LeadFree Package Options Available! ® ispLSI 2032/A In-System Programmable High Density PLD Features Functional Block Diagram • ENHANCEMENTS S Logic Array A6 D Q D Q A5 D Q EW Input Bus GLB A4 0139Bisp/2000 FO R N fmax = 180 MHz Maximum Operating Frequency tpd = 5.0 ns Propagation Delay • IN-SYSTEM PROGRAMMABLE A2 D Q A3 • HIGH PERFORMANCE E2CMOS® TECHNOLOGY TTL Compatible Inputs and Outputs Electrically Erasable and Reprogrammable Non-Volatile 100% Tested at Time of Manufacture Unused Product Term Shutdown Saves Power A1 A7 Output Routing Pool (ORP) Input Bus Output Routing Pool (ORP) 1000 PLD Gates 32 I/O Pins, Two Dedicated Inputs 32 Registers High Speed Global Interconnect Wide Input Gating for Fast Counters, State Machines, Address Decoders, etc. — Small Logic Block Size for Random Logic — — — — — — — Global Routing Pool (GRP) A0 — — — — — D ES IG N • HIGH DENSITY PROGRAMMABLE LOGIC Description The ispLSI 2032 and 2032A are High Density Programmable Logic Devices. The devices contain 32 Registers, 32 Universal I/O pins, two Dedicated Input Pins, three Dedicated Clock Input Pins, one dedicated Global OE input pin and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements. The ispLSI 2032 and 2032A feature 5V insystem programmability and in-system diagnostic capabilities. The ispLSI 2032 and 2032A offer nonvolatile reprogrammability of the logic, as well as the interconnect to provide truly reconfigurable systems. 03 2E — In-System Programmable (ISP™) 5V Only — Increased Manufacturing Yields, Reduced Time-toMarket and Improved Product Quality — Reprogram Soldered Devices for Faster Prototyping I2 • OFFERS THE EASE OF USE AND FAST SYSTEM SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY OF FIELD PROGRAMMABLE GATE ARRAYS LS — Complete Programmable Device Can Combine Glue Logic and Structured Designs — Enhanced Pin Locking Capability — Three Dedicated Clock Input Pins — Synchronous and Asynchronous Clocks — Programmable Output Slew Rate Control to Minimize Switching Noise — Flexible Pin Placement — Optimized Global Routing Pool Provides Global Interconnectivity — Lead-Free Package Options U SE is p The basic unit of logic on these devices is the Generic Logic Block (GLB). The GLBs are labeled A0, A1 .. A7 (Figure 1). There are a total of eight GLBs in the ispLSI 2032 and 2032A devices. Each GLB is made up of four macrocells. Each GLB has 18 inputs, a programmable AND/OR/Exclusive OR array, and four outputs which can be configured to be either combinatorial or registered. Inputs to the GLB come from the GRP and dedicated inputs. All of the GLB outputs are brought back into the GRP so that they can be connected to the inputs of any GLB on the device. Copyright © 2006 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com 2032_11 1 August 2006 Select devices have been discontinued. See Ordering Information section for product status. — ispLSI 2032A is Fully Form and Function Compatible to the ispLSI 2032, with Identical Timing Specifcations and Packaging — ispLSI 2032A is Built on an Advanced 0.35 Micron E2CMOS® Technology Specifications ispLSI 2032/A Functional Block Diagram Figure 1. ispLSI 2032/A Functional Block Diagram A2 A5 A4 SDI/IN 0 SDO/IN 1 2E MODE I/O 24 I/O 23 I/O 22 I/O 21 I/O 20 I/O 19 I/O 18 I/O 17 I/O 16 Y0 03 ispEN I/O 26 I/O 25 CLK 0 CLK 1 CLK 2 FO A3 I/O 27 Input Bus A6 Output Routing Pool (ORP) I/O 12 I/O 13 I/O 14 I/O 15 A1 EW I/O 9 I/O 10 I/O 11 Global Routing Pool (GRP) N I/O 8 I/O 31 I/O 30 I/O 29 I/O 28 A7 R Input Bus I/O 4 I/O 5 I/O 6 I/O 7 Output Routing Pool (ORP) A0 Y1*/RESET Notes: *Y1 and RESET are multiplexed on the same pin SCLK/Y2 I2 0139B(1)isp/2000 All of these signals are made available to the inputs of the GLBs. Delays through the GRP have been equalized to minimize timing skew. pL S The devices also have 32 I/O cells, each of which is directly connected to an I/O pin. Each I/O cell can be individually programmed to be a combinatorial input, output or bi-directional I/O pin with 3-state control. The signal levels are TTL compatible voltages and the output drivers can source 4 mA or sink 8 mA. Each output can be programmed independently for fast or slow output slew rate to minimize overall output switching noise. SE is Clocks in the ispLSI 2032 and 2032A devices are selected using the dedicated clock pins. Three dedicated clock pins (Y0, Y1, Y2) or an asynchronous clock can be selected on a GLB basis. The asynchronous or Product Term clock can be generated in any GLB for its own clock. U Eight GLBs, 32 I/O cells, two dedicated inputs and two ORPs are connected together to make a Megablock (Figure 1). The outputs of the eight GLBs are connected to a set of 32 universal I/O cells by the ORP. Each ispLSI 2032 and 2032A device contains one Megablock. The GRP has as its inputs, the outputs from all of the GLBs and all of the inputs from the bi-directional I/O cells. 2 Select devices have been discontinued. See Ordering Information section for product status. I/O 0 I/O 1 I/O 2 I/O 3 D ES IG N S GOE 0 Specifications ispLSI 2032/A Absolute Maximum Ratings 1 Supply Voltage Vcc ...................................-0.5 to +7.0V Input Voltage Applied ........................ -2.5 to VCC +1.0V Off-State Output Voltage Applied ..... -2.5 to VCC +1.0V S Storage Temperature ................................ -65 to 150°C D ES IG N Max. Junction Temp. (TJ) with Power Applied ... 150°C 1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications). EW DC Recommended Operating Condition PARAMETER Supply Voltage VIL VIH Input Low Voltage MAX. UNITS TA = 0°C to + 70°C 4.75 5.25 V Industrial TA = -40°C to + 85°C 4.5 5.5 V 0.8 V 0 2.0 FO Input High Voltage MIN. Commercial N VCC R SYMBOL Vcc+1 V 2E Table 2 - 0005/2032 03 Capacitance (TA=25°C, f=1.0 MHz) TYPICAL UNITS 6 pf VCC = 5.0V, VIN = 2.0V I/O Capacitance 7 pf VCC = 5.0V, VI/O = 2.0V Clock Capacitance 10 pf VCC = 5.0V, VY = 2.0V SYMBOL PARAMETER C1 C2 C3 pL S I2 Dedicated Input Capacitance TEST CONDITIONS Table 2-0006/2032 SE is Data Retention Specifications PARAMETER MINIMUM MAXIMUM 20 – Years 10000 – Cycles Data Retention U Erase/Reprogram Cycles UNITS Table 2-0008A-isp 3 Select devices have been discontinued. See Ordering Information section for product status. Case Temp. with Power Applied .............. -55 to 125°C Specifications ispLSI 2032/A Switching Test Conditions Figure 2. Test Load GND to 3.0V Input Rise and Fall Time 10% to 90% -135, -150, -180 ≤ 1.5 ns -80, -110 ≤ 3 ns Input Timing Reference Levels 1.5V Output Timing Reference Levels 1.5V Output Load + 5V R1 Device Output See Figure 2 Output Load Conditions (see Figure 2) CL 470Ω 390Ω 35pF Active High ∞ 390Ω 35pF Active Low 470Ω 390Ω 35pF Active High to Z at VOH -0.5V C ∞ 390Ω 5pF Active Low to Z at VOL +0.5V 470Ω 390Ω 5pF 0213A EW R2 N B *CL includes Test Fixture and Probe Capacitance. R1 A CL* D ES IG N R2 FO R Table 2 - 0004A DC Electrical Characteristics Over Recommended Operating Conditions SYMBOL VOL VOH IIL IIH IIL-isp IIL-PU IOS1 Output Low Voltage ICC2, 4 TYP. IOL= 8 mA – – 0.4 V IOH = -4 mA 2.4 – – V 03 Output High Voltage CONDITION 3 MIN. 2E PARAMETER – – -10 μA Input or I/O High Leakage Current 3.5V ≤ VIN ≤ VCC – – 10 μA ispEN Input Low Leakage Current 0V ≤ VIN ≤ VIL – – -150 μA pL S I2 Input or I/O Low Leakage Current 0V ≤ VIN ≤ VIL (Max.) MAX. UNITS 0V ≤ VIN ≤ VIL – – -150 μA Output Short Circuit Current VCC = 5V, VOUT = 0.5V – – -200 mA -180, -150 VIL = 0.0V, VIH = 3.0V Comm. Others fTOGGLE = 1 MHz Industrial – 60 – mA Operating Power Supply Current – 40 – mA – 40 – mA Table 2-0007/2032 SE is I/O Active Pull-Up Current U 1. One output at a time for a maximum duration of one second. VOUT = 0.5V was selected to avoid test problems by tester ground degradation. Characterized but not 100% tested. 2. Measured using two 16-bit counters. 3. Typical values are at VCC = 5V and TA= 25°C. 4. Maximum I CC varies widely with specific device configuration and operating frequency. Refer to the Power Consumption section of this data sheet and Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to estimate maximum I CC . 4 Select devices have been discontinued. See Ordering Information section for product status. Table 2-0003/2032 3-state levels are measured 0.5V from steady-state active level. TEST CONDITION Test Point S Input Pulse Levels Specifications ispLSI 2032/A External Timing Parameters Over Recommended Operating Conditions 4 -150 -180 1 -135 MIN. MAX. MIN. MAX. MIN. MAX. A 1 Data Prop. Delay, 4PT Bypass, ORP Bypass A 2 Data Prop. Delay A 3 Clk Frequency with Internal Feedback 3 – 4 Clk Frequency with Ext. Feedback – 5 – 5.0 – 5.5 – 7.5 10.0 UNITS ns 7.5 – 8.0 – – 154 – 137 125 – 111 – 100 – MHz Clk Frequency, Max. Toggle 200 – 167 – 167 – MHz – D ES IG N ( tsu21+ tco1) ns S – 180 MHz – 6 GLB Reg Setup Time before Clk, 4 PT Bypass 3.0 – 3.0 – 4.0 – ns A 7 GLB Reg. Clk to Output Delay, ORP Bypass – 4.0 – 4.5 – 4.5 ns – 8 GLB Reg. Hold Time after Clk, 4 PT Bypass 0.0 – 0.0 – 0.0 – ns – 9 GLB Reg. Setup Time before Clk 4.0 – 4.5 – 5.5 – ns – 10 GLB Reg. Clk to Output Delay – 4.5 – 11 GLB Reg. Hold Time after Clk A 12 Ext. Reset Pin to Output Delay – 13 Ext. Reset Pulse Duration 5.0 – 5.5 ns – 0.0 – 0.0 – ns – 7.0 – 8.0 – 10.0 ns 4.0 – 4.5 – 5.0 – ns – 10.0 – 11.0 – 12.0 ns – 10.0 – 11.0 – 12.0 ns – 5.0 – 5.0 – 6.0 ns – 5.0 – 5.0 – 6.0 ns N EW – 0.0 14 Input to Output Enable 15 Input to Output Disable B 16 Global OE Output Enable C 17 Global OE Output Disable – 18 Ext. Synchronous Clk Pulse Duration, High 2.5 – 3.0 – 3.0 – ns – 19 Ext. Synchronous Clk Pulse Duration, Low 2.5 – 3.0 – 3.0 – ns FO R B C 03 Unless noted otherwise, all parameters use the GRP, 20 PTXOR path, ORP and Y0 clock. Refer to Timing Model in this data sheet for further details. Standard 16-bit counter using GRP feedback. Reference Switching Test Conditions section. U SE is pL S I2 1. 2. 3. 4. DESCRIPTION 5 Table 2-0030B-180/2032 Select devices have been discontinued. See Ordering Information section for product status. tpd1 tpd2 fmax fmax (Ext.) fmax (Tog.) tsu1 tco1 th1 tsu2 tco2 th2 tr1 trw1 tptoeen tptoedis tgoeen tgoedis twh twl TEST 2 # COND. 2E PARAMETER Specifications ispLSI 2032/A External Timing Parameters Over Recommended Operating Conditions 4 TEST 2 # COND. -80 MIN. MAX. MIN. MAX. UNITS 1 Data Propagation Delay, 4PT Bypass, ORP Bypass – 10.0 – 15.0 ns 2 Data Propagation Delay – 13.0 – 18.5 ns A 3 Clock Frequency with Internal Feedback 3 111 – 84.0 4 Clock Frequency with External Feedback ( – 5 Clock Frequency, Max. Toggle – 6 GLB Reg. Setup Time before Clock, 4 PT Bypass A 7 GLB Reg. Clock to Output Delay, ORP Bypass – 8 GLB Reg. Hold Time after Clock, 4 PT Bypass – 9 GLB Reg. Setup Time before Clock – 10 GLB Reg. Clock to Output Delay – 11 GLB Reg. Hold Time after Clock A 12 Ext. Reset Pin to Output Delay 13 Ext. Reset Pulse Duration 14 Input to Output Enable C 15 Input to Output Disable R N – B ) EW – – 57.0 – MHz 125 – 83.0 – MHz 5.5 – 7.5 – ns – 5.5 – 8.0 ns 0.0 – 0.0 – ns 7.5 – 9.5 – ns – 6.5 – 9.5 ns 0.0 – 0.0 – ns – 13.5 – 19.5 ns 6.5 – 10.0 – ns – 14.5 – 24.0 ns – 14.5 – 24.0 ns – 7.0 – 12.0 ns – 7.0 – 12.0 ns – ns – ns 16 Global OE Output Enable 17 Global OE Output Disable – 18 External Synchronous Clock Pulse Duration, High 4.0 – 6.0 – 19 External Synchronous Clock Pulse Duration, Low 4.0 – 6.0 FO B 03 Unless noted otherwise, all parameters use the GRP, 20 PTXOR path, ORP and Y0 clock. Refer to Timing Model in this data sheet for further details. Standard 16-bit counter using GRP feedback. Reference Switching Test Conditions section. pL S is SE U MHz 77.0 C 6 – D ES IG N 1 tsu2 + tco1 S A A I2 1. 2. 3. 4. -110 1 Table 2-0030B-110/2032 Select devices have been discontinued. See Ordering Information section for product status. tpd1 tpd2 fmax fmax (Ext.) fmax (Tog.) tsu1 tco1 th1 tsu2 tco2 th2 tr1 trw1 tptoeen tptoedis tgoeen tgoedis twh twl DESCRIPTION 2E PARAMETER Specifications ispLSI 2032/A Internal Timing Parameters1 Over Recommended Operating Conditions PARAMETER 2 # -150 -180 DESCRIPTION -135 MIN. MAX. MIN. MAX. MIN. MAX. UNITS 20 Input Buffer Delay – 0.6 – 0.6 – 1.1 21 Dedicated Input Delay – 1.1 – 1.3 – 22 GRP Delay – 0.7 – 0.7 – 1.3 ns 23 4 Product Term Bypass Path Delay (Combinatorial) – 2.3 – 2.6 – 3.6 ns 24 4 Product Term Bypass Path Delay (Registered) – 3.1 – 3.1 – 3.6 ns 25 1 Product Term/XOR Path Delay – 3.6 – 4.3 – 5.0 ns 26 20 Product Term/XOR Path Delay – 4.1 – 4.6 – 5.1 ns tgrp t4ptbpc t4ptbpr t1ptxor t20ptxor txoradj tgbp tgsu tgh tgco tgro tptre tptoe tptck – 4.8 – 5.0 – 5.6 ns – 0.2 – 0.0 – 0.0 ns 0.5 – 0.7 – 0.3 – ns 1.8 – 1.8 – 3.0 – ns – 0.7 – 0.8 – 0.7 ns – 1.0 – 1.2 – 1.1 ns 33 GLB Product Term Reset to Register Delay – 2.8 – 2.9 – 4.4 ns 34 GLB Product Term Output Enable to I/O Cell Delay – 5.9 – 6.9 – 6.4 ns 2.5 3.8 2.5 4.1 2.9 5.2 ns – 0.7 – 0.8 – 1.3 ns – 0.2 – 0.3 – 0.3 ns – 1.2 – 1.3 – 1.2 ns 39 Output Slew Limited Delay Adder – 10.0 – 10.0 – 10.0 ns 40 I/O Cell OE to Output Enabled – 2.8 – 2.8 – 3.2 ns 41 I/O Cell OE to Output Disabled – 2.8 – 2.8 – 3.2 ns 42 Global Output Enable – 2.2 – 2.2 – 2.8 ns 43 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) 1.9 1.9 2.1 2.1 2.3 2.3 ns 44 Clock Delay, Y1 or Y2 to Global GLB Clock Line 1.9 1.9 2.1 2.1 2.3 2.3 ns – 4.1 – 4.7 – 6.4 ns 27 XOR Adjacent Path Delay 30 GLB Register Hold Time after Clock FO 32 GLB Register Reset to Output Delay 2E 35 GLB Product Term Clock Delay 03 36 ORP Delay 37 ORP Bypass Delay I2 is pL S 38 Output Buffer Delay SE tgy0 tgy1/2 R 31 GLB Register Clock to Output Delay Outputs Clocks N 29 GLB Register Setup Time before Clock ORP tob tsl toen todis tgoe 3 28 GLB Register Bypass Delay torp torpbp ns EW GLB ns U Global Reset tgr 45 Global Reset to GLB 1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 3. The XOR adjacent path can only be used by hard macros. 7 Table 2-0036C-180/2032 Select devices have been discontinued. See Ordering Information section for product status. GRP 2.4 D ES IG N tio tdin S Inputs Specifications ispLSI 2032/A Internal Timing Parameters1 Over Recommended Operating Conditions 2 PARAMETER # -110 DESCRIPTION -80 MIN. MAX. MIN. MAX. UNITS Inputs – 1.7 – 2.2 21 Dedicated Input Delay – 3.4 – 4.8 tgrp 22 GRP Delay GLB 23 4 Product Term Bypass Path Delay (Combinatorial) 24 4 Product Term Bypass Path Delay (Registered) 25 1 Product Term/XOR Path Delay 27 XOR Adjacent Path Delay 30 GLB Register Hold Time after Clock – 1.7 – 2.6 ns – 4.9 – 7.2 ns – 4.8 – 7.2 ns – 6.2 – 8.8 ns – 6.8 – 9.2 ns – 7.5 – 10.2 ns – 0.1 – 0.0 ns 0.5 – 0.1 – ns 4.0 – 6.0 – ns – 0.6 – 0.4 ns – 1.8 – 2.2 ns 33 GLB Product Term Reset to Register Delay – 5.9 – 8.8 ns 34 GLB Product Term Output Enable to I/O Cell Delay – 7.1 – 12.8 ns 4.0 7.0 5.5 9.5 ns – 1.5 – 2.1 ns – 0.5 – 0.6 ns 38 Output Buffer Delay – 1.2 – 2.4 ns 39 Output Slew Limited Delay Adder – 10.0 – 10.0 ns 40 I/O Cell OE to Output Enabled – 4.0 – 6.4 ns 41 I/O Cell OE to Output Disabled – 4.0 – 6.4 ns 42 Global Output Enable – 3.0 – 5.6 ns 43 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) 3.2 3.2 4.6 4.6 ns 44 Clock Delay, Y1 or Y2 to Global GLB Clock Line 3.2 3.2 4.6 4.6 ns – 9.0 – 12.8 ns FO 32 GLB Register Reset to Output Delay 35 GLB Product Term Clock Delay 03 36 ORP Delay 37 ORP Bypass Delay I2 pL S SE tgy0 tgy1/2 R 31 GLB Register Clock to Output Delay is Clocks N 29 GLB Register Setup Time befor Clock Outputs tob tsl toen todis tgoe 3 28 GLB Register Bypass Delay ORP torp torpbp EW 26 20 Product Term/XOR Path Delay 2E t4ptbpc t4ptbpr t1ptxor t20ptxor txoradj tgbp tgsu tgh tgco tgro tptre tptoe tptck ns U Global Reset tgr 45 Global Reset to GLB 1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 3. The XOR adjacent path can only be used by hard macros. 8 Table 2-0036C-110/2032 Select devices have been discontinued. See Ordering Information section for product status. GRP ns S 20 Input Buffer Delay D ES IG N tio tdin Specifications ispLSI 2032/A ispLSI 2032/A Timing Model I/O Cell GRP GLB ORP I/O Cell Feedback Reg 4 PT Bypass GLB Reg Bypass ORP Bypass #20 #22 #24 #28 #37 20 PT XOR Delays GLB Reg Delay D #25, 26, 27 ORP Delay Q RST #45 Reset #29, 30, 31, 32 EW Control RE PTs OE #33, 34, CK 35 #43, 44 Y0,1,2 R N #42 GOE 0 FO Derivations of tsu, th and tco from the Product Term Clock 1 = = = 2.1 ns = Logic + Reg su - Clock (min) (tio + tgrp + t20ptxor) + (tgsu) - (tio + tgrp + tptck(min)) (#20+ #22+ #26) + (#29) - (#20+ #22+ #35) (0.6 + 0.7 + 4.1) + (0.5) - (0.6 + 0.7 + 2.5) th = = = 1.5 ns = Clock (max) + Reg h - Logic (tio + tgrp + tptck(max)) + (tgh) - (tio + tgrp + t20ptxor) (#20+ #22+ #35) + (#30) - (#20+ #22+ #26) (0.6 + 0.7 + 3.8) + (1.8) - (0.6 + 0.7 + 4.1) tco = = = 7.7 ns = Clock (max) + Reg co + Output (tio + tgrp + tptck(max)) + (tgco) + (torp + tob) (#20+ #22+ #35) + (#31) + (#36 + #38) (0.6 + 0.7 + 3.8) + (0.7) + (0.7 + 1.2) is pL S I2 03 2E tsu Note: Calculations are based upon timing specifications for the ispLSI 2032/A-180L U SE Table 2- 0042-16/2032 9 #38, 39 D ES IG N GRP #36 #40, 41 0491/2000 I/O Pin (Output) Select devices have been discontinued. See Ordering Information section for product status. I/O Pin (Input) Comb 4 PT Bypass #23 #21 I/O Delay S Ded. In Specifications ispLSI 2032/A Power Consumption used. Figure 4 shows the relationship between power and operating speed. Power consumption in the ispLSI 2032 and 2032A devices depends on two primary factors: the speed at which the device is operating and the number of Product Terms 120 110 ispLSI 2032/A (-150, -180) 90 EW ICC (mA) 100 80 70 N ispLSI 2032/A (-80, -110, -135) 60 40 20 40 60 2E 1 FO R 50 80 100 120 140 160 180 fmax (MHz) 03 Notes: Configuration of Two 16-bit Counters Typical Current at 5V, 25° C I2 ICC can be estimated for the ispLSI 2032/A using the following equation: pL S For 2032/A -150, -180: ICC(mA) = 30 + (# of PTs * 0.46) + (# of nets * Max freq * 0.012) For 2032/A -135, -110, -80: ICC(mA) = 21 + (# of PTs * 0.30) + (# of nets * Max freq * 0.012) SE is Where: # of PTs = Number of Product Terms used in design # of nets = Number of Signals used in device Max freq = Highest Clock Frequency to the device (in MHz) U The ICC estimate is based on typical conditions (VCC = 5.0V, room temperature) and an assumption of two GLB loads on average exists. These values are for estimates only. Since the value of ICC is sensitive to operating conditions and the program in the device, the actual ICC should be verified. 0127A/2032A 10 Select devices have been discontinued. See Ordering Information section for product status. D ES IG N S Figure 4. Typical Device Power Consumption vs fmax Specifications ispLSI 2032/A Pin Description 44-PIN PLCC PIN NUMBERS NAME 48-PIN TQFP PIN NUMBERS 9, 14, 20, 25, 33, 38, 44, 1, 10, 15, 21, 26, 34, 39, 45, 2, 11, 16, 22, 27, 35, 40, 46, 3, 13, 17, 23, 28, 37, 41, 47, 4 DESCRIPTION Input/Output Pins — These are the general purpose I/O pins used by the logic array. 15, 19, 25, 29, 37, 41, 3, 7, GOE 0 2 40 43 Global Output Enable input pin. Y0 11 5 5 RESET/Y1 35 29 31 Dedicated Clock input. This clock input is connected to one of the clock inputs of all the GLBs on the device. This pin performs two functions: - Dedicated clock input. This clock input is brought into the Clock Distribution Network, and can optionally be routed to any GLB and/or I/O cell on the device. - Active Low (0) Reset pin which resets all of the GLB and I/O registers in the device. ispEN 13 7 7 SDI/IN 02 14 8 8 MODE 36 30 SDO/IN 12 24 18 SCLK/Y22 33 11, 15, 21, 25, 33, 37, 43, 3, 12, 16, 22, 26, 34, 38, 44, 4 Input — Dedicated in-system programming enable input pin. This pin is brought low to enable the programming mode. The MODE, SDI, SDO and SCLK controls become active. 23 is 12, 34 FO 2E Input — When in ISP Mode, controls operation of ISP state machine. 19 Output/Input — This pin performs two functions. When ispEN is logic low, it functions as an output pin to read serial shift register data. When ispEN is high, it functions as a dedicated input pin. 27 29 Input — This pin performs two functions. When ispEN is logic low, it functions as a clock pin for the Serial Shift Register. When ispEN is high, it functions as a dedicated clock input. This clock input is brought into the Clock Distribution Network and can be routed to any GLB and/or I/O cell on the device. 17, 39 18, 42 Ground (GND) 6, 6, VCC 28 30 12, 24, 36, 48 SE NC1 Input — This pin performs two functions. When ispEN is logic low, it functions as an input pin to load programming data into the device. SDI/IN0 also is used as one of the two control pins for the isp state machine. When ispEN is high, it functions as a dedicated input pin. 03 VCC 1, 32 I2 pL S GND D ES IG N 10, 14, 20, 24, 32, 36, 42, 2, EW 9, 13, 19, 23, 31 35, 41, 1, N 17, 21, 27, 31, 39, 43, 5, 9, R 16, 20, 26, 30, 38, 42, 4, 8, S I/O 0 - I/O 3 I/O 4 - I/O 7 I/O 8 - I/O 11 I/O 12 - I/O 15 I/O 16 - I/O 19 I/O 20 - I/O 23 I/O 24 - I/O 27 I/O 28 - I/O 31 U 1. NC pins are not to be connected to any active signals, VCC or GND. 2. Pins have dual function capability. 11 No Connect. Table 2-0002A-08isp/2032 Select devices have been discontinued. See Ordering Information section for product status. 18, 22, 28, 32, 40, 44, 6, 10 44-PIN TQFP PIN NUMBERS Specifications ispLSI 2032/A Pin Configuration I/O 21 I/O 20 I/O 19 I/O 22 GND I/O 23 GOE 0 I/O 24 I/O 26 I/O 25 I/O 27 ispLSI 2032/A 44-Pin PLCC Pinout Diagram 7 8 I/O 30 9 I/O 31 10 11 Y0 VCC ispEN 13 0 14 I/O 0 I/O 1 I/O 2 15 16 17 Top View 39 I/O 18 38 37 I/O 17 I/O 16 36 MODE 35 34 RESET/Y1 VCC 33 SCLK/Y21 32 I/O 15 31 30 29 I/O 14 I/O 13 I/O 12 EW 1SDI/IN ispLSI 2032/A 12 D ES IG N I/O 29 N I/O 9 I/O 10 I/O 11 R I/O 8 1 1SDO/IN GND I/O 7 I/O 6 I/O 4 I/O 5 I/O 3 18 19 20 21 22 23 24 25 26 27 28 FO 0123B/2032/A 2E 1. Pins have dual function capability. I2 pL S I/O 28 I/O 29 I/O 30 Y0 VCC ispEN 1SDI/IN 0 I/O 0 I/O 1 I/O 2 I/O 21 I/O 20 I/O 19 I/O 22 GND I/O 23 GOE 0 I/O 24 44 43 42 41 40 39 38 37 36 35 34 1 2 3 4 5 33 I/O 18 32 31 I/O 17 I/O 16 30 MODE RESET/Y1 VCC 6 ispLSI 2032/A 29 28 7 Top View 27 SCLK/Y21 8 26 I/O 15 9 10 11 25 24 23 I/O 14 I/O 13 I/O 12 12 I/O 9 I/O 10 I/O 11 1 1. Pins have dual function capability. I/O 8 1SDO/IN GND I/O 7 I/O 6 I/O 4 I/O 5 12 13 14 15 16 17 18 19 20 21 22 I/O 3 U SE is I/O 31 I/O 26 I/O 25 I/O 27 03 ispLSI 2032/A 44-Pin TQFP Pinout Diagram 0851/2032/A Select devices have been discontinued. See Ordering Information section for product status. I/O 28 S 6 5 4 3 2 1 44 43 42 41 40 Specifications ispLSI 2032/A Pin Configuration I/O 21 I/O 20 I/O 19 I/O 22 GND I/O 23 GOE 0 I/O 24 I/O 26 I/O 25 I/O 27 NC1 ispLSI 2032/A 48-Pin TQFP Pinout Diagram Y0 VCC ispEN 2SDI/IN 0 I/O 0 I/O 1 I/O 2 1NC NC1 35 I/O 18 34 33 3 4 5 6 ispLSI 2032/A 7 Top View 32 31 30 8 29 9 10 11 12 28 27 26 25 D ES IG N I/O 31 36 I/O 17 I/O 16 MODE RESET/Y12 VCC SCLK/Y22 I/O 15 I/O 14 I/O 13 I/O 12 FO N I/O 9 I/O 10 I/O 11 1NC R I/O 8 I/O 7 GND 2SDO/IN 1 I/O 6 I/O 4 I/O 5 I/O 3 13 14 15 16 17 18 19 20 21 22 23 24 48-Pin TQFP-2032/A U SE is pL S I2 03 2E 1. NC pins are not to be connected to any active signal, Vcc or GND. 2. Pins have dual function capability. 13 Select devices have been discontinued. See Ordering Information section for product status. I/O 29 I/O 30 1 2 EW I/O 28 S 48 47 46 45 44 43 42 41 40 39 38 37 Specifications ispLSI 2032/A Part Number Description ispLSI XXXX – XXX X XXX X Device Family Grade Blank = Commercial I = Industrial Package J = PLCC T44 = TQFP T48 = TQFP JN = Lead-Free PLCC TN48 = Lead-Free TQFP TN48 = Lead-Free TQFP Speed 180 = 180 MHz fmax 150 = 154 MHz fmax 135 = 137 MHz fmax 110 = 111 MHz fmax 80 = 84 MHz fmax Power L = Low EW 1. Discontinued per PCN #02-06. Contact Rochester Electronics for available inventory. N ispLSI 2032/A Ordering Information R Conventional Packaging fmax (MHz) tpd (ns) ispLSI 180 180 180 154 154 154 137 137 137 111 111 111 84 84 84 5.0 5.0 5.0 5.5 5.5 5.5 7.5 7.5 7.5 10 10 10 15 15 15 03 I2 pL S is SE U ORDERING NUMBER PACKAGE ispLSI 2032A-180LJ44 44-Pin PLCC 44-Pin TQFP 48-Pin TQFP 44-Pin PLCC 44-Pin TQFP 48-Pin TQFP 44-Pin PLCC 44-Pin TQFP 48-Pin TQFP 44-Pin PLCC 44-Pin TQFP 48-Pin TQFP 44-Pin PLCC 44-Pin TQFP 48-Pin TQFP ispLSI 2032A-180LT44 ispLSI 2032A-180LT48 ispLSI 2032A-150LJ44 ispLSI 2032A-150LT44 ispLSI 2032A-150LT48 ispLSI 2032A-135LJ44 ispLSI 2032A-135LT44 ispLSI 2032A-135LT48 ispLSI 2032A-110LJ44 ispLSI 2032A-110LT44 ispLSI 2032A-110LT48 ispLSI 2032A-80LJ44 ispLSI 2032A-80LT44 ispLSI 2032A-80LT48 2E FAMILY FO COMMERCIAL Table 2-0041A/2032A INDUSTRIAL FAMILY fmax (MHz) tpd (ns) ORDERING NUMBER PACKAGE ispLSI 84 84 84 15 15 15 ispLSI 2032A-80LJ44I ispLSI 2032A-80LT44I ispLSI 2032A-80LT48I 44-Pin PLCC 44-Pin TQFP 48-Pin TQFP Table 2-0041B/2032A 14 Select devices have been discontinued. See Ordering Information section for product status. D ES IG N S Device Number 20321 2032A Specifications ispLSI 2032/A ispLSI 2032/A Ordering Information (Cont.) Conventional Packaging COMMERCIAL tpd (ns) ispLSI 180 180 180 154 154 154 137 137 137 111 111 111 84 84 84 5.0 5.0 5.0 5.5 5.5 5.5 7.5 7.5 7.5 10 10 10 15 15 15 ORDERING NUMBER ispLSI 2032A-180LJ441 N EW D ES IG N ispLSI 2032A-180LT441 ispLSI 2032A-180LT481 ispLSI 2032A-150LJ441 ispLSI 2032A-150LT441 ispLSI 2032A-150LT481 ispLSI 2032A-135LJ441 ispLSI 2032A-135LT441 ispLSI 2032A-135LT481 ispLSI 2032A-110LJ441 ispLSI 2032A-110LT441 ispLSI 2032A-110LT481 ispLSI 2032A-80LJ441 ispLSI 2032A-80LT441 ispLSI 2032A-80LT481 PACKAGE 44-Pin PLCC 44-Pin TQFP 48-Pin TQFP 44-Pin PLCC 44-Pin TQFP 48-Pin TQFP 44-Pin PLCC 44-Pin TQFP 48-Pin TQFP 44-Pin PLCC 44-Pin TQFP 48-Pin TQFP 44-Pin PLCC 44-Pin TQFP 48-Pin TQFP S fmax (MHz) R 1. Discontinued per PCN #02-06. Contact Rochester Electronics for available inventory. fmax (MHz) tpd (ns) ispLSI 84 84 84 15 15 15 2E FAMILY FO INDUSTRIAL ORDERING NUMBER ispLSI 2032-80LJI1 ispLSI 2032-80LT44I1 ispLSI 2032-80LT48I1 PACKAGE 44-Pin PLCC 44-Pin TQFP 48-Pin TQFP SE U COMMERCIAL fmax (MHz) tpd (ns) ORDERING NUMBER PACKAGE 180 180 180 154 154 154 137 137 137 111 111 111 84 84 84 5.0 5.0 5.0 5.5 5.5 5.5 7.5 7.5 7.5 10 10 10 15 15 15 ispLSI 2032A-180LJN44 ispLSI 2032A-180LTN44 ispLSI 2032A-180LTN48 ispLSI 2032A-150LJN44 ispLSI 2032A-150LTN44 ispLSI 2032A-150LTN48 ispLSI 2032A-135LJN44 ispLSI 2032A-135LTN44 ispLSI 2032A-135LTN48 ispLSI 2032A-110LJN44 ispLSI 2032A-110LTN44 ispLSI 2032A-110LTN48 ispLSI 2032A-80LJN44 ispLSI 2032A-80LTN44 ispLSI 2032A-80LTN48 Lead-Free 44-Pin PLCC Lead-Free 44-Pin TQFP Lead-Free 48-Pin TQFP Lead-Free 44-Pin PLCC Lead-Free 44-Pin TQFP Lead-Free 48-Pin TQFP Lead-Free 44-Pin PLCC Lead-Free 44-Pin TQFP Lead-Free 48-Pin TQFP Lead-Free 44-Pin PLCC Lead-Free 44-Pin TQFP Lead-Free 48-Pin TQFP Lead-Free 44-Pin PLCC Lead-Free 44-Pin TQFP Lead-Free 48-Pin TQFP is FAMILY ispLSI I2 pL S Lead-Free Packaging 03 1. Discontinued per PCN #02-06. Contact Rochester Electronics for available inventory. 15 Select devices have been discontinued. See Ordering Information section for product status. FAMILY Specifications ispLSI 2032/A ispLSI 2032/A Ordering Information (Cont.) Lead-Free Packaging INDUSTRIAL fmax (MHz) tpd (ns) ORDERING NUMBER PACKAGE ispLSI 84 84 84 15 15 15 ispLSI 2032A-80LJN44I ispLSI 2032A-80LTN44I ispLSI 2032A-80LTN48I Lead-Free 44-Pin PLCC Lead-Free 44-Pin TQFP Lead-Free 48-Pin TQFP Revision History Version — 10 Previous Lattice release. Change Summary August 2006 11 Updated for lead-free package options. U SE is pL S I2 03 2E FO R N EW Date 16 Select devices have been discontinued. See Ordering Information section for product status. D ES IG N S FAMILY