CPC2125N 400V Dual Normally-Closed Single-Pole 8-Pin SOIC OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Forward Current (to Activate) Rating 400 100 35 2 Units VP mArms / mADC mA Features • • • • • • • Description The CPC2125N is a miniature device with two independent normally-closed (1-Form-B) solid state relays in an 8-pin SOIC package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. Optically coupled outputs, using the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. 1500Vrms Input/Output Isolation Arc-Free With No Snubbing Circuits No EMI/RFI Generation Immune to Radiated EM Fields Wave Solderable Tape & Reel Version Available Small 8-Pin SOIC Package Constructed using IXYS Integrated Circuits Division’s state of the art double-molded, vertical construction packaging, this device is one of the world’s smallest relays. It offers substantial board space savings over the competitor’s larger 8-pin SOIC relay. Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Security • Passive Infrared Detectors (PIR) • Data Signaling • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Medical Equipment—Patient/Equipment Isolation • Aerospace • Industrial Controls Approvals • UL Recognized Component: File E76270 • CSA Approval Pending • EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 Ordering Information Part # CPC2125N CPC2125NTR Description 8-Pin SOIC (50/tube) 8-Pin SOIC (2000/reel) Pin Configuration 1 8 + Control Load 7 2 – Control Load 3 6 + Control Load 4 5 – Control Load Switching Characteristics of Normally-Closed (Form-B) Devices Form-B IF ILOAD 90% 10% toff DS-CPC2125N-R04 www.ixysic.com ton 1 INTEGRATED CIRCUITS DIVISION CPC2125N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage LED Forward Current Peak (10ms) Input Power Dissipation Total Power Dissipation 1 Isolation Voltage, Input to Output (60 Seconds) ESD Rating, Human Body Model Operational Temperature Storage Temperature 1 Ratings 400 5 50 1 70 600 Units VP V mA A mW mW 1500 Vrms 8 -40 to +85 -40 to +125 kV °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 5mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Switching Speeds Turn-On Turn-Off Off-State Leakage Current Output Capacitance Input Characteristics LED Forward Current To Activate 3 To Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IF=0mA t =10ms IL=100mA IL ILPK RON - 26 100 ±350 35 mArms / mADC mAP IF=5mA, VL=10V ton toff VL=400V, IF=2mA IF=2mA, VL= 50V, f=1MHz ILEAK COUT - 0.31 0.30 6 2 2 5 - 0.1 0.9 - 1.2 - 2 1.4 10 IL=100mA IF=5mA VR=5V IF VF IR VIO=0V, f=1MHz CIO 1 Load current derates linearly from 100mA @ 25oC to 60mA @ 85oC, and must be derated if both poles are operating simultaneously. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60°C) a minimum LED forward current of 4mA is recommended. www.ixysic.com - ms µA pF mA V µA pF R04 INTEGRATED CIRCUITS DIVISION CPC2125N PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * 15 10 5 25 20 15 10 5 0.24 Typical LED Forward Current to Activate (N=50, IL=120mA) 25 Device Count (N) 15 10 5 0 0.14 0.16 0.18 0.20 LED Forward Current (mA) 10 5 0.20 25 24 25 25 26 27 On-Resistance (:) 28 10 800 600 400 200 10 20 30 40 LED Forward Current (mA) 2000 1.3 1.2 IF=10mA IF=5mA IF=2mA 1.1 1600 1200 IF=5mA 800 400 -20 310 10 20 30 40 LED Forward Current (mA) 0 20 40 60 Temperature (ºC) 80 100 50 Typical Turn-On Time vs. Temperature (IL=60mA) 450 400 350 300 250 IF=5mA 200 IF=2mA 100 0 -40 312 150 1.0 470 314 500 Turn-On Time (Ps) 1.4 420 430 440 450 460 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=60mA) 0 IF=2mA Turn-Off Time (Ps) 1.5 410 316 50 Typical Turn-Off Time vs. Temperature (IL=60mA) Typical LED Forward Voltage Drop vs. Temperature IF=50mA IF=20mA 5 306 0 1.6 10 308 0 0 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 LED Forward Voltage (V) 15 318 Turn-On Time (Ps) Turn-Off Time (Ps) 20 0.38 20 400 1000 30 0.26 0.29 0.32 0.35 Turn-Off Time (ms) Typical Blocking Voltage Distribution (N=50, IF=2mA) 28 Typical Turn-Off Time vs. LED Forward Current (IL=60mA) 1200 40 0.23 0 0.22 50 10 0.36 15 Typical LED Forward Voltage vs. LED Forward Current LED Forward Voltage (V) 0.28 0.30 0.32 0.34 Turn-On Time (ms) 0 0.12 LED Forward Current (mA) 0.26 Typical On-Resistance Distribution (N=50, IF=0mA, IL=100mA) 20 20 15 0 1.275 Device Count (N) 1.255 1.260 1.265 1.270 LED Forward Voltage (V) 20 5 0 1.250 Typical Turn-Off Time (N=50, IF=5mA, IL=60mA) 30 Device Count (N) 20 0 Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=60mA) 25 Device Count (N) Device Count (N) 25 Typical LED Forward Voltage Drop (N=50, IF=5mA) -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC2125N PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * 45 0.7 On-Resistance (:) 0.6 0.5 0.4 0.3 0.2 0.1 35 30 25 -20 0 20 40 60 Temperature (ºC) 80 100 110 Blocking Voltage (VP) 90 80 70 60 50 -20 0 20 40 60 Temperature (ºC) 80 0 20 40 60 Temperature (ºC) Output Capacitence (pF) 70 80 100 455 450 445 -20 0 20 40 60 Temperature (ºC) -2 -1 0 1 Load Voltage (V) 2 3 Leakage Current vs. Temperature Measured Across Pins 5&6, 7&8 (IF=2mA, VL=400V) 4 3 2 1 50 40 30 20 10 0 10 100 Load Voltage (V) 1000 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 60 1 -3 0 -40 Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz) 0.1 -50 5 460 Load Current (A) -20 0 100 440 -40 50 Typical Blocking Voltage vs. Temperature (IF=5mA) 465 100 100 -150 -40 Maximum Load Current vs. Temperature (IF=0mA) Typical Load Current vs. Load Voltage (IF=0mA) -100 20 -40 Load Current (mA) 40 150 Leakage Current (PA) LED Forward Current (mA) 0.8 Typical On-Resistance vs. Temperature (IF=0mA, IL=60mA) Load Current (mA) Typical LED Forward Current to Activate (IL=60mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC2125N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC2125N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time Maximum Reflow Cycles CPC2125N 260ºC for 30 seconds 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after soldering processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. R04 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC2125N MECHANICAL DIMENSIONS CPC2125N 1.016 ± 0.025 (0.040 ± 0.001) 9.347 ± 0.203 (0.368 ± 0.008) Pin 1 2.184 MAX (0.086 MAX) PCB Land Pattern 5.60 (0.22) 1.30 (0.051) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.051 (0.150 ± 0.002) 2.540 TYP (0.100 TYP) 0.203 ± 0.025 (0.008 ± 0.001) 0.432 ± 0.127 (0.017 ± 0.005) 2.54 (0.100) 0.55 (0.022) Pin to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.838 ± 0.102 (0.033 ± 0.004) Dimensions mm (inches) 0.381 ± 0.051 (0.015 ± 0.002) CPC2125NTR Tape & Reel 1.75 ± 0.10 330.2 DIA. (13.00 DIA.) 4.00 ± 0.10 8.00 ± 0.10 2.00 ± 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.20 7.50 ± 0.10 Ø1.50 +0.1, -0 6.50 9.65 ± 0.10 16.00 ± 0.30 Embossed Carrier 3.50 6.55 ± 0.10 Ø1.50 MIN Embossment 2.35 ± 0.10 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance ± 0.20. 3. Carrier camber is within 1mm in 250mm. 2.85 ± 0.10 4. Tape material : Black Conductive Polystyrene Alloy. 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 ± 0.05mm. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC2125N-R04 ©Copyright 2014, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 11/19/2014