Interrupt Control Register
UART2 Bus Collision Detection Interrupt Control Register
DMA0 Interrupt Control Register
DMA1 Interrupt Control Register
CAN0/1 Error Interrupt Control Register
A/D Conversion Interrupt Control Register
Key Input Interrupt Control Register
UART2 Transmit Interrupt Control Register
UART2 Receive Interrupt Control Register
UART0 Transmit Interrupt Control Register
UART0 Receive Interrupt Control Register
UART1 Transmit Interrupt Control Register
UART1 Receive Interrupt Control Register
Timer A0 Interrupt Control Register
Timer A1 Interrupt Control Register
Timer A2 Interrupt Control Register
Timer A3 Interrupt Control Register
Timer A4 Interrupt Control Register
Timer B0 Interrupt Control Register
Timer B1 Interrupt Control Register
Timer B2 Interrupt Control Register
INT0 Interrupt Control Register
INT1 Interrupt Control Register
INT2 Interrupt Control Register
CAN0 Message Box 0: Identifier / DLC
CAN0 Message Box 0: Data Field
CAN0 Message Box 0: Time Stamp
CAN0 Message Box 1: Identifier / DLC
CAN0 Message Box 1: Data Field
CAN0 Message Box 1: Time Stamp
X: Undefined
NOTE:
1. Blank space is reserved. No access is allowed.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
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Symbol
C01WKIC
C0RECIC
C0TRMIC
INT3IC
TB5IC
TB4IC
U1BCNIC
TB3IC
U0BCNIC
C1RECIC
INT5IC
C1TRMIC
S3IC
INT4IC
U2BCNIC
DM0IC
DM1IC
C01ERRIC
ADIC
KUPIC
S2TIC
S2RIC
S0TIC
S0RIC
S1TIC
S1RIC
TA0IC
TA1IC
TA2IC
TA3IC
TA4IC
TB0IC
TB1IC
TB2IC
INT0IC
INT1IC
INT2IC
After Reset
XXXXX000b
XXXXX000b
XXXXX000b
XX00X000b
XXXXX000b
XXXXX000b
XXXXX000b
XX00X000b
XX00X000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XX00X000b
XX00X000b
XX00X000b
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.3 SFR Information (3)
Address
0080h
0081h
0082h
0083h
0084h
0085h
0086h
0087h
0088h
0089h
008Ah
008Bh
008Ch
008Dh
008Eh
008Fh
0090h
0091h
0092h
0093h
0094h
0095h
0096h
0097h
0098h
0099h
009Ah
009Bh
009Ch
009Dh
009Eh
009Fh
00A0h
00A1h
00A2h
00A3h
00A4h
00A5h
00A6h
00A7h
00A8h
00A9h
00AAh
00ABh
00ACh
00ADh
00AEh
00AFh
00B0h
00B1h
00B2h
00B3h
00B4h
00B5h
00B6h
00B7h
00B8h
00B9h
00BAh
00BBh
00BCh
00BDh
00BEh
00BFh
Register
CAN0 Message Box 2: Identifier / DLC
CAN0 Message Box 2: Data Field
CAN0 Message Box 2: Time Stamp
CAN0 Message Box 3: Identifier / DLC
CAN0 Message Box 3: Data Field
CAN0 Message Box 3: Time Stamp
CAN0 Message Box 4: Identifier / DLC
CAN0 Message Box 4: Data Field
CAN0 Message Box 4: Time Stamp
CAN0 Message Box 5: Identifier / DLC
CAN0 Message Box 5: Data Field
CAN0 Message Box 5: Time Stamp
X: Undefined
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
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Symbol
After Reset
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.4 SFR Information (4)
Address
00C0h
00C1h
00C2h
00C3h
00C4h
00C5h
00C6h
00C7h
00C8h
00C9h
00CAh
00CBh
00CCh
00CDh
00CEh
00CFh
00D0h
00D1h
00D2h
00D3h
00D4h
00D5h
00D6h
00D7h
00D8h
00D9h
00DAh
00DBh
00DCh
00DDh
00DEh
00DFh
00E0h
00E1h
00E2h
00E3h
00E4h
00E5h
00E6h
00E7h
00E8h
00E9h
00EAh
00EBh
00ECh
00EDh
00EEh
00EFh
00F0h
00F1h
00F2h
00F3h
00F4h
00F5h
00F6h
00F7h
00F8h
00F9h
00FAh
00FBh
00FCh
00FDh
00FEh
00FFh
Register
CAN0 Message Box 6: Identifier / DLC
CAN0 Message Box 6: Data Field
CAN0 Message Box 6: Time Stamp
CAN0 Message Box 7: Identifier / DLC
CAN0 Message Box 7: Data Field
CAN0 Message Box 7: Time Stamp
CAN0 Message Box 8: Identifier / DLC
CAN0 Message Box 8: Data Field
CAN0 Message Box 8: Time Stamp
CAN0 Message Box 9: Identifier / DLC
CAN0 Message Box 9: Data Field
CAN0 Message Box 9: Time Stamp
X: Undefined
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 18 of 88
Symbol
After Reset
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.5 SFR Information (5)
Address
0100h
0101h
0102h
0103h
0104h
0105h
0106h
0107h
0108h
0109h
010Ah
010Bh
010Ch
010Dh
010Eh
010Fh
0110h
0111h
0112h
0113h
0114h
0115h
0116h
0117h
0118h
0119h
011Ah
011Bh
011Ch
011Dh
011Eh
011Fh
0120h
0121h
0122h
0123h
0124h
0125h
0126h
0127h
0128h
0129h
012Ah
012Bh
012Ch
012Dh
012Eh
012Fh
0130h
0131h
0132h
0133h
0134h
0135h
0136h
0137h
0138h
0139h
013Ah
013Bh
013Ch
013Dh
013Eh
013Fh
Register
CAN0 Message Box 10: Identifier / DLC
CAN0 Message Box 10: Data Field
CAN0 Message Box 10: Time Stamp
CAN0 Message Box 11: Identifier / DLC
CAN0 Message Box 11: Data Field
CAN0 Message Box 11: Time Stamp
CAN0 Message Box 12: Identifier / DLC
CAN0 Message Box 12: Data Field
CAN0 Message Box 12: Time Stamp
CAN0 Message Box 13: Identifier / DLC
CAN0 Message Box 13: Data Field
CAN0 Message Box 13: Time Stamp
X: Undefined
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 19 of 88
Symbol
After Reset
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.6 SFR Information (6) (1)
Address
0140h
0141h
0142h
0143h
0144h
0145h
0146h
0147h
0148h
0149h
014Ah
014Bh
014Ch
014Dh
014Eh
014Fh
0150h
0151h
0152h
0153h
0154h
0155h
0156h
0157h
0158h
0159h
015Ah
015Bh
015Ch
015Dh
015Eh
015Fh
0160h
0161h
0162h
0163h
0164h
0165h
0166h
0167h
0168h
0169h
016Ah
016Bh
016Ch
016Dh
016Eh
016Fh
0170h
0171h
0172h
0173h
0174h
0175h
0176h
0177h
0178h
0179h
017Ah
017Bh
017Ch
017Dh
017Eh
017Fh
Register
Symbol
CAN0 Message Box 14: Identifier /DLC
CAN0 Message Box 14: Data Field
CAN0 Message Box 14: Time Stamp
CAN0 Message Box 15: Identifier /DLC
CAN0 Message Box 15: Data Field
CAN0 Message Box 15: Time Stamp
CAN0 Global Mask Register
C0GMR
CAN0 Local Mask A Register
C0LMAR
CAN0 Local Mask B Register
C0LMBR
X: Undefined
NOTE:
1. Blank spaces are reserved. No access is allowed.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 20 of 88
After Reset
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.7 SFR Information (7) (2)
Address
0180h
0181h
0182h
0183h
0184h
0185h
0186h
0187h
0188h
0189h
018Ah
018Bh
018Ch
018Dh
018Eh
018Fh
0190h
0191h
0192h
0193h
0194h
0195h
0196h
0197h
0198h
0199h
019Ah
019Bh
019Ch
019Dh
019Eh
019Fh
01A0h
01A1h
01A2h
01A3h
01A4h
01A5h
01A6h
01A7h
01A8h
01A9h
01AAh
01ABh
01ACh
01ADh
01AEh
01AFh
01B0h
01B1h
01B2h
01B3h
01B4h
01B5h
01B6h
01B7h
01B8h
01B9h
01BAh
01BBh
01BCh
01BDh
01BEh
01BFh
Register
Symbol
After Reset
Flash Memory Control Register 1 (1)
FMR1
0X00XX0Xb
Flash Memory Control Register 0 (1)
FMR0
Address Match Interrupt Register 2
RMAD2
Address Match Interrupt Enable Register 2
AIER2
Address Match Interrupt Register 3
RMAD3
00000001b
00h
00h
X0h
XXXXXX00b
00h
00h
X0h
X: Undefined
NOTES:
1. These registers are included in the flash memory version. Cannot be accessed by users in the mask ROM version.
2. Blank spaces are reserved. No access is allowed.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 21 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.8 SFR Information (8) (1)
Address
01C0h
01C1h
01C2h
01C3h
01C4h
01C5h
01C6h
01C7h
01C8h
01C9h
01CAh
01CBh
01CCh
01CDh
01CEh
01CFh
01D0h
01D1h
01D2h
01D3h
01D4h
01D5h
01D6h
01D7h
01D8h
01D9h
01DAh
01DBh
01DCh
01DDh
01DEh
01DFh
01E0h
01E1h
01E2h
01E3h
01E4h
01E5h
01E6h
01E7h
01E8h
01E9h
01EAh
01EBh
01ECh
01EDh
01EEh
01EFh
01F0h
01F1h
01F2h
01F3h
01F4h
01F5h
01F6h
01F7h
01F8h
01F9h
01FAh
01FBh
01FCh
01FDh
01FEh
01FFh
Timer B3, B4, B5 Count Start Flag
Register
Symbol
TBSR
Timer A1-1 Register
TA11
Timer A2-1 Register
TA21
Timer A4-1 Register
TA41
Three-Phase PWM Control Register 0
Three-Phase PWM Control Register 1
Three-Phase Output Buffer Register 0
Three-Phase Output Buffer Register 1
Dead Time Timer
Timer B2 Interrupt Generation Frequency Set Counter
INVC0
INVC1
IDB0
IDB1
DTT
ICTB2
Timer B3 Register
TB3
Timer B4 Register
TB4
Timer B5 Register
TB5
Timer B3 Mode Register
Timer B4 Mode Register
Timer B5 Mode Register
Interrupt Source Select Register 0
Interrupt Source Select Register 1
SI/O3 Transmit/Receive Register
TB3MR
TB4MR
TB5MR
IFSR0
IFSR1
S3TRR
00XX0000b
00XX0000b
00XX0000b
00XXX000b
00h
XXh
SI/O3 Control Register
SI/O3 Bit Rate Register
S3C
S3BRG
01000000b
XXh
UART0 Special Mode Register 4
UART0 Special Mode Register 3
UART0 Special Mode Register 2
UART0 Special Mode Register
UART1 Special Mode Register 4
UART1 Special Mode Register 3
UART1 Special Mode Register 2
UART1 Special Mode Register
UART2 Special Mode Register 4
UART2 Special Mode Register 3
UART2 Special Mode Register 2
UART2 Special Mode Register
UART2 Transmit/Receive Mode Register
UART2 Bit Rate Register
U0SMR4
U0SMR3
U0SMR2
U0SMR
U1SMR4
U1SMR3
U1SMR2
U1SMR
U2SMR4
U2SMR3
U2SMR2
U2SMR
U2MR
U2BRG
UART2 Transmit Buffer Register
U2TB
UART2 Transmit/Receive Control Register 0
UART2 Transmit/Receive Control Register 1
U2C0
U2C1
UART2 Receive Buffer Register
U2RB
00h
000X0X0Xb
X0000000b
X0000000b
00h
000X0X0Xb
X0000000b
X0000000b
00h
000X0X0Xb
X0000000b
X0000000b
00h
XXh
XXh
XXh
00001000b
00000010b
XXh
XXh
X: Undefined
NOTE:
1. Blank spaces are reserved. No access is allowed.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 22 of 88
After Reset
000XXXXXb
XXh
XXh
XXh
XXh
XXh
XXh
00h
00h
00111111b
00111111b
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.9 SFR Information (9)
Address
0200h
0201h
0202h
0203h
0204h
0205h
0206h
0207h
0208h
0209h
020Ah
020Bh
020Ch
020Dh
020Eh
020Fh
0210h
0211h
0212h
0213h
0214h
0215h
0216h
0217h
0218h
0219h
021Ah
021Bh
021Ch
021Dh
021Eh
021Fh
0220h
0221h
0222h
0223h
0224h
0225h
0226h
0227h
0228h
0229h
022Ah
022Bh
022Ch
022Dh
022Eh
022Fh
0230h
0231h
0232h
0233h
0234h
0235h
0236h
0237h
0238h
0239h
023Ah
023Bh
023Ch
023Dh
023Eh
023Fh
CAN0 Message Control Register 0
CAN0 Message Control Register 1
CAN0 Message Control Register 2
CAN0 Message Control Register 3
CAN0 Message Control Register 4
CAN0 Message Control Register 5
CAN0 Message Control Register 6
CAN0 Message Control Register 7
CAN0 Message Control Register 8
CAN0 Message Control Register 9
CAN0 Message Control Register 10
CAN0 Message Control Register 11
CAN0 Message Control Register 12
CAN0 Message Control Register 13
CAN0 Message Control Register 14
CAN0 Message Control Register 15
Register
Symbol
C0MCTL0
C0MCTL1
C0MCTL2
C0MCTL3
C0MCTL4
C0MCTL5
C0MCTL6
C0MCTL7
C0MCTL8
C0MCTL9
C0MCTL10
C0MCTL11
C0MCTL12
C0MCTL13
C0MCTL14
C0MCTL15
CAN0 Control Register
C0CTLR
CAN0 Status Register
C0STR
CAN0 Slot Status Register
C0SSTR
CAN0 Interrupt Control Register
C0ICR
CAN0 Extended ID Register
C0IDR
CAN0 Configuration Register
C0CONR
CAN0 Receive Error Count Register
CAN0 Transmit Error Count Register
C0RECR
C0TECR
CAN0 Time Stamp Register
C0TSR
CAN1 Message Control Register 0
CAN1 Message Control Register 1
CAN1 Message Control Register 2
CAN1 Message Control Register 3
CAN1 Message Control Register 4
CAN1 Message Control Register 5
CAN1 Message Control Register 6
CAN1 Message Control Register 7
CAN1 Message Control Register 8
CAN1 Message Control Register 9
CAN1 Message Control Register 10
CAN1 Message Control Register 11
CAN1 Message Control Register 12
CAN1 Message Control Register 13
CAN1 Message Control Register 14
CAN1 Message Control Register 15
C1MCTL0
C1MCTL1
C1MCTL2
C1MCTL3
C1MCTL4
C1MCTL5
C1MCTL6
C1MCTL7
C1MCTL8
C1MCTL9
C1MCTL10
C1MCTL11
C1MCTL12
C1MCTL13
C1MCTL14
C1MCTL15
CAN1 Control Register
C1CTLR
CAN1 Status Register
C1STR
CAN1 Slot Status Register
C1SSTR
CAN1 Interrupt Control Register
C1ICR
CAN1 Extended ID Register
C1IDR
CAN1 Configuration Register
C1CONR
CAN1 Receive Error Count Register
CAN1 Transmit Error Count Register
C1RECR
C1TECR
CAN1 Time Stamp Register
C1TSR
X: Undefined
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 23 of 88
After Reset
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
X0000001b
XX0X0000b
00h
X0000001b
00h
00h
00h
00h
00h
00h
XXh
XXh
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
X0000001b
XX0X0000b
00h
X0000001b
00h
00h
00h
00h
00h
00h
XXh
XXh
00h
00h
00h
00h
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.10 SFR Information (10) (1)
Address
0240h
0241h
0242h
0243h
0244h
0245h
0246h
0247h
0248h
0249h
024Ah
024Bh
024Ch
024Dh
024Eh
024Fh
0250h
0251h
0252h
0253h
0254h
0255h
0256h
0257h
0258h
0259h
025Ah
025Bh
025Ch
025Dh
025Eh
025Fh
0260h
0261h
0262h
0263h
0264h
0265h
0266h
0267h
0268h
0269h
026Ah
026Bh
026Ch
026Dh
026Eh
026Fh
0270h
0271h
0272h
0273h
0274h
0275h
0276h
0277h
0278h
0279h
027Ah
027Bh
027Ch
027Dh
027Eh
027Fh
Register
Symbol
CAN0 Acceptance Filter Support Register
C0AFS
CAN1 Acceptance Filter Support Register
C1AFS
Peripheral Clock Select Register
CAN0/1 Clock Select Register
PCLKR
CCLKR
CAN1 Message Box 0: Identifier / DLC
CAN1 Message Box 0: Data Field
CAN1 Message Box 0:Time Stamp
CAN1 Message Box 1: Identifier / DLC
CAN1 Message Box 1: Data Field
CAN1 Message Box 1:Time Stamp
X: Undefined
NOTE:
1. Blank spaces are reserved. No access is allowed.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 24 of 88
After Reset
XXh
XXh
XXh
XXh
00h
00h
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.11 SFR Information (11)
Address
0280h
0281h
0282h
0283h
0284h
0285h
0286h
0287h
0288h
0289h
028Ah
028Bh
028Ch
028Dh
028Eh
028Fh
0290h
0291h
0292h
0293h
0294h
0295h
0296h
0297h
0298h
0299h
029Ah
029Bh
029Ch
029Dh
029Eh
029Fh
02A0h
02A1h
02A2h
02A3h
02A4h
02A5h
02A6h
02A7h
02A8h
02A9h
02AAh
02ABh
02ACh
02ADh
02AEh
02AFh
02B0h
02B1h
02B2h
02B3h
02B4h
02B5h
02B6h
02B7h
02B8h
02B9h
02BAh
02BBh
02BCh
02BDh
02BEh
02BFh
Register
CAN1 Message Box 2: Identifier / DLC
CAN1 Message Box 2: Data Field
CAN1 Message Box 2: Time Stamp
CAN1 Message Box 3: Identifier / DLC
CAN1 Message Box 3: Data Field
CAN1 Message Box 3: Time Stamp
CAN1 Message Box 4: Identifier / DLC
CAN1 Message Box 4: Data Field
CAN1 Message Box 4: Time Stamp
CAN1 Message Box 5: Identifier / DLC
CAN1 Message Box 5: Data Field
CAN1 Message Box 5: Time Stamp
X: Undefined
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 25 of 88
Symbol
After Reset
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.12 SFR Information (12)
Address
02C0h
02C1h
02C2h
02C3h
02C4h
02C5h
02C6h
02C7h
02C8h
02C9h
02CAh
02CBh
02CCh
02CDh
02CEh
02CFh
02D0h
02D1h
02D2h
02D3h
02D4h
02D5h
02D6h
02D7h
02D8h
02D9h
02DAh
02DBh
02DCh
02DDh
02DEh
02DFh
02E0h
02E1h
02E2h
02E3h
02E4h
02E5h
02E6h
02E7h
02E8h
02E9h
02EAh
02EBh
02ECh
02EDh
02EEh
02EFh
02F0h
02F1h
02F2h
02F3h
02F4h
02F5h
02F6h
02F7h
02F8h
02F9h
02FAh
02FBh
02FCh
02FDh
02FEh
02FFh
Register
CAN1 Message Box 6: Identifier / DLC
CAN1 Message Box 6: Data Field
CAN1 Message Box 6: Time Stamp
CAN1 Message Box 7: Identifier / DLC
CAN1 Message Box 7: Data Field
CAN1 Message Box 7: Time Stamp
CAN1 Message Box 8: Identifier / DLC
CAN1 Message Box 8: Data Field
CAN1 Message Box 8: Time Stamp
CAN1 Message Box 9: Identifier / DLC
CAN1 Message Box 9: Data Field
CAN1 Message Box 9: Time Stamp
X: Undefined
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 26 of 88
Symbol
After Reset
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.13 SFR Information (13)
Address
0300h
0301h
0302h
0303h
0304h
0305h
0306h
0307h
0308h
0309h
030Ah
030Bh
030Ch
030Dh
030Eh
030Fh
0310h
0311h
0312h
0313h
0314h
0315h
0316h
0317h
0318h
0319h
031Ah
031Bh
031Ch
031Dh
031Eh
031Fh
0320h
0321h
0322h
0323h
0324h
0325h
0326h
0327h
0328h
0329h
032Ah
032Bh
032Ch
032Dh
032Eh
032Fh
0330h
0331h
0332h
0333h
0334h
0335h
0336h
0337h
0338h
0339h
033Ah
033Bh
033Ch
033Dh
033Eh
033Fh
Register
CAN1 Message Box 10: Identifier / DLC
CAN1 Message Box 10: Data Field
CAN1 Message Box 10: Time Stamp
CAN1 Message Box 11: Identifier / DLC
CAN1 Message Box 11: Data Field
CAN1 Message Box 11: Time Stamp
CAN1 Message Box 12: Identifier / DLC
CAN1 Message Box 12: Data Field
CAN1 Message Box 12: Time Stamp
CAN1 Message Box 13: Identifier / DLC
CAN1 Message Box 13: Data Field
CAN1 Message Box 13: Time Stamp
X: Undefined
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 27 of 88
Symbol
After Reset
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.14 SFR Information (14) (1)
Address
0340h
0341h
0342h
0343h
0344h
0345h
0346h
0347h
0348h
0349h
034Ah
034Bh
034Ch
034Dh
034Eh
034Fh
0350h
0351h
0352h
0353h
0354h
0355h
0356h
0357h
0358h
0359h
035Ah
035Bh
035Ch
035Dh
035Eh
035Fh
0360h
0361h
0362h
0363h
0364h
0365h
0366h
0367h
0368h
0369h
036Ah
036Bh
036Ch
036Dh
036Eh
036Fh
0370h
0371h
0372h
0373h
0374h
0375h
0376h
0377h
0378h
0379h
037Ah
037Bh
037Ch
037Dh
037Eh
037Fh
Register
Symbol
CAN1 Message Box 14: Identifier / DLC
CAN1 Message Box 14: Data Field
CAN1 Message Box 14: Time Stamp
CAN1 Message Box 15: Identifier / DLC
CAN1 Message Box 15: Data Field
CAN1 Message Box 15: Time Stamp
CAN1 Global Mask Register
C1GMR
CAN1 Local Mask A Register
C1LMAR
CAN1 Local Mask B Register
C1LMBR
X: Undefined
NOTE:
1. Blank spaces are reserved. No access is allowed.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 28 of 88
After Reset
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.15 SFR Information (15) (2)
Address
0380h
0381h
0382h
0383h
0384h
0385h
0386h
0387h
0388h
0389h
038Ah
038Bh
038Ch
038Dh
038Eh
038Fh
0390h
0391h
0392h
0393h
0394h
0395h
0396h
0397h
0398h
0399h
039Ah
039Bh
039Ch
039Dh
039Eh
039Fh
03A0h
03A1h
03A2h
03A3h
03A4h
03A5h
03A6h
03A7h
03A8h
03A9h
03AAh
03ABh
03ACh
03ADh
03AEh
03AFh
03B0h
03B1h
03B2h
03B3h
03B4h
03B5h
03B6h
03B7h
03B8h
03B9h
03BAh
03BBh
03BCh
03BDh
03BEh
03BFh
Count Start Flag
Clock Prescaler Reset Flag
One-Shot Start Flag
Trigger Select Register
Up/Down Flag
Register
Symbol
TABSR
CPSRF
ONSF
TRGSR
UDF
After Reset
00h
0XXXXXXXb
00h
00h
00h (1)
Timer A0 Register
TA0
Timer A1 Register
TA1
Timer A2 Register
TA2
Timer A3 Register
TA3
Timer A4 Register
TA4
Timer B0 Register
TB0
Timer B1 Register
TB1
Timer B2 Register
TB2
Timer A0 Mode Register
Timer A1 Mode Register
Timer A2 Mode Register
Timer A3 Mode Register
Timer A4 Mode Register
Timer B0 Mode Register
Timer B1 Mode Register
Timer B2 Mode Register
Timer B2 Special Mode Register
TA0MR
TA1MR
TA2MR
TA3MR
TA4MR
TB0MR
TB1MR
TB2MR
TB2SC
UART0 Transmit/Receive Mode Register
UART0 Bit Rate Register
U0MR
U0BRG
UART0 Transmit Buffer Register
U0TB
UART0 Transmit/Receive Control Register 0
UART0 Transmit/Receive Control Register 1
U0C0
U0C1
UART0 Receive Buffer Register
U0RB
UART1 Transmit/Receive Mode Register
UART1 Bit Rate Register
U1MR
U1BRG
UART1 Transmit Buffer Register
U1TB
UART1 Transmit/Receive Control Register 0
UART1 Transmit/Receive Control Register 1
U1C0
U1C1
UART1 Receive Buffer Register
U1RB
UART Transmit/Receive Control Register 2
UCON
00h
XXh
XXh
XXh
00001000b
00XX0010b
XXh
XXh
00h
XXh
XXh
XXh
00001000b
00XX0010b
XXh
XXh
X0000000b
DMA0 Request Source Select Register
DM0SL
00h
DMA1 Request Source Select Register
DM1SL
00h
CRC Data Register
CRCD
CRC Input Register
CRCIN
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
00h
00h
00h
00h
00h
00XX0000b
00XX0000b
00XX0000b
XXXXXX00b
XXh
XXh
XXh
X: Undefined
NOTES:
1. Bits TA2P to TA4P in the UDF register are set to 0 after reset. However, the contents in these bits are undefined when read.
2. Blank spaces are reserved. No access is allowed.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 29 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
4. Special Function Registers (SFRs)
Table 4.16 SFR Information (16) (2)
Address
03C0h
03C1h
03C2h
03C3h
03C4h
03C5h
03C6h
03C7h
03C8h
03C9h
03CAh
03CBh
03CCh
03CDh
03CEh
03CFh
03D0h
03D1h
03D2h
03D3h
03D4h
03D5h
03D6h
03D7h
03D8h
03D9h
03DAh
03DBh
03DCh
03DDh
03DEh
03DFh
03E0h
03E1h
03E2h
03E3h
03E4h
03E5h
03E6h
03E7h
03E8h
03E9h
03EAh
03EBh
03ECh
03EDh
03EEh
03EFh
03F0h
03F1h
03F2h
03F3h
03F4h
03F5h
03F6h
03F7h
03F8h
03F9h
03FAh
03FBh
03FCh
Register
Symbol
After Reset
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
A/D Register 0
AD0
A/D Register 1
AD1
A/D Register 2
AD2
A/D Register 3
AD3
A/D Register 4
AD4
A/D Register 5
AD5
A/D Register 6
AD6
A/D Register 7
AD7
A/D Control Register 2
ADCON2
00h
A/D Control Register 0
A/D Control Register 1
D/A Register 0
ADCON0
ADCON1
DA0
00000XXXb
00h
00h
D/A Register 1
DA1
00h
D/A Control Register
DACON
00h
Port P0 Register
Port P1 Register
Port P0 Direction Register
Port P1 Direction Register
Port P2 Register
Port P3 Register
Port P2 Direction Register
Port P3 Direction Register
Port P4 Register
Port P5 Register
Port P4 Direction Register
Port P5 Direction Register
Port P6 Register
Port P7 Register
Port P6 Direction Register
Port P7 Direction Register
Port P8 Register
Port P9 Register
Port P8 Direction Register
Port P9 Direction Register
Port P10 Register
P0
P1
PD0
PD1
P2
P3
PD2
PD3
P4
P5
PD4
PD5
P6
P7
PD6
PD7
P8
P9
PD8
PD9
P10
XXh
XXh
00h
00h
XXh
XXh
00h
00h
XXh
XXh
00h
00h
XXh
XXh
00h
00h
XXh
XXh
00X00000b
00h
XXh
Port P10 Direction Register
PD10
00h
Pull-up Control Register 0
PUR0
03FDh
Pull-up Control Register 1
PUR1
03FEh
03FFh
Pull-up Control Register 2
Port Control Register
PUR2
PCR
00h
00000000b (1)
00000010b
00h
00h
X: Undefined
NOTES:
1. At hardware reset, the register is as follows:
00000000b where "L" is input to the CNVSS pin
00000010b where "H" is input to the CNVSS pin
At software reset, watchdog timer reset and oscillation stop detection reset, the register is as follows:
00000000b where bits PM01 to PM00 in the PM0 register are 00b (single-chip mode)
00000010b where bits PM01 to PM00 in the PM0 register are 01b (memory expansion mode) or 11b (microprocessor mode)
2. Blank spaces are reserved. No access is allowed.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 30 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
5. Electrical Characteristics
5.1 Electrical Characteristics (T/V-ver.)
Table 5.1 Absolute Maximum Ratings
Symbol
Parameter
Condition
Rated Value
Unit
VCC
Supply voltage (VCC1 = VCC2)
VCC = AVCC
–0.3 to 6.5
V
AVCC
Analog supply voltage
VCC = AVCC
–0.3 to 6.5
V
–0.3 to VCC+0.3
V
_____________
VI
Input
RESET, CNVSS, BYTE,
voltage
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0, P7_2 to P7_7, P8_0 to P8_7,
P9_0, P9_2 to P9_7, P10_0 to P10_7,
VREF, XIN
P7_1, P9_1
VO
Output
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,
voltage
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0, P7_2 to P7_7,
–0.3 to 6.5
V
–0.3 to VCC+0.3
V
–0.3 to 6.5
V
700
mW
P8_0 to P8_4, P8_6, P8_7, P9_0, P9_2 to P9_7,
P10_0 to P10_7, XOUT
Pd
P7_1, P9_1
Power dissipation
Topr
Operating ambient During MCU operation
T version: –40 to 85
temperature
V version: –40 to 125 (option)
During flash memory program and
erase operation
Tstg
Storage temperature
option: All options are on request basis.
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 31 of 88
Topr = 25°C
°C
0 to 60
–65 to 150
°C
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
Table 5.2 Recommended Operating Conditions (1)
Symbol
(1)
Parameter
Min.
Standard
Max.
Typ.
Unit
VCC
Supply voltage (VCC1 = VCC2)
AVCC
Analog supply voltage
VCC
V
VSS
Supply voltage
0
V
AVSS
Analog supply voltage
0
V
VIH
HIGH input
P3_1 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, 0.8 VCC
voltage
P7_0, P7_2 to P7_7, P8_0 to P8_7, P9_0, P9_2 to P9_7,
_____________
P10_0 to P10_7, XIN, RESET, CNVSS, BYTE
P7_1, P9_1
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0
4.2
5.0
5.5
V
VCC
V
0.8 VCC
6.5
V
0.8 VCC
VCC
V
0.5 VCC
VCC
V
0
0.2 VCC
V
0
0.2 VCC
V
0
0.16 VCC
V
–10.0
mA
–5.0
mA
(During single-chip mode)
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0
(Data input during memory expansion and microprocessor modes)
VIL
LOW input
P3_1 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7,
voltage
P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7,
_____________
XIN, RESET, CNVSS, BYTE
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0
(During single-chip mode)
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0
(Data input during memory expansion and microprocessor modes)
IOH(peak)
HIGH peak
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7,
output current P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0,
P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0,
P9_2 to P9_7, P10_0 to P10_7
IOH(avg)
HIGH average P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7,
output current P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0,
P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0,
IOL(peak)
LOW peak
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7,
output current P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7,
P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7
10.0
mA
IOL(avg)
LOW average P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7,
output current P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7,
P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7
5.0
mA
P9_2 to P9_7, P10_0 to P10_7
NOTES:
1. Referenced to VCC = 4.2 to 5.5 V at Topr = –40 to 85°C unless otherwise specified.
2. Average output current values during 100 ms period.
3. The total IOL(peak) for ports P0, P1, P2, P8_6, P8_7, P9, and P10 must be 80 mA max.
The total IOL(peak) for ports P3, P4, P5, P6, P7, and P8_0 to P8_4 must be 80 mA max.
The total IOH(peak) for ports P0, P1, and P2 must be –40 mA max.
The total IOH(peak) for ports P3, P4, and P5 must be –40 mA max.
The total IOH(peak) for ports P6, P7, and P8_0 to P8_4 must be –40 mA max.
The total IOH(peak) for ports P8_6, P8_7, P9, and P10 must be –40 mA max.
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 32 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
Table 5.3 Recommended Operating Conditions (2)
Symbol
f(XIN)
(1)
Parameter
Min.
Main clock input oscillation No wait Mask ROM version VCC = 4.2 to 5.5 V
frequency
(2) (3) (4)
Standard
Max.
Typ.
0
Unit
16
MHz
50
kHz
Flash memory version
f(XCIN)
Sub clock oscillation frequency
f(Ring)
On-chip oscillation frequency
f(PLL)
PLL clock oscillation frequency
f(BCLK)
CPU operation clock
tsu(PLL)
PLL frequency synthesizer stabilization wait time
32.768
1
VCC = 4.2 to 5.5 V
MHz
16
20
MHz
0
20
MHz
20
ms
1. Referenced to VCC = 4.2 to 5.5 V at Topr = –40 to 85°C unless
otherwise specified.
2. Relationship between main clock oscillation frequency and supply
voltage is shown right.
3. Execute program/erase of flash memory by VCC = 5.0 ± 0.5 V.
4. When using over 16 MHz, use PLL clock. PLL clock oscillation
frequency which can be used is 16 MHz or 20 MHz.
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 33 of 88
f(XIN) operating maximum frequency [MHz]
NOTES:
Main clock input oscillation frequency
(Mask ROM version / Flash memory
version: no wait)
16.0
0.0
4.2
5.5
VCC [V] (main clock: no division)
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
Table 5.4 Electrical Characteristics (1)
Parameter
Symbol
(1)
Measuring Condition
Standard
Min. Typ. Max.
VCC
VCC-2.0
Unit
V
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, IOH = –5 mA
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0, P7_2 to P7_7,
P8_0 to P8_4, P8_6, P8_7, P9_0,
P9_2 to P9_7, P10_0 to P10_7
VCC
V
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, IOH = –200 µA
VOH
HIGH output
VCC-0.3
voltage
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0, P7_2 to P7_7,
P8_0 to P8_4, P8_6, P8_7, P9_0,
P9_2 to P9_7, P10_0 to P10_7
IOH = –1 mA
VCC
V
3.0
XOUT
HIGHPOWER
VOH
HIGH output
voltage
IOH = –0.5 mA
VCC
3.0
LOWPOWER
2.5
V
With no load applied
XCOUT HIGHPOWER
HIGH output
voltage
1.6
With no load applied
LOWPOWER
2.0
V
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, IOL = 5 mA
VOL
LOW output
voltage
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4,
P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7
V
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, IOL = 200 µA
0.45
VOL
LOW output
voltage
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4,
P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7
V
VOL
IOL = 1 mA
XOUT
HIGHPOWER
LOW output
2.0
voltage
IOL = 0.5 mA
LOWPOWER
2.0
0
V
With no load applied
XCOUT HIGHPOWER
LOW output
voltage
0
With no load applied
LOWPOWER
_________ _______
V
0.2
VT+-VT- Hysteresis
1.0
HOLD, RDY,
TA0IN to TA4IN, TB0IN to TB5IN,
________
________ _______ _____________ _________
_________
INT0 to INT5, NMI, ADTRG, CTS0 to CTS2,
SCL0 to SCL2, SDA0 to SDA2,
CLK0
to CLK3,
_____
_____
TA0OUT to TA4OUT, KI0 to KI3,
RXD0
to RXD2, SIN3
_____________
V
2.5
VT+-VT- Hysteresis
RESET
0.2
HIGH input
µA
5.0
IIH
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, VI = 5 V
current
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7,
P9_0 to P9_7, P10_0 to P10_7,
____________
XIN, RESET, CNVSS, BYTE
LOW input
–5.0 µA
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, VI = 0 V
IIL
current
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7,
P9_0 ____________
to P9_7, P10_0 to P10_7,
XIN, RESET, CNVSS, BYTE
kΩ
170
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, VI = 0 V
50
RPULLUP Pull-up
30
resistance
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0, P7_2 to P7_7, P8_0 to
P8_4, P8_6, P8_7, P9_0, P9_2 to P9_7,
P10_0 to P10_7
Feedback resistance
MΩ
XIN
1.5
RfXIN
MΩ
Feedback resistance
XCIN
15
RfXCIN
V
RAM
retention
voltage
2.0
At stop mode
VRAM
NOTES:
1. Referenced to VCC = 4.2 to 5.5 V, VSS = 0 V at Topr = –40 to 85°C, f(BCLK) = 20 MHz unless otherwise specified.
VOH
HIGH output
voltage
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 34 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
Table 5.5 Electrical Characteristics (2)
Symbol
ICC
5. Electric Characteristics (T/V-ver.)
(1)
Parameter
Power supply
Measuring Condition
In single-chip mode, Mask ROM
current
Min.
f(BCLK) = 20 MHz,
Standard
Typ. Max.
18
32
Unit
mA
PLL operation,
the output pins are
(VCC = 4.2 to 5.5 V) open and other pins
No division
On-chip oscillation,
No division
1
Flash memory f(BCLK) = 20 MHz,
20
are VSS.
mA
34
mA
PLL operation,
No division
On-chip oscillation,
No division
1.8
mA
Flash memory f(BCLK) = 10 MHz,
15
mA
25
mA
25
µA
25
µA
420
µA
50
µA
8.5
µA
3.0
µA
program
VCC = 5 V
Flash memory f(BCLK) = 10 MHz,
erase
VCC = 5 V
Mask ROM
f(BCLK) = 32kHz,
Low power dissipation
mode, ROM
(2)
Flash memory f(BCLK) = 32 kHz,
Low power dissipation
mode, RAM
(2)
f(BCLK) = 32 kHz,
Low power dissipation
mode,
Flash memory
(2)
Mask ROM
On-chip oscillation,
Flash memory Wait mode
f(BCLK) = 32 kHz,
Wait mode
(3)
,
Oscillation capacity High
f(BCLK) = 32 kHz,
Wait mode
(3)
,
Oscillation capacity Low
Stop mode,
0.8
3.0
µA
Topr = 25°C
NOTES:
1. Referenced to VCC = 4.2 to 5.5 V, VSS = 0 V at Topr = –40 to 85°C, f(BCLK) = 20 MHz unless otherwise specified.
2. This indicates the memory in which the program to be executed exists.
3. With one timer operated using fC32.
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 35 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
(1)
Table 5.6 A/D Conversion Characteristics
Symbol
Parameter
–
Resolution
INL
Integral
10 bits
Min.
VREF = VCC
VREF ANEX0, ANEX1 input, AN0 to AN7 input,
Standard
Typ. Max.
10
= VCC AN0_0 to AN0_7 input, AN2_0 to AN2_7 input
= 5 V External operation amp connection mode
nonlinearity
error
8 bits
–
Measuring Condition
Absolute
10 bits
accuracy
VREF = AVCC = VCC = 5 V
VREF ANEX0, ANEX1 input, AN0 to AN7 input,
Unit
Bit
±3
LSB
±7
LSB
±2
LSB
±3
LSB
= VCC AN0_0 to AN0_7 input, AN2_0 to AN2_7 input
= 5 V External operation amp connection mode
±7
LSB
VREF = AVCC = VCC = 5 V
±2
LSB
DNL
Differential nonlinearity error
±1
LSB
–
Offset error
±3
LSB
–
Gain error
±3
LSB
RLADDER
Resistor ladder
VREF = VCC
10
40
kΩ
tCONV
10-bit conversion time,
VREF = VCC = 5 V, φAD = 10 MHz
3.3
µs
VREF = VCC = 5 V, φAD = 10 MHz
2.8
µs
µs
8 bits
sample & hold available
8-bit conversion time,
sample & hold available
tSAMP
Sampling time
0.3
VREF
Reference voltage
2.0
VCC
V
0
VREF
V
VIA
NOTES:
Analog input voltage
1. Referenced to VCC = AVCC = VREF = 4.2 to 5.5 V, VSS = AVSS = 0 V, –40 to 85°C unless otherwise specified.
2. φAD frequency must be 10 MHz or less.
3. When sample & hold is disabled, φAD frequency must be 250kHz or more in addition to a limit of NOTE 2.
When sample & hold is enabled, φAD frequency must be 1MHz or more in addition to a limit of NOTE 2.
Table 5.7 D/A conversion Characteristics
Symbol
(1)
Parameter
–
Resolution
–
Absolute accuracy
tsu
Setup time
RO
Output resistance
IVREF
Reference power supply input current
Measuring condition
Min.
4
(NOTE 2)
Standard
Typ. Max.
8
10
Unit
Bits
1.0
%
3
µs
20
kΩ
1.5
mA
NOTES:
1. Referenced to VCC = AVCC = VREF = 4.2 to 5.5 V, VSS = AVSS = 0 V, –40 to 85°C unless otherwise specified.
2. This applies when using one D/A converter, with the DAi register (i = 0, 1) for the unused D/A converter set to 00h.
The resistor ladder of the A/D converter is not included. Also, the IVREF will flow even if VREF is disconnected by the
ADCON1 register.
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 36 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
Table 5.8 Power Supply Circuit Timing Characteristics
Symbol
Measuring
Condition
Parameter
Min.
Standard
Typ. Max.
2
Unit
td(P-R)
Time for internal power supply stabilization during powering-on VCC = 4.2 to 5.5 V
td(R-S)
STOP release time
150
µs
td(W-S)
Low power dissipation mode wait mode release time
150
µs
td(P-R)
Time for internal power supply
stabilization during powering-on
VCC
td(P-R)
CPU clock
Interrupt for
(a) Stop mode release
or
(b) Wait mode release
td(R-S)
STOP release time
td(W-S)
Low power dissipation mode
CPU clock
wait mode release time
(a)
(b)
Figure 5.1 Power Supply Circuit Timing Diagram
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 37 of 88
td(R-S)
td(W-S)
ms
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
Timing Requirements
VCC
(Referenced to VCC = 5 V, VSS = 0 V, at Topr = –40 to 85°C unless otherwise specified)
=5V
Table 5.9 External Clock Input (XIN Input)
Symbol
Parameter
tC
External clock input cycle time
tw(H)
External clock input HIGH pulse width
tw(L)
External clock input LOW pulse width
tr
External clock rise time
tf
External clock fall time
Standard
Min.
Max.
62.5
25
25
15
15
Unit
ns
ns
ns
ns
ns
Table 5.10 Memory Expansion Mode and Microprocessor Mode
Symbol
Parameter
tac1(RD-DB)
Data input access time (for setting with no wait)
tac2(RD-DB)
tac3(RD-DB)
Data input access time (for setting with wait)
tsu(DB-RD)
tsu(RDY-BCLK)
Data input setup time
Standard
Unit
Min.
Max.
(NOTE 1) ns
(NOTE 2) ns
(NOTE 3)
Data input access time (when accessing multiplexed bus area)
40
30
________
RDY input setup time
__________
tsu(HOLD-BCLK) HOLD input setup time
th(RD-DB)
Data input hold time
________
th(BCLK-RDY) RDY input hold time
__________
th(BCLK-HOLD) HOLD input hold time
40
0
0
0
ns
ns
ns
ns
ns
ns
ns
NOTES:
1. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 45 [ns]
f(BCLK)
9
2. Calculated according to the BCLK frequency as follows:
(n –0.5) ✕ 10
f(BCLK)
9
– 45 [ns]
n is “2” for 1-wait setting, “3” for 2-wait setting and “4” for 3-wait setting.
3. Calculated according to the BCLK frequency as follows:
(n –0.5) ✕ 109
– 45 [ns]
f(BCLK)
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 38 of 88
n is “2” for 2-wait setting, “3” for 3-wait setting.
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
Timing Requirements
VCC
(Referenced to VCC = 5 V, VSS = 0 V, at Topr = –40 to 85°C unless otherwise specified)
=5V
Table 5.11 Timer A Input (Counter Input in Event Counter Mode)
Parameter
Symbol
tc(TA)
TAiIN input cycle time
tw(TAH)
TAiIN input HIGH pulse width
tw(TAL)
TAiIN input LOW pulse width
Standard
Min.
Max.
100
40
40
Unit
ns
ns
ns
Table 5.12 Timer A Input (Gating Input in Timer Mode)
Parameter
Symbol
tc(TA)
TAiIN input cycle time
tw(TAH)
TAiIN input HIGH pulse width
tw(TAL)
TAiIN input LOW pulse width
Standard
Min.
Max.
400
200
200
Unit
ns
ns
ns
Table 5.13 Timer A Input (External Trigger Input in One-shot Timer Mode)
Symbol
Parameter
tc(TA)
TAiIN input cycle time
tw(TAH)
TAiIN input HIGH pulse width
tw(TAL)
TAiIN input LOW pulse width
Standard
Min.
Max.
200
100
100
Unit
ns
ns
ns
Table 5.14 Timer A Input (External Trigger Input in Pulse Width Modulation Mode)
tw(TAH)
TAiIN input HIGH pulse width
Standard
Min.
Max.
100
tw(TAL)
TAiIN input LOW pulse width
100
Symbol
Parameter
Unit
ns
ns
Table 5.15 Timer A Input (Counter Increment/decrement Input in Event Counter Mode)
Symbol
Parameter
Standard
Min.
Max.
2000
1000
tc(UP)
TAiOUT input cycle time
tw(UPH)
TAiOUT input HIGH pulse width
tw(UPL)
TAiOUT input LOW pulse width
tsu(UP-TIN)
TAiOUT input setup time
1000
400
th(TIN-UP)
TAiOUT input hold time
400
Unit
ns
ns
ns
ns
ns
Table 5.16 Timer A Input (Two-phase Pulse Input in Event Counter Mode)
Symbol
Parameter
tc(TA)
TAiIN input cycle time
tsu(TAIN-TAOUT) TAiOUT input setup time
tsu(TAOUT-TAIN) TAiIN input setup time
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 39 of 88
Standard
Max.
Min.
800
200
200
Unit
ns
ns
ns
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
Timing Requirements
VCC
(Referenced to VCC = 5 V, VSS = 0 V, at Topr = –40 to 85°C unless otherwise specified)
=5V
Table 5.17 Timer B Input (Counter Input in Event Counter Mode)
Symbol
tc(TB)
tw(TBH)
tw(TBL)
tc(TB)
tw(TBH)
tw(TBL)
Parameter
TBiIN input cycle time (counted on one edge)
TBiIN input HIGH pulse width (counted on one edge)
TBiIN input LOW pulse width (counted on one edge)
Standard
Min.
Max.
100
40
40
TBiIN input HIGH pulse width (counted on both edges)
200
80
TBiIN input LOW pulse width (counted on both edges)
80
TBiIN input cycle time (counted on both edges)
Unit
ns
ns
ns
ns
ns
ns
Table 5.18 Timer B Input (Pulse Period Measurement Mode)
TBiIN input HIGH pulse width
Standard
Min.
Max.
400
200
TBiIN input LOW pulse width
200
Symbol
tc(TB)
tw(TBH)
tw(TBL)
Parameter
TBiIN input cycle time
Unit
ns
ns
ns
Table 5.19 Timer B Input (Pulse Width Measurement Mode)
Symbol
tc(TB)
tw(TBH)
tw(TBL)
Parameter
TBiIN input cycle time
TBiIN input HIGH pulse width
Standard
Min.
Max.
400
200
200
TBiIN input LOW pulse width
Unit
ns
ns
ns
Table 5.20 A/D Trigger Input
Symbol
tC(AD)
tw(ADL)
Parameter
_____________
ADTRG input cycle time (trigger able minimum)
Standard
Min.
Max.
1000
_____________
ADTRG input LOW pulse width
125
Unit
ns
ns
Table 5.21 Serial Interface
CLKi input HIGH pulse width
Standard
Min.
Max.
200
100
CLKi input LOW pulse width
100
Symbol
tc(CK)
tw(CKH)
tw(CKL)
td(C-Q)
th(C-Q)
tsu(D-C)
th(C-D)
Parameter
CLKi input cycle time
80
TXDi output delay time
RXDi input setup time
0
70
RXDi input hold time
90
TXDi hold time
Unit
ns
ns
ns
ns
ns
ns
ns
_______
Table 5.22 External Interrupt INTi Input
Symbol
tw(INH)
tw(INL)
Parameter
_______
INTi input HIGH pulse width
_______
INTi input LOW pulse width
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 40 of 88
Standard
Min.
Max.
250
250
Unit
ns
ns
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
Switching Characteristics
VCC
(Referenced to VCC = 5 V, VSS = 0 V, at Topr = –40 to 85 °C unless otherwise specified)
=5V
Table 5.23 Memory Expansion Mode and Microprocessor Mode (for setting with no wait)
Symbol
td(BCLK-AD)
th(BCLK-AD)
th(RD-AD)
th(WR-AD)
td(BCLK-CS)
th(BCLK-CS)
td(BCLK-ALE)
th(BCLK-ALE)
td(BCLK-RD)
th(BCLK-RD)
td(BCLK-WR)
th(BCLK-WR)
td(BCLK-DB)
th(BCLK-DB)
td(DB-WR)
th(WR-DB)
Standard
Min.
Max.
25
Measuring
Condition
Parameter
Address output delay time
Figure 5.2
Address output hold time (in relation to BCLK)
Address output hold time (in relation to RD)
0
Address output hold time (in relation to WR)
(NOTE 1)
Chip select output delay time
ALE signal output delay time
15
ns
ns
25
ns
ns
–4
RD signal output delay time
RD signal output hold time
ns
0
WR signal output delay time
25
WR signal output hold time
Data output hold time (in relation to BCLK)
40
(3)
Data output delay time (in relation to WR)
(3)
ns
ns
0
Data output delay time (in relation to BCLK)
Data output hold time (in relation to WR)
25
ns
ns
4
ALE signal output hold time
ns
ns
ns
4
Chip select output hold time (in relation to BCLK)
Unit
ns
4
ns
(NOTE 2)
ns
(NOTE 1)
ns
__________
td(BCLK-HLDA)
HLDA output delay time
40
ns
NOTES:
1. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 10 [ns]
f(BCLK)
9
2. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 40 [ns]
f(BCLK)
9
f(BCLK) is 12.5 MHz or less.
3. This standard value shows the timing when the
output is off, and does not show hold time of
data bus.
Hold time of data bus varies with capacitor volume
and pull-up (pull-down) resistance value.
Hold time of data bus is expressed in
t = – CR ✕ ln (1 – VOL / VCC)
by a circuit of the right figure.
For example, when VOL = 0.2 VCC, C = 30 pF,
R =1 kΩ, hold time of output “L” level is
t = – 30 pF ✕ 1 kΩ ✕ ln (1 – 0.2 VCC / VCC) = 6.7 ns.
R
DBi
C
P0
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
30 pF
Figure 5.2 Port P0 to P10 Measurement Circuit
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 41 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
Switching Characteristics
VCC
(Referenced to VCC = 5 V, VSS = 0 V, at Topr = –40 to 85 °C unless otherwise specified)
=5V
Table 5.24 Memory Expansion Mode and Microprocessor Mode (for 1- to 3-wait setting and external area access)
Symbol
Measuring
Condition
Parameter
td(BCLK-AD)
th(BCLK-AD)
th(RD-AD)
th(WR-AD)
td(BCLK-CS)
th(BCLK-CS)
td(BCLK-ALE)
th(BCLK-ALE)
td(BCLK-RD)
th(BCLK-RD)
td(BCLK-WR)
th(BCLK-WR)
td(BCLK-DB)
th(BCLK-DB)
td(DB-WR)
th(WR-DB)
Address output delay time
Figure 5.2
Address output hold time (in relation to BCLK)
Standard
Min.
Max.
25
Address output hold time (in relation to RD)
0
Address output hold time (in relation to WR)
(NOTE 1)
Chip select output delay time
25
ns
ns
15
ns
ns
25
ns
ns
25
ns
ns
40
ns
ns
4
ALE signal output delay time
ALE signal output hold time
–4
RD signal output delay time
RD signal output hold time
0
WR signal output delay time
WR signal output hold time
0
Data output delay time (in relation to BCLK)
Data output hold time (in relation to BCLK)
(3)
Data output hold time (in relation to WR)
ns
ns
4
Data output delay time (in relation to WR)
(NOTE 2)
(3)
ns
ns
ns
4
Chip select output hold time (in relation to BCLK)
Unit
ns
(NOTE 1)
__________
td(BCLK-HLDA)
HLDA output delay time
40
ns
NOTES:
1. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 10 [ns]
f(BCLK)
9
2. Calculated according to the BCLK frequency as follows:
(n – 0.5) ✕ 10
– 40 [ns]
f(BCLK)
9
n is “1” for 1-wait setting, “2” for 2-wait setting and “3” for 3-wait setting.
When n = 1, f(BCLK) is 12.5 MHz or less.
3. This standard value shows the timing when the
output is off, and does not show hold time of
data bus.
Hold time of data bus varies with capacitor volume
and pull-up (pull-down) resistance value.
Hold time of data bus is expressed in
t = – CR ✕ ln (1 – VOL / VCC)
by a circuit of the right figure.
For example, when VOL = 0.2 VCC, C = 30 pF,
R =1 kΩ, hold time of output “L” level is
t = – 30 pF ✕ 1 kΩ ✕ ln (1 – 0.2 VCC / VCC) = 6.7 ns.
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 42 of 88
R
DBi
C
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
Switching Characteristics
VCC
(Referenced to VCC = 5 V, VSS = 0 V, at Topr = –40 to 85 °C unless otherwise specified)
=5V
Table 5.25 Memory Expansion Mode and Microprocessor Mode
(for 2- to 3-wait setting, external area access and multiplexed bus selection)
Symbol
Parameter
td(BCLK-AD)
th(BCLK-AD)
th(RD-AD)
th(WR-AD)
td(BCLK-CS)
th(BCLK-CS)
th(RD-CS)
th(WR-CS)
td(BCLK-RD)
th(BCLK-RD)
td(BCLK-WR)
th(BCLK-WR)
td(BCLK-DB)
th(BCLK-DB)
td(DB-WR)
th(WR-DB)
Address output delay time
Measuring
Condition
Figure 5.2
Standard
Min.
Max.
25
Address output hold time (in relation to BCLK)
(NOTE 1)
Address output hold time (in relation to WR)
(NOTE 1)
Chip select output delay time
25
Chip select output hold time (in relation to BCLK)
(NOTE 1)
Chip select output hold time (in relation to WR)
(NOTE 1)
RD signal output delay time
ns
25
RD signal output hold time
25
WR signal output hold time
ns
ns
0
Data output delay time (in relation to BCLK)
ns
ns
0
WR signal output delay time
ns
ns
ns
ns
4
Chip select output hold time (in relation to RD)
ns
ns
ns
4
Address output hold time (in relation to RD)
Unit
40
ns
Data output hold time (in relation to BCLK)
4
ns
Data output delay time (in relation to WR)
(NOTE 2)
ns
Data output hold time (in relation to WR)
(NOTE 1)
ns
__________
td(BCLK-HLDA)
HLDA output delay time
td(BCLK-ALE)
th(BCLK-ALE)
td(AD-ALE)
th(ALE-AD)
td(AD-RD)
td(AD-WR)
tdZ(RD-AD)
ALE signal output delay time (in relation to BCLK)
40
ns
15
ns
–4
ns
ALE signal output delay time (in relation to Address)
(NOTE 3)
ns
ALE signal output hold time (in relation to Address)
(NOTE 4)
ns
RD signal output delay from the end of Address
0
ns
WR signal output delay from the end of Address
0
ALE signal output hold time (in relation to BCLK)
Address output floating start time
NOTES:
1. Calculated according to the BCLK frequency as follows:
0.5 ✕ 109 – 10 [ns]
f(BCLK)
2. Calculated according to the BCLK frequency as follows:
(n –0.5) ✕ 10
f(BCLK)
9
– 40 [ns]
n is “2” for 2-wait setting, “3” for 3-wait setting.
3. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 25 [ns]
f(BCLK)
9
4. Calculated according to the BCLK frequency as follows:
0.5 ✕ 109 – 15 [ns]
f(BCLK)
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 43 of 88
ns
8
ns
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
VCC = 5 V
XIN input
tr
tr
tw(H)
tw(L)
tc
tc(TA)
tw(TAH)
TAiIN input
tw(TAL)
tc(UP)
tw(UPH)
TAiOUT input
tw(UPL)
TAiOUT input
(Up/down input)
During event counter mode
TAiIN input
(When count on falling edge
is selected)
th(TIN—UP) tsu(UP—TIN)
TAiIN input
(When count on rising edge
is selected)
Two-phase pulse input in event counter mode
tC(TA)
TAiIN input
tsu(TAIN—TAOUT)
tsu(TAIN—TAOUT)
tsu(TAOUT—TAIN)
TAiOUT input
tsu(TAOUT—TAIN)
tc(TB)
tw(TBH)
TBiIN input
tw(TBL)
tc(AD)
tw(ADL)
ADTRG input
tc(CK)
tw(CKH)
CLKi
tw(CKL)
th(C—Q)
TXDi
td(C—Q)
tsu(D—C)
RXDi
tw(INL)
INTi input
tw(INH)
Figure 5.3 Timing Diagram (1)
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 44 of 88
th(C—D)
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
VCC = 5 V
Memory Expansion Mode and Microprocessor Mode
(Effective for setting with wait)
BCLK
RD
(Separate bus)
WR, WRL, WRH
(Separate bus)
RD
(Multiplexed bus)
WR, WRL, WRH
(Multiplexed bus)
RDY input
tsu(RDY–BCLK)
th(BCLK–RDY)
(Common to setting with wait and setting without wait)
BCLK
tsu(HOLD–BCLK)
th(BCLK–HOLD)
HOLD input
HLDA output
td(BCLK–HLDA)
P0, P1, P2,
P3, P4,
P5_0 to P5_2 (1)
td(BCLK–HLDA)
Hi–Z
NOTE:
1. The above pins are set to high-impedance regardless of the input level of the BYTE pin,
the PM06 bit in the PM0 register, and the PM11 bit in the PM1 register.
Measuring conditions :
VCC = 5 V
Input timing voltage : Determined with VIL = 1.0 V, VIH = 4.0 V
Output timing voltage: Determined with VOL = 2.5 V, VOH = 2.5 V
Figure 5.4 Timing Diagram (2)
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 45 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
Memory Expansion Mode and Microprocessor Mode
(For setting with no wait)
Read timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
25ns.max
4ns.min
CSi
tcyc
td(BCLK-AD)
th(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(BCLK-ALE)
-4ns.min
25ns.max
th(RD-AD)
0ns.min
ALE
td(BCLK-RD)
25ns.max
th(BCLK-RD)
0ns.min
RD
tac1(RD-DB)
(0.5 ✕ tcyc-45)ns.max
Hi-Z
DBi
tSU(DB-RD)
40ns.min
th(RD-DB)
0ns.min
Write timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
25ns.max
4ns.min
CSi
tcyc
td(BCLK-AD)
th(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(BCLK-ALE)
25ns.max
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
-4ns.min
ALE
td(BCLK-WR)
25ns.max
th(BCLK-WR)
0ns.min
WR,WRL,
WRH
td(BCLK-DB)
th(BCLK-DB)
4ns.min
40ns.max
Hi-Z
DBi
td(DB-WR)
Measuring conditions :
VCC = 5 V
Input timing voltage : VIL = 0.8 V, VIH = 2.0 V
Output timing voltage : VOL = 0.4 V, VOH = 2.4 V
Figure 5.5 Timing Diagram (3)
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
th(WR-DB)
(0.5 ✕ tcyc-40)ns.min (0.5 ✕ tcyc-10)ns.min
1
tcyc =
f(BCLK)
page 46 of 88
VCC = 5 V
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
Memory Expansion Mode and Microprocessor Mode
(For 1-wait setting and external area access)
Read timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
25ns.max
4ns.min
CSi
tcyc
td(BCLK-AD)
th(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(RD-AD)
th(BCLK-ALE)
0ns.min
-4ns.min
25ns.max
ALE
td(BCLK-RD)
th(BCLK-RD)
0ns.min
25ns.max
RD
tac2(RD-DB)
(1.5 ✕ tcyc-45)ns.max
DBi
Hi-Z
th(RD-DB)
tSU(DB-RD)
0ns.min
40ns.min
Write timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
25ns.max
4ns.min
CSi
tcyc
td(BCLK-AD)
th(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(BCLK-ALE)
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
-4ns.min
25ns.max
ALE
td(BCLK-WR)
25ns.max
th(BCLK-WR)
0ns.min
WR,WRL,
WRH
td(BCLK-DB)
th(BCLK-DB)
4ns.min
40ns.max
Hi-Z
DBi
td(DB-WR)
(0.5 ✕ tcyc-40)ns.min
1
tcyc =
f(BCLK)
Measuring conditions :
VCC = 5 V
Input timing voltage : VIL = 0.8 V, VIH = 2.0 V
Output timing voltage : VOL = 0.4 V, VOH = 2.4 V
Figure 5.6 Timing Diagram (4)
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 47 of 88
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
VCC = 5 V
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
Memory Expansion Mode and Microprocessor Mode
(For 2-wait setting and external area access)
Read timing
tcyc
BCLK
th(BCLK-CS)
4ns.min
td(BCLK-CS)
25ns.max
CSi
th(BCLK-AD)
4ns.min
td(BCLK-AD)
25ns.max
ADi
BHE
td(BCLK-ALE)
25ns.max
th(RD-AD)
th(BCLK-ALE)
-4ns.min
0ns.min
ALE
th(BCLK-RD)
0ns.min
td(BCLK-RD)
25ns.max
RD
tac2(RD-DB)
(2.5 ✕ tcyc-45)ns.max
DBi
Hi-Z
tSU(DB-RD)
40ns.min
th(RD-DB)
0ns.min
Write timing
tcyc
BCLK
td(BCLK-CS)
25ns.max
th(BCLK-CS)
td(BCLK-AD)
25ns.max
th(BCLK-AD)
4ns.min
CSi
4ns.min
ADi
BHE
td(BCLK-ALE)
25ns.max
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
th(BCLK-ALE)
-4ns.min
ALE
td(BCLK-WR)
25ns.max
th(BCLK-WR)
0ns.min
WR, WRL
WRH
td(BCLK-DB)
40ns.max
DBi
Hi-Z
td(DB-WR)
(1.5 ✕ tcyc-40)ns.min
tcyc =
th(BCLK-DB)
4ns.min
1
f(BCLK)
Measuring conditions :
VCC = 5 V
Input timing voltage : VIL = 0.8 V, VIH = 2.0 V
Output timing voltage : VOL = 0.4 V, VOH = 2.4 V
Figure 5.7 Timing Diagram (5)
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 48 of 88
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
VCC = 5 V
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
VCC = 5 V
Memory Expansion Mode and Microprocessor Mode
(For 3-wait setting and external area access)
Read timing
tcyc
BCLK
th(BCLK-CS)
4ns.min
td(BCLK-CS)
25ns.max
CSi
th(BCLK-AD)
td(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(RD-AD)
0ns.min
th(BCLK-ALE)
25ns.max
-4ns.min
ALE
th(BCLK-RD)
td(BCLK-RD)
25ns.max
0ns.min
RD
tac2(RD-DB)
(3.5 ✕ tcyc-45)ns.max
DBi
Hi-Z
tSU(DB-RD)
th(RD-DB)
40ns.min
0ns.min
Write timing
tcyc
BCLK
td(BCLK-CS)
25ns.max
th(BCLK-CS)
4ns.min
td(BCLK-AD)
th(BCLK-AD)
4ns.min
CSi
25ns.max
ADi
BHE
td(BCLK-ALE)
25ns.max
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
th(BCLK-ALE)
-4ns.min
ALE
td(BCLK-WR)
25ns.max
th(BCLK-WR)
0ns.min
WR, WRL
WRH
DBi
td(BCLK-DB)
th(BCLK-DB)
40ns.max
4ns.min
Hi-Z
td(DB-WR)
(2.5 ✕ tcyc-40)ns.min
1
tcyc =
f(BCLK)
Measuring conditions :
VCC = 5 V
Input timing voltage : VIL = 0.8 V, VIH = 2.0 V
Output timing voltage : VOL = 0.4 V, VOH = 2.4 V
Figure 5.8 Timing Diagram (6)
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 49 of 88
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
VCC = 5 V
Memory Expansion Mode and Microprocessor Mode
(For 1- or 2-wait setting, external area access and multiplexed bus selection)
Read timing
BCLK
td(BCLK-CS)
th(RD-CS)
(0.5 ✕ tcyc-10)ns.min
tcyc
25ns.max
th(BCLK-CS)
4ns.min
CSi
td(AD-ALE)
(0.5 ✕ tcyc-25)ns.min
ADi
/DBi
th(ALE-AD)
(0.5 ✕ tcyc-15)ns.min
Address
8ns.max
Address
Data input
tdZ(RD-AD)
tac3(RD-DB)
(1.5 ✕ tcyc-45)ns.max
tSU(DB-RD)
th(RD-DB)
0ns.min
40ns.min
td(AD-RD)
0ns.min
td(BCLK-AD)
th(BCLK-AD)
4ns.min
25ns.max
ADi
BHE
td(BCLK-ALE)
th(BCLK-ALE)
25ns.max
th(RD-AD)
(0.5 ✕ tcyc-10)ns.min
-4ns.min
ALE
td(BCLK-RD)
th(BCLK-RD)
0ns.min
25ns.max
RD
Write timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
th(WR-CS)
(0.5 ✕ tcyc-10)ns.min
tcyc
25ns.max
4ns.min
CSi
th(BCLK-DB)
td(BCLK-DB)
4ns.min
40ns.max
ADi
/DBi
Address
Data output
td(DB-WR)
td(AD-ALE)
(1.5 ✕ tcyc-40)ns.min
(0.5 ✕ tcyc-25)ns.min
Address
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
td(BCLK-AD)
th(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
25ns.max
th(BCLK-ALE)
td(AD-WR)
-4ns.min
0ns.min
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
ALE
td(BCLK-WR)
25ns.max
WR,WRL,
WRH
tcyc =
1
f(BCLK)
Measuring conditions :
VCC = 5 V
Input timing voltage : VIL = 0.8 V, VIH = 2.0 V
Output timing voltage : VOL = 0.4 V, VOH = 2.4 V
Figure 5.9 Timing Diagram (7)
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 50 of 88
th(BCLK-WR)
0ns.min
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (T/V-ver.)
VCC = 5 V
Memory Expansion Mode and Microprocessor Mode
(For 3-wait setting, external area access and multiplexed bus selection)
Read timing
tcyc
BCLK
th(RD-CS)
(0.5 ✕ tcyc-10)ns.min
td(BCLK-CS)
th(BCLK-CS)
4ns.min
25ns.max
CSi
td(AD-ALE)
(0.5 ✕ tcyc-25)ns.min
ADi
/DBi
th(ALE-AD)
(0.5 ✕ tcyc-15)ns.min
Address
td(BCLK-AD)
td(AD-RD)
25ns.max
ADi
BHE
Data input
tdZ(RD-AD)
8ns.max
th(RD-DB)
tac3(RD-DB)
(2.5 ✕ tcyc-45)ns.max
0ns.min
tSU(DB-RD)
0ns.min
th(BCLK-AD)
40ns.min
4ns.min
(no multiplex)
td(BCLK-ALE)
25ns.max
th(RD-AD)
th(BCLK-ALE)
(0.5 ✕ tcyc-10)ns.min
-4ns.min
ALE
th(BCLK-RD)
td(BCLK-RD)
0ns.min
25ns.max
RD
Write timing
tcyc
BCLK
th(WR-CS)
(0.5 ✕ tcyc-10)ns.min
td(BCLK-CS)
25ns.max
th(BCLK-CS)
4ns.min
CSi
th(BCLK-DB)
td(BCLK-DB)
40ns.max
ADi
/DBi
Address
4ns.min
Data output
td(AD-ALE)
td(DB-WR)
(0.5 ✕ tcyc-25)ns.min
(2.5 ✕ tcyc-40)ns.min
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
td(BCLK-AD)
th(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
(no multiplex)
td(BCLK-ALE)
25ns.max
th(BCLK-ALE)
th(WR-AD)
-4ns.min
td(AD-WR)
ALE
td(BCLK-WR)
25ns.max
WR, WRL
WRH
tcyc =
(0.5 ✕ tcyc-10)ns.min
0ns.min
1
f(BCLK)
Measuring conditions :
VCC = 5 V
Input timing voltage : VIL = 0.8 V, VIH = 2.0 V
Output timing voltage : VOL = 0.4 V, VOH = 2.4 V
Figure 5.10 Timing Diagram (8)
Rev.2.40 Aug 25, 2006
REJ03B0003-02400
page 51 of 88
th(BCLK-WR)
0ns.min
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
5.2 Electrical Characteristics (Normal-ver.)
Table 5.26 Absolute Maximum Ratings
Symbol
Parameter
Condition
Rated Value
Unit
VCC
Supply voltage (VCC1 = VCC2)
VCC = AVCC
–0.3 to 6.5
V
AVCC
Analog supply voltage
VCC = AVCC
–0.3 to 6.5
V
–0.3 to VCC+0.3
V
–0.3 to 6.5
V
–0.3 to VCC+0.3
V
_____________
VI
Input
RESET, CNVSS, BYTE,
voltage
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0, P7_2 to P7_7, P8_0 to P8_7,
P9_0, P9_2 to P9_7, P10_0 to P10_7,
VREF, XIN
P7_1, P9_1
VO
Output
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,
voltage
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0, P7_2 to P7_7,
P8_0 to P8_4, P8_6, P8_7, P9_0, P9_2 to P9_7,
P10_0 to P10_7, XOUT
Pd
P7_1, P9_1
Power dissipation
Topr
Operating ambient During MCU operation
temperature
Tstg
During flash memory program and
erase operation
Storage temperature
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 52 of 88
Topr = 25°C
–0.3 to 6.5
V
700
mW
–40 to 85
°C
0 to 60
–65 to 150
°C
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Table 5.27 Recommended Operating Conditions (1)
Symbol
(1)
Parameter
Min.
Standard
Max.
Typ.
Unit
VCC
Supply voltage (VCC1 = VCC2)
AVCC
Analog supply voltage
VCC
V
VSS
Supply voltage
0
V
AVSS
Analog supply voltage
0
V
VIH
HIGH input
P3_1 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, 0.8 VCC
voltage
P7_0, P7_2 to P7_7, P8_0 to P8_7, P9_0, P9_2 to P9_7,
_____________
P10_0 to P10_7, XIN, RESET, CNVSS, BYTE
P7_1, P9_1
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0
3.0
5.0
5.5
V
VCC
V
0.8 VCC
6.5
V
0.8 VCC
VCC
V
0.5 VCC
VCC
V
0
0.2 VCC
V
0
0.2 VCC
V
0
0.16 VCC
V
–10.0
mA
–5.0
mA
(During single-chip mode)
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0
(Data input during memory expansion and microprocessor modes)
VIL
LOW input
P3_1 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7,
voltage
P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7,
_____________
XIN, RESET, CNVSS, BYTE
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0
(During single-chip mode)
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0
(Data input during memory expansion and microprocessor modes)
IOH(peak)
HIGH peak
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7,
output current P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0,
P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0,
P9_2 to P9_7, P10_0 to P10_7
IOH(avg)
HIGH average P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7,
output current P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0,
P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0,
IOL(peak)
LOW peak
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7,
output current P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7,
P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7
10.0
mA
IOL(avg)
LOW average P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7,
output current P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7,
P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7
5.0
mA
P9_2 to P9_7, P10_0 to P10_7
NOTES:
1. Referenced to VCC = 3.0 to 5.5 V at Topr = –40 to 85°C unless otherwise specified.
2. Average output current values during 100 ms period.
3. The total IOL(peak) for ports P0, P1, P2, P8_6, P8_7, P9, and P10 must be 80 mA max.
The total IOL(peak) for ports P3, P4, P5, P6, P7, and P8_0 to P8_4 must be 80 mA max.
The total IOH(peak) for ports P0, P1, and P2 must be –40 mA max.
The total IOH(peak) for ports P3, P4, and P5 must be –40 mA max.
The total IOH(peak) for ports P6, P7, and P8_0 to P8_4 must be –40 mA max.
The total IOH(peak) for ports P8_6, P8_7, P9, and P10 must be –40 mA max.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 53 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Table 5.28 Recommended Operating Conditions (2)
Symbol
f(XIN)
(1)
Parameter
Min.
Main clock input oscillation No wait Mask ROM version VCC = 3.0 to 5.5 V
frequency
(2) (3) (4)
Standard
Max.
Typ.
0
Unit
16
MHz
50
kHz
Flash memory version
f(XCIN)
Sub clock oscillation frequency
f(Ring)
On-chip oscillation frequency
f(PLL)
PLL clock oscillation frequency
f(BCLK)
CPU operation clock
tsu(PLL)
PLL frequency synthesizer stabilization wait time
32.768
1
VCC = 3.0 to 5.5 V
MHz
16
24
MHz
0
24
MHz
20
ms
1. Referenced to VCC = 3.0 to 5.5 V at Topr = –40 to 85°C unless
otherwise specified.
2. Relationship between main clock oscillation frequency and supply
voltage is shown right.
3. Execute program/erase of flash memory by VCC = 3.3 ± 0.3 V or
VCC = 5.0 ± 0.5 V.
4. When using over 16 MHz, use PLL clock. PLL clock oscillation
frequency which can be used is 16 MHz, 20 MHz or 24 MHz.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 54 of 88
f(XIN) operating maximum frequency [MHz]
NOTES:
Main clock input oscillation frequency
(Mask ROM version / Flash memory
version: no wait)
16.0
0.0
3.0
5.5
VCC [V] (main clock: no division)
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Table 5.29 A/D Conversion Characteristics
Symbol
Parameter
–
Resolution
INL
Integral
10 bits
Measuring Condition
Min.
VREF = VCC
VREF ANEX0, ANEX1 input, AN0 to AN7 input,
Standard
Typ. Max.
10
= VCC AN0_0 to AN0_7 input, AN2_0 to AN2_7 input
= 5 V External operation amp connection mode
nonlinearity
error
8 bits
–
(1)
Absolute
10 bits
8 bits
Bit
±3
LSB
±7
LSB
VREF ANEX0, ANEX1 input, AN0 to AN7 input,
= VCC AN0_0 to AN0_7 input, AN2_0 to AN2_7 input
±5
LSB
= 3.3 V External operation amp connection mode
±7
LSB
VREF = AVCC = VCC = 5.0 V, 3.3 V
VREF ANEX0, ANEX1 input, AN0 to AN7 input,
±2
LSB
±3
LSB
= VCC AN0_0 to AN0_7 input, AN2_0 to AN2_7 input
= 5 V External operation amp connection mode
accuracy
Unit
±7
LSB
VREF ANEX0, ANEX1 input, AN0 to AN7 input,
= VCC AN0_0 to AN0_7 input, AN2_0 to AN2_7 input
±5
LSB
= 3.3 V External operation amp connection mode
±7
LSB
VREF = AVCC = VCC = 5.0 V, 3.3 V
±2
LSB
DNL
Differential nonlinearity error
±1
LSB
–
Offset error
±3
LSB
–
Gain error
±3
LSB
RLADDER
Resistor ladder
VREF = VCC
10
40
kΩ
tCONV
10-bit conversion time,
VREF = VCC = 5 V, φAD = 10 MHz
3.3
µs
VREF = VCC = 5 V, φAD = 10 MHz
2.8
µs
sample & hold available
8-bit conversion time,
sample & hold available
tSAMP
Sampling time
VREF
Reference voltage
VIA
Analog input voltage
µs
0.3
2.0
VCC
V
0
VREF
V
NOTES:
1. Referenced to VCC = AVCC = VREF = 3.3 to 5.5 V, VSS = AVSS = 0 V, –40 to 85°C unless otherwise specified.
2. φAD frequency must be 10 MHz or less.
3. When sample & hold is disabled, φAD frequency must be 250 kHz or more in addition to a limit of NOTE 2.
When sample & hold is enabled, φAD frequency must be 1 MHz or more in addition to a limit of NOTE 2.
Table 5.30 D/A conversion Characteristics
Symbol
Parameter
–
Resolution
–
Absolute accuracy
tsu
Setup time
RO
Output resistance
IVREF
Reference power supply input current
(1)
Measuring Condition
Min.
4
(NOTE 2)
Standard
Typ. Max.
8
10
Unit
Bits
1.0
%
3
µs
20
kΩ
1.5
mA
NOTES:
1. Referenced to VCC = AVCC = VREF = 3.3 to 5.5 V, VSS = AVSS = 0 V, –40 to 85°C unless otherwise specified.
2. This applies when using one D/A converter, with the DAi register (i = 0, 1) for the unused D/A converter set to 00h.
The resistor ladder of the A/D converter is not included. Also, the current IVREF always flows even though VREF
may have been set to be unconnected by the ADCON1 register.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 55 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Table 5.31 Power Supply Circuit Timing Characteristics
Symbol
Measuring
Condition
Parameter
Min.
Standard
Typ. Max.
2
Unit
td(P-R)
Time for internal power supply stabilization during powering-on VCC = 3.0 to 5.5 V
td(R-S)
STOP release time
150
µs
td(W-S)
Low power dissipation mode wait mode release time
150
µs
td(P-R)
Time for internal power supply
stabilization during powering-on
VCC
td(P-R)
CPU clock
Interrupt for
(a) Stop mode release
or
(b) Wait mode release
td(R-S)
STOP release time
td(W-S)
Low power dissipation mode
CPU clock
wait mode release time
(a)
(b)
Figure 5.11 Power Supply Circuit Timing Diagram
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 56 of 88
td(R-S)
td(W-S)
ms
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Table 5.32 Electrical Characteristics (1)
Symbol
VOH
HIGH output
voltage
VOH
HIGH output
voltage
VOH
HIGH output
voltage
HIGH output
voltage
VOL
LOW output
voltage
VOL
LOW output
voltage
VOL
LOW output
voltage
LOW output
voltage
VT+-VT- Hysteresis
(1)
VCC = 5 V
Standard
Parameter
Measuring Condition
Min. Typ. Max.
VCC
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, IOH = –5 mA
VCC-2.0
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0, P7_2 to P7_7,
P8_0 to P8_4, P8_6, P8_7, P9_0,
P9_2 to P9_7, P10_0 to P10_7
VCC
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, IOH = –200 µA
VCC-0.3
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0, P7_2 to P7_7,
P8_0 to P8_4, P8_6, P8_7, P9_0,
P9_2 to P9_7, P10_0 to P10_7
IOH = –1 mA
VCC
3.0
XOUT
HIGHPOWER
IOH = –0.5 mA
VCC
3.0
LOWPOWER
2.5
With
no
load
applied
XCOUT HIGHPOWER
1.6
With no load applied
LOWPOWER
2.0
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, IOL = 5 mA
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4,
P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, IOL = 200 µA
0.45
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4,
P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7
IOL = 1 mA
XOUT
HIGHPOWER
2.0
IOL = 0.5 mA
LOWPOWER
2.0
0
With no load applied
XCOUT HIGHPOWER
0
With no load applied
LOWPOWER
_________ _______
0.2
1.0
HOLD, RDY, TA0IN to TA4IN, TB0IN to TB5IN,
________
________ _______ _____________ _________
Unit
V
V
V
V
V
V
V
V
V
_________
INT0 to INT5, NMI, ADTRG, CTS0 to CTS2,
SCL0 to SCL2, SDA0 to SDA2,
CLK0
to CLK3,
_____
_____
TA0OUT to TA4OUT, KI0 to KI3,
RXD0
to RXD2, SIN3
_____________
VT+-VT- Hysteresis
RESET
HIGH input
IIH
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,
current
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7,
P9_0 ____________
to P9_7, P10_0 to P10_7,
XIN, RESET, CNVSS, BYTE
LOW input
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,
IIL
current
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7,
P9_0 ____________
to P9_7, P10_0 to P10_7,
XIN, RESET, CNVSS, BYTE
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,
RPULLUP Pull-up
resistance
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0, P7_2 to P7_7, P8_0 to
P8_4, P8_6, P8_7, P9_0, P9_2 to P9_7,
P10_0 to P10_7
Feedback
resistance
XIN
RfXIN
Feedback
resistance
XCIN
RfXCIN
RAM retention voltage
VRAM
0.2
VI = 5 V
2.5
5.0
V
µA
VI = 0 V
–5.0
µA
170
kΩ
VI = 0 V
30
50
1.5
15
At stop mode
2.0
MΩ
MΩ
V
NOTES:
1. Referenced to VCC = 4.2 to 5.5 V, VSS = 0 V at Topr = –40 to 85°C, f(BCLK) = 24 MHz unless otherwise specified.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 57 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
Table 5.33 Electrical Characteristics (2)
Symbol
ICC
5. Electric Characteristics (Normal-ver.)
(1)
Parameter
Power supply
Measuring Condition
In single-chip mode, Mask ROM
current
Min.
f(BCLK) = 24 MHz,
Standard
Typ. Max.
20
36
Unit
mA
PLL operation,
the output pins are
(VCC = 3.0 to 5.5 V) open and other pins
No division
On-chip oscillation,
No division
1
Flash memory f(BCLK) = 24 MHz,
22
are VSS.
mA
38
mA
PLL operation,
No division
On-chip oscillation,
No division
1.8
mA
Flash memory f(BCLK) = 10 MHz,
15
mA
25
mA
25
µA
25
µA
420
µA
50
µA
8.5
µA
3.0
µA
program
VCC = 5 V
Flash memory f(BCLK) = 10 MHz,
erase
VCC = 5 V
Mask ROM
f(BCLK) = 32 kHz,
Low power dissipation
mode, ROM
(2)
Flash memory f(BCLK) = 32 kHz,
Low power dissipation
mode, RAM
(2)
f(BCLK) = 32 kHz,
Low power dissipation
mode,
Flash memory
(2)
Mask ROM
On-chip oscillation,
Flash memory Wait mode
f(BCLK) = 32 kHz,
Wait mode
(3)
,
Oscillation capacity High
f(BCLK) = 32 kHz,
Wait mode
(3)
,
Oscillation capacity Low
Stop mode,
0.8
3.0
µA
Topr = 25°C
NOTES:
1. Referenced to VCC = 3.0 to 5.5 V, VSS = 0 V at Topr = –40 to 85°C, f(BCLK) = 24 MHz unless otherwise specified.
2. This indicates the memory in which the program to be executed exists.
3. With one timer operated using fC32.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 58 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Timing Requirements
VCC
(Referenced to VCC = 5 V, VSS = 0 V, at Topr = –40 to 85°C unless otherwise specified)
=5V
Table 5.34 External Clock Input (XIN Input)
Symbol
Parameter
tC
External clock input cycle time
tw(H)
External clock input HIGH pulse width
tw(L)
External clock input LOW pulse width
tr
External clock rise time
tf
External clock fall time
Standard
Min.
Max.
62.5
25
25
15
15
Unit
ns
ns
ns
ns
ns
Table 5.35 Memory Expansion Mode and Microprocessor Mode
Symbol
Parameter
tac1(RD-DB)
Data input access time (for setting with no wait)
tac2(RD-DB)
tac3(RD-DB)
Data input access time (for setting with wait)
tsu(DB-RD)
tsu(RDY-BCLK)
Data input setup time
Standard
Unit
Min.
Max.
(NOTE 1) ns
(NOTE 2) ns
(NOTE 3)
Data input access time (when accessing multiplexed bus area)
40
30
________
RDY input setup time
__________
tsu(HOLD-BCLK) HOLD input setup time
th(RD-DB)
Data input hold time
________
th(BCLK-RDY) RDY input hold time
__________
th(BCLK-HOLD) HOLD input hold time
40
0
0
0
ns
ns
ns
ns
ns
ns
ns
NOTES:
1. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 45 [ns]
f(BCLK)
9
2. Calculated according to the BCLK frequency as follows:
(n –0.5) ✕ 10
f(BCLK)
9
– 45 [ns]
n is “2” for 1-wait setting, “3” for 2-wait setting and “4” for 3-wait setting.
3. Calculated according to the BCLK frequency as follows:
(n –0.5) ✕ 109
– 45 [ns]
f(BCLK)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 59 of 88
n is “2” for 2-wait setting, “3” for 3-wait setting.
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Timing Requirements
VCC
(Referenced to VCC = 5 V, VSS = 0 V, at Topr = –40 to 85°C unless otherwise specified)
=5V
Table 5.36 Timer A Input (Counter Input in Event Counter Mode)
Parameter
Symbol
tc(TA)
TAiIN input cycle time
tw(TAH)
TAiIN input HIGH pulse width
tw(TAL)
TAiIN input LOW pulse width
Standard
Min.
Max.
100
40
40
Unit
ns
ns
ns
Table 5.37 Timer A Input (Gating Input in Timer Mode)
Parameter
Symbol
tc(TA)
TAiIN input cycle time
tw(TAH)
TAiIN input HIGH pulse width
tw(TAL)
TAiIN input LOW pulse width
Standard
Min.
Max.
400
200
200
Unit
ns
ns
ns
Table 5.38 Timer A Input (External Trigger Input in One-shot Timer Mode)
Symbol
Parameter
tc(TA)
TAiIN input cycle time
tw(TAH)
TAiIN input HIGH pulse width
tw(TAL)
TAiIN input LOW pulse width
Standard
Min.
Max.
200
100
100
Unit
ns
ns
ns
Table 5.39 Timer A Input (External Trigger Input in Pulse Width Modulation Mode)
tw(TAH)
TAiIN input HIGH pulse width
Standard
Min.
Max.
100
tw(TAL)
TAiIN input LOW pulse width
100
Symbol
Parameter
Unit
ns
ns
Table 5.40 Timer A Input (Counter Increment/decrement Input in Event Counter Mode)
Symbol
Parameter
Standard
Min.
Max.
2000
1000
tc(UP)
TAiOUT input cycle time
tw(UPH)
TAiOUT input HIGH pulse width
tw(UPL)
TAiOUT input LOW pulse width
tsu(UP-TIN)
TAiOUT input setup time
1000
400
th(TIN-UP)
TAiOUT input hold time
400
Unit
ns
ns
ns
ns
ns
Table 5.41 Timer A Input (Two-phase Pulse Input in Event Counter Mode)
Symbol
Parameter
tc(TA)
TAiIN input cycle rime
tsu(TAIN-TAOUT) TAiOUT input setup time
tsu(TAOUT-TAIN) TAiIN input setup time
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 60 of 88
Standard
Max.
Min.
800
200
200
Unit
ns
ns
ns
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Timing Requirements
VCC
(Referenced to VCC = 5 V, VSS = 0 V, at Topr = –40 to 85°C unless otherwise specified)
=5V
Table 5.42 Timer B Input (Counter Input in Event Counter Mode)
Symbol
tc(TB)
tw(TBH)
tw(TBL)
tc(TB)
tw(TBH)
tw(TBL)
Parameter
TBiIN input cycle time (counted on one edge)
TBiIN input HIGH pulse width (counted on one edge)
TBiIN input LOW pulse width (counted on one edge)
Standard
Min.
Max.
100
40
40
TBiIN input HIGH pulse width (counted on both edges)
200
80
TBiIN input LOW pulse width (counted on both edges)
80
TBiIN input cycle time (counted on both edges)
Unit
ns
ns
ns
ns
ns
ns
Table 5.43 Timer B Input (Pulse Period Measurement Mode)
TBiIN input HIGH pulse width
Standard
Min.
Max.
400
200
TBiIN input LOW pulse width
200
Symbol
tc(TB)
tw(TBH)
tw(TBL)
Parameter
TBiIN input cycle time
Unit
ns
ns
ns
Table 5.44 Timer B Input (Pulse Width Measurement Mode)
Symbol
tc(TB)
tw(TBH)
tw(TBL)
Parameter
TBiIN input cycle time
TBiIN input HIGH pulse width
Standard
Min.
Max.
400
200
200
TBiIN input LOW pulse width
Unit
ns
ns
ns
Table 5.45 A/D Trigger Input
Symbol
tC(AD)
tw(ADL)
Parameter
_____________
ADTRG input cycle time (trigger able minimum)
Standard
Min.
Max.
1000
_____________
ADTRG input LOW pulse width
125
Unit
ns
ns
Table 5.46 Serial Interface
CLKi input HIGH pulse width
Standard
Min.
Max.
200
100
CLKi input LOW pulse width
100
Symbol
tc(CK)
tw(CKH)
tw(CKL)
td(C-Q)
th(C-Q)
tsu(D-C)
th(C-D)
Parameter
CLKi input cycle time
80
TXDi output delay time
RXDi input setup time
0
70
RXDi input hold time
90
TXDi hold time
Unit
ns
ns
ns
ns
ns
ns
ns
_______
Table 5.47 External Interrupt INTi Input
Symbol
tw(INH)
tw(INL)
Parameter
_______
INTi input HIGH pulse width
_______
INTi input LOW pulse width
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 61 of 88
Standard
Min.
Max.
250
250
Unit
ns
ns
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Switching Characteristics
VCC
(Referenced to VCC = 5 V, VSS = 0 V, at Topr = –40 to 85 °C unless otherwise specified)
=5V
Table 5.48 Memory Expansion Mode and Microprocessor Mode (for setting with no wait)
Symbol
td(BCLK-AD)
th(BCLK-AD)
th(RD-AD)
th(WR-AD)
td(BCLK-CS)
th(BCLK-CS)
td(BCLK-ALE)
th(BCLK-ALE)
td(BCLK-RD)
th(BCLK-RD)
td(BCLK-WR)
th(BCLK-WR)
td(BCLK-DB)
th(BCLK-DB)
td(DB-WR)
th(WR-DB)
Standard
Min.
Max.
25
Measuring
Condition
Parameter
Address output delay time
Figure 5.12
Address output hold time (in relation to BCLK)
Address output hold time (in relation to RD)
0
Address output hold time (in relation to WR)
(NOTE 1)
Chip select output delay time
ALE signal output delay time
15
ns
ns
25
ns
ns
–4
RD signal output delay time
RD signal output hold time
ns
0
WR signal output delay time
25
WR signal output hold time
Data output hold time (in relation to BCLK)
40
(3)
Data output delay time (in relation to WR)
(3)
ns
ns
0
Data output delay time (in relation to BCLK)
Data output hold time (in relation to WR)
25
ns
ns
4
ALE signal output hold time
ns
ns
ns
4
Chip select output hold time (in relation to BCLK)
Unit
ns
4
ns
(NOTE 2)
ns
(NOTE 1)
ns
__________
td(BCLK-HLDA)
HLDA output delay time
40
ns
NOTES:
1. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 10 [ns]
f(BCLK)
9
2. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 40 [ns]
f(BCLK)
9
f(BCLK) is 12.5 MHz or less.
3. This standard value shows the timing when the
output is off, and does not show hold time of
data bus.
Hold time of data bus varies with capacitor volume
and pull-up (pull-down) resistance value.
Hold time of data bus is expressed in
t = – CR ✕ ln (1 – VOL / VCC)
by a circuit of the right figure.
For example, when VOL = 0.2 VCC, C = 30 pF,
R =1 kΩ, hold time of output “L” level is
t = – 30 pF ✕ 1 kΩ ✕ ln (1 – 0.2 VCC / VCC) = 6.7 ns.
R
DBi
C
P0
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
30 pF
Figure 5.12 Port P0 to P10 Measurement Circuit
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 62 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Switching Characteristics
VCC
(Referenced to VCC = 5 V, VSS = 0 V, at Topr = –40 to 85 °C unless otherwise specified)
=5V
Table 5.49 Memory Expansion Mode and Microprocessor Mode (for 1- to 3-wait setting and external area access)
Symbol
Measuring
Condition
Parameter
td(BCLK-AD)
th(BCLK-AD)
th(RD-AD)
th(WR-AD)
td(BCLK-CS)
th(BCLK-CS)
td(BCLK-ALE)
th(BCLK-ALE)
td(BCLK-RD)
th(BCLK-RD)
td(BCLK-WR)
th(BCLK-WR)
td(BCLK-DB)
th(BCLK-DB)
td(DB-WR)
th(WR-DB)
Address output delay time
Figure 5.12
Address output hold time (in relation to BCLK)
Standard
Min.
Max.
25
Address output hold time (in relation to RD)
0
Address output hold time (in relation to WR)
(NOTE 1)
Chip select output delay time
25
ns
ns
15
ns
ns
25
ns
ns
25
ns
ns
40
ns
ns
4
ALE signal output delay time
ALE signal output hold time
–4
RD signal output delay time
RD signal output hold time
0
WR signal output delay time
WR signal output hold time
0
Data output delay time (in relation to BCLK)
Data output hold time (in relation to BCLK)
(3)
Data output hold time (in relation to WR)
ns
ns
4
Data output delay time (in relation to WR)
(NOTE 2)
(3)
ns
ns
ns
4
Chip select output hold time (in relation to BCLK)
Unit
ns
(NOTE 1)
__________
td(BCLK-HLDA)
HLDA output delay time
40
ns
NOTES:
1. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 10 [ns]
f(BCLK)
9
2. Calculated according to the BCLK frequency as follows:
(n – 0.5) ✕ 10
– 40 [ns]
f(BCLK)
9
n is “1” for 1-wait setting, “2” for 2-wait setting and “3” for 3-wait setting.
When n = 1, f(BCLK) is 12.5 MHz or less.
3. This standard value shows the timing when the
output is off, and does not show hold time of
data bus.
Hold time of data bus varies with capacitor volume
and pull-up (pull-down) resistance value.
Hold time of data bus is expressed in
t = – CR ✕ ln (1 – VOL / VCC)
by a circuit of the right figure.
For example, when VOL = 0.2 VCC, C = 30 pF,
R =1 kΩ, hold time of output “L” level is
t = – 30 pF ✕ 1 kΩ ✕ ln (1 – 0.2 VCC / VCC) = 6.7 ns.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 63 of 88
R
DBi
C
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Switching Characteristics
VCC
(Referenced to VCC = 5 V, VSS = 0 V, at Topr = –40 to 85 °C unless otherwise specified)
=5V
Table 5.50 Memory Expansion Mode and Microprocessor Mode
(for 2- to 3-wait setting, external area access and multiplexed bus selection)
Symbol
Parameter
td(BCLK-AD)
th(BCLK-AD)
th(RD-AD)
th(WR-AD)
td(BCLK-CS)
th(BCLK-CS)
th(RD-CS)
th(WR-CS)
td(BCLK-RD)
th(BCLK-RD)
td(BCLK-WR)
th(BCLK-WR)
td(BCLK-DB)
th(BCLK-DB)
td(DB-WR)
th(WR-DB)
Address output delay time
Measuring
Condition
Figure 5.12
Standard
Min.
Max.
25
Address output hold time (in relation to BCLK)
(NOTE 1)
Address output hold time (in relation to WR)
(NOTE 1)
Chip select output delay time
25
Chip select output hold time (in relation to BCLK)
(NOTE 1)
Chip select output hold time (in relation to WR)
(NOTE 1)
RD signal output delay time
ns
25
RD signal output hold time
25
WR signal output hold time
ns
ns
0
Data output delay time (in relation to BCLK)
ns
ns
0
WR signal output delay time
ns
ns
ns
ns
4
Chip select output hold time (in relation to RD)
ns
ns
ns
4
Address output hold time (in relation to RD)
Unit
40
ns
Data output hold time (in relation to BCLK)
4
ns
Data output delay time (in relation to WR)
(NOTE 2)
ns
Data output hold time (in relation to WR)
(NOTE 1)
ns
__________
td(BCLK-HLDA)
HLDA output delay time
td(BCLK-ALE)
th(BCLK-ALE)
td(AD-ALE)
th(ALE-AD)
td(AD-RD)
td(AD-WR)
tdZ(RD-AD)
ALE signal output delay time (in relation to BCLK)
40
ns
15
ns
–4
ns
ALE signal output delay time (in relation to Address)
(NOTE 3)
ns
ALE signal output hold time (in relation to Address)
(NOTE 4)
ns
RD signal output delay from the end of Address
0
ns
WR signal output delay from the end of Address
0
ALE signal output hold time (in relation to BCLK)
Address output floating start time
NOTES:
1. Calculated according to the BCLK frequency as follows:
0.5 ✕ 109 – 10 [ns]
f(BCLK)
2. Calculated according to the BCLK frequency as follows:
(n –0.5) ✕ 10
f(BCLK)
9
– 40 [ns]
n is “2” for 2-wait setting, “3” for 3-wait setting.
3. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 25 [ns]
f(BCLK)
9
4. Calculated according to the BCLK frequency as follows:
0.5 ✕ 109 – 15 [ns]
f(BCLK)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 64 of 88
ns
8
ns
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
VCC = 5 V
XIN input
tr
tr
tw(H)
tw(L)
tc
tc(TA)
tw(TAH)
TAiIN input
tw(TAL)
tc(UP)
tw(UPH)
TAiOUT input
tw(UPL)
TAiOUT input
(Up/down input)
During event counter mode
TAiIN input
(When count on falling edge
is selected)
th(TIN—UP) tsu(UP—TIN)
TAiIN input
(When count on rising edge
is selected)
Two-phase pulse input in event counter mode
tC(TA)
TAiIN input
tsu(TAIN—TAOUT)
tsu(TAIN—TAOUT)
tsu(TAOUT—TAIN)
TAiOUT input
tsu(TAOUT—TAIN)
tc(TB)
tw(TBH)
TBiIN input
tw(TBL)
tc(AD)
tw(ADL)
ADTRG input
tc(CK)
tw(CKH)
CLKi
tw(CKL)
th(C—Q)
TXDi
td(C—Q)
tsu(D—C)
RXDi
tw(INL)
INTi input
tw(INH)
Figure 5.13 Timing Diagram (1)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 65 of 88
th(C—D)
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Memory Expansion Mode and Microprocessor Mode
VCC = 5 V
(Effective for setting with wait)
BCLK
RD
(Separate bus)
WR, WRL, WRH
(Separate bus)
RD
(Multiplexed bus)
WR, WRL, WRH
(Multiplexed bus)
RDY input
tsu(RDY–BCLK)
th(BCLK–RDY)
(Common to setting with wait and setting without wait)
BCLK
tsu(HOLD–BCLK)
th(BCLK–HOLD)
HOLD input
HLDA output
td(BCLK–HLDA)
P0, P1, P2,
P3, P4,
P5_0 to P5_2 (1)
td(BCLK–HLDA)
Hi–Z
NOTE:
1. The above pins are set to high-impedance regardless of the input level of the BYTE pin,
the PM06 bit in the PM0 register, and the PM11 bit in the PM1 register.
Measuring conditions :
VCC = 5 V
Input timing voltage : Determined with VIL = 1.0 V, VIH = 4.0 V
Output timing voltage: Determined with VOL = 2.5 V, VOH = 2.5 V
Figure 5.14 Timing Diagram (2)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 66 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Memory Expansion Mode and Microprocessor Mode
(For setting with no wait)
Read timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
25ns.max
4ns.min
CSi
tcyc
td(BCLK-AD)
th(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(BCLK-ALE)
-4ns.min
25ns.max
th(RD-AD)
0ns.min
ALE
td(BCLK-RD)
25ns.max
th(BCLK-RD)
0ns.min
RD
tac1(RD-DB)
(0.5 ✕ tcyc-45)ns.max
Hi-Z
DBi
tSU(DB-RD)
40ns.min
th(RD-DB)
0ns.min
Write timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
25ns.max
4ns.min
CSi
tcyc
td(BCLK-AD)
th(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(BCLK-ALE)
25ns.max
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
-4ns.min
ALE
td(BCLK-WR)
25ns.max
th(BCLK-WR)
0ns.min
WR,WRL,
WRH
td(BCLK-DB)
th(BCLK-DB)
4ns.min
40ns.max
Hi-Z
DBi
td(DB-WR)
Measuring conditions :
VCC = 5 V
Input timing voltage : VIL = 0.8 V, VIH = 2.0 V
Output timing voltage : VOL = 0.4 V, VOH = 2.4 V
Figure 5.15 Timing Diagram (3)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
th(WR-DB)
(0.5 ✕ tcyc-40)ns.min (0.5 ✕ tcyc-10)ns.min
1
tcyc =
f(BCLK)
page 67 of 88
VCC = 5 V
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Memory Expansion Mode and Microprocessor Mode
(For 1-wait setting and external area access)
Read timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
25ns.max
4ns.min
CSi
tcyc
td(BCLK-AD)
th(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(RD-AD)
th(BCLK-ALE)
0ns.min
-4ns.min
25ns.max
ALE
td(BCLK-RD)
th(BCLK-RD)
0ns.min
25ns.max
RD
tac2(RD-DB)
(1.5 ✕ tcyc-45)ns.max
DBi
Hi-Z
th(RD-DB)
tSU(DB-RD)
0ns.min
40ns.min
Write timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
25ns.max
4ns.min
CSi
tcyc
td(BCLK-AD)
th(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(BCLK-ALE)
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
-4ns.min
25ns.max
ALE
td(BCLK-WR)
25ns.max
th(BCLK-WR)
0ns.min
WR,WRL,
WRH
td(BCLK-DB)
th(BCLK-DB)
4ns.min
40ns.max
Hi-Z
DBi
td(DB-WR)
(0.5 ✕ tcyc-40)ns.min
1
tcyc =
f(BCLK)
Measuring conditions :
VCC = 5 V
Input timing voltage : VIL = 0.8 V, VIH = 2.0 V
Output timing voltage : VOL = 0.4 V, VOH = 2.4 V
Figure 5.16 Timing Diagram (4)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 68 of 88
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
VCC = 5 V
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Memory Expansion Mode and Microprocessor Mode
(For 2-wait setting and external area access)
Read timing
tcyc
BCLK
th(BCLK-CS)
4ns.min
td(BCLK-CS)
25ns.max
CSi
th(BCLK-AD)
4ns.min
td(BCLK-AD)
25ns.max
ADi
BHE
td(BCLK-ALE)
25ns.max
th(RD-AD)
th(BCLK-ALE)
-4ns.min
0ns.min
ALE
th(BCLK-RD)
0ns.min
td(BCLK-RD)
25ns.max
RD
tac2(RD-DB)
(2.5 ✕ tcyc-45)ns.max
DBi
Hi-Z
tSU(DB-RD)
40ns.min
th(RD-DB)
0ns.min
Write timing
tcyc
BCLK
td(BCLK-CS)
25ns.max
th(BCLK-CS)
td(BCLK-AD)
25ns.max
th(BCLK-AD)
4ns.min
CSi
4ns.min
ADi
BHE
td(BCLK-ALE)
25ns.max
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
th(BCLK-ALE)
-4ns.min
ALE
td(BCLK-WR)
25ns.max
th(BCLK-WR)
0ns.min
WR, WRL
WRH
td(BCLK-DB)
40ns.max
DBi
Hi-Z
td(DB-WR)
(1.5 ✕ tcyc-40)ns.min
tcyc =
th(BCLK-DB)
4ns.min
1
f(BCLK)
Measuring conditions :
VCC = 5 V
Input timing voltage : VIL = 0.8 V, VIH = 2.0 V
Output timing voltage : VOL = 0.4 V, VOH = 2.4 V
Figure 5.17 Timing Diagram (5)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 69 of 88
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
VCC = 5 V
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
VCC = 5 V
Memory Expansion Mode and Microprocessor Mode
(For 3-wait setting and external area access)
Read timing
tcyc
BCLK
th(BCLK-CS)
4ns.min
td(BCLK-CS)
25ns.max
CSi
th(BCLK-AD)
td(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(RD-AD)
0ns.min
th(BCLK-ALE)
25ns.max
-4ns.min
ALE
th(BCLK-RD)
td(BCLK-RD)
25ns.max
0ns.min
RD
tac2(RD-DB)
(3.5 ✕ tcyc-45)ns.max
DBi
Hi-Z
tSU(DB-RD)
th(RD-DB)
40ns.min
0ns.min
Write timing
tcyc
BCLK
td(BCLK-CS)
25ns.max
th(BCLK-CS)
4ns.min
td(BCLK-AD)
th(BCLK-AD)
4ns.min
CSi
25ns.max
ADi
BHE
td(BCLK-ALE)
25ns.max
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
th(BCLK-ALE)
-4ns.min
ALE
td(BCLK-WR)
25ns.max
th(BCLK-WR)
0ns.min
WR, WRL
WRH
DBi
td(BCLK-DB)
th(BCLK-DB)
40ns.max
4ns.min
Hi-Z
td(DB-WR)
(2.5 ✕ tcyc-40)ns.min
1
tcyc =
f(BCLK)
Measuring conditions :
VCC = 5 V
Input timing voltage : VIL = 0.8 V, VIH = 2.0 V
Output timing voltage : VOL = 0.4 V, VOH = 2.4 V
Figure 5.18 Timing Diagram (6)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 70 of 88
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
VCC = 5 V
Memory Expansion Mode and Microprocessor Mode
(For 1- or 2-wait setting, external area access and multiplexed bus selection)
Read timing
BCLK
td(BCLK-CS)
th(RD-CS)
(0.5 ✕ tcyc-10)ns.min
tcyc
25ns.max
th(BCLK-CS)
4ns.min
CSi
td(AD-ALE)
(0.5 ✕ tcyc-25)ns.min
ADi
/DBi
th(ALE-AD)
(0.5 ✕ tcyc-15)ns.min
Address
8ns.max
Address
Data input
tdZ(RD-AD)
tac3(RD-DB)
(1.5 ✕ tcyc-45)ns.max
tSU(DB-RD)
th(RD-DB)
0ns.min
40ns.min
td(AD-RD)
0ns.min
td(BCLK-AD)
th(BCLK-AD)
4ns.min
25ns.max
ADi
BHE
td(BCLK-ALE)
th(BCLK-ALE)
25ns.max
th(RD-AD)
(0.5 ✕ tcyc-10)ns.min
-4ns.min
ALE
td(BCLK-RD)
th(BCLK-RD)
0ns.min
25ns.max
RD
Write timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
th(WR-CS)
(0.5 ✕ tcyc-10)ns.min
tcyc
25ns.max
4ns.min
CSi
th(BCLK-DB)
td(BCLK-DB)
4ns.min
40ns.max
ADi
/DBi
Address
Data output
td(DB-WR)
td(AD-ALE)
(1.5 ✕ tcyc-40)ns.min
(0.5 ✕ tcyc-25)ns.min
Address
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
td(BCLK-AD)
th(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
25ns.max
th(BCLK-ALE)
td(AD-WR)
-4ns.min
0ns.min
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
ALE
td(BCLK-WR)
25ns.max
WR,WRL,
WRH
tcyc =
1
f(BCLK)
Measuring conditions :
VCC = 5 V
Input timing voltage : VIL = 0.8 V, VIH = 2.0 V
Output timing voltage : VOL = 0.4 V, VOH = 2.4 V
Figure 5.19 Timing Diagram (7)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 71 of 88
th(BCLK-WR)
0ns.min
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
VCC = 5 V
Memory Expansion Mode and Microprocessor Mode
(For 3-wait setting, external area access and multiplexed bus selection)
Read timing
tcyc
BCLK
th(RD-CS)
(0.5 ✕ tcyc-10)ns.min
td(BCLK-CS)
th(BCLK-CS)
4ns.min
25ns.max
CSi
td(AD-ALE)
(0.5 ✕ tcyc-25)ns.min
ADi
/DBi
th(ALE-AD)
(0.5 ✕ tcyc-15)ns.min
Address
td(BCLK-AD)
td(AD-RD)
25ns.max
ADi
BHE
Data input
tdZ(RD-AD)
8ns.max
th(RD-DB)
tac3(RD-DB)
(2.5 ✕ tcyc-45)ns.max
0ns.min
tSU(DB-RD)
0ns.min
th(BCLK-AD)
40ns.min
4ns.min
(no multiplex)
td(BCLK-ALE)
25ns.max
th(RD-AD)
th(BCLK-ALE)
(0.5 ✕ tcyc-10)ns.min
-4ns.min
ALE
th(BCLK-RD)
td(BCLK-RD)
0ns.min
25ns.max
RD
Write timing
tcyc
BCLK
th(WR-CS)
(0.5 ✕ tcyc-10)ns.min
td(BCLK-CS)
25ns.max
th(BCLK-CS)
4ns.min
CSi
th(BCLK-DB)
td(BCLK-DB)
40ns.max
ADi
/DBi
Address
4ns.min
Data output
td(AD-ALE)
td(DB-WR)
(0.5 ✕ tcyc-25)ns.min
(2.5 ✕ tcyc-40)ns.min
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
td(BCLK-AD)
th(BCLK-AD)
25ns.max
4ns.min
ADi
BHE
(no multiplex)
td(BCLK-ALE)
25ns.max
th(BCLK-ALE)
th(WR-AD)
-4ns.min
td(AD-WR)
ALE
td(BCLK-WR)
25ns.max
WR, WRL
WRH
tcyc =
(0.5 ✕ tcyc-10)ns.min
0ns.min
1
f(BCLK)
Measuring conditions :
VCC = 5 V
Input timing voltage : VIL = 0.8 V, VIH = 2.0 V
Output timing voltage : VOL = 0.4 V, VOH = 2.4 V
Figure 5.20 Timing Diagram (8)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 72 of 88
th(BCLK-WR)
0ns.min
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Table 5.51 Electrical Characteristics
Symbol
VOH
HIGH output
voltage
(1)
VCC = 3.3 V
Standard
Parameter
Measuring Condition
Min. Typ. Max.
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, IOH = –1 mA
VCC
VCC-0.5
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
Unit
V
P6_0 to P6_7, P7_0, P7_2 to P7_7,
P8_0 to P8_4, P8_6, P8_7, P9_0,
P9_2 to P9_7, P10_0 to P10_7
VOH
VOL
VCC
VCC-0.5
VCC
XOUT
HIGH output
voltage
XCOUT HIGHPOWER
With no load applied
2.5
LOWPOWER
With no load applied
1.6
LOW output
voltage
HIGHPOWER
VCC-0.5
HIGH output
voltage
IOH = –0.1 mA
LOWPOWER
IOH = –50 µA
V
V
0.5
V
IOL = 0.1 mA
0.5
V
IOL = 50 µA
0.5
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, IOL = 1 mA
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4,
P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7
VOL
LOW output
voltage
XOUT
LOW output
voltage
XCOUT HIGHPOWER
VT+-V T- Hysteresis
HIGHPOWER
LOWPOWER
LOWPOWER
_________ _______
With no load applied
0
With no load applied
0
HOLD, RDY, TA0IN to TA4IN, TB0IN to TB5IN,
________
________ _______ _____________ _________
V
V
0.2
0.8
0.2
1.8
V
4.0
µA
–4.0
µA
500
kΩ
_________
INT0 to INT5, NMI, ADTRG, CTS0 to CTS2,
SCL0 to SCL2, SDA0 to SDA2, CLK0 to CLK3,
_____
_____
TA0OUT to TA4OUT, KI0 to KI3,
RXD0 to RXD2, SIN3
VT+-V T- Hysteresis
IIH
HIGH input
current
_____________
RESET
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, VI = 3.3 V
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7,
P9_0 to P9_7, P10_0 to P10_7,
____________
XIN, RESET, CNVSS, BYTE
IIL
LOW input
current
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, VI = 0 V
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7,
P9_0 to P9_7, P10_0 to P10_7,
____________
XIN, RESET, CNVSS, BYTE
RPULLUP Pull-up
resistance
P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, VI = 0 V
P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,
50
100
P6_0 to P6_7, P7_0, P7_2 to P7_7, P8_0 to
P8_4, P8_6, P8_7, P9_0, P9_2 to P9_7,
RfXIN
RfXCIN
P10_0 to P10_7
Feedback resistance
XIN
Feedback resistance
XCIN
RAM retention voltage
3.0
25
MΩ
MΩ
At stop mode
VRAM
V
2.0
NOTES:
1. Referenced to VCC = 3.0 to 3.6 V, VSS = 0 V at Topr = –40 to 85°C, f(BCLK) = 24 MHz unless otherwise specified.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 73 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Timing Requirements
VCC
(Referenced to VCC = 3.3 V, VSS = 0 V, at Topr = –40 to 85°C unless otherwise specified)
= 3.3 V
Table 5.52 External Clock Input (XIN Input)
Symbol
Parameter
tC
External clock input cycle time
tw(H)
External clock input HIGH pulse width
tw(L)
External clock input LOW pulse width
tr
External clock rise time
tf
External clock fall time
Standard
Min.
Max.
62.5
25
25
15
15
Unit
ns
ns
ns
ns
ns
Table 5.53 Memory Expansion Mode and Microprocessor Mode
Symbol
Parameter
tac1(RD-DB)
Data input access time (for setting with no wait)
tac2(RD-DB)
tac3(RD-DB)
Data input access time (for setting with wait)
tsu(DB-RD)
tsu(RDY-BCLK)
Data input setup time
Standard
Unit
Min.
Max.
(NOTE 1) ns
(NOTE 2) ns
(NOTE 3)
Data input access time (when accessing multiplexed bus area)
50
40
________
RDY input setup time
__________
tsu(HOLD-BCLK) HOLD input setup time
th(RD-DB)
Data input hold time
________
th(BCLK-RDY) RDY input hold time
__________
th(BCLK-HOLD) HOLD input hold time
50
0
0
0
ns
ns
ns
ns
ns
ns
ns
NOTES:
1. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 60 [ns]
f(BCLK)
9
2. Calculated according to the BCLK frequency as follows:
(n –0.5) ✕ 10
f(BCLK)
9
– 60 [ns]
n is “2” for 1-wait setting, “3” for 2-wait setting and “4” for 3-wait setting.
3. Calculated according to the BCLK frequency as follows:
(n –0.5) ✕ 109
– 60 [ns]
f(BCLK)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 74 of 88
n is “2” for 2-wait setting, “3” for 3-wait setting.
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Timing Requirements
VCC
(Referenced to VCC = 3.3 V, VSS = 0 V, at Topr = –40 to 85°C unless otherwise specified)
= 3.3 V
Table 5.54 Timer A Input (Counter Input in Event Counter Mode)
Parameter
Symbol
tc(TA)
TAiIN input cycle time
tw(TAH)
TAiIN input HIGH pulse width
tw(TAL)
TAiIN input LOW pulse width
Standard
Min.
Max.
150
60
60
Unit
ns
ns
ns
Table 5.55 Timer A Input (Gating Input in Timer Mode)
Parameter
Symbol
tc(TA)
TAiIN input cycle time
tw(TAH)
TAiIN input HIGH pulse width
tw(TAL)
TAiIN input LOW pulse width
Standard
Min.
Max.
600
300
300
Unit
ns
ns
ns
Table 5.56 Timer A Input (External Trigger Input in One-shot Timer Mode)
Symbol
Parameter
tc(TA)
TAiIN input cycle time
tw(TAH)
TAiIN input HIGH pulse width
tw(TAL)
TAiIN input LOW pulse width
Standard
Min.
Max.
300
150
150
Unit
ns
ns
ns
Table 5.57 Timer A Input (External Trigger Input in Pulse Width Modulation Mode)
tw(TAH)
TAiIN input HIGH pulse width
Standard
Min.
Max.
150
tw(TAL)
TAiIN input LOW pulse width
150
Symbol
Parameter
Unit
ns
ns
Table 5.58 Timer A Input (Counter Increment/decrement Input in Event Counter Mode)
Symbol
Parameter
Standard
Min.
Max.
3000
1500
tc(UP)
TAiOUT input cycle time
tw(UPH)
TAiOUT input HIGH pulse width
tw(UPL)
TAiOUT input LOW pulse width
tsu(UP-TIN)
TAiOUT input setup time
1500
600
th(TIN-UP)
TAiOUT input hold time
600
Unit
ns
ns
ns
ns
ns
Table 5.59 Timer A Input (Two-phase Pulse Input in Event Counter Mode)
Symbol
Parameter
tc(TA)
TAiIN input cycle time
tsu(TAIN-TAOUT) TAiOUT input setup time
tsu(TAOUT-TAIN) TAiIN input setup time
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 75 of 88
Standard
Max.
Min.
2
500
500
Unit
µs
ns
ns
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Timing Requirements
VCC
(Referenced to VCC = 3.3 V, VSS = 0 V, at Topr = –40 to 85°C unless otherwise specified)
= 3.3 V
Table 5.60 Timer B Input (Counter Input in Event Counter Mode)
Symbol
tc(TB)
tw(TBH)
tw(TBL)
tc(TB)
tw(TBH)
tw(TBL)
Parameter
TBiIN input cycle time (counted on one edge)
TBiIN input HIGH pulse width (counted on one edge)
TBiIN input LOW pulse width (counted on one edge)
Standard
Min.
Max.
150
60
60
TBiIN input HIGH pulse width (counted on both edges)
300
120
TBiIN input LOW pulse width (counted on both edges)
120
TBiIN input cycle time (counted on both edges)
Unit
ns
ns
ns
ns
ns
ns
Table 5.61 Timer B Input (Pulse Period Measurement Mode)
TBiIN input HIGH pulse width
Standard
Min.
Max.
600
300
TBiIN input LOW pulse width
300
Symbol
tc(TB)
tw(TBH)
tw(TBL)
Parameter
TBiIN input cycle time
Unit
ns
ns
ns
Table 5.62 Timer B Input (Pulse Width Measurement Mode)
Symbol
tc(TB)
tw(TBH)
tw(TBL)
Parameter
TBiIN input cycle time
TBiIN input HIGH pulse width
Standard
Min.
Max.
600
300
300
TBiIN input LOW pulse width
Unit
ns
ns
ns
Table 5.63 A/D Trigger Input
Symbol
tC(AD)
tw(ADL)
Parameter
_____________
ADTRG input cycle time (trigger able minimum)
Standard
Min.
Max.
1500
_____________
ADTRG input LOW pulse width
200
Unit
ns
ns
Table 5.64 Serial Interface
CLKi input HIGH pulse width
Standard
Min.
Max.
300
150
CLKi input LOW pulse width
150
Symbol
tc(CK)
tw(CKH)
tw(CKL)
td(C-Q)
th(C-Q)
tsu(D-C)
th(C-D)
Parameter
CLKi input cycle time
160
TXDi output delay time
RXDi input setup time
0
100
RXDi input hold time
90
TXDi hold time
Unit
ns
ns
ns
ns
ns
ns
ns
_______
Table 5.65 External Interrupt INTi Input
Symbol
tw(INH)
tw(INL)
Parameter
_______
INTi input HIGH pulse width
_______
INTi input LOW pulse width
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 76 of 88
Standard
Min.
Max.
380
380
Unit
ns
ns
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Switching Characteristics
VCC
(Referenced to VCC = 3.3 V, VSS = 0 V, at Topr = –40 to 85 °C unless otherwise specified)
= 3.3 V
Table 5.66 Memory Expansion Mode and Microprocessor Mode (for setting with no wait)
Symbol
td(BCLK-AD)
th(BCLK-AD)
th(RD-AD)
th(WR-AD)
td(BCLK-CS)
th(BCLK-CS)
td(BCLK-ALE)
th(BCLK-ALE)
td(BCLK-RD)
th(BCLK-RD)
td(BCLK-WR)
th(BCLK-WR)
td(BCLK-DB)
th(BCLK-DB)
td(DB-WR)
th(WR-DB)
Standard
Min.
Max.
30
Measuring
Condition
Parameter
Address output delay time
Figure 5.21
Address output hold time (in relation to BCLK)
Address output hold time (in relation to RD)
0
Address output hold time (in relation to WR)
(NOTE 1)
Chip select output delay time
ALE signal output delay time
25
ns
ns
30
ns
ns
–4
RD signal output delay time
RD signal output hold time
ns
0
WR signal output delay time
30
WR signal output hold time
Data output hold time (in relation to BCLK)
40
(3)
Data output delay time (in relation to WR)
(3)
ns
4
ns
(NOTE 2)
ns
(NOTE 1)
__________
td(BCLK-HLDA)
ns
ns
0
Data output delay time (in relation to BCLK)
Data output hold time (in relation to WR)
30
ns
ns
4
ALE signal output hold time
ns
ns
ns
4
Chip select output hold time (in relation to BCLK)
Unit
HLDA output delay time
40
ns
ns
NOTES:
1. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 10 [ns]
f(BCLK)
9
2. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 40 [ns]
f(BCLK)
9
f(BCLK) is 12.5 MHz or less.
3. This standard value shows the timing when the
output is off, and does not show hold time of
data bus.
Hold time of data bus varies with capacitor volume
and pull-up (pull-down) resistance value.
Hold time of data bus is expressed in
t = – CR ✕ ln (1 – VOL / VCC)
by a circuit of the right figure.
For example, when VOL = 0.2 VCC, C = 30 pF,
R =1 kΩ, hold time of output “L” level is
t = – 30 pF ✕ 1 kΩ ✕ ln (1 – 0.2 VCC / VCC) = 6.7 ns.
R
DBi
C
P0
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
30 pF
Figure 5.21 Port P0 to P10 Measurement Circuit
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 77 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Switching Characteristics
VCC
(Referenced to VCC = 3.3 V, VSS = 0 V, at Topr = –40 to 85 °C unless otherwise specified)
= 3.3 V
Table 5.67 Memory Expansion Mode and Microprocessor Mode (for 1- to 3-wait setting and external area access)
Symbol
Measuring
Condition
Parameter
td(BCLK-AD)
th(BCLK-AD)
th(RD-AD)
th(WR-AD)
td(BCLK-CS)
th(BCLK-CS)
td(BCLK-ALE)
th(BCLK-ALE)
td(BCLK-RD)
th(BCLK-RD)
td(BCLK-WR)
th(BCLK-WR)
td(BCLK-DB)
th(BCLK-DB)
td(DB-WR)
th(WR-DB)
Address output delay time
Figure 5.21
Address output hold time (in relation to BCLK)
Standard
Min.
Max.
30
Address output hold time (in relation to RD)
0
Address output hold time (in relation to WR)
(NOTE 1)
Chip select output delay time
30
ns
ns
25
ns
ns
30
ns
ns
30
ns
ns
40
ns
ns
4
ALE signal output delay time
ALE signal output hold time
–4
RD signal output delay time
RD signal output hold time
0
WR signal output delay time
WR signal output hold time
0
Data output delay time (in relation to BCLK)
Data output hold time (in relation to BCLK)
(3)
Data output hold time (in relation to WR)
ns
ns
4
Data output delay time (in relation to WR)
(NOTE 2)
(3)
ns
ns
ns
4
Chip select output hold time (in relation to BCLK)
Unit
ns
(NOTE 1)
__________
td(BCLK-HLDA)
HLDA output delay time
40
ns
NOTES:
1. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 10 [ns]
f(BCLK)
9
2. Calculated according to the BCLK frequency as follows:
(n – 0.5) ✕ 10
– 40 [ns]
f(BCLK)
9
n is “1” for 1-wait setting, “2” for 2-wait setting and “3” for 3-wait setting.
When n = 1, f(BCLK) is 12.5 MHz or less.
3. This standard value shows the timing when the
output is off, and does not show hold time of
data bus.
Hold time of data bus varies with capacitor volume
and pull-up (pull-down) resistance value.
Hold time of data bus is expressed in
t = – CR ✕ ln (1 – VOL / VCC)
by a circuit of the right figure.
For example, when VOL = 0.2 VCC, C = 30 pF,
R =1 kΩ, hold time of output “L” level is
t = – 30 pF ✕ 1 kΩ ✕ ln (1 – 0.2 VCC / VCC) = 6.7 ns.
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 78 of 88
R
DBi
C
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Switching Characteristics
VCC
(Referenced to VCC = 3.3 V, VSS = 0 V, at Topr = –40 to 85 °C unless otherwise specified)
= 3.3 V
Table 5.68 Memory Expansion Mode and Microprocessor Mode
(for 2- to 3-wait setting, external area access and multiplexed bus selection)
Symbol
Parameter
td(BCLK-AD)
th(BCLK-AD)
th(RD-AD)
th(WR-AD)
td(BCLK-CS)
th(BCLK-CS)
th(RD-CS)
th(WR-CS)
td(BCLK-RD)
th(BCLK-RD)
td(BCLK-WR)
th(BCLK-WR)
td(BCLK-DB)
th(BCLK-DB)
td(DB-WR)
th(WR-DB)
Address output delay time
Measuring
Condition
Figure 5.21
Standard
Min.
Max.
50
Address output hold time (in relation to BCLK)
(NOTE 1)
Address output hold time (in relation to WR)
(NOTE 1)
Chip select output delay time
50
Chip select output hold time (in relation to BCLK)
(NOTE 1)
Chip select output hold time (in relation to WR)
(NOTE 1)
RD signal output delay time
ns
40
RD signal output hold time
40
WR signal output hold time
ns
ns
0
Data output delay time (in relation to BCLK)
ns
ns
0
WR signal output delay time
ns
ns
ns
ns
4
Chip select output hold time (in relation to RD)
ns
ns
ns
4
Address output hold time (in relation to RD)
Unit
50
ns
Data output hold time (in relation to BCLK)
4
ns
Data output delay time (in relation to WR)
(NOTE 2)
ns
Data output hold time (in relation to WR)
(NOTE 1)
ns
__________
td(BCLK-HLDA)
HLDA output delay time
td(BCLK-ALE)
th(BCLK-ALE)
td(AD-ALE)
th(ALE-AD)
td(AD-RD)
td(AD-WR)
tdZ(RD-AD)
ALE signal output delay time (in relation to BCLK)
40
ns
25
ns
–4
ns
ALE signal output delay time (in relation to Address)
(NOTE 3)
ns
ALE signal output hold time (in relation to Address)
(NOTE 4)
ns
RD signal output delay from the end of Address
0
ns
WR signal output delay from the end of Address
0
ALE signal output hold time (in relation to BCLK)
Address output floating start time
NOTES:
1. Calculated according to the BCLK frequency as follows:
0.5 ✕ 109 – 10 [ns]
f(BCLK)
2. Calculated according to the BCLK frequency as follows:
(n –0.5) ✕ 10
f(BCLK)
9
– 50 [ns]
n is “2” for 2-wait setting, “3” for 3-wait setting.
3. Calculated according to the BCLK frequency as follows:
0.5 ✕ 10 – 40 [ns]
f(BCLK)
9
4. Calculated according to the BCLK frequency as follows:
0.5 ✕ 109 – 15 [ns]
f(BCLK)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 79 of 88
ns
8
ns
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
VCC = 3.3 V
XIN input
tr
tr
tw(H)
tw(L)
tc
tc(TA)
tw(TAH)
TAiIN input
tw(TAL)
tc(UP)
tw(UPH)
TAiOUT input
tw(UPL)
TAiOUT input
(Up/down input)
During event counter mode
TAiIN input
(When count on falling edge
is selected)
th(TIN—UP) tsu(UP—TIN)
TAiIN input
(When count on rising edge
is selected)
Two-phase pulse input in event counter mode
tC(TA)
TAiIN input
tsu(TAIN—TAOUT)
tsu(TAIN—TAOUT)
tsu(TAOUT—TAIN)
TAiOUT input
tsu(TAOUT—TAIN)
tc(TB)
tw(TBH)
TBiIN input
tw(TBL)
tc(AD)
tw(ADL)
ADTRG input
tc(CK)
tw(CKH)
CLKi
tw(CKL)
th(C—Q)
TXDi
td(C—Q)
tsu(D—C)
RXDi
tw(INL)
INTi input
tw(INH)
Figure 5.22 Timing Diagram (1)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 80 of 88
th(C—D)
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Memory Expansion Mode and Microprocessor Mode
VCC = 3.3 V
(Effective for setting with wait)
BCLK
RD
(Separate bus)
WR, WRL, WRH
(Separate bus)
RD
(Multiplexed bus)
WR, WRL, WRH
(Multiplexed bus)
RDY input
tsu(RDY–BCLK)
th(BCLK–RDY)
(Common to setting with wait and setting without wait)
BCLK
tsu(HOLD–BCLK)
th(BCLK–HOLD)
HOLD input
HLDA output
td(BCLK–HLDA)
P0, P1, P2,
P3, P4,
P5_0 to P5_2 (1)
td(BCLK–HLDA)
Hi–Z
NOTE:
1. The above pins are set to high-impedance regardless of the input level of the BYTE pin,
the PM06 bit in the PM0 register, and the PM11 bit in the PM1 register.
Measuring conditions :
VCC = 3.3 V
Input timing voltage : Determined with VIL = 0.6 V, VIH = 2.7 V
Output timing voltage: Determined with VOL = 1.65 V, VOH = 1.65 V
Figure 5.23 Timing Diagram (2)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 81 of 88
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Memory Expansion Mode and Microprocessor Mode
(For setting with no wait)
Read timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
30ns.max
4ns.min
CSi
tcyc
td(BCLK-AD)
th(BCLK-AD)
30ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(BCLK-ALE)
-4ns.min
30ns.max
th(RD-AD)
0ns.min
ALE
td(BCLK-RD)
30ns.max
th(BCLK-RD)
0ns.min
RD
tac1(RD-DB)
(0.5 ✕ tcyc-60)ns.max
Hi-Z
DBi
tSU(DB-RD)
50ns.min
th(RD-DB)
0ns.min
Write timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
30ns.max
4ns.min
CSi
tcyc
td(BCLK-AD)
th(BCLK-AD)
30ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(BCLK-ALE)
30ns.max
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
-4ns.min
ALE
td(BCLK-WR)
30ns.max
th(BCLK-WR)
0ns.min
WR,WRL,
WRH
td(BCLK-DB)
th(BCLK-DB)
4ns.min
40ns.max
Hi-Z
DBi
td(DB-WR)
Measuring conditions :
VCC = 3.3 V
Input timing voltage : VIL = 0.6 V, VIH = 2.7 V
Output timing voltage : VOL = 1.65 V, VOH = 1.65 V
Figure 5.24 Timing Diagram (3)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
th(WR-DB)
(0.5 ✕ tcyc-40)ns.min (0.5 ✕ tcyc-10)ns.min
1
tcyc =
f(BCLK)
page 82 of 88
VCC = 3.3 V
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Memory Expansion Mode and Microprocessor Mode
(For 1-wait setting and external area access)
Read timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
30ns.max
4ns.min
CSi
tcyc
td(BCLK-AD)
th(BCLK-AD)
30ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(RD-AD)
th(BCLK-ALE)
0ns.min
-4ns.min
30ns.max
ALE
td(BCLK-RD)
th(BCLK-RD)
30ns.max
0ns.min
RD
tac2(RD-DB)
(1.5 ✕ tcyc-60)ns.max
DBi
Hi-Z
th(RD-DB)
tSU(DB-RD)
0ns.min
50ns.min
Write timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
30ns.max
4ns.min
CSi
tcyc
td(BCLK-AD)
th(BCLK-AD)
30ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(BCLK-ALE)
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
-4ns.min
30ns.max
ALE
td(BCLK-WR)
30ns.max
th(BCLK-WR)
0ns.min
WR,WRL,
WRH
td(BCLK-DB)
th(BCLK-DB)
4ns.min
40ns.max
Hi-Z
DBi
td(DB-WR)
(0.5 ✕ tcyc-40)ns.min
1
tcyc =
f(BCLK)
Measuring conditions :
VCC = 3.3 V
Input timing voltage : VIL = 0.6 V, VIH = 2.7 V
Output timing voltage : VOL = 1.65 V, VOH = 1.65 V
Figure 5.25 Timing Diagram (4)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 83 of 88
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
VCC = 3.3 V
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Memory Expansion Mode and Microprocessor Mode
(For 2-wait setting and external area access)
Read timing
tcyc
BCLK
th(BCLK-CS)
4ns.min
td(BCLK-CS)
30ns.max
CSi
th(BCLK-AD)
4ns.min
td(BCLK-AD)
30ns.max
ADi
BHE
td(BCLK-ALE)
30ns.max
th(RD-AD)
th(BCLK-ALE)
-4ns.min
0ns.min
ALE
th(BCLK-RD)
0ns.min
td(BCLK-RD)
30ns.max
RD
tac2(RD-DB)
(2.5 ✕ tcyc-60)ns.max
DBi
Hi-Z
tSU(DB-RD)
50ns.min
th(RD-DB)
0ns.min
Write timing
tcyc
BCLK
td(BCLK-CS)
30ns.max
th(BCLK-CS)
td(BCLK-AD)
30ns.max
th(BCLK-AD)
4ns.min
CSi
4ns.min
ADi
BHE
td(BCLK-ALE)
30ns.max
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
th(BCLK-ALE)
-4ns.min
ALE
td(BCLK-WR)
30ns.max
th(BCLK-WR)
0ns.min
WR, WRL
WRH
td(BCLK-DB)
40ns.max
DBi
Hi-Z
td(DB-WR)
(1.5 ✕ tcyc-40)ns.min
1
tcyc =
f(BCLK)
Measuring conditions :
VCC = 3.3 V
Input timing voltage : VIL = 0.6 V, VIH = 2.7 V
Output timing voltage : VOL = 1.65 V, VOH = 1.65 V
Figure 5.26 Timing Diagram (5)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
th(BCLK-DB)
4ns.min
page 84 of 88
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
VCC = 3.3 V
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Memory Expansion Mode and Microprocessor Mode
VCC = 3.3 V
(For 3-wait setting and external area access)
Read timing
tcyc
BCLK
th(BCLK-CS)
4ns.min
td(BCLK-CS)
30ns.max
CSi
th(BCLK-AD)
td(BCLK-AD)
30ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
th(RD-AD)
0ns.min
th(BCLK-ALE)
30ns.max
-4ns.min
ALE
th(BCLK-RD)
td(BCLK-RD)
30ns.max
0ns.min
RD
tac2(RD-DB)
(3.5 ✕ tcyc-60)ns.max
DBi
Hi-Z
tSU(DB-RD)
th(RD-DB)
50ns.min
0ns.min
Write timing
tcyc
BCLK
td(BCLK-CS)
30ns.max
th(BCLK-CS)
4ns.min
td(BCLK-AD)
th(BCLK-AD)
4ns.min
CSi
30ns.max
ADi
BHE
td(BCLK-ALE)
30ns.max
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
th(BCLK-ALE)
-4ns.min
ALE
td(BCLK-WR)
30ns.max
th(BCLK-WR)
0ns.min
WR, WRL
WRH
DBi
td(BCLK-DB)
th(BCLK-DB)
40ns.max
4ns.min
Hi-Z
td(DB-WR)
(2.5 ✕ tcyc-40)ns.min
1
tcyc =
f(BCLK)
Measuring conditions :
VCC = 3.3 V
Input timing voltage : VIL = 0.6 V, VIH = 2.7 V
Output timing voltage : VOL = 1.65 V, VOH = 1.65 V
Figure 5.27 Timing Diagram (6)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 85 of 88
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
VCC = 3.3 V
Memory Expansion Mode and Microprocessor Mode
(For 2-wait setting, external area access and multiplexed bus selection)
Read timing
BCLK
td(BCLK-CS)
th(RD-CS)
(0.5 ✕ tcyc-10)ns.min
tcyc
40ns.max
th(BCLK-CS)
4ns.min
CSi
td(AD-ALE)
(0.5 ✕ tcyc-40)ns.min
ADi
/DBi
Address
th(ALE-AD)
(0.5 ✕ tcyc-15)ns.min
8ns.max
Address
Data input
tdZ(RD-AD)
tac3(RD-DB)
(1.5 ✕ tcyc-60)ns.max
tSU(DB-RD)
th(RD-DB)
0ns.min
50ns.min
td(AD-RD)
0ns.min
td(BCLK-AD)
th(BCLK-AD)
4ns.min
40ns.max
ADi
BHE
td(BCLK-ALE)
th(BCLK-ALE)
40ns.max
th(RD-AD)
(0.5 ✕ tcyc-10)ns.min
-4ns.min
ALE
td(BCLK-RD)
th(BCLK-RD)
0ns.min
40ns.max
RD
Write timing
BCLK
td(BCLK-CS)
th(BCLK-CS)
th(WR-CS)
(0.5 ✕ tcyc-10)ns.min
tcyc
40ns.max
4ns.min
CSi
th(BCLK-DB)
td(BCLK-DB)
4ns.min
50ns.max
ADi
/DBi
Address
Data output
td(DB-WR)
td(AD-ALE)
(1.5 ✕ tcyc-50)ns.min
(0.5 ✕ tcyc-40)ns.min
Address
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
td(BCLK-AD)
th(BCLK-AD)
40ns.max
4ns.min
ADi
BHE
td(BCLK-ALE)
40ns.max
th(BCLK-ALE)
td(AD-WR)
-4ns.min
0ns.min
th(WR-AD)
(0.5 ✕ tcyc-10)ns.min
ALE
td(BCLK-WR)
40ns.max
WR,WRL,
WRH
tcyc =
1
f(BCLK)
Measuring conditions :
VCC = 3.3 V
Input timing voltage : VIL = 0.6 V, VIH = 2.7 V
Output timing voltage : VOL = 1.65 V, VOH = 1.65 V
Figure 5.28 Timing Diagram (7)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 86 of 88
th(BCLK-WR)
0ns.min
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
5. Electric Characteristics (Normal-ver.)
Memory Expansion Mode and Microprocessor Mode
VCC = 3.3 V
(For 3-wait setting, external area access and multiplexed bus selection)
Read timing
tcyc
BCLK
th(RD-CS)
(0.5 ✕ tcyc-10)ns.min
td(BCLK-CS)
th(BCLK-CS)
6ns.min
40ns.max
CSi
td(AD-ALE)
(0.5 ✕ tcyc-40)ns.min
ADi
/DBi
th(ALE-AD)
(0.5 ✕ tcyc-15)ns.min
Address
td(BCLK-AD)
td(AD-RD)
40ns.max
ADi
BHE
Data input
tdZ(RD-AD)
8ns.max
th(RD-DB)
tac3(RD-DB)
(2.5 ✕ tcyc-60)ns.max
0ns.min
tSU(DB-RD)
0ns.min
th(BCLK-AD)
50ns.min
4ns.min
(no multiplex)
td(BCLK-ALE)
40ns.max
th(RD-AD)
th(BCLK-ALE)
(0.5 ✕ tcyc-10)ns.min
-4ns.min
ALE
th(BCLK-RD)
td(BCLK-RD)
0ns.min
40ns.max
RD
Write timing
tcyc
BCLK
th(WR-CS)
(0.5 ✕ tcyc-10)ns.min
td(BCLK-CS)
40ns.max
th(BCLK-CS)
4ns.min
CSi
th(BCLK-DB)
td(BCLK-DB)
50ns.max
ADi
/DBi
4ns.min
Address
Data output
td(AD-ALE)
td(DB-WR)
(0.5 ✕ tcyc-40)ns.min
(2.5 ✕ tcyc-50)ns.min
th(WR-DB)
(0.5 ✕ tcyc-10)ns.min
td(BCLK-AD)
th(BCLK-AD)
40ns.max
4ns.min
ADi
BHE
(no multiplex)
td(BCLK-ALE)
40ns.max
th(BCLK-ALE)
th(WR-AD)
-4ns.min
td(AD-WR)
ALE
td(BCLK-WR)
40ns.max
WR, WRL
WRH
tcyc =
(0.5 ✕ tcyc-10)ns.min
0ns.min
1
f(BCLK)
Measuring conditions :
VCC = 3.3 V
Input timing voltage : VIL = 0.6 V, VIH = 2.7 V
Output timing voltage : VOL = 1.65 V, VOH = 1.65 V
Figure 5.29 Timing Diagram (8)
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 87 of 88
th(BCLK-WR)
0ns.min
Under development
This document is under development and its contents are subject to change.
M16C/6N Group (M16C/6N4)
Appendix 1. Package Dimensions
Appendix 1. Package Dimensions
JEITA Package Code
P-QFP100-14x20-0.65
RENESAS Code
PRQP0100JB-A
Previous Code
100P6S-A
MASS[Typ.]
1.6g
HD
*1
D
80
51
81
50
E
*2
HE
NOTE)
1. DIMENSIONS "*1" AND "*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION "*3" DOES NOT
INCLUDE TRIM OFFSET.
ZE
Reference
Symbol
100
31
30
Index mark
c
F
A2
ZD
A1
A
1
L
*3
e
y
JEITA Package Code
P-LQFP100-14x14-0.50
bp
Detail F
RENESAS Code
PLQP0100KB-A
Previous Code
100P6Q-A / FP-100U / FP-100UV
D
E
A2
HD
HE
A
A1
bp
c
e
y
ZD
ZE
L
Dimension in Millimeters
Min Nom Max
19.8 20.0 20.2
13.8 14.0 14.2
2.8
22.5 22.8 23.1
16.5 16.8 17.1
3.05
0.1 0.2
0
0.25 0.3 0.4
0.13 0.15 0.2
0°
10°
0.5 0.65 0.8
0.10
0.575
0.825
0.4 0.6 0.8
MASS[Typ.]
0.6g
HD
*1
D
51
75
NOTE)
1. DIMENSIONS "*1" AND "*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION "*3" DOES NOT
INCLUDE TRIM OFFSET.
50
76
bp
c1
Reference
Symbol
c
E
*2
HE
b1
D
E
A2
HD
HE
A
A1
bp
b1
c
c1
26
1
ZE
Terminal cross section
100
25
Index mark
ZD
y
e
*3
bp
A1
c
A2
A
F
L
x
L1
Detail F
Rev.2.40 Aug 25, 2006
REJ03B0003-0240
page 88 of 88
e
x
y
ZD
ZE
L
L1
Dimension in Millimeters
Min Nom Max
13.9 14.0 14.1
13.9 14.0 14.1
1.4
15.8 16.0 16.2
15.8 16.0 16.2
1.7
0.05 0.1 0.15
0.15 0.20 0.25
0.18
0.09 0.145 0.20
0.125
0°
8°
0.5
0.08
0.08
1.0
1.0
0.35 0.5 0.65
1.0
REVISION HISTORY
Rev.
Date
M16C/6N Group (M16C/6N4) Data Sheet
Description
Page
Summary
1.00 Jun. 30, 2003
–
First edition issued
2.00 Nov. 10, 2004
–
Revised edition issued
1
2
4
5
6
8
12
13
19
27
28
29
31
32
* Words standardizes (on-chip oscillator)
* 100P6Q-A (100-pin version) is added.
* Revised parts and revised contents are as follows (except for change of a layout
and an expressional change).
1. Overview 3rd line: "and LQFP" is added.
Table 1.1 Performance outline of M16C/6N Group (M16C/6N4)
• Operation Mode is added.
• Address Space is added.
• Power Consumption is revised.
• "LQFP" is added to Package.
Table 1.2 Product List is revised.
Figure 1.2 Type No., Memory Size, and Package:
• "GP: Package 100P6Q-A" is added to Package type.
Figure 1.3 Pin Configuration (Top View) (1): "ZP" is added.
Figure 1.4 Pin Configuration (Top View) (2) is added. (100P6Q-A)
Table 1.4 Pin Description (2): "ZP" is added to Timer A.
3. Memory
• 5th to 6th lines: The description about the flash memory version (block A) is added.
Figure 3.1 Memory Map
• Interenal ROM (data area) is added.
• NOTES 3, 4 are added and NOTE 5 is revised.
Table 4.1 SFR Information (1)
• The value of After Reset in PM1 register is revised.
• The value of After Reset in CM2 register is revised.
Table 4.7 SFR Information (7)
• The value of After Reset in FMR0 register is revised.
Table 4.15 SFR Information (15)
• The value of After Reset in U0C1 register is revised.
• The value of After Reset in U1C1 register is revised.
• NOTE 1 is added.
Table 4.16 SFR Information (16)
• The value of After Reset in DA0, DA1 registers are revised.
Table 5.1 Absolute Maximum Ratings
• "Flash Program Erase" in Operating Ambient Temperature is added.
Table 5.3 Recommended Operating Conditions (2)
• Parameters of Power Supply Ripple are added.
• NOTE 4 is revised.
Figure 5.1 Timing of Voltage Fluctuation is added.
Table 5.4 Electrical Characteristics (1): Hysteresis
• "CLK4" is revised to ____________
"CLK3", and "TA2OUT" is revised to "TA0OUT".
• Max. of Standard in RESET is revised from "2.2" to "2.5".
• XIN is added.
A-1
REVISION HISTORY
Rev.
Date
2.00 Nov. 10, 2004
M16C/6N Group (M16C/6N4) Data Sheet
Description
Page
Summary
34
Table 5.6 A/D Conversion Characteristics: "Tolerance Level Impedance" is added.
35
Table 5.8 Power Supply Circuit Timing Characteristics: "td(M-L)" is deleted.
36
Table 5.10 Memory Expansion Mode and Microprocessor Mode: "td(BCLK-HLDA)" is deleted.
Figure 5.2 Power Supply Circuit Timing Diagram is added.
38
Table 5.21 Serial I/O: Min. of standard in tsu(D-C) is revised from "30" to "70".
39
Table 5.23 Memory Expansion Mode and Microprocessor Mode (for setting with no wait)
• Max. of Standard in td(BCLK-ALE) is revised from "25" to "15".
• td(BCLK-HLDA) is added.
40
Table 5.24 Memory Expansion Mode and Microprocessor Mode (for 1- to 3-wait setting
and external area access)
• Max. of Standard in td(BCLK-ALE) is revised from "25" to "15".
• td(BCLK-HLDA) is added.
41
Table 5.25 Memory Expansion Mode and Microprocessor Mode (for 2- to 3-wait setting,
external area access and multiplexed bus selection)
• td(BCLK-HLDA) is added.
• Max. of Standard in td(BCLK-ALE) is revised from "25" to "15".
42
Figure 5.4 Timing Diagram (1): "XIN input" is added.
44, 45
Figures 5.6 and 5.7 Timing Diagram (3) (4): "DB" in Read timing is revised to "DBi".
46, 47
Figures 5.8 and 5.9 Timing Diagram (5) (6): "DB" in Write timing is revised to "DBi".
49
Figure 5.11 Timing Diagram (8)
• "ADi/DB" in Read/Write timing is revised to "ADi/DBi".
2.10 Jun. 24, 2005
50
Appendix 1. Package Dimensions: 100P6Q-A is added.
–
Revised edition issued
* The contents of product are revised. (Normal-ver. is added.)
* Revised parts and revised contents are as follows (except for expressional change).
2
Table 1.1 Performance outline of M16C/6N Group (M16C/6N4)
4
Table 1.2 Product List is revised. (Normal-ver. is added.)
• Performance outline of Normal-ver. is added.
Figure 1.2 Type No., Memory Size, and Package:
• "(no): Normal-ver." is added to Characteristics.
19
Figure 4.7 SFR Information (7): NOTE 1 is revised.
32
Table 5.4 Electrical Characteristics (1)
• Measuring Condition of VOL is revised from “LOL = –200µA” to “LOL = 200µA”.
33
Table 5.5 Electrical Characteristics (2): Mask ROM (5th item)
• “f(XCIN)” is changed to “(f(BCLK)).
2.40 Aug. 25, 2006
34
Table 5.6 A/D Conversion Characteristics: “Tolerance Level Impedance” is deleted.
–
Revised edition issued
* Electric Characteristics of Normal-ver. is added.
* Revised parts and revised contents are as follows (except for expressional change).
1
1.1 Applications: Comment of Normal-ver. is added.
4
Table 1.2 Product Information
• Status of development is revised and NOTES 1 and 2 are added.
A-2
REVISION HISTORY
Rev.
Date
2.40 Aug. 25, 2006
M16C/6N Group (M16C/6N4) Data Sheet
Description
Page
7, 8
Summary
Tables 1.3 and 1.4 List of Pin Names (1)(2) are added.
9
Table 1.5 Pin Functions (1)
22
Table 4.8 SFR Information (8)
• 3.0 to 5.5 V (Normal-ver.) is added to Description of Power supply input.
• The value of After Reset in IDB0 register is revised.
• The value of After Reset in IDB1 register is revised.
33
Table 5.3 Recommended Operating Conditions (2)
• Power supply ripple is deleted. (three items)
Figure 5.1 Voltage Fluctuation Timing is deleted.
34
52 to 87
Table 5.4 Electrical Characteristics (1): Hysteresis XIN is deleted.
5.2 Electrical Characteristics (Normal-ver.) is added.
A-3
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