PM1206 AC Power Switch INTEGRATED CIRCUITS DIVISION Parameter AC Operating Voltage Load Current On-State Voltage Drop (IL=500mArms) Rating 260 500 1.4 Features • Load Current up to 0.5Arms • Blocking Voltages up to 600VP • 5mA Sensitivity • Zero-Crossing Detection • DC Control, AC Output • Optically Isolated • TTL and CMOS Compatible • Low EMI and RFI Generation • High Noise Immunity • VDE compatible • Machine Insertable, Wave Solderable Units Vrms mArms Vrms Description The PM1206 is an AC Solid State Switch using optical coupling with dual power SCR outputs to produce an alternative to optocoupler and Triac circuits. The PM1206 switches are robust enough to provide a blocking voltage of up to 600VP. In addition, tightly controlled zero-cross circuitry ensures switching of AC loads without the generation of transients. The input and output circuits are optically coupled to provide 3750Vrms of isolation and noise immunity between control and load circuits. As a result, the PM1206 is well suited for industrial environments where electromagnetic interference could disrupt the operation of electromechanical relays. Approvals • UL Recognized Component: UL 508 File E69938 • CSA Certified Component: File 043639 Ordering Information Applications • Programmable Control • Process Control • Power Control Panels • Remote Switching • Gas Pump Electronics • Contactors • Large Relays • Solenoids • Motors • Heaters Part # PM1206 PM1206S PM1206STR Description 6-Lead DIP (50/Tube) 6-Lead Surface Mount (50/Tube) 6-Lead Surface Mount (1000/Reel) Pin Configuration 1 – LED 2 3 DS-PM1206-R10 6 + LED www.ixysic.com ZC 5 AC Load AC Load 4 1 INTEGRATED CIRCUITS DIVISION PM1206 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Min 3750 -40 -40 Max 600 5 100 1 150 800 +85 +125 Units VP V mA A mW mW Vrms ºC ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25ºC Parameter Output Characteristics AC Operating Voltage Load Current (Continuous) Maximum Surge Current Off-State Leakage Current On-State Voltage Drop Critical Rate of Rise Switching Speeds Turn-On Turn-Off Zero-Cross Turn-On Voltage 1 Operating Frequency Load Power Factor for Guaranteed Turn-On 2 Capacitance Input-To-Output Input Characteristics Input Control Current For Normal Environment For High Noise Environment Input Voltage Drop Input Dropout Voltage Reverse Input Current 1 2 2 Conditions Symbol Min Typ Max Units IF=5mA VL=120-240VAC t<16ms VL=600VDC IL=0.5Arms - VOP IL IPEAK ILEAK dV/dt 20 0.005 1000 1200 260 0.5 12 1 1.4 - Vrms Arms A mA Vrms V/µs IF=5mA ton toff 20 0.25 - 2 3 0.5 0.5 5 1 500 - 0.9 0.8 - 1.2 - 5 10 1.4 10 1st half-cycle Subsequent half-cycle - IF=5mA VR=5V PF CI/O IF VF IR Cycles V V Hz pF mA V V µA Zero Cross 1st half-cycle @ < 100Hz. Snubber circuits may be required at low power factors. www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION PM1206 PERFORMANCE DATA* Max Surge Current Non-Repetitive Load Current Free Air 0.8 RTJA = 60ºC/W 0.4 0.2 0 -40 20 Forward Voltage (V) 1.0 0.6 1.3 25 Peak Surge Current (A) Load Current (Arms) 1.2 Typical Forward Voltage vs. Temperature NOTE: Values apply to TJ=50ºC before surge. 15 10 5 0 0 55 Ambient Temperature (ºC) 85 1.2 1.1 1.0 0.9 16 50 100 0 10 25 40 55 70 85 Ambient Temperature (ºC) Pulse Duration (ms) Typical dV/dt vs. Temperature dV/dt Method Critical Rate of Rise (V/Ps) 1400 1200 Vo 1000 800 Vo = 300V 63% dV 0.63 x 300V 189 = = dt RC RC In accordance with EIA/NARM Standards RS-443 for Solid State Relays 600 400 200 0 10% 0 25 50 Ambient Temperature (ºC) 85 RC *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R10 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PM1206 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating PM1206 MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time PM1206 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. 4 www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION PM1206 Mechanical Dimensions PM1206 3.302 ± 0.051 (0.130 ± 0.002) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) Pin 1 PCB Hole Pattern 2.540 ± 0.127 (0.100 ± 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 TYP. (0.010 TYP.) 9.652 ± 0.381 (0.380 ± 0.015) 7.239 TYP. (0.285 TYP.) 6.350 ± 0.127 (0.250 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 4.064 TYP. (0.160 TYP.) 0.457 ± 0.076 (0.018 ± 0.003) Dimensions mm (inches) 2.007 ± 0.102 (0.079 ± 0.004) PM1206S 9.525 ± 0.254 (0.375 ± 0.010) 2.540 ± 0.127 (0.100 ± 0.005) 2.54 (0.10) 6.350 ± 0.127 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.254 (0.300 ± 0.010) Pin 1 9.652 ± 0.381 (0.380 ± 0.015) 3.302 ± 0.051 (0.130 ± 0.002) PCB Land Pattern 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0256) 0.635 ± 0.127 (0.025 ± 0.005) 1.65 (0.065) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 2.159 ± 0.102 (0.085 ± 0.004) R10 8.90 (0.350) www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PM1206 PM1206STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment W=16.00 (0.63) Bo=10.30 (0.406) Ao=10.30 (0.406) P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-PM1206-R10 ©Copyright 2013, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 10/21/2013