IX3120

IX3120
2.5A Output Current Gate Driver
Optocoupler
INTEGRATED CIRCUITS DIVISION
Features
Description
• 2.5A Maximum Peak Output Current
• 25kV/µs Minimum Common Mode Rejection (CMR)
at 1500VCM
• Wide Operating Voltage Range: 15V to 30V
• Under Voltage Lockout with Hysteresis
• 3750Vrms Input to Output Isolation
• Wide Temperature Range: -40°C to +100°C
The IX3120 gate driver includes an input infrared LED
that is optically coupled to a power output stage. The
power output stage is capable of sourcing or sinking
2A of peak current, which is ideal for driving IGBTs
and MOSFETs in the mid-power range.
The gate driver optocoupler with its low input LED
current, high output peak current, and high noise
immunity (25kV/s) is ideally suited for use in motor
control and inverter applications.
Applications
•
•
•
•
Isolated IGBT/MOSFET Gate Drive
Switch Mode Power Supplies
Industrial Inverters
Motor Drivers
The IX3120 is provided in an 8-pin DIP package and
an 8-pin surface mount package.
Approvals
• UL Recognized Component: File E76270
• IEC/EN/DIN EN 60747-5-5 (“GE” Versions)
Ordering Information
Part
Description
IX3120G
8-Pin DIP Package (50/Tube)
IX3120GS
8-Pin Surface Mount (50/Tube)
IX3120GSTR
8-Pin Surface Mount Tape & Reel (1000/Reel)
IX3120GE
8-Pin DIP Package (50/Tube), IEC 60747-5-5 Option
IX3120GES
8-Pin Surface Mount (50/Tube), IEC 60747-5-5 Option
IX3120GESTR
8-Pin Surface Mount Tape & Reel (1000/Reel), IEC 60747-5-5 Option
Figure 1. IX3120 Block Diagram
TRUTH TABLE
N/C
ANODE
CATHODE
N/C
1
2
3
4
DS-IX3120-R04
8
7
6
5
VCC
VO
VO
LED
VCC-VEE
Positive Going
(i.e. Turn-On)
VCC-VEE
Negative Going
(i.e. Turn-Off)
VO
OFF
0V - 30V
0V - 30V
LOW
ON
0V - 11V
0V - 9.5V
LOW
ON
11V - 13.5V
9.5V - 12V
TRANSITION
ON
13.5V - 30V
12V - 30V
HIGH
VEE
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Note: A 0.1μF bypass capacitor must
be connected between pins 5 and 8.
1
INTEGRATED CIRCUITS DIVISION
IX3120
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Electrical Specifications (DC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Switching Characteristics (AC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 Safety and Insulation Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
3
4
4
5
6
2. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5 Package Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5.1 IX3120G & IX3120GE 8-Pin DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5.2 IX3120GS & IX3120GES 8-Pin Surface Mount . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5.3 IX3120GSTR & IX3120GESTR Tape & Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6 Device Branding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
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10
10
10
10
10
11
11
11
12
12
R04
INTEGRATED CIRCUITS DIVISION
IX3120
1. Specifications
1.1 Package Pinout
N/C
ANODE
CATHODE
N/C
1.2 Pin Description
8
1
2
7
3
6
4
5
VCC
VO
VO
VEE
Pin#
Name
1
N/C
Description
No connection
2
ANODE
3
CATHODE
Anode of input LED
4
N/C
No connection
5
VEE
Negative Supply Voltage
6
VO
Gate Drive Output
7
VO
Gate Drive Output
8
VCC
Positive Supply Voltage
Cathode of input LED
1.3 Absolute Maximum Ratings
Absolute maximum ratings are at 25°C.
Parameter
Symbol
Limit
Units
Supply Voltage
VCC - VEE
0 to 35
V
Output Voltage
VO(PEAK)
0 to VCC
V
1
IOH(PEAK)
- 2.5
A
“Low” Peak Output Current 1
IOL(PEAK)
2.5
A
Reverse Input Voltage
VR
5
V
Average Input Current
IF(AVG)
20
mA
Peak Transient Input Current
(<1s pulse width, 300pps)
IF(TRAN)
1
A
Input Power Dissipation 2
PIN
50
mW
Total Power Dissipation 3
PT
800
mW
Isolation Voltage, Input to Output
VIO
3750
Vrms
Operating Temperature
TA
-40 to +100
°C
TSTG
-55 to +125
°C
“High” Peak Output Current
Storage Temperature
Notes:
1 Maximum pulse width=10s, maximum duty cycle=0.2%.
2
Derate linearly 1.33mW/°C
3
Derate linearly 7.5mW/°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
R04
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3
INTEGRATED CIRCUITS DIVISION
IX3120
1.4 Recommended Operating Conditions
Parameter
Symbol
Min
Max
Units
VCC - VEE
15
30
V
Input Current (ON)
IF(on)
7
16
mA
Input Voltage (OFF)
VF(off)
-3.6
0.8
V
TA
-40
100
°C
Power Supply Voltage
Operating Temperature
1.5 Electrical Specifications (DC)
Over recommended operating conditions unless otherwise specified. Typical values are at TA=25°C,VCC=30V, and
VEE=Ground.
Parameter
Conditions
High Level Output Current
VO=(VCC-4V) 1
VO=(VCC-15V) 2
Low Level Output Current
VO=(VEE+2.5V) 1
VO=(VEE+15V) 2
Symbol
IOH
IOL
Min
Typ
Max
- 0.5
-1.5
-
-2
-
-
0.5
1.4
-
2
-
-
Units
A
A
High Level Output Voltage
IO=-100mA
VOH
VCC- 4
VCC- 3
-
V
Low Level Output Voltage
IO=100mA
VOL
-
0.1
0.5
V
High Level Supply Current
Output Open, IF=7 to 16mA
ICCH
-
4.5
6
Low Level Supply Current
Output Open, VF=- 3 to +0.8V
ICCL
-
2.6
6
Threshold Input Current, Low-to-High
IO=0mA, VO>5V
IFLH
-
0.7
5
mA
Threshold Input Voltage, High-to-Low
VFHL
0.8
-
-
V
Input Forward Voltage
IF=10mA
VF
1
1.24
1.5
V
Temperature Coefficient of Forward Voltage
IF=10mA
VF/TA
-
-1.6
-
mV/°C
Input Reverse Breakdown Voltage
IR=10A
BVR
5
-
-
V
f=1MHz, VF=0V
CIN
-
60
-
pF
VUVLO+
11
12.3
13.5
VUVLO-
9.5
10.7
12
UVLOHYS
-
1.6
-
Input Capacitance
UVLO Threshold
UVLO Hysteresis
1
2
VO>5V, IF=10mA
VO>5V, IF=10mA
mA
V
V
Maximum pulse width = 50s, maximum duty cycle = 0.5%.
Maximum pulse width = 10s, maximum duty cycle = 0.2%.
See “Test Circuits” on page 9 for more information.
4
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R04
INTEGRATED CIRCUITS DIVISION
IX3120
1.6 Switching Characteristics (AC)
Over recommended operating conditions, unless otherwise specified.
Parameter
Conditions
Propagation Delay Time
to High Output Level
Propagation Delay Time
to Low Output Level
Pulse Width Distortion
RG=10, CG=10nF
f=10kHz, Duty Cycle=50%
Propagation Delay Difference
Between any Two Parts1
Rise Time
Symbol
Min
Typ
Max
tPLH
0.1
0.3
0.5
tPHL
0.1
0.3
0.5
PWD
|tPHL-tPLH|
-
-
0.3
PDD
(tPHL-tPLH)
-0.35
-
0.35
tr
-
0.1
-
tf
-
0.1
-
Fall Time
UVLO Turn-On Delay
VO>5V, IF=10mA
tUVLO(on)
-
0.8
-
UVLO Turn-Off Delay
VO<5V, IF=10mA
tUVLO(off)
-
0.6
-
Output High Level
Common Mode Transient Immunity
IF=10 to 16mA, VCM=1500V,
VCC=30V, TA=25°C
|CMH|
25
35
-
Output Low Level
Common Mode Transient Immunity
VF=0V, VCM=1500V, VCC=30V,
TA=25°C
|CML|
1
Units
s
s
kV/s
25
35
-
The difference between tPHL and tPLH of any two IX3120 devices operating under the same conditions and temperature.
Figure 2. Timing Waveforms
IF
tr
tf
90%
50%
VOUT
10%
tPLH
R04
tPHL
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5
INTEGRATED CIRCUITS DIVISION
IX3120
1.7 Safety and Insulation Ratings
As per IEC 60747-5-5.
Parameter
Minimum External Air Gap (Clearance)
Minimum External Tracking (Creepage)
Distance Through Insulation
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Installation classification
Climatic Classification
Input to Output Test Voltage
Insulation Resistance
Pollution Degree
Highest Allowable Over-Voltage
Conditions
Symbol
Rating
Units
L(101)
7.62
mm
L(102)
7.50
mm
-
0.48
mm
CTI
>175
V
-
IIIa
-
-
I-IV
-
DIN VDE 0110/1.89, Table 1
Rated mains voltage < 1000Vrms
-
I-III
-
-
-
55/100/21
-
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along
body.
Insulation thickness between emitter and
detector
DIN IEC 60112/VDE 0303 Part 1
DIN VDE 0110, 1/89, Table 1
Material Group
DIN VDE 0110/1.89, Table 1
Rated mains voltage < 300Vrms
IEC EN 60747-5-5 Method b,
VIORM x 1.875 = VPR, 100% Production Test
with tm = 1 sec., Partial Discharge < 5pC
IEC EN 60747-5-5 Method a,
VIORM x 1.6 = VPR, Type and Sample Test
with tm = 10 sec., Partial Discharge < 5pC
TS, VIO = 500VDC
VPEAK
VPR
3200
RS
109
2

Transient Over-Voltage
VIOTM
6000
VP
Recurring Voltage
VIORM
2000
VP
DIN EN 60747-5-5 Method B
VPR
3750
VP
-
VISO
3750
Vrms
Input-Output Momentary Withstand
Voltage
RH < 50%, t = 1 min,
TA = 25°C
VISO
3750
Vrms
Resistance (Input-Output), Typical
VI-O = 500VDC
RI-O
1012

Capacitance (Input-Output), Typical
f = 1 MHz
CI-O
0.6
pF
Maximum Working Insulation Voltage
Partial Discharge Test Voltage
Isolation Test Voltage
6
DIN VDE 0109
3750
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R04
INTEGRATED CIRCUITS DIVISION
IX3120
2. Performance Data
-0.14
-0.16
-0.18
-20
0
20
40
60
Temperature (ºC)
80
Output Low Current (A)
-4
-6
-8
5.0
0.5
1.0
1.5
IOH (A)
2.0
2.5
ICC vs. Temperature
(VCC=30V, VEE=0V, Output=Open)
0.12
0
20
40
60
Temperature (ºC)
80
ICC (mA)
3.5
3.0
0
20
40
60
Temperature (ºC)
80
1.6
80
60
40
20
0
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50
LED Forward Voltage (V)
R04
100
6
2
1.2
0
-20
0
20
40
60
Temperature (ºC)
80
100
0.0
ICC vs. VCC
(IF=10mA, VEE=0V, TA=25ºC)
ICCH
3.0
ICCL
2.5
0.5
1.0
1.5
IOL (A)
2.0
2.5
IFLH vs. Temperature
(VCC=30V, VEE=0V, Output=OPEN)
0.74
3.5
160
80
4
1.4
0.72
0.70
0.68
0.66
0.64
0.62
0.60
15
LED Forward Current
vs. Forward Voltage
(TA=25ºC)
20
40
60
Temperature (ºC)
100ºC
25ºC
-40ºC
8
1.8
100
0
10
20
25
Supply Voltage (V)
-40
30
Propagation Delay vs. VCC
(IF=10mA, RG=10Ω, CG=10nF)
(Duty Cycle=50%, f=10kHz, TA=25ºC)
140
tPHL
120
100
160
Propagation Delay (ns)
-20
-20
VOL vs. IOL
(VCC=15V, VEE=0V, VF(off)=-3.0 to 0.8V)
12
1.0
Propagation Delay (ns)
LED Forward Current (mA)
100
-40
2.0
1.5
ICCL: IF=0mA
2.0
-40
1.5
2.2
2.0
2.5
2.0
100
4.0
4.0
2.5
1.0
-20
4.5
ICCH: IF=10mA
Output High Current vs. Temperature
(VCC=15V, VEE=0V, IF=7mA, VOUT=VCC-4V)
3.0
Output Low Current vs. Temperature
(VCC=15V, VEE=0V, VOUT=2.5V)
(VF(off)=-3.0 to 0.8V)
5.0
4.5
ICC (mA)
0.14
1.0
-40
-10
0.0
0.16
2.4
-40ºC
25ºC
100ºC
-2
VOH - VCC (V)
100
VOH vs. IOH
(IF=7mA, VCC=15V, VEE=0V)
0
0.18
0.10
-40
-0.20
-40
0.20
VOL (V)
VOH - VCC (V)
-0.12
VOL vs. Temperature
(IF=0mA, IOUT=100mA, VCC=15V, VEE=0V)
Output High Current (A)
Voltage Output Low (V)
-0.10
0.22
Forward Current (mA)
VOH vs. Temperature
(IF=7mA, IOUT=-100mA, VCC=15V, VEE=0V)
tPLH
80
-20
0
20
40
60
Temperature (ºC)
80
100
Propagation Delay vs. RG
(IF=10mA, VCC=30V, VEE=0V, CG=10nF)
(Duty Cycle=50%, f=10kHz, TA=25ºC)
tPHL
140
120
100
tPLH
80
60
60
15
20
25
VCC - Supply Voltage (V)
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30
10
15
20
25
30
35
RG (Ω)
40
45
50
7
INTEGRATED CIRCUITS DIVISION
IX3120
Performance Data (Cont.)
160
140
120
100
tPLH
80
20
40
60
CG (nF)
80
160
tPHL
140
120
100
60
0
Propagation Delay vs. IF
(VCC=30V, VEE=0V, RG=10Ω, CG=10nF)
(Duty Cycle=50%, f=10kHz, TA=25ºC)
Propagation Delay (ns)
tPHL
Propagation Delay (ns)
Propagation Delay (ns)
160
Propagation Delay vs. CG
(IF=10mA, VCC=30V, VEE=0V, RG=10Ω)
(Duty Cycle=50%, f=10kHz, TA=25ºC)
tPLH
80
tPHL
140
120
100
tPLH
80
60
60
100
Propagation Delay vs. Temperature
(IF=10mA, VCC=30V, VEE=0V, RG=10Ω)
(CG=10nF, Duty Cycle=50%, f=10kHz)
6
8
10
12
14
16
IF (mA)
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Transfer Characteristics
VO - Output Voltage (V)
35
30
25
20
15
10
5
0
0
8
1
2
3
4
IF - Forward LED Current (mA)
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5
R04
INTEGRATED CIRCUITS DIVISION
IX3120
3. Test Circuits
1
8
1
0.1μF
IF=7 to 16mA
2
+
7
2
+
3
8
0.1μF
4V
2.5V
-
6
3
6
5
4
8
2
-
+
5
1
8
0.1μF
0.1μF
IF=7 to 16mA
VCC=15 to 30V
IOL Test Circuit
IOH Test Circuit
1
+
-
IOH
4
IOL
7
VCC=15 to 30V
7
VOH
2
+
3
6
4
5
100mA
7
VCC=15 to 30V
+
-
3
6
4
5
VCC=15 to 30V
VOL
100mA
VOH Test Circuit
1
VOL Test Circuit
8
IF
1
8
0.1μF
2
0.1μF
IF=10mA
7
3
6
VO>5V
4
2
+
-
-
3
VCC=15 to 30V
6
VCC
VO>5V
5
4
IFLH Test Circuit
5
UVLO Test Circuit
1
2
+
-
8
+
0.1μF
IF=7 to 16mA
10kHz
50%
Duty Cycle
7
+
-
7
VO
500Ω
3
6
4
5
VCC=15 to 30V
RG
10Ω
CG
10nF
tPLH, tPHL, tr, tf Test Circuit
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9
INTEGRATED CIRCUITS DIVISION
IX3120
4. Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
IX3120G / IX3120GS / IX3120GE / IX3120GES
MSL 1
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
Maximum Reflow Cycles
IX3120G / IX3120GS / IX3120GE / IX3120GES
250°C for 30 seconds
3
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
IX3120
4.5 Package Mechanical Dimensions
4.5.1 IX3120G & IX3120GE 8-Pin DIP
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
3.302 ± 0.051
(0.130 ± 0.002)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.127
(0.300 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
4.5.2 IX3120GS & IX3120GES 8-Pin Surface Mount
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
3.302 ± 0.051
(0.130 ± 0.002)
0.635 ± 0.127
(0.025 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
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11
INTEGRATED CIRCUITS DIVISION
IX3120
4.5.3 IX3120GSTR & IX3120GESTR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
K0 =4.90
(0.193)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
4.6 Device Branding
IX3120G
IX3120GE
YYWW@KKKKK
*
IX3120G
IX3120GS
YYWW@KKKKK
*
IX3120GE
IX3120GES
*
YYWW@KKKKK
YYWW = date code (year/year/week/week)
@KKKKK = sequentially assigned kit code with assembly location identifier
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IX3120-R04
©Copyright 2014, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
9/26/2014
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