MIL-PRF-38534 & 38535 CERTIFIED FACILITY
M.S.KENNEDY CORP.
600V/600A
HALF BRIDGE PEM
4803
FEATURES:
Half Bridge Configuration
600V Rated Voltage
600A Continuous Output Current
Internal Zener Clamps on Gates
Encapsulation Provides Near Hermetic Performance
HI-REL Screening Available (Modified 38534)
Light Weight Domed ALSIC Baseplate
Robust Mechanical Design for Hi-Rel Applications
Ultra-Low Inductance Internal Layout
Withstands 96 Hours HAST and Thermal Cycling (-55°C to +125°C)
High Side Collector Sense Pin for De-Sat Detection
DESCRIPTION:
The MSK4803 is one of a family of plastic encapsulated modules (PEM) developed specifically for use in military,
aerospace and other severe environment applications. The half bridge configuration and 600 volt/600 amp rating make it
ideal for use in high current motor drive and inverter applications. The Aluminum Silicon Carbide (AlSiC) baseplate offers
superior flatness and light weight; far better than the copper or copper alloys found in most high power plastic modules.
The high thermal conductivity materials used to construct the MSK4803 allow high power outputs at elevated baseplate
temperatures.
EQUIVALENT SCHEMATIC
TYPICAL APPLICATIONS
Motor Drives
Inverters
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8548-121 Rev. C 9/14
ABSOLUTE MAXIMUM RATING
VCE
VGE
IOUT
I OUTP
VCASE
Collector to Emitter Voltage
Gate to Emitter Voltage
Current (Continuous)
Current Pulsed (1mS)
Case Isolation Voltage
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8
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TST
TJ
TC
600V
±20V
600A
1200A
2500 V
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Storage Temperature Range 9 -55°C to +125°C
Junction Temperature
150°C
Case Operating Temperature Range
MSK4803H
-55°C to +125°C
MSK4803
-40°C to +85°C
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ELECTRICAL SPECIFICATIONS
NOTES:
1
2
3
4
5
6
7
8
9
Guaranteed by design but not tested. Typical parameters are representative of actual device performance but are for reference only.
Industrial grade devices shall be tested to subgroup 1 unless otherwise specified.
HI-REL grade devices ("H" suffix) shall be 100% tested to subgroups 1, 2 and sample tested to subgroup 3.
Subgroups 4 testing available upon request.
Subgroup 1, 4 TA = +25°C
2
TA = +125°C
3
TA = -55°C
All specifications apply to both the upper and lower sections of the half bridge.
VGE=15V unless otherwise specified.
Continuous operation at or above absolute maximum ratings may adversly effect the device performance and/or life cycle
Internal solder reflow temperature is 180°C, do not exceed.
2
8548-121 Rev. C 9/14
APPLICATION NOTES
THERMAL CALCULATIONS
Power dissipation and maximum allowable temperature rise involve many variables working together. Collector current,
PWM duty cycle and switching frequency all factor into power dissipation. DC losses or "ON-TIME" losses are simply
VCE(SAT) x Collector Current x PWM duty cycle. For the MSK4803, VCE(SAT)=2.5V max., and at 600 amps and a PWM
duty cycle of 30%, DC losses equal 450 watts. Switching losses vary proportionally with switching frequency. The MSK4803
typical switching losses at VCE=300V and ICE=600A are about 98mJ, which is simply the sum of the turn-on switching
loss and the turn-off switching loss. Multiplying the switching frequency times the switching losses will result in a power
dissipation number for switching. The MSK4803, at 5KHz, will exhibit switching power dissipation of 490 watts. The total
losses are the sum of DC losses plus switching losses, or in this case, 940 watts total. 940 watts x 0.09°C/W thermal
resistance equals 85 degrees of temperature rise between the case and the junction. Subtracting 85°C from the maximum
junction temperature of 150°C equals 65°C maximum case temperature for this example.
VCE(SAT) x IC x PWM duty cycle = 2.5V x 600 amps x 30% = 450 watts DC losses
Turn-on switching loss + Turn-off switching loss = Total switching losses = 2.5 + 73 = 98mJ
Total switching loss x PWM frequency = Total switching power dissipation = 98mJ x 5KHz = 490 watts
Total power dissipation = DC losses + switching losses = 450 + 490 = 940 watts
Junction temperature rise above case = Total power dissipation x thermal resistance
940 watts x 0.09°C/W = 84.6°C temperature rise above case
Maximum junction temperature - junction temperature rise = maximum baseplate temperature
150°C - 85°C = 65°C
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8548-121 Rev. C 9/14
TYPICAL PERFORMANCE CURVES
4
8548-121 Rev. C 9/14
SCREENING CHART
5
8548-121 Rev. C 9/14
MECHANICAL SPECIFICATIONS
WEIGHT = 250 GRAMS MAX.
ALL DIMENSIONS ARE SPECIFIED IN INCHES
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8548-121 Rev. C 9/14
MECHANICAL SPECIFICATIONS CONT'D
ALL DIMENSIONS ARE SPECIFIED IN INCHES
MSK4803 H
ORDERING INFORMATION
SCREENING
BLANK=INDUSTRIAL; H=HI-REL (MODIFIED 38534)
GENERAL PART NUMBER
THE ABOVE EXAMPLE IS A HI-REL SCREENED MODULE.
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8548-121 Rev. C 9/14
REVISION HISTORY
M.S. Kennedy Corp.
Phone (315) 701-6751
FAX (315) 701-6752
www.mskennedy.com
The information contained herein is believed to be accurate at the time of printing. MSK reserves the right to make
changes to its products or specifications without notice, however, and assumes no liability for the use of its products.
Please visit our website for the most recent revision of this datasheet.
8
8548-121 Rev. B 4/14