-REVISIONS LTR DESCRIPTION A DATE (YR-MO-DA) APPROVED 04-09-15 Raymond Monnin Table I; For the Input-output isolation current test (II-O) and Channelchannel isolation current test (IISO) changed "RH ≤ 45 %" to "RH ≤ 65 %" in the conditions . Editorial changes throughout. -sld REV SHEET REV SHEET REV STATUS REV A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Gary Zahn STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 CHECKED BY Greg Cecil http://www.dscc.dla.mil/ APPROVED BY Raymond Monnin MICROCIRCUIT, HYBRID, LINEAR, POWER MOSFET, DUAL CHANNEL, OPTOCOUPLER DRAWING APPROVAL DATE 03-07-23 REVISION LEVEL A SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 1 OF 5962-03247 9 5962-E419-04 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 Federal stock class designator \ RHA designator (see 1.2.1) 03247 01 Device type (see 1.2.2) / H Device class designator (see 1.2.3) X Case outline (see 1.2.4) X Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 Circuit function 53252 Dual channel, power MOSFET, optocoupler, 90 V, 0.8 A 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Y Descriptive designator Terminals Package style See figure 1 See figure 1 8 8 Dual-in-line Dual-in-line 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03247 A REVISION LEVEL A SHEET 2 1.3 Absolute maximum ratings. 1/ Average input current (IF) ...................................................................................... Peak repetitive input current (IFPK) ........................................................................ Peak surge input current (IFPK surge) ................................................................... Continuous output current per relay (IO) ............................................................... Single shot output current per relay (IOPK surge, pulse width <10 ms)................. Output voltage (VO) ............................................................................................... Output power dissipation (PO) .............................................................................. Junction temperature (TJ) .................................................................................... Thermal resistance junction-to-case (θJC) ........................................................... Lead temperature (soldering, 10 seconds) .......................................................... Storage temperature range................................................................................... 20 mA 40 mA 2/ 100 mA 3/ 0.8 A 4/ 3.0 A 90 V dc 1.54 W 5/ +150°C 15°C/W +260°C 6/ -65°C to +150°C 1.4 Recommended operating conditions. Input current ON (IFON) .......................................................................................... Input voltage OFF (VFOFF) ..................................................................................... Ambient operating temperature range (TA)........................................................... 10 mA minimum to 20 mA maximum 0 to 0.6 V dc maximum -55°C to +125°C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ 2/ 3/ 4/ 5/ 6/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Pulse width < 100 ms, duty cycle < 50 %. Pulse width < 0.2 ms, duty cycle < 0.1 %. Maximum average current rating where the case temperature (TC) is maintained below 120°C. Output power dissipation (PO) is obtained when the part is handling the maximum output current (IO). Care should be taken not to exceed the maximum output dissipation, maximum case temperature, and maximum junction temperature when repetitively switching loads. Lead temperature soldering occurs 1.6 mm below the seating plane. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03247 A REVISION LEVEL A SHEET 3 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1015 of MIL-STD-883. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03247 A REVISION LEVEL A SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Group A subgroups Conditions -55°C ≤ TA ≤ +125°C unless otherwise specified Device type Unit Limits Min Max Output withstand voltage VO(OFF) VFOFF = 0.6 V, IO = 10 µA 1,2,3 01 Output on resistance 1/ R(ON) IFON = 10 mA, IO = 800 mA, pulse duration ≤ 30 ms, duty cycle < 10% 1,2,3 01 Output leakage current IO(OFF) VFOFF = 0.6 V, VO = 90 V 1,2,3 01 Input forward voltage VFOFF IFON = 10 mA 1,2,3 01 1.0 Input reverse breakdown voltage Vr Ir = 10 µA 1,2,3 01 5.0 Input-output isolation current 2/ II-O VI-O = 1000 V dc, t = 5 s, RH ≤ 65 %, TA = +25°C 1 01 1.0 µA Channel-channel isolation current 2/ IISO VI-O = 1000 V dc, t = 5 s, RH ≤ 65 %, TA = +25°C 1 01 1.0 µA Turn-on time 1/ tON IFON = 10 mA, IO = 0.8 A, pulse duration ≤ 30 ms, duty cycle < 10% 9,10,11 01 6.0 ms Turn-off time 1/ tOFF IFON = 10 mA, IO = 0.8 A, pulse duration ≤ 30 ms, duty cycle < 10% 9,10,11 01 2.0 ms 1/ 2/ 90 V Ω 1.2 µA 10 1.7 V V During the pulse RON measurement (IO duration < 30 ms), TA and TC are equal. This is a momentary withstand test, not a continuous operating condition. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03247 A REVISION LEVEL A SHEET 5 Case outline X. Millimeters Min Max 6.99 1.40 1.65 0.41 0.53 0.18 0.33 9.40 9.91 2.29 2.79 9.65 9.91 8.13 1.07 1.32 0.89 1.27 Symbol A A1 b c D e E E1 L S Inches Max .275 .055 .065 .016 .021 .007 .013 .370 .390 .090 .110 .380 .390 .320 .042 .052 .035 .050 Min Case outline Y. Millimeters Min Max 6.60 0.76 1.27 0.41 0.53 0.18 0.33 9.40 9.91 2.29 2.79 8.13 7.37 7.87 12.70 0.51 0.89 1.27 Symbol A A1 b c D e E eA L Q S Inches Max .260 .030 .050 .016 .021 .007 .013 .370 .390 .090 .110 .320 .290 .310 .500 .020 .035 .050 Min NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is indicated by the ESD triangle(s) marked on top of the package. FIGURE 1. Case outline(s). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03247 A REVISION LEVEL A SHEET 6 Device type Case outlines Terminal number 01 X and Y Terminal symbol 1 2 3 4 5 6 7 8 + IN 1 - IN 1 - OUT 2 + OUT 2 + IN 2 - IN 2 - OUT 1 + OUT 1 FIGURE 2. Terminal connections. Input Output OFF OFF ON ON FIGURE 3. Truth table(s). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03247 A REVISION LEVEL A SHEET 7 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1 Final electrical parameters 1*,2,3,9 Group A test requirements 1,2,3,9,10,11 Group C end-point electrical parameters 1,2,3 End-point electrical parameters for radiation hardness assurance (RHA) devices Not applicable * PDA applies to subgroup 1. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 shall be omitted. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03247 A REVISION LEVEL A SHEET 8 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF-38534. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-1081. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-03247 A REVISION LEVEL A SHEET 9 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 04-09-15 Approved sources of supply for SMD 5962-03247 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. 1/ 2/ Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-0324701HXA 31757 53252-117 5962-0324701HXC 31757 53252-118 5962-0324701HYA 31757 53252-107 5962-0324701HYC 31757 53252-108 The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 31757 Vendor name and address Micropac Industries, Incorporated 905 E. Walnut Street Garland, TX 75040 Point of contact: Microcircuit Division The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.