ETC 5962L0251002HXC

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
REV
SHEET
REV
SHEET
REV STATUS
REV
OF SHEETS
SHEET
PMIC N/A
PREPARED BY
Steve L. Duncan
1
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
Michael C. Jones
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
APPROVED BY
Raymond Monnin
AMSC N/A
2
3
4
5
6
7
8
9
10
11
12
13
DEFENSE SUPPLY CENTER COLUMBUS
POST OFFICE BOX 3990
COLUMBUS, OHIO 43216-5000
MICROCIRCUIT, HYBRID, LINEAR, 3.3 VOLT,
SINGLE CHANNEL, DC-DC CONVERTER
DRAWING APPROVAL DATE
01-11-30
REVISION LEVEL
SIZE
A
CAGE CODE
5962-02510
67268
SHEET
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1 OF
13
5962-E090-02
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962



Federal
stock class
designator
\



RHA
designator
(see 1.2.1)
02510
01



Device
type
(see 1.2.2)
/
H



Device
class
designator
(see 1.2.3)
X



Case
outline
(see 1.2.4)
X



Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
Circuit function
MHF+283R3S/883, MHF+283R3SF/883
SMHF283R3S, SMHF283R3SF
DC-DC converter, 8 W, 3.3 V output
DC-DC converter, 8 W, 3.3 V output
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
Device performance documentation
K
Highest reliability class available. This level is intended for use in space
applications.
H
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
G
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-02510
A
REVISION LEVEL
SHEET
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
See figure 1
See figure 1
8
8
X
Z
Package style
Dual-in-line
Flange mount
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Input voltage range....................................................................
Power dissipation (PD):
Device types 01 and 02 (non-RHA) .......................................
Device type 02 (RHA levels L and R).....................................
Output power .............................................................................
Lead soldering temperature (10 seconds).................................
Storage temperature range .......................................................
-0.5 V dc to +50 V dc
8W
9W
8.23 W
+300°C
-65°C to +150°C
1.4 Recommended operating conditions.
Input voltage range....................................................................
Case operating temperature range (TC) ....................................
+16 V dc to +40 V dc
-55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Microcircuit Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
1/
Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-02510
A
REVISION LEVEL
SHEET
3
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.
Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).
Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not
perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device
class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked
with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked in MIL-HDBK-103 and
QML-38534.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer
and be made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-02510
A
REVISION LEVEL
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Output voltage
Symbol
VOUT
Conditions 1/
-55°C ≤ TC ≤ +125°C
VIN = 28 V dc ±0.5 V
no external sync, CL = 0
unless otherwise specified
Group A
subgroups
Device
types
Min
IOUT = 2.4 A dc
1
01,02
2,3
L, R
Output current
IOUT
VRIP
VRLINE
Input current
VRLOAD
IIN
3.20
3.40
3.10
3.50
2400
1,2,3
02
2400
1
01
80
02
160
2,3
01,02
240
1,2,3
02
350
1,2,3
01,02
100
1,2,3
02
200
1,2,3
01,02
50
L, R
1,2,3
02
100
IOUT = 0 A,
Inhibit (pin 1) = 0 V dc
1,2,3
01,02
12
L, R
1,2,3
02
15
1, 2, 3
01
40
02
65
1,2,3
02
100
1
01,02
80
2,3
01,02
120
1,2,3
02
150
IOUT = 2.4 A
BW = 10 kHz to 2 MHz
VIN =16 V dc to 40 V dc
IOUT = 2.4 A
IOUT = 0 to 2.4 A
L, R
IRIP
3.33
01, 02
IOUT = 0 A,
Inhibit (pin 1) = open
IIN ripple current
3.27
1,2,3
VIN = 16 V dc to 40 V dc
L, R
VOUT load regulation
Max
02
L, R
VOUT line regulation
Unit
1,2,3
L, R
VOUT ripple voltage
Limits
IOUT = 2.4 A,
BW = 10 kHz to 10 MHz
L, R
V dc
mA
mVp-p
mV
mV
mA
mAp-p
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-02510
A
REVISION LEVEL
SHEET
5
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
Group A
subgroups
-55°C ≤ TC ≤ +125°C
VIN = 28 V dc ±0.5 V
no external sync, CL = 0
unless otherwise specified
Efficiency
Eff
Min
IOUT = 2.4 A
ISO
Short circuit
power dissipation,
PD
Switching frequency
FS
2/
FSYNC
70
2,3
01,02
67
1,2,3
02
62
1
01,02
100
1
02
100
PD = PIN - total POUT
1,2,3
01,02
8
L, R
1,2,3
02
9
4
01,02
500
600
5,6
01,02
480
620
4,5,6
02
400
700
4,5,6
01,02
500
600
4,5,6
02
500
600
4,5,6
01,02
-400
+400
4,5,6
02
-1200
+1200
4,5,6
01,02
300
4,5,6
02
1200
4,5,6
01,02
-800
+800
4,5,6
02
-1500
+1500
Input to output or any pin
to case (except pin 6) at
500V dc,
TC = +25°C
L, R
IOUT = 2.4 A
IOUT = 2.4 A, TTL level to
pin 5
L, R
VOUT step load transient 3/
VTLOAD
50% load to/from 100%
load
L, R
VOUT step load transient
recovery 3/ 4/ 5/
TTLOAD
50% load to/from 100%
load
L, R
VOUT step line transient
4/ 6/
VTLINE
Max
01,02
L, R
External sync range
Unit
1
L, R
Isolation
Limits
Device
types
Input step 16 V dc to/from
40 V dc, IOUT = 2.4 A
L, R
%
MΩ
W
kHz
kHz
mV pk
µs
mV pk
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-02510
A
REVISION LEVEL
SHEET
6
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/
Group A
subgroups
-55°C ≤ TC ≤ +125°C
VIN = 28 V dc ±0.5 V
no external sync, CL = 0
unless otherwise specified
VOUT step line transient
recovery 4/ 5/
TTLINE
Min
Input step 16 V dc to/from
40 V dc, IOUT = 2.4 A
L, R
Start up overshoot 4/
VtonOS
IOUT = 2.4 A,
VIN = 0 to 28 V dc
L, R
Start up delay 7/
TonD
IOUT = 2.4 A,
VIN = 0 to 28 V dc
L, R
Load fault recovery 4/
TrLF
IOUT = 2.4 A
L, R
Capacitive load 4/ 8/
CL
Limits
Device
types
No effect on dc
performance, TC = +25°C
L, R
Unit
Max
4,5,6
01,02
1.2
4,5,6
02
2.4
4,5,6
01,02
300
4,5,6
02
1500
4,5,6
01,02
25
4,5,6
02
100
4,5,6
01,02
30
4,5,6
02
100
4
01,02
300
4
02
300
ms
mV pk
ms
ms
µF
1/ Post irradiation testing shall be in accordance with 4.3.5 herein.
2/ A TTL level waveform (VIH = 4.5 V minimum, VIL = 0.8 V maximum) with a 50% ±10% duty cycle applied
to the sync input pin (pin 5) within the sync range frequency shall cause the converter’s switching frequency to become
synchronous with the frequency applied to the sync input pin (pin 5).
3/ Load step transition time greater than 10 µs.
4/ Parameter shall be tested as part of device characterization and after design and process changes. Thereafter,
parameters shall be guaranteed to the limits specified in table I.
5/ Recovery time is measured from the initiation of the transient until VOUT has returned to within ±1 percent of VOUT
final value.
6/ Input step transition time greater than 10 µs.
7/ Start up delay time measurement is either for a step application of power at the input or the removal of a ground signal from
the inhibit pin (pin 1) while power is applied to the input.
8/ Capacitive load may be any value from 0 to the maximum limit without compromising dc performance.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-02510
A
REVISION LEVEL
SHEET
7
Case outline X.
Symbol
A
φb
D
e
e1
e2
e3
e4
E
E1
L
Millimeters
Min
Max
8.38
0.64
0.89
36.70
28.32
5.08
5.33
12.08
12.95
17.78
18.03
22.86
23.11
27.94
28.19
28.32
28.57
20.19
20.44
6.09
6.60
Inches
Min
Max
.330
.025
.035
1.445
1.455
.200
.210
.500
.510
.700
.710
.900
.910
1.100
1.110
1.115
1.125
.795
.805
.240
.260
NOTES:
1. The case outline X was originally designed using the inch-pound units of measurement, in the event of conflict
between the metric and inch-pound units, the inch-pound units shall take precedence.
2. Pin numbers are for reference only.
3. Device weight: 30 grams.
FIGURE 1. Case outline(s).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
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A
REVISION LEVEL
SHEET
8
Case outline Z.
Symbol
A
A1
φb
D
D1
D2
e
e1
e2
e3
e4
E
E1
L
φp
R
Millimeters
Min
Max
8.38
0.94
1.45
0.64
0.89
50.80
43.82
44.07
36.83
8.64
8.89
16.26
16.51
21.37
21.59
26.41
26.67
31.50
31.75
28.70
20.07
20.57
6.09
6.60
3.20
3.30
3.18
3.43
Inches
Min
Max
.330
.037
.057
.025
.035
2.000
1.725
1.735
1.450
.340
.350
.640
.650
.840
.850
1.040
1.050
1.240
1.250
1.130
.790
.810
.240
.260
.126
.130
.125
.135
NOTES:
1. The case outline Z was originally designed using the inch-pound units of measurement, in the event of conflict
between the metric and inch-pound units, the inch-pound units shall take precedence.
2. Pin numbers are for reference only.
3. Device weight: 30 grams maximum.
FIGURE 1. Case outline(s) - continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
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DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
SHEET
9
Device types
01 and 02
Case outlines
X and Z
Terminal number
Terminal symbol
1
Inhibit
2
No connection
3
Output return
4
Output
5
Sync input
6
Case ground
7
Input return
8
Input
FIGURE 2. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
SHEET
10
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the
form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
b.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1015 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1015 of MIL-STD-883.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A
test table)
Interim electrical parameters
Final electrical parameters
1*, 2, 3, 4, 5, 6
Group A test requirements
1, 2, 3, 4, 5, 6
1
Group C end-point electrical
parameters
1, 2, 3, 4, 5, 6
End-point electrical parameters
for radiation hardness
assurance (RHA) devices
* PDA applies to subgroup 1.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
Tests shall be as specified in table II herein.
b.
Subgroups 7, 8, 9, 10, and 11 shall be omitted.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
STANDARD
MICROCIRCUIT DRAWING
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COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-02510
A
REVISION LEVEL
SHEET
11
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
End-point electrical parameters shall be as specified in table II herein.
b.
Steady-state life test, method 1005 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1005 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1005 of MIL-STD-883.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5. Radiation hardness assurance (RHA). RHA qualification is required only for those devices with the RHA designator as
specified herein.
RHA level L
RHA level R
Units
Total ionizing dose
tolerance level
50
100
kRad (Si)
Single event upset
survival level (LET)
No
guarantee
40
MeV
a.
Radiation dose rate is in accordance with condition C of method 1019 of MIL-STD-883. Unless otherwise specified,
components are tested at a rate of 9 rad(Si)/s, in accordance with method 1019 of MIL-STD-750 or MIL-STD-883, as
applicable.
b.
The manufacturer shall perform a worst-case and radiation susceptibility analysis on the device. This analysis shall
show that the minimum performance requirements of each component has adequate design margin under worst-case
operating conditions (extremes of line voltage, temperatures, load, frequency, radiation environment, etc.). This
analysis guarantees the post-irradiation parameter limits specified in table I.
c.
RHA testing shall be performed at the component level for initial device qualification, and after design changes that
may affect the RHA performance of the device. As an alternative to testing, components may be procured to
manufacturer radiation guarantees that meet the minimum performance requirements. Component radiation
performance guarantees shall be established in compliance with MIL-PRF-19500, Group D or MIL-PRF-38535, Group
E, as applicable. For components with less than adequate performance margin, component lot radiation acceptance
screening shall be performed.
d.
The manufacturer shall establish procedures controlling component radiation testing, and shall establish radiation test
plans used to implement component lot qualification during procurement. Test plans and test reports shall be filed and
controlled in accordance with the manufacturer's configuration management system.
e.
The device manufacturer shall designate a RHA program manager to oversee component lot qualification, and to
monitor design changes for continued compliance to RHA requirements.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-02510
A
REVISION LEVEL
SHEET
12
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished in accordance with MIL-PRF-38534.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application
requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for
coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)
should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Post Office Box 3990, Columbus, Ohio 432165000, or telephone (614) 692-0512.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-02510
A
REVISION LEVEL
SHEET
13
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 01-11-30
Approved sources of supply for SMD 5962-02510 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next
dated revisions of MIL-HDBK-103 and QML-38534.
1/
2/
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-0251001HXA
5962-0251001HXC
5962-0251001HZA
5962-0251001HZC
50821
50821
50821
50821
MHF+283R3S/883
MHF+283R3S/883
MHF+283R3SF/883
MHF+283R3SF/883
5962-0251002HXA
5962-0251002HXC
5962-0251002HZA
5962-0251002HZC
50821
50821
50821
50821
SMHF283R3S/HO
SMHF283R3S/HO
SMHF283R3SF/HO
SMHF283R3SF/HO
5962L0251002HXA
5962L0251002HXC
5962L0251002HZA
5962L0251002HZC
50821
50821
50821
50821
SMHF283R3S/HL
SMHF283R3S/HL
SMHF283R3SF/HL
SMHF283R3SF/HL
5962R0251002HXA
5962R0251002HXC
5962R0251002HZA
5962R0251002HZC
50821
50821
50821
50821
SMHF283R3S/HR
SMHF283R3S/HR
SMHF283R3SF/HR
SMHF283R3SF/HR
5962L0251002KXA
5962L0251002KXC
5962L0251002KZA
5962L0251002KZC
50821
50821
50821
50821
SMHF283R3S/KL
SMHF283R3S/KL
SMHF283R3SF/KL
SMHF283R3SF/KL
5962R0251002KXA
5962R0251002KXC
5962R0251002KZA
5962R0251002KZC
50821
50821
50821
50821
SMHF283R3S/KR
SMHF283R3S/KR
SMHF283R3SF/KR
SMHF283R3SF/KR
The lead finish shown for each PIN representing a hermetic package is the most readily available from the
manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its
availability.
Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the
performance requirements of this drawing.
Vendor CAGE
number
50821
Vendor name
and address
Interpoint Corporation
10301 Willows Road
Redmond, WA 98073-9705
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.