CPC1330GRTR

CPC1330
Single-Pole, Normally Open
4-Pin OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameters
Peak Blocking Voltage
Ratings
350
Units
VP
Load Current
On-Resistance (max)
120
30
mArms / mADC

Description
The CPC1330G is a single-pole normally-open
(1-Form-A) Solid State Relay with an enhanced input
to output isolation barrier of 5000Vrms.
The relay output is constructed with efficient
MOSFET switches that use IXYS Integrated Circuits
Division's patented OptoMOS architecture. The input,
a highly efficient GaAlAS infrared LED, controls the
optically coupled output.
Features
•
•
•
•
•
•
•
•
5000Vrms Input/Output Isolation
350VP Blocking Voltage
100% Solid State
Low Drive Power Requirements (TTL/CMOS
Compatible)
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Small 4-Pin Package
Machine Insertable, Wave Solderable
Approvals
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
Ordering Information
Applications
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Part Number
CPC1330G
CPC1330GR
CPC1330GRTR
Description
4-Pin DIP (100/Tube)
4-Pin Surface Mount (100/Tube)
4-Pin Surface Mount (1000/Reel)
Pin Configuration
+ Control
– Control
1
4
2
3
Load
Load
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
Pb
DS-CPC1330-R05
toff
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1
INTEGRATED CIRCUITS DIVISION
CPC1330
Absolute Maximum Ratings @ 25ºC
Parameter
Peak Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Package Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 3.00 mW / ºC
Ratings
350
5
50
1
100
550
5000
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
mW
Vrms
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current
Continuous
Peak
On-Resistance
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
2
Conditions
Symbol
Min
Typ
-
IL
-
t=10ms
IL=120mA
VL=350VP
ILPK
RON
ILEAK
-
IF=0mA, VL=50V, f=1MHz
ton
toff
COUT
IL=120mA
IF=5mA
VR=5V
-
IF=5mA, VL=10V
Max
Units
-
120
25
-
±350
30
1
mArms / mADC
mAP

-
25
2
1
-
IF
IF
VF
IR
0.2
0.9
-
0.33
0.3
1.2
-
2
1.4
10
mA
mA
V
A
CI/O
-
3
-
pF
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A
ms
pF
R05
INTEGRATED CIRCUITS DIVISION
CPC1330
PERFORMANCE DATA*
Typical Turn-On Time
(N=50, IF=5mA, IL=120mA, TA=25ºC)
35
Device Count (N)
Device Count (N)
30
25
20
15
10
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mA, TA=25ºC)
25
25
20
20
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
15
10
5
15
10
5
5
0
0
LED Forward Voltage Drop (V)
1.00 1.10 1.15
Turn-On (ms)
Typical IF for Switch Operation
(N=50, IL=120mA, TA=25ºC)
Typical IF for Switch Dropout
(N=50, IL=120mA, TA=25ºC)
1.19
1.21
1.23
0.85
1.25
25
25
20
20
15
10
5
0.90
1.20
1.25
0.21
0.29
0.30
0.31 0.32 0.33 0.34
LED Current (mA)
15
10
5
0.26
0.27
25
20
15
10
5
0
0.27
0.35
0.28
0.29
0.30
0.31
0.32
0.33
23.5
24
24.5
25
25.5
26
26.5
On-Resistance (:)
LED Current (mA)
35
0.23 0.24 0.25
Turn-Off (ms)
30
0
0
0.22
Typical On-Resistance Distribution
(N=50, IL=120mA, TA=25ºC)
35
Device Count (N)
1.17
Device Count (N)
Device Count (N)
0
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
Device Count (N)
30
25
20
15
10
5
0
370
I F = 50mA
I F = 30mA
I F = 20mA
I F = 10mA
I F = 5mA
1.2
1.0
0.8
-40
-20
0
20
40
60
Temperature (ºC)
80
100
120
400
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Typical Turn-Off
vs. LED Forward Current
(IL=120mA)
0.7
0.6
Turn-Off (ms)
1.4
Turn-On (ms)
LED Forward Voltage Drop (V)
1.6
380 385 390 395
Blocking Voltage (VP)
Typical Turn-On
vs. LED Forward Current
(IL=120mA)
Typical LED Forward Voltage Drop
vs. Temperature
1.8
375
0.5
0.4
0.3
0.2
0.1
0
0
5
10
15
20
25
30
35
40
LED Forward Current (mA)
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R05
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3
INTEGRATED CIRCUITS DIVISION
CPC1330
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
I F = 5mA
I F = 10mA
-40
-20
0
20
40
60
Temperature (ºC)
80
0
80
0.4
0.4
0.2
0
-40
-20
0
20
40
60
80
100
10
-40
20
40
60
Temperature (ºC)
80
0
-50
-100
-40
-20
0
20
40
60
80
-150
100
Temperature (ºC)
Temperature (ºC)
-1
0
1
Load Voltage (V)
Maximum Load Current
vs. Temperature
Typical Blocking Voltage
vs. Temperature
Typical Leakage vs. Temperature
Measured Across Pins 3 & 4
400
0.016
395
0.014
120
100
I F = 10mA
80
I F = 2mA
60
40
390
385
380
375
20
370
0
365
0
20
40
60
80
Temperature (ºC)
100
Leakage (PA)
140
-3
-2
2
3
0.012
0.010
0.008
0.006
0.004
0.002
-40
120
100
50
160
-20
0
100
180
-40
-20
150
0.6
0
20
Typical Load Current
vs. Load Voltage
(IF=5mA, TA=25ºC)
0.8
0.2
30
100
Load Current (mA)
LED Current (mA)
0.6
40
0
20
40
60
Temperature (ºC)
1.0
0.8
50
Typical IF for Switch Dropout
vs. Temperature
(IL=80mA)
1.2
Blocking Voltage (VP)
LED Current (mA)
I F = 5mA
-20
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=80mA)
60
I F = 10mA
-40
1.0
Load Current (mA)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
100
Typical IF for Switch Operation
vs. Temperature
(IL=80mA)
1.2
Typical Turn-Off vs. Temperature
(IL=80mA)
On-Resistance (:)
Typical Turn-On vs. Temperature
(IL=80mA)
Turn-Off (ms)
Turn-On (ms)
PERFORMANCE DATA*
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Load Current (A)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10μs 100μs 1ms 10ms 100ms
1s
10s 100s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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R05
INTEGRATED CIRCUITS DIVISION
CPC1330
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1330G / CPC1330GR
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1330G / CPC1330GR
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R05
e3
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5
INTEGRATED CIRCUITS DIVISION
CPC1330
MECHANICAL DIMENSIONS
CPC1330G
0.991
(0.039)
PC Board Pattern (Top View)
0.254
(0.010)
3.30 ± 0.050
(0.130 ± 0.002)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
4.572 ± 0.127
(0.180 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
PIN 1
9º (ALL)
9º (ALL)
7.620 ± 0.250
(0.300 ± 0.010)
2.159
(0.085)
0.457 ± 0.076
(0.018 ± 0.003)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
0.508
(0.020)
3.175
(0.125)
2.540 ± 0.127
(0.100 ± 0.005)
Dimensions
mm
(inches)
CPC1330GR
2.540 ± 0.127
(0.100 ± 0.005)
PCB Land Pattern
3.300 ± 0.050
(0.130 ± 0.002)
0.635 ± 0.254
(0.025 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
9.525
(0.375)
7.620 ± 0.254
(0.300 ± 0.010)
8.80
(0.346)
1.60
(0.063)
PIN #1
0.991
(0.039)
9º ± 1º
(ALL)
2.287
(0.09)
3.480 ± 0.076
(0.137 ± 0.003)
4.572 ± 0.127
(0.180 ± 0.005)
0.254
(0.010)
0.95
(0.037)
2.540 ± 0.127
(0.100 ± 0.005)
2.287 ± 0.127
(0.090 ± 0.005)
6
0.102 min / 0.254 max
(0.004 min / 0.010 max)
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Dimensions
mm
(inches)
R05
INTEGRATED CIRCUITS DIVISION
CPC1330
CPC1330GRTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00±0.30
(0.630±0.012)
B0=5.00
(0.197)
K0=4.20
(0.165)
K1=3.70
(0.146)
A0=10.01
(0.394)
P=12.00
(0.472)
Dimensions
mm
(inches)
Embossed
Carrier
Embossment
NOTES:
1. All dimensions meet EIA-481-C requirements
2. Unless otherwise noted, tolerances = ±0.10 (0.004)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-CPC1330-R05
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012