CPC1301

CPC1301
Optocoupler with
High-Voltage Darlington Output
INTEGRATED CIRCUITS DIVISION
Parameter
Breakdown Voltage - BVCEO
Current Transfer Ratio - CTR
Rating
350
1000-8000
Description
Units
VP
%
The CPC1301 is a unidirectional input optocoupler
with a high-voltage Darlington output. Light output
from the highly efficient GaAlAs infrared LED
activates the optically coupled silicon NPN
photo-Darlington output transistor. The input LED and
the output transistor are separated by a 5000Vrms
isolation barrier.
Features
•
•
•
•
•
5000Vrms Input/Output Isolation
350VP Breakdown Voltage
Small 4-Pin Package
Machine Insertable, Wave Solderable
Surface Mount Tape & Reel Version Available
With a LED current of only 1mA, a current transfer
ratio of 1000% to 8000% is guaranteed at the
collector of the 350V Darlington output transistor.
Applications
•
•
•
•
•
•
•
Telecom Switching
Tip/Ring Circuits
Hook Switch
Modem Switching (Laptop, Notebook, Pocket Size)
Loop Detect
Ringing Detect
Current Sensing
The CPC1301's low input current, high current
transfer ratio, high output voltage capability, and
large isolation barrier rating make it ideal for many
applications such as telecom, industrial, and power
control.
Approvals
• UL 1577 Approved Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN 60950 Certified Component:
TUV Certificate B 10 05 49410 006
Ordering Information
Part Number
CPC1301G
CPC1301GR
CPC1301GRTR
Description
4-Pin DIP (100/Tube)
4-Pin Surface Mount (100/Tube)
4-Pin Surface Mount (1000/Reel)
Pin Configuration
A
K
Pb
DS-CPC1301-R05
1
4
2
3
C
E
e3
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1
INTEGRATED CIRCUITS DIVISION
CPC1301
Absolute Maximum Ratings @ 25ºC
Parameter
Breakdown Voltage, BVCEO
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Phototransistor Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
Ratings
350
5
50
1
150
150
5000
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Derate linearly 1.33 mW / oC
Derate linearly 1.5 mW / oC
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Phototransistor Breakdown Voltage
Emitter-Collector Breakdown Voltage
Phototransistor Output (Dark) Current
Saturation Voltage
Current Transfer Ratio
Output Capacitance
Input Characteristics
Input Control Current
Input Voltage Drop
Input Reverse Current
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
ICEO=100µA
IE=0.1mA
VCEO=200V, IF=0mA
IC=10mA, IF=1mA
IC=100mA, IF=10mA
IF=1mA, VCE=1V
VCEO=50V, f=1MHz
BVCEO
BVECO
ICEO
CTR
COUT
350
0.3
1000
-
5500
13
100
1
1.2
8000
-
VP
V
nA
V
V
%
pF
IC=10mA, VCE=1V
IF=5mA
VR=5V
IF
VF
IR
0.9
-
0.07
1.2
-
1
1.4
10
mA
V
µA
-
CI/O
-
3
-
pF
VCE(Sat)
Switching Characteristics @ 25ºC
Characteristic
Rise Time
Fall Time
Turn-On Time
Storage Time
Turn-Off Time
Turn-On Time
Storage Time
Turn-Off Time
Symbol
tR
tF
ton
tS
toff
ton
tS
toff
Test Condition
VCC=10V
IF=10mA
RL=100
VCC=10V
IF=16mA
RL=180
Typ
40
2.6
2.75
20
60
1
40
80
Units
IF
tF
VCE
s
tR
90%
10%
t on
tS
Switching Time Test Circuit
t off
VCC
RL
Pulse Width=5ms
Duty Cycle=50%
2
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IF
VCE
R05
INTEGRATED CIRCUITS DIVISION
CPC1301
PERFORMANCE DATA*
LED Current (IF)
vs. LED Forward Voltage (VF)
(TA=25ºC)
100
30
20
10
VCE=1.0V
100
VCE=1.0V
10
1
10
0.1
1
120
100
IF = 2mA
80
IF = 1mA
60
IF = 0.5mA
40
2.5
2.0
1.5
1.0
0.5
0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Collector-Emitter Voltage V CE (V)
1000
-40
-20
0
20
40
60
Temperature (ºC)
80
0
20
40
60
Temperature (ºC)
80
100
IF=10mA
300
IF=5mA
225
150
75
IF=1mA
IF=0.5mA
-20
0
20
40
60
80
100
Breakdown Voltage vs. Temperature
20
0
-20
Collector Current vs. Temperature
(VCE = 1.2V)
-40
Breakdown Voltage BVCEO (VP)
IF = 5mA
140
IF=2mA
Temperature (ºC)
IF = 10mA
160
IF=5mA
1.1
Leakage vs. Temperature
(VCEO = 350V)
3.0
Leakage Current (µA)
Collector Current IC (mA)
180
IF=10mA
1.2
100
0.1
1
10
LED Forward Current (mA)
LED Current (mA)
Collector Current vs.
Collector-Emitter Voltage
(TA=25ºC)
IF=20mA
1.3
0
0.01
100
10
IF=50mA
1.4
375
VCE=1.5V
100
1.5
1.0
-40
Collector Current IC (mA)
Collector Current IC (mA)
CTR (%)
1
1000
VCE=1.5V
1000
10
Collector Current
vs. LED Current (IF)
(TA=25ºC)
CTR vs. LED Current (IF)
(TA=25ºC)
10,000
1.6
0.1
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55
LED Forward Voltage (V)
0
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55
LED Forward Voltage (V)
100,000
LED Forward Voltage
vs. Temperature
LED Forward Voltage (V)
40
LED Current (mA)
LED Current (mA)
50
LED Current (IF)
vs. LED Forward Voltage (VF)
(TA=25ºC)
100
120
450
440
430
420
410
400
390
380
370
-40
-15
10
35
Temperature (ºC)
60
85
Switching Time vs. Load Resistance
(TA=25ºC)
Switching Time (Ps)
tOFF, IF=16mA
100
tOFF, IF=1.6mA
10
tON, IF=1.6mA
1
tON, IF=16mA
0.1
10
100
1K
10K
100K
Load Resistance (:)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R05
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INTEGRATED CIRCUITS DIVISION
CPC1301
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1301G / CPC1301GR
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1301G / CPC1301GR
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
4
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R05
INTEGRATED CIRCUITS DIVISION
CPC1301
MECHANICAL DIMENSIONS
CPC1301G
0.991
(0.039)
PC Board Pattern (Top View)
0.254
(0.010)
3.30 ± 0.050
(0.130 ± 0.002)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
4.572 ± 0.127
(0.180 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
PIN 1
9.144 ± 0.508
(0.360 ± 0.020)
9º (ALL)
9º (ALL)
7.620 ± 0.250
(0.300 ± 0.010)
2.159
(0.085)
0.457 ± 0.076
(0.018 ± 0.003)
6.350 ± 0.127
(0.250 ± 0.005)
0.508
(0.020)
3.175
(0.125)
2.540 ± 0.127
(0.100 ± 0.005)
Dimensions
mm
(inches)
CPC1301GR
2.540 ± 0.127
(0.100 ± 0.005)
PCB Land Pattern
3.300 ± 0.050
(0.130 ± 0.002)
0.635 ± 0.254
(0.025 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
9.525
(0.375)
7.620 ± 0.254
(0.300 ± 0.010)
8.80
(0.346)
1.60
(0.063)
PIN #1
0.991
(0.039)
9º ± 1º
(ALL)
2.287
(0.09)
3.480 ± 0.076
(0.137 ± 0.003)
4.572 ± 0.127
(0.180 ± 0.005)
0.254
(0.010)
0.95
(0.037)
2.540 ± 0.127
(0.100 ± 0.005)
2.287 ± 0.127
(0.090 ± 0.005)
R05
0.102 min / 0.254 max
(0.004 min / 0.010 max)
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Dimensions
mm
(inches)
5
INTEGRATED CIRCUITS DIVISION
CPC1301
CPC1301GRTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00±0.30
(0.630±0.012)
B0=5.00
(0.197)
K0=4.20
(0.165)
K1=3.70
(0.146)
A0=10.01
(0.394)
P=12.00
(0.472)
Dimensions
mm
(inches)
Embossed
Carrier
Embossment
NOTES:
1. All dimensions meet EIA-481-C requirements
2. Unless otherwise noted, tolerances = ±0.10 (0.004)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1301-R05
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/16/2012