L O W- S I D E G AT E D R I V E R I C S F R O M 2 A T O 1 4 A N E W P R O D U C T B R I E F Low-Side Gate Driver ICs from 2A to 14A NEXT GENERATION IXD_5XX LOW-SIDE GATE DRIVERS WITH IMPROVED COST-EFFICIENCY, CIRCUIT DENSITY AND RUGGEDNESS FOR MOSFETs AND IGBTs Features Applications • • • • • Diverse choice of single and dual outputs, with extensive mix of logic, packaging and output currents Enable options for fast, controlled shutdown Rated for operation from 4.5V to 35V and -55ºC to +125ºC Multiple packaging options, including high density 6-Lead DFN No internal cross conduction, output rise and fall times of 25ns maximum • • • • Industrial – Inverters, Motor Drives, Welding Consumer – LCD TV, Audio Amplifiers Power Conversion – SMPS, UPS, PFC Actuators – Relays, Solenoids Block Diagrams IXD(D,E)504 Block Diagram IXD(F,I,N)502, IXD(F,I,N)504 Block Diagram Vcc IXDN July 2006 IN A Description IXDI IXDF IXYS’ new family of high performance Gate Driver ICs raises the “industry benchmark” for superior toughness and reliability. IXYS has long enjoyed a reputation for producing the most rugged and dependable Power MOSFETs and IGBTs available, and now IXYS engineers are proud to introduce the most rugged and dependable Gate Driver ICs available. Power System Designers are well aware that the voltage and current spikes inherent in Power Supply and Motor Control circuits demand the use of highly reliable and robust Gate Driver ICs. IXYS’ new IXD_5XX family has been designed using the latest proprietary processes and design innovations in order to achieve a remarkably strong resistance to noise, coupled with greatly enhanced immunity to latch-up. Furthermore, these advanced Gate Drivers include IXYS’ traditional patented* drive stage design features that eliminate internal Cross-Conduction. Additional advantages include “extended” operating voltage range (up to 35V), and “extended” operating temperature range (-55°C to +125°C). User logic options include versions which incorporate an Enable function for fast output shutdown. Further enhancing the value is the inclusion of a high-density DFN package option, occupying less than 65% of the board area of a typical 8-pin SOIC, available over the entire range of drive currents. 8-Pin SOIC (SIA) IXDN IN B IXDI IXDF GND Anti-Cross Conduction Circuit* OUT B or OUT B EN A IXDD IXDE IN B EN B Anti-Cross Conduction Circuit* OUT A or OUT A Anti-Cross Conduction Circuit* OUT B or OUT B GND IXD(I, N)509, IXD(I, N)514 Block Diagram Vcc Vcc Vcc Vcc 8-Pin PDIP (PI) IXDD IN 6-Lead DFN (D1) IXDN Anti-Cross Conduction Circuit* IXDE EN OUT or OUT Anti-Cross Conduction Circuit* IN IXDI GND GND OUT or OUT GND GND * United States Patent 6,917,227 8-Lead DFN (D2) Case Drawings 8-Pin SOIC * United States Patent 6,917,227 8-Pin DPIP D 8 7 6 DIM 5 E 1 IPK @ TC = 25°C 2 A, Dual 4 A, Dual 4 A, Dual 9 A, Single 14 A, Single Logic Configuration(1) F, I, N F, I, N D, E D, E, I, N D, E, I, N Package(2) PI, SIA, SIAT/R, D1, D1T/R PI, SIA, SIAT/R, D1, D1T/R PI, SIA, SIAT/R, D2, D2T/R PI, SIA, SIAT/R, D1, D1T/R PI, SIA, SIAT/R, D1, D1T/R Configuration Non-Inverting + Enable Inverting + Enable Non-Inverting and Inverting Designation I N Configuration Inverting Non-Inverting Package 8-Pin PDIP 8-Pin SOIC 8-Pin SOIC 6-Lead DFN 6-Lead DFN 8-Lead DFN 8-Lead DFN Packing Style Tube Tube 13" Tape and Reel Bulk 13" Tape and Reel Bulk 13" Tape and Reel Pack Qty 50 94 2500 1500 2500 1500 2500 2 4 DIMENSIONS 1 SUMMARY TABLES FOR 50x LOW-SIDE GATE DRIVER FAMILY Logic Configurations Designation D E F Package Details Designation PI SIA SIAT/R D1 D1T/R D2 D2T/R OUT A or OUT A IXD(D,E)509, IXD(D,E)514 Block Diagram With current ratings from 2A to 14A, with a complete set of logic level control and packaging options, this new family of IXD_5XX Gate Driver ICs offers superior performance, improved cost effectiveness, greater circuit density and unsurpassed ruggedness! Part Numbers and Configurations Part Number IXD(1)502(2) IXD(1)504(2) IXD(1)504(2) IXD(1)509(2) IXD(1)514(2) Anti-Cross Conduction Circuit* Vcc IXDD IXDE IN A 3 K H C L 4 F A1 JX45º A A1 B C D E F H J K L INCHES MIN MAX .0532 .0688 .0040 .0098 .013 .020 .0075 .0098 .1890 .1968 .1497 .1574 .050 BSC .2440 .2284 .0099 .0196 0º 8º .016 .050 MILLIMETERS MIN MAX 1.35 1.75 .10 .25 .33 .51 .19 .25 4.80 5.00 3.80 4.00 1.27 BSC 6.20 5.80 0.25 .50 0º 8º .40 1.27 A TOP VIEW E 1 SYM –––– –––– –––– –––– E1 2 2 5 –––– –––– –––– –––– –––– 6 7 eA eB 8 D A2 A A1 L D1 b3 6-Lead DFN 2 NOTE 3. MOLDED PACKAGE SHALL CONFORM TO JEDEC STANDARD CONFIGURATION MS-012 VARIATION AA 2 DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 1 CONTROLLING DIMENSIONS: MILLIMETERS NOTES: (UNLESS OTHERWISE SPECIFIED) B 3 e c A A1 A2 b b2 b3 c D D1 E E1 e eA eB L INCHES MIN MAX .140 .180 .015 .040 .125 .145 .015 .020 .055 .065 .035 .045 .009 .012 .400 .355 .010 .040 .300 .325 .240 .270 .100 BSC .300 BSC .300 .430 .120 .140 MILLIMETERS MIN MAX 3.56 4.57 0.38 1.02 3.18 3.68 0.38 0.51 1.40 1.65 0.89 1.14 0.23 0.30 10.16 9.02 0.25 1.02 7.62 8.26 6.10 6.86 2.54 BSC 7.62 BSC 7.62 10.92 3.05 3.56 NOTE: THIS DRAWING MEETS ALL REQUIREMENT OF JEDEC OUTLINES MS-001 BA. b b2 8-Lead DFN SIDE BOTTOM VIEW TOP VIEW IXYS Semiconductor GmbH Edisonstr.15 • D-68623 Lampertheim Telfon: +49-62 06-503-0 • Fax: +49-62 06-503 627 e-mail: [email protected] Efficiency Through Technology SIDE BOTTOM VIEW IXYS Corporation 3540 Bassett Street • Santa Clara CA 95054 Phone: (408) 982-0700 • Fax: (408) 496-0670 email: [email protected] L O W- S I D E G AT E D R I V E R I C S F R O M 2 A T O 1 4 A N E W P R O D U C T B R I E F Low-Side Gate Driver ICs from 2A to 14A NEXT GENERATION IXD_5XX LOW-SIDE GATE DRIVERS WITH IMPROVED COST-EFFICIENCY, CIRCUIT DENSITY AND RUGGEDNESS FOR MOSFETs AND IGBTs Features Applications • • • • • Diverse choice of single and dual outputs, with extensive mix of logic, packaging and output currents Enable options for fast, controlled shutdown Rated for operation from 4.5V to 35V and -55ºC to +125ºC Multiple packaging options, including high density 6-Lead DFN No internal cross conduction, output rise and fall times of 25ns maximum • • • • Industrial – Inverters, Motor Drives, Welding Consumer – LCD TV, Audio Amplifiers Power Conversion – SMPS, UPS, PFC Actuators – Relays, Solenoids Block Diagrams IXD(D,E)504 Block Diagram IXD(F,I,N)502, IXD(F,I,N)504 Block Diagram Vcc IXDN July 2006 IN A Description IXDI IXDF IXYS’ new family of high performance Gate Driver ICs raises the “industry benchmark” for superior toughness and reliability. IXYS has long enjoyed a reputation for producing the most rugged and dependable Power MOSFETs and IGBTs available, and now IXYS engineers are proud to introduce the most rugged and dependable Gate Driver ICs available. Power System Designers are well aware that the voltage and current spikes inherent in Power Supply and Motor Control circuits demand the use of highly reliable and robust Gate Driver ICs. IXYS’ new IXD_5XX family has been designed using the latest proprietary processes and design innovations in order to achieve a remarkably strong resistance to noise, coupled with greatly enhanced immunity to latch-up. Furthermore, these advanced Gate Drivers include IXYS’ traditional patented* drive stage design features that eliminate internal Cross-Conduction. Additional advantages include “extended” operating voltage range (up to 35V), and “extended” operating temperature range (-55°C to +125°C). User logic options include versions which incorporate an Enable function for fast output shutdown. Further enhancing the value is the inclusion of a high-density DFN package option, occupying less than 65% of the board area of a typical 8-pin SOIC, available over the entire range of drive currents. 8-Pin SOIC (SIA) IXDN IN B IXDI IXDF GND Anti-Cross Conduction Circuit* OUT B or OUT B EN A IXDD IXDE IN B EN B Anti-Cross Conduction Circuit* OUT A or OUT A Anti-Cross Conduction Circuit* OUT B or OUT B GND IXD(I, N)509, IXD(I, N)514 Block Diagram Vcc Vcc Vcc Vcc 8-Pin PDIP (PI) IXDD IN 6-Lead DFN (D1) IXDN Anti-Cross Conduction Circuit* IXDE EN OUT or OUT Anti-Cross Conduction Circuit* IN IXDI GND GND OUT or OUT GND GND * United States Patent 6,917,227 8-Lead DFN (D2) Case Drawings 8-Pin SOIC * United States Patent 6,917,227 8-Pin DPIP D 8 7 6 DIM 5 E 1 IPK @ TC = 25°C 2 A, Dual 4 A, Dual 4 A, Dual 9 A, Single 14 A, Single Logic Configuration(1) F, I, N F, I, N D, E D, E, I, N D, E, I, N Package(2) PI, SIA, SIAT/R, D1, D1T/R PI, SIA, SIAT/R, D1, D1T/R PI, SIA, SIAT/R, D2, D2T/R PI, SIA, SIAT/R, D1, D1T/R PI, SIA, SIAT/R, D1, D1T/R Configuration Non-Inverting + Enable Inverting + Enable Non-Inverting and Inverting Designation I N Configuration Inverting Non-Inverting Package 8-Pin PDIP 8-Pin SOIC 8-Pin SOIC 6-Lead DFN 6-Lead DFN 8-Lead DFN 8-Lead DFN Packing Style Tube Tube 13" Tape and Reel Bulk 13" Tape and Reel Bulk 13" Tape and Reel Pack Qty 50 94 2500 1500 2500 1500 2500 2 4 DIMENSIONS 1 SUMMARY TABLES FOR 50x LOW-SIDE GATE DRIVER FAMILY Logic Configurations Designation D E F Package Details Designation PI SIA SIAT/R D1 D1T/R D2 D2T/R OUT A or OUT A IXD(D,E)509, IXD(D,E)514 Block Diagram With current ratings from 2A to 14A, with a complete set of logic level control and packaging options, this new family of IXD_5XX Gate Driver ICs offers superior performance, improved cost effectiveness, greater circuit density and unsurpassed ruggedness! Part Numbers and Configurations Part Number IXD(1)502(2) IXD(1)504(2) IXD(1)504(2) IXD(1)509(2) IXD(1)514(2) Anti-Cross Conduction Circuit* Vcc IXDD IXDE IN A 3 K H C L 4 F A1 JX45º A A1 B C D E F H J K L INCHES MIN MAX .0532 .0688 .0040 .0098 .013 .020 .0075 .0098 .1890 .1968 .1497 .1574 .050 BSC .2440 .2284 .0099 .0196 0º 8º .016 .050 MILLIMETERS MIN MAX 1.35 1.75 .10 .25 .33 .51 .19 .25 4.80 5.00 3.80 4.00 1.27 BSC 6.20 5.80 0.25 .50 0º 8º .40 1.27 A TOP VIEW E 1 SYM –––– –––– –––– –––– E1 2 2 5 –––– –––– –––– –––– –––– 6 7 eA eB 8 D A2 A A1 L D1 b3 6-Lead DFN 2 NOTE 3. MOLDED PACKAGE SHALL CONFORM TO JEDEC STANDARD CONFIGURATION MS-012 VARIATION AA 2 DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 1 CONTROLLING DIMENSIONS: MILLIMETERS NOTES: (UNLESS OTHERWISE SPECIFIED) B 3 e c A A1 A2 b b2 b3 c D D1 E E1 e eA eB L INCHES MIN MAX .140 .180 .015 .040 .125 .145 .015 .020 .055 .065 .035 .045 .009 .012 .400 .355 .010 .040 .300 .325 .240 .270 .100 BSC .300 BSC .300 .430 .120 .140 MILLIMETERS MIN MAX 3.56 4.57 0.38 1.02 3.18 3.68 0.38 0.51 1.40 1.65 0.89 1.14 0.23 0.30 10.16 9.02 0.25 1.02 7.62 8.26 6.10 6.86 2.54 BSC 7.62 BSC 7.62 10.92 3.05 3.56 NOTE: THIS DRAWING MEETS ALL REQUIREMENT OF JEDEC OUTLINES MS-001 BA. b b2 8-Lead DFN SIDE BOTTOM VIEW TOP VIEW IXYS Semiconductor GmbH Edisonstr.15 • D-68623 Lampertheim Telfon: +49-62 06-503-0 • Fax: +49-62 06-503 627 e-mail: [email protected] Efficiency Through Technology SIDE BOTTOM VIEW IXYS Corporation 3540 Bassett Street • Santa Clara CA 95054 Phone: (408) 982-0700 • Fax: (408) 496-0670 email: [email protected]