CPC1393

CPC1393
Single-Pole, Normally Open
4-Pin OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
600
90
50
Description
Units
VP
mArms / mADC

The CPC1393G is a single-pole, normally open
(1-Form-A) Solid State Relay with an enhanced input
to output isolation barrier of 5000Vrms.
The relay output is constructed with efficient
MOSFET switches that use IXYS Integrated Circuits
Division's patented OptoMOS architecture. The input,
a highly efficient GaAlAS infrared LED, controls the
optically coupled output.
Features
•
•
•
•
•
•
•
•
5000Vrms Input/Output Isolation
600VP Blocking Voltage
100% Solid State
Low Drive Power Requirements (TTL/CMOS
Compatible)
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Small 4-Pin Package
Machine Insertable, Wave Solderable
Approvals
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
Ordering Information
Applications
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Part Number
CPC1393G
CPC1393GV
CPC1393GR
CPC1393GRTR
Description
4-Pin DIP (100/Tube)
4-Pin DIP V-Bend (100/Tube)
4-Pin Surface Mount (100/Tube)
4-Pin Surface Mount (1000/Reel)
Pin Configuration
+ Control
– Control
1
4
2
3
Load
Load
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
Pb
DS-CPC1393-R05
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1
INTEGRATED CIRCUITS DIVISION
CPC1393
Absolute Maximum Ratings @ 25ºC
Parameter
Peak Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Package Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 3.00 mW / ºC
Ratings
600
5
50
1
100
550
5000
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
mW
Vrms
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current
Continuous
Peak
On-Resistance 1
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
Conditions
Symbol
Min
Typ
Max
Units
t=10ms
IL=90mA
VL=600VP
IL
ILPK
RON
ILEAK
-
35
-
90
±350
50
1
mArms / mADC
mAP

IF=5mA, VL=10V
IF=0mA, VL=50V, f=1MHz
ton
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COUT
-
50
5
5
-
IL=90mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.2
0.9
-
0.55
1.2
-
2
1.4
10
-
CI/O
-
3
-
A
ms
pF
mA
V
A
pF
Measurement taken within 1 second of on-time.
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INTEGRATED CIRCUITS DIVISION
CPC1393
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
Device Count (N)
Device Count (N)
35
25
30
25
20
15
10
5
30
20
Device Count (N)
35
15
10
5
1.17
10
0.68
0.72
0.76
0.80
0.84
0.22
0.88
Typical IF for Switch Dropout
(N=50, IL=90mADC, TA=25ºC)
0.24
20
20
15
10
5
30
15
10
5
25
20
15
10
5
0
0.33
0.59
35
0.30
35
0
0
0.26
0.28
Turn-Off (ms)
Typical On-Resistance Distribution
(N=50, IL=90mADC, TA=25ºC)
Device Count (N)
25
Device Count (N)
25
0.55 0.56 0.57 0.58
LED Current (mA)
15
Turn-On (ms)
Typical IF for Switch Operation
(N=50, IL=90mADC, TA=25ºC)
0.54
20
0
0.64
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
0.53
25
5
0
0
Device Count (N)
Typical Turn-Off Time
(N=50, IF=2mA, IL=90mADC, TA=25ºC)
Typical Turn-On Time
(N=50, IF=2mA, IL=90mADC, TA=25ºC)
0.34
0.35 0.36 0.37 0.38
LED Current (mA)
0.39
34.3
34.6
34.9
35.2
35.5
35.8
36.1
On-resistance (:)
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
Device Count (N)
30
25
20
15
10
5
0
777
IF=50mA
1.2
IF=10mA
IF=5mA
1.0
0.8
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
807
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Typical Turn-Off
vs. LED Forward Current
(IL=90mADC)
0.7
0.6
Turn-Off (ms)
1.4
Turn-On (ms)
LED Forward Voltage Drop (V)
1.6
787 792 797 802
Blocking Voltage (VP)
Typical Turn-On
vs. LED Forward Current
(IL=90mADC)
Typical LED Forward Voltage Drop
vs. Temperature
1.8
782
0.5
0.4
0.3
0.2
0.1
0
0
5
10
15
20
25
30
35
40
LED Forward Current (mA)
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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3
INTEGRATED CIRCUITS DIVISION
CPC1393
PERFORMANCE DATA*
IF=5mA
IF=10mA
-40
-20
0
20
40
60
Temperature (ºC)
80
-20
0
20
40
60
Temperature (ºC)
80
1.0
Typical IF for Switch Dropout
vs. Temperature
(IL=50mADC)
-20
0
20
40
60
Temperature (ºC)
80
2.0
1.5
1.0
Maximum Load Current
vs. Temperature
(IF=2mA)
100
Blocking Voltage (VP)
90
80
70
60
50
40
30
20
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature (ºC)
100
100
30
0
-30
-2.0
-1.0
0
1.0
2.0
Temperature (ºC)
Load Voltage (V)
Typical Blocking Voltage
vs. Temperature
Typical Leakage vs. Temperature
Measured Across Pins 3 & 4
950
0.040
900
0.035
850
0.030
800
750
700
3.0
0.025
0.020
0.015
0.010
650
0.005
-40
120
80
60
-90
-3.0
100
600
10
20
40
60
Temperature (ºC)
-60
-40
100
0
90
Leakage (PA)
-40
-20
Typical Load Current vs. Load Voltage
(IF=2mA, TA=25ºC)
0.0
0.0
30
-40
0.5
0.5
40
100
Load Current (mA)
1.5
50
20
2.5
LED Current (mA)
LED Current (mA)
70
10
3.0
2.0
Typical On-Resistance
vs. Temperature
(IF=2mA, IL=50mADC)
60
-40
2.5
Load Current (mA)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
100
Typical IF for Switch Operation
vs. Temperature
(IL=50mADC)
3.0
Typical Turn-Off vs. Temperature
(IF=5mA, IL=70mADC)
On-resistance (:)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Turn-Off (ms)
Turn-On (ms)
Typical Turn-On vs. Temperature
(IL=70mADC)
-20
0
20
40
60
80
100
Temperature (ºC)
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Load Current (A)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10μs 100μs 1ms 10ms 100ms
Time
1s
10s 100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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R05
INTEGRATED CIRCUITS DIVISION
CPC1393
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1393G / CPC1393GV / CPC1393GR
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1393G / CPC1393GV / CPC1393GR
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R05
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INTEGRATED CIRCUITS DIVISION
CPC1393
MECHANICAL DIMENSIONS
CPC1393G
0.991
(0.039)
PC Board Pattern (Top View)
0.254
(0.010)
3.30 ± 0.050
(0.130 ± 0.002)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
4.572 ± 0.127
(0.180 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
PIN 1
9º (ALL)
9º (ALL)
7.620 ± 0.250
(0.300 ± 0.010)
2.159
(0.085)
0.457 ± 0.076
(0.018 ± 0.003)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
0.508
(0.020)
3.175
(0.125)
2.540 ± 0.127
(0.100 ± 0.005)
Dimensions
mm
(inches)
CPC1393GV
0.254
(0.010)
0.991
(0.039)
3.30 ± 0.050
(0.130 ± 0.002)
PC Board Pattern (Top View)
10.160 ± 0.508
(0.400 ± 0.020)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.050
(0.250 ± 0.002)
4.572 ± 0.050
(0.180 ± 0.002)
9º (ALL)
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.050
(0.100 ± 0.002)
6
2.540 ± 0.127
(0.100 ± 0.005)
10.160 ± 0.127
(0.400 ± 0.005)
Pin 1
9º (ALL)
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
1.778
(0.070)
0.127
(0.005)
Dimensions
mm
(inches)
2.92
(0.115)
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R05
INTEGRATED CIRCUITS DIVISION
CPC1393
CPC1393GR
2.540 ± 0.127
(0.100 ± 0.005)
PCB Land Pattern
3.300 ± 0.050
(0.130 ± 0.002)
0.635 ± 0.254
(0.025 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
9.525
(0.375)
7.620 ± 0.254
(0.300 ± 0.010)
8.80
(0.346)
1.60
(0.063)
PIN #1
0.991
(0.039)
3.480 ± 0.076
(0.137 ± 0.003)
4.572 ± 0.127
(0.180 ± 0.005)
9º ± 1º
(ALL)
2.287
(0.09)
0.95
(0.037)
0.254
(0.010)
2.540 ± 0.127
(0.100 ± 0.005)
Dimensions
mm
(inches)
0.102 min / 0.254 max
(0.004 min / 0.010 max)
2.287 ± 0.127
(0.090 ± 0.005)
CPC1393GRTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00±0.30
(0.630±0.012)
B0=5.00
(0.197)
K0=4.20
(0.165)
K1=3.70
(0.146)
A0=10.01
(0.394)
P=12.00
(0.472)
Dimensions
mm
(inches)
Embossed
Carrier
Embossment
NOTES:
1. All dimensions meet EIA-481-C requirements
2. Unless otherwise noted, tolerances = ±0.10 (0.004)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-CPC1393-R05
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/16/2012