CPC1303 Optocoupler with Single-Transistor Output INTEGRATED CIRCUITS DIVISION Parameter Breakdown Voltage - BVCEO Current Transfer Ratio Saturation Voltage Input Control Current Rating 30 200 0.5 0.2 Description Units VP % V mA The CPC1303 is a unidirectional input optocoupler with a single-transistor output, which uses optically coupled technology to provide an enhanced 5000Vrms isolation barrier between the input and the output. The optically coupled output is controlled by a highly efficient infrared LED. Features • • • • • • This optocoupler satisfies the PD output requirements of IXYS Integrated Circuits Division's CPC1466 Broadband ADSL/VDSL DC Termination IC. 5000Vrms Input/Output Isolation Low Drive Power Requirements High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 4-pin Package Approvals • UL 1577 Approved Component: File E76270 • EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 Applications • • • • • • • • • • Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment: Patient/Equipment Isolation Aerospace Industrial Controls Ordering Information Part Number CPC1303G CPC1303GR CPC1303GRTR Description 4-Pin DIP (100/Tube) 4-Pin Surface Mount, Tubed (100/Tube) 4-Pin Surface Mount, Tape & Reel (1000/Reel) Pin Configuration A K DS-CPC1303-R05 www.ixysic.com 1 4 2 3 C E 1 INTEGRATED CIRCUITS DIVISION CPC1303 Absolute Maximum Ratings @ 25ºC Parameter Breakdown Voltage Reverse Input Voltage Input Control Current Peak (10ms) Power Dissipation 2 Input 1 Phototransistor 2 Isolation Voltage, Input to Output Operating Temperature Storage Temperature 1 2 Ratings 30 5 50 1 150 150 5000 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements.. mW Vrms °C °C Derate linearly 1.33 mW / oC Derate linearly 2.00 mW / oC Electrical Characteristics @ 25ºC Parameters Output Characteristics Phototransistor Breakdown Voltage Phototransistor Output (Dark) Current Saturation Voltage Current Transfer Ratio Output Capacitance Input Characteristics Input Control Current Input Voltage Drop Input Reverse Current Common Characteristics Capacitance, Input to Output Conditions Symbol Min Typ Max Units ICEO=10µA VCEO=5V, IF=0mA IC=0.4mA, IF=0.2mA IC=10mA, IF=10mA IF=0.2mA, VCE=0.5V IF=0mA, V=25V, f=1MHz BVCEO ICEO 25 0.1 0.12 1000 6 500 0.45 0.5 2500 - VP nA CTR COUT 30 200 - IC=0.4mA, VCE=0.5V IF=5mA VR=5V IF VF IR 0.9 - 1.2 - 0.2 1.4 10 mA V µA VIO=0V, f=1MHz CIO - 3 - pF VCEsat V % pF Switching Characteristics @ 25ºC Characteristic Turn-On Time Turn-Off Time Symbol ton toff Test Condition Typ 2 8 VCC=5V, IF=1mA, RL=500 Switching Time Test Circuit Units s VCC IF RL Pulse Width=5ms Duty Cycle=1% IF VCE VCE 90% 10% t on 2 www.ixysic.com t off R05 INTEGRATED CIRCUITS DIVISION CPC1303 PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)* LED Voltage vs. LED Current (Linear) 1.6 40 30 20 10 0 1.1 1.2 1.3 1.4 1.5 LED Forward Voltage (V) 1.6 LED Forward Voltage (V) 100 LED Forward Current (mA) 10 1 0.1 1.1 1.2 1.3 1.4 1.5 LED Forward Voltage (V) Collector Current (mA) -40ºC 1000 CTR (%) 25ºC 85ºC 600 400 200 10 100 LED Forward Current (PA) 1.2 1.1 40 IF=3mA 30 IF=2mA 20 IF=1mA IF=0.5mA IF=0.2mA 2 3 Collector Voltage (V) 4 IF=50PA IF=20PA 100 IF=10PA IF=5PA IF=2PA IF=1PA 10 Typical Blocking Voltage vs. Temperature 0 40 80 Temperature (ºC) 120 Leakage Current vs. Temperature 500 Leakage Current (nA) Blocking Voltage (VP) 0.08 100 IF=200PA IF=100PA -40 5 95 0.10 80 IF=1000PA IF=500PA 1 1 96 0.12 20 40 60 Temperature (ºC) 1000 10 Saturation Voltage vs. Temperature (IF=1mA, ICE=2mA) 0.14 0 10000 0 0.16 -20 IF=5mA 50 1000 IF=2mA IF=1mA IF=0.2mA ICE Current vs. Temperature 0 0 1 1.3 100000 60 1200 800 1.4 Typical Collector Voltage vs. Typical Collector Current LED Forward Current vs. CTR IF=50mA IF=20mA IF=10mA IF=5mA 1.5 1.0 -40 1.6 ICE Current (PA) LED Forward Current (mA) 50 Saturation Voltage (V) LED Forward Voltage vs. Temperature LED Voltage vs. LED Current (LOG) 94 93 92 91 90 89 400 VCE Leakage 10V 300 VCE Leakage 5V VCE Leakage 3V 200 100 88 0.06 -40 87 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 350 1.4 300 Turn-Off Time (Ps) Turn-On Time (Ps) 1.5 1.2 1.1 1.0 100 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Turn-Off Time vs. Load Resistance (VCC=5V, IF=1mA) Turn-On Time vs. Load Resistance (IF=1mA, VCC=5V) 1.3 80 250 200 150 100 50 0.9 0 0 20 40 60 80 Load Resistance (k:) 100 0 20 40 60 80 Load Resistance (k:) 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1303 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1303G CPC1303GR MSL 1 MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1303GR, the solder reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed. For the through-hole device, CPC1303G, and any other processes, the guidelines of J-STD-020 must be observed. Device Maximum Body Temperature (Tc) Time CPC1303GR 250ºC 15 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION CPC1303 MECHANICAL DIMENSIONS CPC1303G 0.991 (0.039) PC Board Pattern (Top View) 0.254 (0.010) 3.30 ± 0.050 (0.130 ± 0.002) 6 - 0.800 DIA. (6 - 0.031 DIA.) 6.350 ± 0.127 (0.250 ± 0.005) 4.572 ± 0.127 (0.180 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) PIN 1 9º (ALL) 9º (ALL) 7.620 ± 0.250 (0.300 ± 0.010) 2.159 (0.085) 0.457 ± 0.076 (0.018 ± 0.003) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) 0.508 (0.020) 3.175 (0.125) 2.540 ± 0.127 (0.100 ± 0.005) Dimensions mm (inches) CPC1303GR 2.540 ± 0.127 (0.100 ± 0.005) PCB Land Pattern 3.300 ± 0.050 (0.130 ± 0.002) 0.635 ± 0.254 (0.025 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 (0.375) 7.620 ± 0.254 (0.300 ± 0.010) 8.80 (0.346) 1.60 (0.063) PIN #1 0.991 (0.039) 9º ± 1º (ALL) 2.287 (0.09) 3.480 ± 0.076 (0.137 ± 0.003) 4.572 ± 0.127 (0.180 ± 0.005) 0.254 (0.010) 0.95 (0.037) 2.540 ± 0.127 (0.100 ± 0.005) 2.287 ± 0.127 (0.090 ± 0.005) R05 0.102 min / 0.254 max (0.004 min / 0.010 max) www.ixysic.com Dimensions mm (inches) 5 INTEGRATED CIRCUITS DIVISION CPC1303 CPC1303GRTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00±0.30 (0.630±0.012) B0=5.00 (0.197) K0=4.20 (0.165) K1=3.70 (0.146) A0=10.01 (0.394) P=12.00 (0.472) Dimensions mm (inches) Embossed Carrier Embossment NOTES: 1. All dimensions meet EIA-481-C requirements 2. Unless otherwise noted, tolerances = ±0.10 (0.004) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1303-R05 ©Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/7/2016