CPC1390

CPC1390
Single Pole, Normally Open
4-Pin OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Peak Blocking Voltage
Rating
400
Units
VP
Load Current
On-Resistance (max)
140
22
mArms / mADC

Description
The CPC1390G is a single-pole normally-open
(1-Form-A) Solid State Relay with an enhanced input
to output isolation barrier of 5000Vrms.
The relay output is constructed with efficient
MOSFET switches that use IXYS Integrated Circuits
Division's patented OptoMOS architecture. The input,
a highly efficient GaAlAS infrared LED, controls the
optically coupled output.
Features
•
•
•
•
•
•
•
•
5000Vrms Input/Output Isolation
400VP Blocking Voltage
100% Solid State
Low Drive Power Requirements (TTL/CMOS
Compatible)
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Small 4-Pin Package
Machine Insertable, Wave Solderable
Approvals
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
Ordering Information
Applications
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Part Number
CPC1390G
CPC1390GV
CPC1390GR
CPC1390GRTR
Description
4-Pin DIP (100/Tube)
4-Pin DIP V-Bend (100/Tube)
4-Pin Surface Mount (100/Tube)
4-Pin Surface Mount (1000/Reel)
Pin Configuration
+ Control
– Control
1
4
2
3
Load
Load
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
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DS-CPC1390-R07
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1
INTEGRATED CIRCUITS DIVISION
CPC1390
Absolute Maximum Ratings @ 25ºC
Parameter
Peak Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Package Dissipation 2
Isolation Voltage, Input to Output, 60 sec.
ESD Rating, Human Body Model
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 3.00 mW / ºC
Ratings
400
5
50
1
100
550
5000
8
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
mW
Vrms
kV
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current
Continuous 1
Peak
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate 3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
-
IL
-
-
140
t=10ms
IF=2mA, IL=140mA
VL=400VP
ILPK
RON
ILEAK
-
14
-
±400
22
1
mArms / mADC
mAP

IF=0mA, VL=50V, f=1MHz
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COUT
-
0.525
0.42
13
1
1
-
IL=140mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.2
0.9
-
0.4
1.2
-
2
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
IF=10mA, VL=10V
A
ms
pF
1
Load current derates linearly from 140mA @ 25ºC to 70mA @ 85ºC.
Measurement taken within one second of turn-on time.
3 For applications requiring high-temperature operation (T >60ºC), a LED current of 4mA is recommended.
A
2
2
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INTEGRATED CIRCUITS DIVISION
CPC1390
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
35
20
Typical Turn-On Time
(N=50, IF=10mA, IL=140mA, TA=25ºC)
30
25
20
15
10
Device Count (N)
25
Device Count (N)
Device Count (N)
30
15
10
5
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
10
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=140mADC, TA=25ºC)
Typical IF for Switch Operation
(N=50, IL=140mA, TA=25ºC)
25
0.33
0.420 0.455 0.490 0.525 0.560 0.595 0.630
Turn-On Time (ms)
Device Count (N)
20
15
10
5
35
35
30
30
25
20
15
10
5
0
0.30
0.35 0.40 0.45
LED Current (mA)
0.50
13.5
14.0
14.5
15.0
1.4
1.2
IF=50mA
1.0
IF=10mA
IF=5mA
4
3
2
120
1.4
Turn-On Time (ms)
1.0
0.8
0.6
0.4
20
30
LED Current (mA)
40
-20
0
20
40
60
Temperature (ºC)
80
100
0.41
0.40
0
Typical Turn-On Time
vs. Temperature
(IL=70mA)
2.5
10
20
30
LED Current (mA)
40
50
Typical Turn-Off Time
vs. Temperature
(IL=70mA)
0.9
IF=2mA
IF=5mA
IF=10mA
0.8
2.0
1.5
1.0
0.7
0.6
IF=2mA
IF=5mA
IF=10mA
0.5
0.4
0.3
0.2
0
-40
0.42
50
0.5
0.2
486.5
0.38
10
3.0
1.2
477.5
0.39
0
Typical IF for Switch Operation
(IL=70mA)
468.5
0.43
Turn-Off Time (ms)
100
459.5
Typical Turn-Off Time
vs. LED Forward Current
(IL=70mA, TA=25ºC)
0.44
0
20
40
60
80
Temperature (ºC)
10
Blocking Voltage (VP)
1
0.8
0
15
441.5 450.5
Turn-Off Time (ms)
5
Turn-On Time (ms)
1.6
-20
20
15.5
Typical Turn-On Time
vs. LED Forward Current
(IL=70mA, TA=25ºC)
Typical LED Forward Voltage Drop
vs. Temperature
-40
25
On-resistance (:)
6
0.47
0
13.0
0.55
1.8
0.38 0.40 0.42 0.45
Turn-Off Time (ms)
5
0
0.25
0.35
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
Device Count (N)
1.17
Device Count (N)
15
0
0
0
LED Forward Voltage Drop (V)
20
5
5
LED Current (mA)
Typical Turn-Off Time
(N=50, IF=10mA, IL=140mA, TA=25ºC)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.1
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R07
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3
INTEGRATED CIRCUITS DIVISION
CPC1390
PERFORMANCE DATA*
10
5
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
180
100
160
50
0
-50
60
Leakage (PA)
Blocking Voltage (VP)
475
0.030
460
455
160
0.025
0.020
0.015
0.010
0
-40
-40
-20
0
20
40
60
80
100
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
-40
Typical Leakage vs. Temperature
Measured Across Pins 3 & 4
(VL=400V)
0.005
450
100
-150
-2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 2.5
Load Voltage (V)
0.035
465
120
80
480
Maximum Load Current
vs. Temperature
(IF=2mA)
140
-100
Typical Blocking Voltage
vs. Temperature
470
Load Current (mA)
15
150
Output Capacitance (pF)
20
Typical Load Current vs. Load Voltage
(IF=2mA, TA=25ºC)
Load Current (mA)
On-Resistance (:)
25
Typical On-Resistance
vs. Temperature
(IF=2mA, IL=100mA Instantaneous)
-20
0
20
40
60
80
Temperature (ºC)
100
120
Output Capacitance vs. Load Voltage
(IF=0mA, f=1MHz, TA=25ºC)
140
120
100
80
60
40
20
0
0
50
100
150
Load Voltage (V)
200
Energy Rating Curve
1.2
Load Current (A)
1.0
0.8
0.6
0.4
0.2
0
10Ps 100Ps 1ms 10ms 100ms
1s
10s 100s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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R07
INTEGRATED CIRCUITS DIVISION
CPC1390
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1390G / CPC1390GV / CPC1390GR
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1390G / CPC1390GV / CPC1390GR
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
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5
INTEGRATED CIRCUITS DIVISION
CPC1390
MECHANICAL DIMENSIONS
CPC1390G
0.991
(0.039)
PC Board Pattern (Top View)
0.254
(0.010)
3.30 ± 0.050
(0.130 ± 0.002)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
4.572 ± 0.127
(0.180 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
PIN 1
9.144 ± 0.508
(0.360 ± 0.020)
9º (ALL)
9º (ALL)
7.620 ± 0.250
(0.300 ± 0.010)
2.159
(0.085)
0.457 ± 0.076
(0.018 ± 0.003)
6.350 ± 0.127
(0.250 ± 0.005)
0.508
(0.020)
3.175
(0.125)
2.540 ± 0.127
(0.100 ± 0.005)
Dimensions
mm
(inches)
CPC1390GV
0.254
(0.010)
0.991
(0.039)
3.30 ± 0.050
(0.130 ± 0.002)
PC Board Pattern (Top View)
10.160 ± 0.508
(0.400 ± 0.020)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.050
(0.250 ± 0.002)
4.572 ± 0.050
(0.180 ± 0.002)
9º (ALL)
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.050
(0.100 ± 0.002)
6
2.540 ± 0.127
(0.100 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
10.160 ± 0.127
(0.400 ± 0.005)
Pin 1
9º (ALL)
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
1.778
(0.070)
0.127
(0.005)
Dimensions
mm
(inches)
2.92
(0.115)
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R07
INTEGRATED CIRCUITS DIVISION
CPC1390
CPC1390GR
2.540 ± 0.127
(0.100 ± 0.005)
PCB Land Pattern
3.300 ± 0.050
(0.130 ± 0.002)
0.635 ± 0.254
(0.025 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
9.525
(0.375)
7.620 ± 0.254
(0.300 ± 0.010)
8.80
(0.346)
1.60
(0.063)
PIN #1
0.991
(0.039)
9º ± 1º
(ALL)
2.287
(0.09)
3.480 ± 0.076
(0.137 ± 0.003)
4.572 ± 0.127
(0.180 ± 0.005)
0.95
(0.037)
0.254
(0.010)
2.540 ± 0.127
(0.100 ± 0.005)
2.287 ± 0.127
(0.090 ± 0.005)
Dimensions
mm
(inches)
0.102 min / 0.254 max
(0.004 min / 0.010 max)
CPC1390GRTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00±0.30
(0.630±0.012)
B0=5.00
(0.197)
K0=4.20
(0.165)
K1=3.70
(0.146)
A0=10.01
(0.394)
P=12.00
(0.472)
Dimensions
mm
(inches)
Embossed
Carrier
Embossment
NOTES:
1. All dimensions meet EIA-481-C requirements
2. Unless otherwise noted, tolerances = ±0.10 (0.004)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-CPC1390-R07
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/16/2012