IX3180 2.5A Output Current High Speed Gate Driver Optocoupler INTEGRATED CIRCUITS DIVISION Features Description • 2.5A Maximum Peak Output Current • 20ns Typical Pulse Width Distortion • 10kV/µs Minimum Common Mode Rejection (CMR) at 1500VCM • Wide Operating Voltage Range: 10V to 20V • Under Voltage Lockout with Hysteresis • 3750Vrms Input to Output Isolation • Wide Temperature Range: -40°C to +100°C • 200ns Maximum Propagation Delay Over Temperature Range The IX3180 is a high speed MOSFET gate drive optocoupler. It consists of an input infrared LED that is optically coupled to an integrated power gate driver that is capable of sourcing and sinking 2.5A of peak current. The IX3180 is ideally suited for high frequency driving of power MOSFETs used in high performance DC/DC converters, motor control inverter applications, and high performance switching power supplies. Applications • • • • The IX3180 is available in an 8-pin DIP package and an 8-pin surface mount package. Approvals Isolated Power MOSFET Gate Drive Switch Mode Power Supplies Industrial Inverters Motor Drivers • UL Recognized Component: File E76270 Ordering Information Part Description IX3180G 8-Pin DIP Package (50/Tube) IX3180GS 8-Pin Surface Mount (50/Tube) IX3180GSTR 8-Pin Surface Mount Tape & Reel (1000/Reel) Figure 1. IX3180 Block Diagram N/C 1 8 VCC ANODE 2 7 VO CATHODE 3 6 VO N/C 4 5 VEE Note: A 0.1F bypass capacitor must be connected between pins 5 & 8. DS-IX3180-R02 www.ixysic.com 1 IX3180 INTEGRATED CIRCUITS DIVISION 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings @ 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Specifications (DC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Switching Characteristics (AC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Package Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 4 4 5 5 2. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3. Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.5 Package Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.5.1 IX3180G 8-Pin DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.5.2 IX3180GS 8-Pin Surface Mount . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.5.3 IX3180GSTR Tape & Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2 www.ixysic.com R02 IX3180 INTEGRATED CIRCUITS DIVISION 1. Specifications 1.1 Package Pinout N/C ANODE CATHODE N/C 1.2 Pin Description 8 1 2 7 3 6 4 5 VCC VO VO VEE Pin# Name 1 N/C Description No connection 2 ANODE 3 CATHODE Anode of input LED 4 N/C No connection 5 VEE Negative Supply Voltage 6 VO Gate Drive Output 7 VO Gate Drive Output 8 VCC Positive Supply Voltage Cathode of input LED 1.3 Absolute Maximum Ratings @ 25°C Parameter Symbol Limit Units Supply Voltage VCC - VEE -0.5 to 25 V Output Voltage VO(PEAK) 0 to VCC V “High” Peak Output Current 1 IOH(PEAK) - 2.5 A “Low” Peak Output Current 1 IOL(PEAK) 2.5 A Reverse Input Voltage VR 5 V Average Input Current IF(AVG) 20 mA Peak Transient Input Current (<1s pulse width, 300pps) IF(TRAN) 1 A Input Power Dissipation 2 PIN 70 mW Total Power Dissipation 3 PT 800 mW Isolation Voltage, Input to Output VIO 3750 Vrms Operating Temperature TA -40 to +100 °C TSTG -55 to +125 °C Storage Temperature Notes: 1 Maximum pulse width=10s, maximum duty cycle=0.2%. 2 Derate linearly 0.66mW/°C 3 Derate linearly 7.5mW/°C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. R02 www.ixysic.com 3 IX3180 INTEGRATED CIRCUITS DIVISION 1.4 Recommended Operating Conditions Parameter Symbol Min Max Units VCC - VEE 10 20 V Input Current (ON) IF(on) 10 16 mA Input Voltage (OFF) VF(off) -3.6 0.8 V TA -40 100 °C Power Supply Voltage Operating Temperature 1.5 Electrical Specifications (DC) Over recommended operating conditions unless otherwise specified. Typical values are at TA=25°C. Parameter Conditions High Level Output Current VO=(VCC-4V) 1 VO=(VCC-10V) 2 Low Level Output Current VO=(VEE+2.5V) 1 VO=(VEE+10V) 2 Symbol IOH IOL Min Typ Max - 0.5 - - -2 - - 0.5 - - 2 - - Units A A High Level Output Voltage IO=-100mA VOH VCC- 1 - - V Low Level Output Voltage IO=100mA VOL - - 0.5 V High Level Supply Current Output Open, IF=10 to 16mA ICCH - 3 6 Low Level Supply Current Output Open, VF=- 3 to +0.8V ICCL - 3 6 Threshold Input Current, Low-to-High IO=0mA, VO>5V IFLH - - 8 mA Threshold Input Voltage, High-to-Low - VFHL 0.8 - - V Input Forward Voltage IF=10mA VF 1 1.35 1.7 V Temperature Coefficient of Forward Voltage IF=10mA VF/TA - -1.4 - mV/°C Input Reverse Breakdown Voltage IR=10A BVR 5 - - V f=1MHz, VF=0V CIN - 30 - pF VUVLO+ - 8.7 - VUVLO- - 8.1 - UVLOHYS - 0.6 - Input Capacitance UVLO Threshold UVLO Hysteresis 1 2 VO>5V, IF=10mA VO>5V, IF=10mA mA V V Maximum pulse width = 50s, maximum duty cycle = 0.5%. Maximum pulse width = 10s, maximum duty cycle = 0.2%. See “Test Circuits” on page 8 for more information. 4 www.ixysic.com R02 IX3180 INTEGRATED CIRCUITS DIVISION 1.6 Switching Characteristics (AC) Over recommended operating conditions, unless otherwise specified. Parameter Conditions Propagation Delay Time to High Output Level Propagation Delay Time to Low Output Level Pulse Width Distortion Symbol Min Typ Max tPLH 50 85 200 tPHL 50 100 200 PWD |tPHL-tPLH| - 20 65 PDD (tPHL-tPLH) -90 - 90 tr - 25 - tf - 25 - RG=10, CG=10nF f=250kHz, Duty Cycle=50% Propagation Delay Difference Between any Two Parts1 Rise Time Fall Time UVLO Turn-On Delay VO>5V, IF=10mA tUVLO(on) - 2 - UVLO Turn-Off Delay VO<5V, IF=10mA tUVLO(off) - 0.3 - Output High Level Common Mode Transient Immunity IF=10 to 16mA, VCM=1500V, VCC=20V, TA=25°C |CMH| 10 - - Output Low Level Common Mode Transient Immunity VF=0V, VCM=1500V, VCC=20V, TA=25°C |CML| 1 Units ns s kV/s 10 - - The difference between tPHL and tPLH of any two IX3180 devices operating under the same conditions and temperature. Figure 2. Timing Waveforms IF tr tf 90% 50% VOUT 10% tPHL tPLH 1.7 Package Characteristics Parameter Conditions Symbol Rating Units - VISO 3750 Vrms Input-Output Momentary Withstand Voltage RH < 50%, t = 1 min, TA = 25°C VISO 3750 Vrms Resistance (Input-Output), Typical VI-O = 500VDC RI-O 1012 Capacitance (Input-Output), Typical f = 1 MHz CI-O 0.6 pF Isolation Test Voltage R02 www.ixysic.com 5 IX3180 INTEGRATED CIRCUITS DIVISION 2. Performance Data VOH vs. Temperature IOH vs. Temperature VOH vs. IOH (IOH= -100mA, IF=10mA to 16mA, VCC=10V to 20V, VEE=0V) (IF=10mA, VOUT=VCC-4V, VCC=10V, VEE=0V) (IF=10mA, VCC=10V, VEE=0V) 3.5 0 Output Voltage Drop = VOH-VCC (V) 0.20 3.0 Output Current (A) VCC-VOH (V) 0.15 0.10 0.05 2.5 2.0 1.5 1.0 0.5 -40 -20 0 20 40 60 Temperature (ºC) 80 -25 0 25 50 75 Temperature (ºC) 100 0.5 1.0 1.5 2.0 Output Current (A) 2.5 VOL vs. Temperature IOL vs. Temperature VOL vs. IOL (VF(off)=-3V to 0.8V, VOUT=2.5V, VCC=10V, VEE=0V) (VF(off)=-3V to 0.8V, VCC=10V, VEE=0V) 3.0 0.10 0.05 2.0 1.5 1.0 0.5 0.0 0.00 -40 -20 0 20 40 60 Temperature (ºC) 80 -25 0 25 50 75 Temperature (ºC) 100 Supply Current - ICC vs. Supply Voltage - VCC (VCC=20V, VEE=0V) (TA=25ºC, VEE=0V) 20 40 60 Temperature (ºC) 80 2 3.5 2.5 2.0 1.5 10 100 12 14 16 VCC (V) 18 20 -40 22 250 250 200 200 200 100 tPLH 150 tPHL 100 25 80 100 tPHL tPLH 50 0 0 20 20 40 60 Temperature (ºC) 150 100 tPLH 50 0 tP (ns) tP (ns) tPHL 0 (IF=10mA, VCC=20V, VEE=0V, RG=10Ω, CG=10nF, f=250kHz) (VCC=20V, VEE=0V, RG=10Ω, CG=10nF, f=250kHz, Duty Cycle=50%) 250 150 -20 Propagation Delay vs. Temperature Propagation Delay vs. IF Propagation Delay vs. VCC (IF=10mA, RG=10Ω, CG=10nF, f=250kHz, Duty Cycle=50%) VCC (V) 3.0 3.0 ICCL (IF=0mA) 0 0 15 1.5 2.0 2.5 Output Current (A) (VCC=10V to 20V, VEE=0V, Output=Open) 1 1 10 1.0 3.5 IFLH (mA) ICC (mA) 2 50 0.5 IF Low-to-high Threshold vs. Temperature 3 ICCL (IF=0mA) 0 1 ICCH (IF=10mA) ICCH (IF=10mA) -20 2 0.0 4 3 -40 TA= 100ºC TA= 25ºC TA= -40ºC 3 125 ICC vs. Temperature 4 4 0 -50 100 3.0 5 Output Voltage Drop = VOL (V) Output Current (A) VOL (V) 0.0 (IOL= 100mA, VF(off)=-3V to 0.8V, VCC=10V to 20V, VEE=0V) 0.15 ICC Supply Current (mA) -4 125 2.5 Propagation Delay (ns) -3 -5 -50 100 0.20 6 -2 0.0 0.00 TA= -40ºC TA= 25ºC TA= 100ºC -1 8 10 12 14 IF (mA) www.ixysic.com 16 18 -40 -20 0 20 40 60 Temperature (ºC) 80 100 R02 IX3180 INTEGRATED CIRCUITS DIVISION Propagation Delay vs. RG Propagation Delay vs. CG (VCC=20V, IF=10V, CG=10nF, f=250kHz, Duty Cycle=50%) (VCC=20V, IF=10mA, RG=10Ω, f=250kHz, Duty Cycle=50%) 130 110 tPHL 90 tPLH 70 25 130 20 110 tPHL 90 tPLH 70 50 50 10 15 20 25 30 35 RG (Ω) 40 45 Transfer Characteristic 150 VO - Output Voltage (V) Propagation Delay (ns) Porpagation Delay (ns) 150 5 50 10 15 CG (nF) 20 25 15 10 5 0 0 1 2 3 4 IF - Forward LED Current (mA) 5 Input Current vs. Forward Voltage (TA=25ºC) Input Current (mA) 50 40 30 20 10 0 0.8 R02 0.9 1.0 1.1 1.2 1.3 Forward Voltage (V) www.ixysic.com 1.4 1.5 7 IX3180 INTEGRATED CIRCUITS DIVISION 3. Test Circuits 1 8 1 0.1μF IF=10 to 16mA 2 + 7 2 + 3 8 0.1μF 4V 2.5V - 6 3 6 5 4 8 2 - + 5 1 8 0.1μF 0.1μF IF=10 to 16mA VCC=10 to 20V IOL Test Circuit IOH Test Circuit 1 + - IOH 4 IOL 7 VCC=10 to 20V 7 VOH 2 + 3 6 4 5 100mA 7 VCC=10 to 20V + - 3 6 4 5 VCC=10 to 20V VOL 100mA VOH Test Circuit 1 VOL Test Circuit 8 IF 1 8 0.1μF 2 0.1μF IF=10mA 7 3 6 VO>5V 4 2 + - - 3 VCC=10 to 20V 6 VCC VO>5V 5 4 IFLH Test Circuit 5 UVLO Test Circuit 1 2 + - 8 + 0.1μF IF=10 to 16mA 10kHz 50% Duty Cycle 7 + - 7 VO 500Ω 3 6 4 5 VCC=20V RG 10Ω CG 10nF tPLH, tPHL, tr, tf Test Circuit 8 www.ixysic.com R02 IX3180 INTEGRATED CIRCUITS DIVISION 4. Manufacturing Information 4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating IX3180G / IX3180GS MSL 1 4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 4.3 Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time Maximum Reflow Cycles IX3180G / IX3180GS 250°C for 30 seconds 3 4.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. R02 www.ixysic.com 9 IX3180 INTEGRATED CIRCUITS DIVISION 4.5 Package Mechanical Dimensions 4.5.1 IX3180G 8-Pin DIP 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 3.302 ± 0.051 (0.130 ± 0.002) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.127 (0.300 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) 4.5.2 IX3180GS 8-Pin Surface Mount 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 3.302 ± 0.051 (0.130 ± 0.002) 0.635 ± 0.127 (0.025 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) 10 www.ixysic.com R02 IX3180 INTEGRATED CIRCUITS DIVISION 4.5.3 IX3180GSTR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=16.00 (0.63) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IX3180-R02 ©Copyright 2015, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/6/2015 R02 www.ixysic.com 11