Plastic Packages for Integrated Circuits B S Power Small Outline Plastic Package (PSOP) E2 2 PLACES -C- PIN 1 MARKER A S N 3 2 1.10 MAX. X 45o (DATUM PLANE A) b D1 D e -A- 1 D2 2 PLACES 0.25 M C B S 0.25 M C A S SEATING PLANE E3 E1 -B- M20.433 20 LEAD POWER SMALL OUTLINE PLASTIC PACKAGE INCHES MIN MAX MIN MAX NOTES A 0.122 0.142 3.10 3.60 - A1 0.004 0.012 0.10 0.30 - A2 0.118 0.130 3.00 3.30 - A3 0.000 0.004 0.00 0.10 - b 0.016 0.021 0.40 0.53 6, 7 b1 0.016 0.020 0.40 0.50 6, 7 c 0.009 0.013 0.23 0.32 7 c1 0.009 0.011 0.23 0.29 7 D 0.622 0.630 15.80 16.00 3 D1 0.496 0.512 12.60 13.00 - D2 - 0.043 1.10 - E 0.547 0.571 13.90 14.50 - E1 0.429 0.437 10.90 11.10 4 - E2 - 0.114 - 2.90 E3 0.228 0.244 5.80 6.20 A e 0.050 BSC L A2 A1 SEATING PLANE SEE DETAIL "A" 3.10 REF. L1 0.15 REF. B - -H- E 0.10 C MILLIMETERS SYMBOL GAUGE PLANE 0.031 0.043 - 1.27 BSC 0.80 - 1.10 5 L1 0.014 BSC 0.35 BSC - N 20 20 - Rev. 0 3/96 NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M-1982. 2. "C" is a reference datum. Seating plane is defined by lead tips only. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 per side. D measured at -H-. 4. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 per side. E1 measured at -H-. 5. Dimension "L" is the length of terminal for soldering to a substrate. 6. The lead width dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the lead width dimension at maximum material condition. 7. Section "B-B" to be determined at 0.10mm to 0.25mm from the lead tip. 8. Controlling dimension: MILLIMETER. 9. Dimensions conform with JEDEC Outline MO-166AA Issue B. 17.15 A3 L HEAT SLUG B 0-8o 4.09 N DETAIL "A" 13.92 1.60 REF. 1.52 4.22 7.26 b1 c c1 2.87 0.71 4.09 b 2.21 1 SECTION "B-B" 42 e LAND PATTERN