DATASHEET ±16.5kV ESD Protected, +125°C, 3.0V to 5.5V, SOT-23/TDFN Packaged, Low Power, RS-485/RS-422 Transmitters ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Features • High ESD protection on RS-485 outputs . . . . ±16.5kV HBM - IEC61000-4-2 contact test method . . . . . . . . . . . . . . . ±7kV - Class 3 ESD level on all other pins. . . . . . . . . . . .>8kV HBM The Intersil ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E are ±16.5kV HBM ESD Protected (7kV IEC61000 contact), 3.0V to 5.5V powered, single transmitters for balanced communication using the RS-485 and RS-422 standards. These drivers have very low bus currents (±40mA), so they present less than a “1/8 unit load” to the RS-485 bus. This allows more than 256 transmitters on the network without violating the RS-485 specification’s 32 unit load maximum, and without using repeaters. • Specified for +125°C operation (VCC ≤ 3.6V only) • Logic supply pin (VL) eases operation in mixed supply systems (ISL3296E through ISL3298E only) • Hot plug - Tx outputs remain three-state during power-up • Low Tx leakage allows >256 devices on the bus • High data rates. . . . . . . . . . . . . . . . . . . . . . . . . . up to 20Mbps Hot Plug circuitry ensures that the Tx outputs remain in a high impedance state while the power supply stabilizes. • Low quiescent supply current. . . . . . . . . . . . . . . 150µA (max) - Very low shutdown supply current . . . . . . . . . . . 1µA (max) The ISL3293E, ISL3294E, ISL3296E, ISL3297E utilize slew rate limited drivers which reduce EMI, and minimize reflections from improperly terminated transmission lines, or from unterminated stubs in multidrop and multipoint applications. Drivers on the ISL3295E and ISL3298E are not limited, so they can achieve the 20Mbps data rate. All versions are offered in industrial and extended industrial (-40°C to +125°C) temperature ranges. • -7V to +12V common-mode output voltage range (VCC ≤ 3.6V only) • Current limiting and thermal shutdown for driver overload protection (VCC ≤ 3.6V only) • Tri-statable Tx outputs • 5V tolerant logic inputs when VCC ≤5V A 26% smaller footprint is available with the ISL3296E, ISL3297E, ISL3298E’s TDFN package. These devices also feature a logic supply pin (VL) that sets the switching points of the DE and DI inputs to be compatible with a lower supply voltage in mixed voltage systems. • Pb-free (RoHS compliant) Applications • Clock distribution For companion single RS-485 receivers in micro packages, please see the ISL3280E, ISL3281E, ISL3282E, ISL3283E, ISL3284E datasheet. • High node count systems • Space constrained systems • Security camera networks • Building environmental control/lighting systems • Industrial/process control networks TABLE 1. SUMMARY OF FEATURES TX MAXIMUM DATA RATE SLEW RATE HOT VL ENABLE? QUIESCENT LOW POWER ICC (µA) SHUTDOWN? FUNCTION (Mbps) LIMITED? PLUG? PIN? (Note 11) PART NUMBER PIN COUNT ISL3293E (No longer available or supported, recommended replacement: ISL32613E) 1 Tx 0.25 YES YES NO YES 150 YES 6 Ld SOT ISL3294E (No longer available or supported, recommended replacement: ISL32614E) 1 Tx 0.5 YES YES NO YES 150 YES 6 Ld SOT ISL3295E 1 Tx 20 NO YES NO YES 150 YES 6 Ld SOT ISL3296E (No longer available or supported) 1 Tx 0.25 YES YES YES YES 150 YES 8 Ld TDFN ISL3297E (No longer available or supported) 1 Tx 0.5 YES YES YES YES 150 YES 8 Ld TDFN ISL3298E 1 Tx 20 NO YES YES YES 150 YES 8 Ld TDFN September 25, 2015 FN6544.3 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2007, 2014, 2015. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Pin Configurations ISL3296E, ISL3297E, ISL3298E (8 LD TDFN) TOP VIEW ISL3293E, ISL3294E, ISL3295E (6 LD SOT-23) TOP VIEW DI 1 VCC D 2 DE 3 6 Y 5 GND 4 Z 8 VCC 7 Z 3 6 Y 4 5 GND VL 1 DE 2 DI GND D NOTE: BOTH GND PINS MUST BE CONNECTED Truth Tables Pin Descriptions TRANSMITTING INPUTS PIN NAME OUTPUTS DE (Note 11) DI Z Y 1 1 0 1 1 0 1 0 0 X High-Z * High-Z * NOTE: *Shutdown Mode Submit Document Feedback DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the driver enable function isn’t needed, connect DE to VCC (or VL) through a 1kΩ to 3kΩ resistor. DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND 2 FUNCTION Ground connection. This is also the potential of the TDFN thermal pad. Y ±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected RS-485/422 level, noninverting transmitter output. Z ±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected RS-485/422 level, inverting transmitter output. VCC System power supply input (3.0V to 5.5V). On devices with a VL pin powered from a separate supply, power-up VCC first. VL Logic-level supply which sets the VIL/VIH levels for the DI and DE pins (ISL3296E, ISL3297E, ISL3298E only). If VL and VCC are different supplies, power-up this supply after VCC, and keep VL ≤ VCC. FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Ordering Information PART MARKING (Note 4) PART NUMBER (Notes 1, 2, 3) TEMP. RANGE (°C) PACKAGE (RoHS Compliant) PKG. DWG. # ISL3293EFHZ-T 293F (No longer available or supported, recommended replacement: ISL32613E) -40 to +125 6 Ld SOT-23 P6.064 ISL3293EIHZ-T 293I (No longer available or supported, recommended replacement: ISL32613E) -40 to +85 6 Ld SOT-23 P6.064 ISL3294EFHZ-T 294F (No longer available or supported, recommended replacement: ISL32614E) -40 to +125 6 Ld SOT-23 P6.064 ISL3294EIHZ-T 294I (No longer available or supported, recommended replacement: ISL32614E) -40 to +85 6 Ld SOT-23 P6.064 ISL3295EFHZ-T 295F -40 to +125 6 Ld SOT-23 P6.064 ISL3295EIHZ-T 295I -40 to +85 6 Ld SOT-23 P6.064 ISL3296EFRTZ-T (No longer available or supported) 96F -40 to +125 8 Ld TDFN L8.2x3A ISL3296EIRTZ-T (No longer available or supported) 96I -40 to +85 8 Ld TDFN L8.2x3A ISL3297EFRTZ-T (No longer available or supported) 97F -40 to +125 8 Ld TDFN L8.2x3A ISL3297EIRTZ-T (No longer available or supported) 97I -40 to +85 8 Ld TDFN L8.2x3A ISL3298EFRTZ-T 98F -40 to +125 8 Ld TDFN L8.2x3A ISL3298EIRTZ-T (No longer available or supported) 98I -40 to +85 8 Ld TDFN L8.2x3A NOTES: 1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. Please refer to TB347 for details on reel specifications. 3. For Moisture Sensitivity Level (MSL), please see product information page for ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E. For more information on MSL, please see tech brief TB363. 4. SOT-23 “PART MARKING” is branded on the bottom side. Submit Document Feedback 3 FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Typical Operating Circuits +3.3V TO 5V +3.3V + 1 VCC 0.1µF 0.1µF + 2 VCC ISL3281E 3 RO R ISL329xE A 6 B 4 RT 6 Y 4 Z D 5 RE DI 1 DE 3 GND GND 2 5 FIGURE 1. NETWORK WITH ENABLES +3.3V TO 5V +3.3V + 1 VCC 0.1µF 0.1µF + 2 R 3 VCC ISL3280E 3 RO 1kΩ TO 3kΩ Note 10 ISL329xE A 5 B 4 RT 6 Y 4 Z DE D GND GND 2 5 DI 1 FIGURE 2. NETWORK WITHOUT ENABLE 2.5V +3.3V TO 5V +3.3V + 4 VCC 6 VL VCC LOGIC DEVICE (µP, ASIC, UART) 0.1µF 0.1µF 8 R 1 VL VCC ISL3282E 1 RO 1.8V + ISL3298E A 5 B 8 RT 6 Y 7 Z D 7 RE DI 3 DE 2 GND 2 NOTE: IF POWERED FROM SEPARATE SUPPLIES, POWER-UP VCC BEFORE VL VCC LOGIC DEVICE (µP, ASIC, UART) GND 4, 5 FIGURE 3. NETWORK WITH VL PIN FOR INTERFACING TO LOWER VOLTAGE LOGIC DEVICES Submit Document Feedback 4 FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Absolute Maximum Ratings Thermal Information VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V VL to GND (ISL3296E thru ISL3298E Only) . . . . . . . . -0.3V to (VCC + 0.3V) Input Voltages DI, DE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Output Voltages Y, Z (VCC ≤ 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V Y, Z (VCC > 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VCC +0.5V Short-circuit Duration Y, Z (VCC ≤ 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Y, Z (VCC > 3.6V, Note 13) . . . . . . . . . . . . . . . . . . . . . . . . . 1s at <300mA ESD Rating . . . . . . . . . . . . . . . . . . See Electrical Specifications on page 6 Thermal Resistance (Typical) JA (°C/W) JC (°C/W) 6 Ld SOT-23 Package (Note 5) . . . . . . . . . . 177 N/A 8 Ld TDFN Package (Notes 6, 7). . . . . . . . . 65 8 Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493 Operating Conditions Temperature Range F Suffix (VCC ≤ 3.6V only). . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C I Suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 5. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 6. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 7. For JC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications Test Conditions: VCC = 3.0V to 5.5V, VL = VCC (ISL3296E, ISL3297E, ISL3298E only), typicals are at TA = +25°C, unless otherwise specified. (Note 8) PARAMETER SYMBOL TEST CONDITIONS TEMP (°C) MIN (Note 12) TYP (Note 14) MAX (Note 12) UNIT DC CHARACTERISTICS VOD Driver Differential VOUT VOD Change in Magnitude of Driver Differential VOUT for Complementary Output States VOC Driver Common-mode VOUT Change in Magnitude of Driver Common-mode VOUT for Complementary Output States Input High Voltage (DI, DE) 5 VCC ≥ 3.15V Full 2 2.3 - V VCC ≥ 4.5V Full 3 3.8 - V RL = 54Ω (RS-485) (Figure 4A) VCC ≥ 3.0V Full 1.5 2 VCC V VCC ≥ 4.5V V Full 2.5 3.4 VCC No load Full - - VCC RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 4B) Full 1.5 2, 3.4 - V RL = 54Ω or 100Ω (Figure 4A) Full - 0.01 0.2 V RL = 54Ω or 100Ω (Figure 4A) VCC ≤ 3.6V Full - 2 3 V VCC ≤ 5.5V Full - - 3.2 V VOC RL = 54Ω or 100Ω (Figure 4A) Full - 0.01 0.2 V VIH1 VL = VCC if ISL3296E, ISL3297E, ISL3298E VCC ≤ 3.6V Full 2.2 - - V VCC ≤ 5.5V Full 3 - - V VIH2 Submit Document Feedback RL = 100Ω (RS-422) (Figure 4A) VIH3 2.7V ≤ VL < 3.0V (ISL3296E, ISL3297E, ISL3298E only) Full 2 - - V VIH4 2.3V ≤ VL < 2.7V (ISL3296E, ISL3297E, ISL3298E only) Full 1.65 - - V VIH5 1.6V ≤ VL < 2.3V (ISL3296E, ISL3297E, ISL3298E only) Full 0.7*VL - - V VIH6 1.35V ≤ VL < 1.6V (ISL3296E, ISL3297E, ISL3298E only) 25 - 0.5*VL - V FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Electrical Specifications Test Conditions: VCC = 3.0V to 5.5V, VL = VCC (ISL3296E, ISL3297E, ISL3298E only), typicals are at TA = +25°C, unless otherwise specified. (Note 8) (Continued) PARAMETER SYMBOL Input Low Voltage (DI, DE) TEST CONDITIONS TEMP (°C) MIN (Note 12) TYP (Note 14) MAX (Note 12) UNIT VIL1 VL = VCC if ISL3296E, ISL3297E, ISL3298E Full - - 0.8 V VIL2 VL ≥ 2.7V (ISL3296E, ISL3297E, ISL3298E only) Full - - 0.8 V VIL3 2.3V ≤ VL < 2.7V (ISL3296E, ISL3297E, ISL3298E only) Full - - 0.65 V VIL4 1.6V ≤ VL < 2.3V (ISL3296E, ISL3297E, ISL3298E only) Full - - 0.22*VL V VIL5 1.35V ≤ VL < 1.6V (ISL3296E, ISL3297E, ISL3298E only) 25 - 0.3*VL - V Logic Input Current IIN DI = DE = 0V or VCC (Note 11) Full -2 - 2 µA Output Leakage Current (Y, Z, Note 11) IOZ DE = 0V, VIN = 12V VCC = 0V, 3.6V, or 5.5V VIN = -7V Full - 0.1 40 µA Full -40 -10 - µA DE = VCC, -7V ≤ VO ≤ 12V, VCC ≤ 3.6V Full - - ±250 mA DE = VCC, 0V ≤ VO ≤ VCC, VCC > 3.6V (Note 13) Full - - ±450 mA Full - 160 - °C Full - 120 150 µA DE = 0V, DI = 0V or VCC Full - 0.01 1 µA Human Body Model, from bus pins to GND 25 - ±16.5 - kV IEC61000 Contact, from bus pins to GND 25 - ±7 - kV Driver Short-circuit Current, VO = High or Low (Note 9) IOSD1 Thermal Shutdown Threshold TSD SUPPLY CURRENT No-load Supply Current ICC Shutdown Supply Current ISHDN DI = 0V or VCC DE = VCC ESD PERFORMANCE RS-485 Pins (Y, Z) All Pins HBM, per MIL-STD-883 Method 3015 25 - ±8 - kV Machine Model 25 - ±400 - V DRIVER SWITCHING CHARACTERISTICS (ISL3293E, ISL3296E, 250kbps) Maximum Data Rate Driver Single-ended Output Delay fMAX VOD = ±1.5V, CD = 820pF (Figure 7) Full 250 - - kbps tSD RDIFF = 54Ω, CD = 50pF (Figure 5) Full 400 1350 1700 ns Part-to-part Output Delay Skew tSKPP RDIFF = 54Ω, CD = 50pF (Figure 5, Note 10) Full - - 900 ns Driver Single-ended Output Skew tSSK RDIFF = 54Ω, CD = 50pF (Figure 5) Full - 600 750 ns Driver Differential Output Delay tDD RDIFF = 54Ω CD = 50pF (Figure 5) Full 400 1100 1500 ns Driver Differential Output Skew tDSK RDIFF = 54Ω, CD = 50pF (Figure 5) Full - 4, 1 30 ns Driver Differential Rise or Fall Time tR, tF RDIFF = 54Ω, CD = 50pF (Figure 5) Full 400 960 1500 ns 25 - 1300 - ns Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 100, 60 250 ns Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 60, 35 250 ns Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 30, 22 60 ns Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 25, 20 60 ns VCC ≤ 3.6V VCC = 5V DRIVER SWITCHING CHARACTERISTICS (ISL3294E, ISL3297E, 500kbps) Maximum Data Rate Driver Single-ended Output Delay fMAX VOD = ±1.5V, CD = 820pF (Figure 7) Full 500 - - kbps tSD RDIFF = 54Ω, CD = 50pF (Figure 5) Full 200 340 500 ns Part-to-part Output Delay Skew tSKPP RDIFF = 54Ω, CD = 50pF (Figure 5, Note 10) Full - - 300 ns Driver Single-ended Output Skew tSSK RDIFF = 54Ω, CD = 50pF (Figure 5) Full - 30, 80 150 ns Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 5) Full 200 345 500 ns Submit Document Feedback 6 FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Electrical Specifications Test Conditions: VCC = 3.0V to 5.5V, VL = VCC (ISL3296E, ISL3297E, ISL3298E only), typicals are at TA = +25°C, unless otherwise specified. (Note 8) (Continued) TEMP (°C) MIN (Note 12) TYP (Note 14) MAX (Note 12) UNIT RDIFF = 54Ω, CD = 50pF (Figure 5) Full - 2 30 ns RDIFF = 54Ω, CD = 50pF (Figure 5) Full 200 350 800 ns RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 100, 60 250 ns RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 60, 35 250 ns PARAMETER SYMBOL TEST CONDITIONS Driver Differential Output Skew tDSK Driver Differential Rise or Fall Time tR, tF Driver Enable to Output High tZH Driver Enable to Output Low tZL Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 30, 22 60 ns Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 25, 20 60 ns VOD = ±1.5V, CD = 360pF (Figure 7) Full 20 - - Mbps RDIFF = 54Ω, CD = 50pF (Figure 5) VL = VCC Full 15 29, 23 42 ns VL ≥ 1.8V 25 - 32 - ns DRIVER SWITCHING CHARACTERISTICS (ISL3295E, ISL3298E, 20Mbps) Maximum Data Rate fMAX Driver Single-ended Output Delay tSD VL = 1.5V 25 - 36 - ns VL = 1.35V 25 - 40 - ns Part-to-part Output Delay Skew tSKPP RDIFF = 54Ω, CD = 50pF (Figure 5, Note 10) Full - - 25 ns Driver Single-ended Output Skew tSSK RDIFF = 54Ω, CD = 50pF (Figure 5) Full - 3 7 ns VL ≥ 1.8V 25 - 3 - ns VL = 1.5V 25 - 4 - ns VL = 1.35V 25 - 5 - ns VL = VCC Full - 29, 22 42 ns VL ≥ 1.8V 25 - 32 - ns VL = 1.5V 25 - 36 - ns VL = 1.35V 25 - 42 - ns VL = VCC ≤ 3.6V Full - 0.5 3 ns VL = VCC = 5V 25 - 2 - ns VL ≥ 1.8V 25 - 0.5, 1 - ns VL ≥ 1.5V 25 - 1, 2 - ns VL = 1.35V 25 - 2, 4 - ns VL = VCC Full - 9 15 ns VL ≥ 1.35V 25 - 9 - ns Driver Differential Output Delay tDD Driver Differential Output Skew tDSK RDIFF = 54Ω, CD = 50pF (Figure 5) RDIFF = 54Ω, CD = 50pF (Figure 5) RDIFF = 54Ω, CD = 50pF (Figure 5) VL = VCC Driver Differential Rise or Fall Time tR, tF Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 6) Full - 100, 60 250 ns Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 60, 35 250 ns Driver Disable from Output High tHZ RL = 500Ω CL = 50pF, SW = GND (Figure 6) Full - 30, 22 60 ns Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 6) Full - 25, 20 60 ns NOTES: 8. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 9. Applies to peak current. See “Typical Performance Curves” on page 11 for more information. 10. tSKPP is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC, temperature, etc.). 11. If the driver enable function isn’t needed, connect DE to VCC (or VL) through a 1kΩ to 3kΩ resistor. 12. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested. 13. Due to the high short-circuit current at VCC > 3.6V, the outputs must not be shorted outside the range of GND to VCC or damage may occur. To prevent excessive power dissipation that may damage the output, the short-circuit current should be limited to ≤ 300mA during testing. It is best to use an external resistor for this purpose, since the current limiting on the VO supply may respond too slowly to protect the output. 14. Typicals are measured at VCC = 3.3V for parameters specified with 3V ≤ VCC ≤ 3.6V, and are measured at VCC = 5V for parameters specified with 4.5V ≤ VCC ≤ 5.5V. If VCC isn’t specified, then a single “TYP” entry applies to both VCC = 3.3V and 5V, and two entries separated by a comma refer to VCC = 3.3V and 5V, respectively. Submit Document Feedback 7 FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Test Circuits and Waveforms VCC OR VL RL/2 DE DI Z DI VOD D 375Ω DE VCC OR VL Z Y VCM RL = 60Ω VOD D -7V TO +12V Y VOC RL/2 375Ω FIGURE 4B. VOD WITH COMMON-MODE LOAD FIGURE 4A. VOD AND VOC FIGURE 4. DC DRIVER TEST CIRCUITS 3V OR VL DI 50% 50% 0V VCC OR VL tSD2 tSD1 DE Z DI VOH OUT (Z) RDIFF D 50% CD 50% VOL OUT (Y) Y tDDLH SIGNAL GENERATOR DIFF OUT (Y - Z) tDDHL 90% 50% 10% tR -VOD tF tDSK = |tDDLH - tDDHL| tSSK = |tSD1(Y) - tSD2(Y)| OR |tSD1(Z) - tSD2(Z)| FIGURE 5A. TEST CIRCUIT +VOD 90% 50% 10% FIGURE 5B. MEASUREMENT POINTS FIGURE 5. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE DI SIGNAL GENERATOR Z 500Ω VCC D SW Y 3V OR VL DE 50% GND 50% 0V 50pF tZH OUTPUT HIGH OUTPUT DI SW tHZ Y/Z 1/0 GND tLZ Y/Z 0/1 VCC tZH Y/Z 1/0 GND tZL Y/Z 0/1 VCC VOH - 0.25V 50% OUT (Y, Z) PARAMETER tHZ 0V tZL tLZ VCC OUT (Y, Z) 50% VOL + 0.25V V OUTPUT LOW FIGURE 6A. TEST CIRCUIT VOH OL FIGURE 6B. MEASUREMENT POINTS FIGURE 6. DRIVER ENABLE AND DISABLE TIMES Submit Document Feedback 8 FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Test Circuits and Waveforms (Continued) VCC OR VL DE 3V OR VL + Z DI 54Ω D CD Y VOD DI 0V - SIGNAL GENERATOR +VOD DIFF OUT (Y - Z) -VOD FIGURE 7A. TEST CIRCUIT 0V FIGURE 7B. MEASUREMENT POINTS FIGURE 7. DRIVER DATA RATE Application Information RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transmitters and receivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 specification requires that drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended Common-Mode Range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000’, so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. Driver Features These RS-485/RS-422 drivers are differential output devices that delivers at least 1.5V across a 54Ω load (RS-485) and at least 2V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width and to minimize EMI. All drivers are tri-statable via the active high DE input. If the Tx enable function is not needed, tie DE to VCC (or VL) through a 1kΩ to 3kΩ resistor. The 250kbps and 500kbps driver outputs are slew rate limited to minimize EMI, and to reduce reflections in unterminated or improperly terminated networks. Outputs of the ISL3295E and ISL3298E drivers are not limited, so faster output transition times allow data rates of at least 20Mbps. Submit Document Feedback 9 Wide Supply Range The ISL3293E through ISL3298E are optimized for 3.3V operation, but can be operated with supply voltages as high as 5.5V. These devices meet the RS-422 and RS-485 specifications for supply voltages less than 4V, and are RS-422 and RS-485 compatible for supplies greater than 4V. Operation at +125°C requires VCC ≤ 3.6V, while 5V operation requires adding output current limiting resistors (as described in the “Driver Overload Protection” on page 10) if output short-circuits (e.g., from bus contention) are a possibility. 5.5V Tolerant Logic Pins Logic input pins (DI, DE) contain no ESD nor parasitic diodes to VCC (nor to VL), so they withstand input voltages exceeding 5.5V regardless of the VCC and VL voltages. Logic Supply (VL Pin, ISL3296E through ISL3298E) Note: If powered from separate supplies, power-up VCC before powering up the VL supply and keep VL ≤ VCC. The ISL3296E through ISL3298E include a VL pin that powers the logic inputs (DI and DE). These pins interface with “logic” devices such as UARTs, ASICs, and µcontrollers, and today most of these devices use power supplies significantly lower than 3.3V. Thus, the logic device’s low VOH might not exceed the VIH of a 3.3V or 5V powered DI or DE input. Connecting the VL pin to the power supply of the logic device (as shown in Figure 8) reduces the DI and DE input switching points to values compatible with the logic device’s output levels. Tailoring the logic pin input switching points and output levels to the supply voltage of the UART, ASIC, or µcontroller eliminates the need for a level shifter/translator between the two ICs. FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E VCC = +3.3V DI DE outputs remain disabled for a period of time, regardless of the state of DE. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. VCC = +2V VIH ≥ 2V ESD Protection TXD VOH ≤ 2V VIH ≥ 2V VOH ≤ 2V GND ISL3293E DEN GND UART/PROCESSOR VCC = +3.3V VCC = +2V VL DI DE VIH = 1.4V TXD VOH ≤ 2V Data Rate, Cables and Terminations VIH = 1.4V GND VOH ≤ 2V ISL3296E DEN GND UART/PROCESSOR FIGURE 8. USING VL PIN TO ADJUST LOGIC LEVELS VL can be anywhere from VCC down to 1.35V, but the input switching points may not provide enough noise margin and 20Mbps data rates may not be achievable, when VL < 1.5V. Table 2 indicates typical VIH and VIL values for various VL settings so the user can ascertain whether or not a particular VL voltage meets his needs. TABLE 2. VIH AND VIL vs VL FOR VCC = 3.3V OR 5V VL (V) VIH (V) VIL (V) 1.35 0.7 0.4 1.5 0.8 0.5 1.8 0.9 0.7 2.3 1.1 1.0 2.7 1.3 1.1 3.3 1.5 1.4 5.0 (i.e., VCC) 2.7 2.3 The VL supply current (IL) is typically much less than 20µA, as shown in Figure 12 on page 11, when DE and DI are above/below VIH/VIL. Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control line (DE) is unable to ensure that the RS-485 Tx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid this scenario, the ISL329xE family incorporates a “Hot Plug” function. During power-up, circuitry monitoring VCC ensures that the Tx Submit Document Feedback 10 All pins on these devices include class 3 (8kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs) incorporate advanced structures allowing them to survive ESD events in excess of ±16.5kV HBM and ±7kV to the IEC61000 contact test method. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up and without degrading the RS-485 common-mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes) and the associated, undesirable capacitive load they present. RS-485/RS-422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. Devices operating at 20Mbps are limited to lengths less than 100’, while the 250kbps versions can operate at full data rates with lengths of several 1000’. Twisted pair is the cable of choice for RS-485/RS-422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common-mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative, when using the 20Mbps devices, to minimize reflections. Short networks using the 250kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multireceiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multidriver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transmitter or receiver to the main cable should be kept as short as possible. Driver Overload Protection As stated previously, the RS-485 specification requires that drivers survive worst case bus contentions undamaged. These drivers meet this requirement, for VCC ≤ 3.6V, via driver output short-circuit current limits and on-chip thermal shutdown circuitry. The driver output stages incorporate short-circuit current limiting circuitry, which ensures that the output current never exceeds the RS-485 specification, for VCC ≤ 3.6V, even at the common-mode voltage range extremes. Additionally, these devices utilize a foldback circuit which reduces the short-circuit current and thus the power dissipation, whenever the contending voltage exceeds either VCC or GND. FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E In the event of a major short-circuit condition, devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically reenable after the die temperature drops about +20°C. If the contention persists, the thermal shutdown/reenable cycle repeats until the fault is cleared. At VCC > 3.6V, the instantaneous short-circuit current is high enough that output stage damage may occur during short-circuit conditions to voltages outside of GND to VCC, before the short-circuit limiting and thermal shutdown activate. For VCC = 5V operation, if output short-circuits are a possibility (e.g., due to bus contention), it is recommended that a 5Ω resistor be inserted in series with each output. This resistor limits the instantaneous current below levels that can cause damage. The driver VOD at VCC = 5V is so large that this small added resistance has little impact. Typical Performance Curves High Temperature Operation Due to power dissipation and instantaneous output short-circuit current levels at VCC = 5V, these transmitters may not be operated at +125°C with VCC > 3.6V. At VCC = 3.6V, even the SOT-23 versions may be operated at +125°C, while driving a 100’, double terminated, CAT 5 cable at 20Mbps, without triggering the thermal SHDN circuit. Low Power Shutdown Mode These BiCMOS transmitters all use a fraction of the power required by their bipolar counterparts, but they also include a shutdown feature that reduces the already low quiescent ICC to a 1µA trickle. These devices enter shutdown whenever the driver disables (DE = GND). VCC = VL = 3.3V, TA = +25°C, unless otherwise specified. 2.4 DIFFERENTIAL OUTPUT VOLTAGE (V) DRIVER OUTPUT CURRENT (mA) 110 100 90 +85°C 80 +25°C 70 +125°C 60 50 40 30 20 10 0 +25°C 0 0.5 1.0 1.5 2.0 2.5 3.0 DIFFERENTIAL OUTPUT VOLTAGE (V) RDIFF = 100Ω 2.2 2.1 2.0 RDIFF = 54Ω 1.9 1.8 1.7 1.6 1.5 -40 3.5 FIGURE 9. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE 2.3 10 -15 60 35 TEMPERATURE (°C) 110 125 85 FIGURE 10. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 40 100 VCC = 3.3V 35 90 VL = 3.3V 80 30 25 60 IL (µA) ICC (µA) 70 50 40 20 15 30 VL = 2.5V 10 20 5 10 0 DE = VCC = VL -40 -15 10 35 60 85 TEMPERATURE (°C) FIGURE 11. SUPPLY CURRENT vs TEMPERATURE Submit Document Feedback 11 110 125 0 VL ≤ 2V 0 1 2 3 4 5 6 7 7.5 DI VOLTAGE (V) FIGURE 12. VL SUPPLY CURRENT vs LOGIC PIN VOLTAGE FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Typical Performance Curves VCC = VL = 3.3V, TA = +25°C, unless otherwise specified. (Continued) 1250 700 VL = 1.35V TO VCC tDDLH 600 tSSK 1200 500 tDDHL 1175 SKEW (ns) PROPAGATION DELAY (ns) 1225 1150 1125 400 VL = 1.35V TO VCC 300 200 1100 100 1075 tDSK 1050 -40 10 -15 35 60 85 0 -40 110 125 -15 10 TEMPERATURE (°C) FIGURE 13. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3293E, ISL3296E) 60 85 110 125 FIGURE 14. DRIVER SKEW vs TEMPERATURE (ISL3293E, ISL3296E) 60 390 VL = 1.35V TO VCC VL = 1.35V TO VCC 380 50 370 40 SKEW (ns) PROPAGATION DELAY (ns) 35 TEMPERATURE (°C) 360 350 tSSK 30 20 tDDHL 340 10 tDDLH 330 -40 -15 tDSK 10 35 60 85 0 -40 110 125 -15 10 TEMPERATURE (°C) 35 60 85 110 125 TEMPERATURE (°C) FIGURE 15. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3294E, ISL3297E) FIGURE 16. DRIVER SKEW vs TEMPERATURE (ISL3294E, ISL3297E) 50 4.5 4.0 40 VL = 1.35V, tDDLH 3.5 VL = 1.35V, tDDHL 3.0 VL = 1.5V, tDDLH, tDDHL SKEW (ns) PROPAGATION DELAY (ns) 45 35 30 VL = 1.8V, tDDLH, tDDHL VL = 1.35V 2.5 2.0 1.5 VL = 1.5V 1.0 25 20 -40 VL = VCC, tDDLH, tDDHL -15 10 0.5 35 60 85 110 125 TEMPERATURE (°C) FIGURE 17. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3295E, ISL3298E) Submit Document Feedback 12 0 -40 VL ≥ 1.8V -15 10 35 60 85 110 125 TEMPERATURE (°C) FIGURE 18. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3295E, ISL3298E) FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Typical Performance Curves VCC = VL = 3.3V, TA = +25°C, unless otherwise specified. (Continued) 200 6 ISL3295E/ISL3298E VL = 1.35V 150 5 VL = 1.5V 3 VL ≥ 1.8V 2 Y OR Z = LOW 50 0 -50 Y OR Z = HIGH 1 -100 -150 -15 10 35 60 85 110 125 ISL329xE -7 -6 -4 -2 TEMPERATURE (°C) 0 1.5 Z Y 0 DRIVER OUTPUT (V) 3 2 1 Y-Z 0 DRIVER OUTPUT (V) 3 DRIVER INPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) RDIFF = 54Ω, CD = 50pF 3.0 -1 -2 -3 0 DRIVER OUTPUT (V) 3 2 1 0 DRIVER OUTPUT (V) Y DRIVER INPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) 3 0 1.5 Y-Z -1 -2 -3 TIME (200ns/DIV) FIGURE 23. DRIVER WAVEFORMS, LOW-TO-HIGH (ISL3294E, ISL3297E) Submit Document Feedback 13 3 DI 0 3.0 1.5 Y Z 0 3 2 1 0 Y-Z -1 -2 -3 FIGURE 22. DRIVER WAVEFORMS, HIGH-TO-LOW (ISL3293E, ISL3296E) RDIFF = 54Ω, CD = 50pF Z 12 TIME (400ns/DIV) FIGURE 21. DRIVER WAVEFORMS, LOW-TO-HIGH (ISL3293E, ISL3296E) 3.0 10 RDIFF = 54Ω, CD = 50pF TIME (400ns/DIV) DI 8 FIGURE 20. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT VOLTAGE FIGURE 19. DRIVER SINGLE-ENDED SKEW vs TEMPERATURE (ISL3295E, ISL3298E) DI 0 2 4 6 OUTPUT VOLTAGE (V) DRIVER INPUT (V) 0 -40 RDIFF = 54Ω, CD = 50pF 3 DI 0 3.0 1.5 Y Z DRIVER INPUT (V) SKEW (ns) 4 OUTPUT CURRENT (mA) OTHER ISL329xE 100 0 3 2 1 0 -1 -2 -3 Y-Z TIME (200ns/DIV) FIGURE 24. DRIVER WAVEFORMS, HIGH-TO-LOW (ISL3294E, ISL3297E) FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E 0 3.0 Z Y 1.5 0 3 2 1 Y-Z 0 -1 -2 -3 0 3.0 1.5 Y Z 0 3 2 1 Y-Z 0 -1 -2 -3 TIME (10ns/DIV) TIME (10ns/DIV) DI 0 3.0 1.5 Z Y 0 3 2 1 0 Y-Z -1 -2 -3 TIME (10ns/DIV) FIGURE 27. DRIVER WAVEFORMS, LOW-TO-HIGH (ISL3295E, ISL3298E) DRIVER OUTPUT (V) 3 DRIVER INPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) RDIFF = 54Ω CD = 50pF DRIVER OUTPUT (V) FIGURE 26. DRIVER WAVEFORMS, HIGH-TO-LOW (ISL3295E, ISL3298E) FIGURE 25. DRIVER WAVEFORMS, LOW-TO-HIGH (ISL3295E, ISL3298E) VL = 1.35V 3 DI RDIFF = 54Ω, CD = 50pF VL = 1.35V 3 DI 0 3.0 1.5 Y Z DRIVER INPUT (V) DI RDIFF = 54Ω, CD = 50pF DRIVER INPUT (V) 3 DRIVER OUTPUT (V) RDIFF = 54Ω, CD = 50pF DRIVER INPUT (V) VCC = VL = 3.3V, TA = +25°C, unless otherwise specified. (Continued) DRIVER OUTPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) Typical Performance Curves 0 3 2 1 0 -1 -2 -3 Y-Z TIME (10ns/DIV) FIGURE 28. DRIVER WAVEFORMS, HIGH-TO-LOW (ISL3295E, ISL3298E) Die Characteristics SUBSTRATE AND TDFN THERMAL PAD POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 516 PROCESS: Si Gate BiCMOS Submit Document Feedback 14 FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that you have the latest revision. DATE REVISION CHANGE September 25, 2015 FN6544.3 On page 1, table 1, for ISL3293E entry, added "Recommended replacement: ISL32613E" after "No longer available or supported". For ISL3294E entry, added "Recommended replacement: ISL32614E" after "No longer available or supported". On page 3, "Ordering Information" table, for ISL3293E entries (rows 1 and 2), added "Recommended replacement: ISL32613E" after "No longer available or supported". For ISL3294E entries (rows 3 and 4), added "Recommended replacement: ISL32614E" after "No longer available or supported". July 27, 2015 FN6544.2 Table 1 Summary of Features on page 1, added “No longer available or supported” to ISL3293E, ISL3294E, ISL3296E, ISL3297E. Ordering Information table on page 3, added “No longer available or supported” to the following parts: ISL3293E and ISL3294E (1st 4 rows) and to ISL3296E and ISL3297E (rows 7-10). Electrical Spec table, added “(Parts no longer available or supported)” to DRIVER SWITCHING CHARACTERISTICS sections on page 6 (for parts ISL3293E, ISL3296E and ISL3294E, ISL3297E). POD on page 16, updated from ref 1 to rev 2. Changes since rev 1: Tiebar Note updated From: Tiebar shown (if present) is a non-functional feature. To: Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). December 11, 2014 FN6544.1 Updated entire datasheet to Intersil new standard. Added text in several places to clarify that VL can be connected to Vcc. Updated PODs P6.064 and L8.2x3A to latest revisions with changes as follows: Updated to new POD format by removing table listing dimensions and moving dimensions onto drawing. Added Typical Recommended Land Pattern. September 19, 2007 FN6544.0 Initial Release. About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. 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For information regarding Intersil Corporation and its products, see www.intersil.com Submit Document Feedback 15 FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Package Outline Drawing P6.064 6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE Rev 4, 2/10 0-8° 1.90 0.95 0.08-0.22 D A 6 5 4 2.80 PIN 1 INDEX AREA 1.60 +0.15/-0.10 3 3 (0.60) 1 2 3 0.20 C 2x 0.40 ±0.10 B SEE DETAIL X 3 0.20 M C A-B D END VIEW TOP VIEW 10° TYP (2 PLCS) 2.90 ±0.10 3 1.15 +0.15/-0.25 C 0.10 C SEATING PLANE 0.00-0.15 SIDE VIEW (0.25) GAUGE PLANE 1.45 MAX DETAIL "X" 0.45±0.1 4 (0.95) (0.60) (1.20) (2.40) NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. 3. Dimension is exclusive of mold flash, protrusions or gate burrs. 4. Foot length is measured at reference to guage plane. 5. Package conforms to JEDEC MO-178AB. TYPICAL RECOMMENDED LAND PATTERN Submit Document Feedback 16 FN6544.3 September 25, 2015 ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E Package Outline Drawing L8.2x3A 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE WITH E-PAD Rev 2, 05/15 0.25 0.50 2.20 6 PIN 1 INDEX AREA (4X) 6 PIN #1 INDEX AREA B 3.00 A 1.80 +0.1/ -0.15 2.00 0.15 (8x0.40) 1.65 +0.1/ -0.15 TOP VIEW BOTTOM VIEW (8x0.25) PACKAGE OUTLINE (6x0.50) 0.75 SEE DETAIL "X" SIDE VIEW 1.80 3.00 0.05 (8x0.40) 1.65 C 0.20 REF C BASE PLANE SEATING PLANE 0.08 C 5 (8x0.20) 0.05 2.00 TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.20mm and 0.32mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature. Submit Document Feedback 17 FN6544.3 September 25, 2015