m20.433: 20 Lead Power Small Outline Plastic Package

Plastic Packages for Integrated Circuits
B S
Power Small Outline Plastic Package (PSOP)
E2
2 PLACES
-C-
PIN 1
MARKER
A S
N
3
2
1.10 MAX. X 45o
(DATUM
PLANE A)
b
D1
D
e
-A-
1
D2
2 PLACES
0.25 M C B S
0.25 M C A S
SEATING
PLANE
E3
E1
-B-
M20.433
20 LEAD POWER SMALL OUTLINE PLASTIC
PACKAGE
INCHES
MIN
MAX
MIN
MAX
NOTES
A
0.122
0.142
3.10
3.60
-
A1
0.004
0.012
0.10
0.30
-
A2
0.118
0.130
3.00
3.30
-
A3
0.000
0.004
0.00
0.10
-
b
0.016
0.021
0.40
0.53
6, 7
b1
0.016
0.020
0.40
0.50
6, 7
c
0.009
0.013
0.23
0.32
7
c1
0.009
0.011
0.23
0.29
7
D
0.622
0.630
15.80
16.00
3
D1
0.496
0.512
12.60
13.00
-
D2
-
0.043
1.10
-
E
0.547
0.571
13.90
14.50
-
E1
0.429
0.437
10.90
11.10
4
-
E2
-
0.114
-
2.90
E3
0.228
0.244
5.80
6.20
A
e
0.050 BSC
L
A2
A1
SEATING
PLANE
SEE DETAIL "A"
3.10 REF.
L1
0.15
REF.
B
-
-H-
E
0.10 C
MILLIMETERS
SYMBOL
GAUGE
PLANE
0.031
0.043
-
1.27 BSC
0.80
-
1.10
5
L1
0.014 BSC
0.35 BSC
-
N
20
20
-
Rev. 0 3/96
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1982.
2. "C" is a reference datum. Seating plane is defined by
lead tips only.
3. Dimension D does not include mold flash, protrusions
or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15 per side. D measured at -H-.
4. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed
0.15 per side. E1 measured at -H-.
5. Dimension "L" is the length of terminal for soldering to
a substrate.
6. The lead width dimension does not include dambar
protrusion. Allowable dambar protrusion shall be
0.08mm total in excess of the lead width dimension at
maximum material condition.
7. Section "B-B" to be determined at 0.10mm to 0.25mm
from the lead tip.
8. Controlling dimension: MILLIMETER.
9. Dimensions conform with JEDEC Outline MO-166AA
Issue B.
17.15
A3
L
HEAT
SLUG
B
0-8o
4.09
N
DETAIL "A"
13.92
1.60 REF.
1.52
4.22 7.26
b1
c
c1
2.87
0.71
4.09
b
2.21
1
SECTION "B-B"
42
e
LAND PATTERN