Plastic Packages for Integrated Circuits 0.20 M C A B Power Small Outline Plastic Package (PSOP) SEATING PLANE E2 2 PLACES PIN 1 MARKER N 3 2 1.10 MAX. X 45o b (DATUM PLANE A) D1 -C- D e -A- 0.25 M C B A 1 M24.433 24 LEAD POWER SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL MAX MIN A 0.122 0.142 3.10 3.60 - A1 0.004 0.012 0.10 0.30 - A2 0.118 0.130 3.00 3.30 - A3 0.000 0.004 0.00 0.10 - b 0.016 0.021 0.40 0.53 6, 7 D2 2 PLACES E1 -B- 0.016 0.020 0.40 0.50 6, 7 0.009 0.013 0.23 0.32 7 c1 0.009 0.011 0.23 0.29 7 D 0.622 0.630 15.80 16.00 3 D1 0.496 0.512 12.60 13.00 - 0.547 -H- E1 0.429 A E2 SEATING PLANE SEE DETAIL "A" 3.10 REF. 0.15 REF. A3 B L HEAT SLUG DETAIL "A" B L1 GAUGE PLANE 0-8o - 13.90 14.50 - 0.437 10.90 11.10 4 2.90 - 0.244 0.031 1.10 0.571 5.80 0.039 BSC L 0.10 C - 0.114 0.228 e A1 0.043 - E3 A2 NOTES c E E MAX b1 D2 E3 MILLIMETERS MIN 0.043 6.20 - 1.0 BSC 0.80 - 1.10 5 L1 0.014 BSC 0.35 BSC - N 24 24 - Rev. 0 4/97 NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M-1982. 2. "C" is a reference datum. Seating plane is defined by lead tips only. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 per side. D measured at -H-. 4. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 per side. E1 measured at -H-. 5. Dimension "L" is the length of terminal for soldering to a substrate. 6. The lead width dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the lead width dimension at maximum material condition. 7. Section "B-B" to be determined at 0.10mm to 0.25mm from the lead tip. 8. Controlling dimension: MILLIMETER. 9. Dimensions conform with JEDEC Outline MO-166AC Issue C. 17.15 1.60 REF. 4.09 N 13.92 1.52 b1 c 4.22 7.26 c1 b 2.87 0.71 4.09 2.21 SECTION "B-B" 1 49 e LAND PATTERN