iCE40LM Family Data Sheet DS1045 Version 1.5, March 2015 iCE40LM Family Data Sheet Introduction January 2014 Data Sheet DS1045 General Description iCE40LM family is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications, such as smartphones, tablets and hand-held devices. The iCE40LM family includes integrated SPI & I2C blocks to interface with virtually all mobile sensors and application processors. The iCE40LM family also features two Strobe Generators that can generates strobes in Microsecond ranges with the Low-Power Strobe Generator, and also generates strobes in Nanosecond ranges with the High-Speed Strobe Generator. In addition, the iCE40LM family of devices includes logic to perform other functions such as mobile bridging, antenna tuning, GPIO expansion, motion/gesture recognition, IR remote control, bar code emulation and other custom functions. The iCE40LM family features three device densities, from 1100 to 3520 Look Up Tables (LUTs) of logic with programmable I/Os that can be used as either SPI/I2C interface ports or general purpose I/O’s. It also has up to 80 kbits of Block RAMs to work with user logic. Features Flexible Logic Architecture High Current Drive Outputs for LED • Three devices with 1100 to 3520 LUTs • 18 I/O pins for 25-pin WLCSP Ultra-low Power Devices • Advanced 40 nm ultra-low power process • As low as 120 µW standby power typical Embedded and Distributed Memory • Up to 80 kbits sysMEM™ Embedded Block RAM • Three High Drive (HD) output in each device • Source/sink nominal 24 mA Flexible On-Chip Clocking • Six low-skew global signal resource Flexible Device Configuration • SRAM is configured through SPI Ultra-Small Form Factor • As small as 25-pin WLCSP package 1.71 mm x 1.71 mm Two Hardened I2C Interfaces Two Hardened SPI Interfaces Two On-Chip Strobe Generators • Low-Power Strobe Generator (Microsecond ranges) • High-Speed Strobe Generator (Nanosecond ranges) Applications • Smartphones • Multi Sensor Management Applications • Tablets and Consumer Handheld Devices • Sensor Pre-processing & Sensor Fusion • Handheld Commercial and Industrial Devices • Always-On Sensor Applications © 2014 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 1-1 DS1045 Introduction_01.3 Introduction iCE40LM Family Data Sheet Table 1-1. iCE40LM Family Selection Guide Part Number Logic Cells (LUT + Flip-Flop) RAM4K Memory Blocks RAM4K RAM Bits iCE40LM1K iCE40LM2K iCE40LM4K 1100 2048 3520 16 20 20 80K 80K 64K Package Programmable I/O Count 25-pin WLCSP, 1.71 mm x 1.71 mm, 0.35 mm 18 18 18 36-pin ucBGA, 2.5 mm x 2.5 mm, 0.40 mm 28 28 28 49-pin ucBGA, 3 mm x 3 mm, 0.40 mm 37 37 37 Introduction The iCE40LM family of ultra-low power FPGAs has three devices with densities ranging from 1100 to 3520 LookUp Tables (LUTs). In addition to LUT-based, low-cost programmable logic, these devices also feature Embedded Block RAM (EBR), two Strobe Generators (LPSG, HSSG), two hardened I2C Controllers and two hardened SPI Controllers. These features allow the devices to be used in low-cost, high-volume consumer and mobile applications. The iCE40LM devices are fabricated on a 40nm CMOS low power process. The device architecture has several features such as user configurable I2C and SPI Controllers, either as master or slave, and two Strobe Generators. The iCE40LM FPGAs are available in very small form factor packages, with the smallest in 25-pin WLCSP. The 25pin WLCSP package has a 0.35 mm ball pitch, resulting to an overall package size of 1.71 mm x 1.71 mm that easily fits into a lot of mobile applications. Table 1-1 shows the LUT densities, package and I/O pin count. The iCE40LM devices offer enhanced I/O features such as pull-up resistors. Pull-up features are controllable on a “per-pin” basis. Lattice provides a variety of design tools that allow complex designs to be efficiently implemented using the iCE40LM family of devices. Popular logic synthesis tools provide synthesis library support for iCE40LM. Lattice design tools use the synthesis tool output along with the user-specified preferences and constraints to place and route the design in the iCE40LM device. These tools extract the timing from the routing and back-annotate it into the design for timing verification. Lattice provides many pre-engineered IP (Intellectual Property) modules, including a number of reference designs, licensed free of charge, optimized for the iCE40LM FPGA family. Lattice also can provide fully verified bit-stream for some of the widely used target functions in mobile device applications, such as ultra-low power sensor management, gesture recognition, IR remote, barcode emulator functions. Users can use these functions as offered by Lattice, or they can use the design to create their own unique required functions. For more information regarding Lattice's Reference Designs or fully-verified bitstreams, please contact your local Lattice representative. 1-2 iCE40LM Family Data Sheet Architecture March 2014 Data Sheet DS1045 Architecture Overview The iCE40LM family architecture contains an array of Programmable Logic Blocks (PLB), two Strobe Generators, two user configurable I2C controllers, two user configurable SPI controllers, and blocks of sysMEM™ Embedded Block RAM (EBR) surrounded by Programmable I/O (PIO). Figure 2-1shows the block diagram of the iCE40LM-4K device. Figure 2-1. iCE40LM-4K Device, Top View I2C I/O Bank 0 4 kbit RAM Blocks 4 kbit RAM Blocks PLB 4 kbit RAM Blocks LPSG 4 kbit RAM Blocks HSSG 8 Logic Cells = Programmable Logic Block I 2C config SPI SPI I/O Bank 2 Carry Logic 4-Input Look-up Table (LUT) Flip-flop with Enable and Reset Controls The logic blocks, Programmable Logic Blocks (PLB) and sysMEM EBR blocks, are arranged in a two-dimensional grid with rows and columns. Each column has either logic blocks or EBR blocks. The PIO cells are located at the top and bottom of the device, arranged in banks. The PLB contains the building blocks for logic, arithmetic, and register functions. The PIOs utilize a flexible I/O buffer referred to as a sysIO buffer that supports operation with a variety of interface standards. The blocks are connected with many vertical and horizontal routing channel resources. The place and route software tool automatically allocates these routing resources. In the iCE40LM family, There are two sysIO banks, one on top and one on bottom. User can connect both VCCIOs together, if all the I/Os are using the same voltage standard. Refer to the details in later sections of this document. The sysMEM EBRs are large 4 kbit, dedicated fast memory blocks. These blocks can be configured as RAM, ROM or FIFO with user logic using PLBs. Every device in the family has two user SPI ports, one of these (right side) SPI port also supports programming and configuration of the device. The iCE40LM also includes two user I2C ports, and two Strobe Generators. © 2014 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 2-1 DS1045 Architecture_01.4 Architecture iCE40LM Family Data Sheet PLB Blocks The core of the iCE40LM device consists of Programmable Logic Blocks (PLB) which can be programmed to perform logic and arithmetic functions. Each PLB consists of eight interconnected Logic Cells (LC) as shown in Figure 2-2. Each LC contains one LUT and one register. Figure 2-2. PLB Block Diagram Shared Block-Level Controls Clock Programmable Logic Block (PLB) Enable FCOUT 1 Set/Reset 0 Logic Cell Carry Logic DFF 8 Logic Cells (LCs) I0 D O Q EN I1 LUT I2 SR I3 FCIN Four-input Look-Up Table (LUT) Flip-flop with optional enable and set or reset controls = Statically defined by configuration program Logic Cells Each Logic Cell includes three primary logic elements shown in Figure 2-2. • A four-input Look-Up Table (LUT) builds any combinational logic function, of any complexity, requiring up to four inputs. Similarly, the LUT element behaves as a 16x1 Read-Only Memory (ROM). Combine and cascade multiple LUTs to create wider logic functions. • A ‘D’-style Flip-Flop (DFF), with an optional clock-enable and reset control input, builds sequential logic functions. Each DFF also connects to a global reset signal that is automatically asserted immediately following device configuration. • Carry Logic boosts the logic efficiency and performance of arithmetic functions, including adders, subtracters, comparators, binary counters and some wide, cascaded logic functions. Table 2-1. Logic Cell Signal Descriptions Function Type Input Data signal Input Control signal Signal Names I0, I1, I2, I3 Enable Description Inputs to LUT Clock enable shared by all LCs in the PLB Input Control signal Set/Reset1 Asynchronous or synchronous local set/reset shared by all LCs in the PLB. Input Control signal Clock Clock one of the eight Global Buffers, or from the general-purpose interconnects fabric shared by all LCs in the PLB Input Inter-PLB signal FCIN Fast carry in Output Data signals Output Inter-PFU signal O FCOUT LUT or registered output Fast carry out 1. If Set/Reset is not used, then the flip-flop is never set/reset, except when cleared immediately after configuration. 2-2 Architecture iCE40LM Family Data Sheet Routing There are many resources provided in the iCE40LM devices to route signals individually with related control signals. The routing resources consist of switching circuitry, buffers and metal interconnect (routing) segments. The inter-PLB connections are made with three different types of routing resources: Adjacent (spans two PLBs), x4 (spans five PLBs) and x12 (spans thirteen PLBs). The Adjacent, x4 and x12 connections provide fast and efficient connections in the diagonal, horizontal and vertical directions. The design tool takes the output of the synthesis tool and places and routes the design. Clock/Control Distribution Network Each iCE40LM device has six global inputs, two pins on the top bank and four pins on the bottom bank These global inputs can be used as high fanout nets, clock, reset or enable signals. The dedicated global pins are identified as Gxx and the global buffers are identified as GBUF[7:0]. These six inputs may be used as general purpose I/O if they are not used to drive the clock nets. Table 2-2 lists the connections between a specific global buffer and the inputs on a PLB. All global buffers optionally connect to the PLB CLK input. Any four of the eight global buffers can drive logic inputs to a PLB. Even-numbered global buffers optionally drive the Set/Reset input to a PLB. Similarly, odd-numbered buffers optionally drive the PLB clock-enable input. GBUF[7:6, 3:0] can connect directly to G[7:6, 3:0] pins respectively. GBUF4 and GBUF5 can connect to the two on-chip Strobe Generators (GBUF4 connects to LPSG, GBUF5 connects to HSSG). Table 2-2. Global Buffer (GBUF) Connections to Programmable Logic Blocks Global Buffer Clock Clock Enable GBUF0 Yes Yes GBUF1 Yes GBUF2 Yes GBUF3 Yes GBUF4 LUT Inputs Yes, any 4 of 8 GBUF Inputs Yes GBUF5 Yes GBUF6 Yes GBUF7 Yes Reset Yes Yes Yes Yes Yes Yes Yes The maximum frequency for the global buffers are shown in the iCE40LM External Switching Characteristics tables later in this document. Global Hi-Z Control The global high-impedance control signal, GHIZ, connects to all I/O pins on the iCE40LM device. This GHIZ signal is automatically asserted throughout the configuration process, forcing all user I/O pins into their high-impedance state. Global Reset Control The global reset control signal connects to all PLB and PIO flip-flops on the iCE40LM device. The global reset signal is automatically asserted throughout the configuration process, forcing all flip-flops to their defined wake-up state. For PLB flip-flops, the wake-up state is always reset, regardless of the PLB flip-flop primitive used in the application. 2-3 Architecture iCE40LM Family Data Sheet sysCLOCK Phase Locked Loops (PLLs) - NOT SUPPORTED on the 25-Pin WLCSP The sysCLOCK PLLs provide the ability to synthesize clock frequencies. The iCE40LM devices have one sysCLOCK PLL (Please note that the 25-pin WLCSP package does not support the PLL). REFERENCECLK is the reference frequency input to the PLL and its source can come from an external I/O pin, the internal strobe generator or from internal routing. EXTFEEDBACK is the feedback signal to the PLL which can come from internal routing or an external I/O pin. The feedback divider is used to multiply the reference frequency and thus synthesize a higher frequency clock output. The PLLOUT output has an output divider, thus allowing the PLL to generate different frequencies for each output. The output divider can have a value from 1 to 64 (in increments of 2X). The PLLOUT outputs can all be used to drive the iCE40 global clock network directly or general purpose routing resources can be used. The LOCK signal is asserted when the PLL determines it has achieved lock and de-asserted if a loss of lock is detected. A block diagram of the PLL is shown in Figure 2-3. The timing of the device registers can be optimized by programming a phase shift into the PLLOUT output clock which will advance or delay the output clock with reference to the REFERENCECLK clock. This phase shift can be either programmed during configuration or can be adjusted dynamically. In dynamic mode, the PLL may lose lock after a phase adjustment on the output used as the feedback source and not relock until the tLOCK parameter has been satisfied. The iCE40LM PLL functions the same as the PLLs in the iCE40 family. For more details on the PLL, see TN1251, iCE40 sysCLOCK PLL Design and Usage Guide. Figure 2-3. PLL Diagram RESET BYPASS BYPASS GNDPLL VCCPLL REFERENCECLK DIVR Phase Detector Input Divider RANGE Low-Pass Filter DIVQ Voltage Controlled Oscillator (VCO) VCO Divider SIMPLE DIVF PLLOUTCORE Feedback Divider Fine Delay Adjustment Feedback Phase Shifter Fine Delay Adjustment Output Port PLLOUTGLOBAL Feedback_Path LOCK DYNAMICDELAY[7:0] EXTFEEDBACK LATCHINPUTVALUE EXTERNAL Low Power mode (iCEgate enabled) Table 2-3 provides signal descriptions of the PLL block. 2-4 Architecture iCE40LM Family Data Sheet Table 2-3. PLL Signal Descriptions Signal Name Direction Description REFERENCECLK Input Input reference clock BYPASS Input The BYPASS control selects which clock signal connects to the PLLOUT output. 0 = PLL generated signal 1 = REFERENCECLK EXTFEEDBACK Input External feedback input to PLL. Enabled when the FEEDBACK_PATH attribute is set to EXTERNAL. DYNAMICDELAY[7:0] Input Fine delay adjustment control inputs. Enabled when DELAY_ADJUSTMENT_MODE is set to DYNAMIC. LATCHINPUTVALUE Input When enabled, forces the PLL into low-power mode; PLL output is held static at the last input clock value. Set ENABLE ICEGATE_PORTA and PORTB to ‘1’ to enable. PLLOUTGLOBAL Output Output from the Phase-Locked Loop (PLL). Drives a global clock network on the FPGA. The port has optimal connections to global clock buffers GBUF4 and GBUF5. PLLOUTCORE Output Output clock generated by the PLL, drives regular FPGA routing. The frequency generated on this output is the same as the frequency of the clock signal generated on the PLLOUTLGOBAL port. LOCK Output When High, indicates that the PLL output is phase aligned or locked to the input reference clock. RESET Input Active low reset. sysMEM Embedded Block RAM Memory Larger iCE40LM device includes multiple high-speed synchronous sysMEM Embedded Block RAMs (EBRs), each 4 kbit in size. This memory can be used for a wide variety of purposes including data buffering, and FIFO. sysMEM Memory Block The sysMEM block can implement single port, pseudo dual port, or FIFO memories with programmable logic resources. Each block can be used in a variety of depths and widths as shown in Table 2-4. Table 2-4. sysMEM Block Configurations1 Block RAM Configuration and Size WADDR Port Size (Bits) WDATA Port Size (Bits) RADDR Port Size (Bits) RDATA Port Size (Bits) MASK Port Size (Bits) SB_RAM256x16 SB_RAM256x16NR SB_RAM256x16NW SB_RAM256x16NRNW 256x16 (4K) 8 [7:0] 16 [15:0] 8 [7:0] 16 [15:0] 16 [15:0] SB_RAM512x8 SB_RAM512x8NR SB_RAM512x8NW SB_RAM512x8NRNW 512x8 (4K) 9 [8:0] 8 [7:0] 9 [8:0] 8 [7:0] No Mask Port SB_RAM1024x4 SB_RAM1024x4NR SB_RAM1024x4NW SB_RAM1024x4NRNW 1024x4 (4K) 10 [9:0] 4 [3:0] 10 [9:0] 4 [3:0] No Mask Port SB_RAM2048x2 SB_RAM2048x2NR SB_RAM2048x2NW SB_RAM2048x2NRNW 2048x2 (4K) 11 [10:0] 2 [1:0] 11 [10:0] 2 [1:0] No Mask Port Block RAM Configuration 1. For iCE40LM EBR primitives with a negative-edged Read or Write clock, the base primitive name is appended with a ‘N’ and a ‘R’ or ‘W’ depending on the clock that is affected. 2-5 Architecture iCE40LM Family Data Sheet RAM Initialization and ROM Operation If desired, the contents of the RAM can be pre-loaded during device configuration. By preloading the RAM block during the chip configuration cycle and disabling the write controls, the sysMEM block can also be utilized as a ROM. Memory Cascading Larger and deeper blocks of RAM can be created using multiple EBR sysMEM Blocks. RAM4k Block Figure 2-4 shows the 256x16 memory configurations and their input/output names. In all the sysMEM RAM modes, the input data and addresses for the ports are registered at the input of the memory array. Figure 2-4. sysMEM Memory Primitives Write Port Read Port WDATA[15:0] RDATA[15:0] MASK[15:0] RADDR[7:0] WADDR[7:0] WE RAM4K RAM Block (256x16) RE WCLKE RCLKE WCLK RCLK Table 2-5. EBR Signal Descriptions Signal Name Direction Description WDATA[15:0] Input Write Data input. MASK[15:0] Input Masks write operations for individual data bit-lines. 0 = write bit; 1 = don’t write bit WADDR[7:0] Input Write Address input. Selects one of 256 possible RAM locations. WE Input Write Enable input. WCLKE Input Write Clock Enable input. WCLK Input Write Clock input. Default rising-edge, but with falling-edge option. RDATA[15:0] Output Read Data output. RADDR[7:0] Input Read Address input. Selects one of 256 possible RAM locations. RE Input Read Enable input. RCLKE Input Read Clock Enable input. RCLK Input Read Clock input. Default rising-edge, but with falling-edge option. The iCE40LM EBR block functions the same as EBR blocks in the iCE40 family. For further information on the sysMEM EBR block, please refer to TN1250, Memory Usage Guide for iCE40 Devices. 2-6 Architecture iCE40LM Family Data Sheet sysIO Buffer Banks iCE40LM devices have up to two I/O banks with independent VCCIO rails. Configuration bank VCC_SPI for the SPI I/Os is connected to VCCIO2 on the 25-pin WLCSP package. Programmable I/O (PIO) The programmable logic associated with an I/O is called a PIO. The individual PIOs are connected to their respective sysIO buffers and pads. The PIOs are placed on the top and bottom of the devices. Figure 2-5. I/O Bank and Programmable I/O Cell VCCIO I/O Bank 0 or 2 Voltage Supply Enabled ‘1’ Disabled ‘0’ 0 = Hi-Z 1 = Output Enabled Pull-up OE VCC VCCIO_0 Internal Core Pull-up Enable I2C I/O Bank 0 I2C 4 kbit RAM Blocks 4 kbit RAM Blocks OUT PAD OUTCLK PLB 4 kbit RAM Blocks LPSG 4 kbit RAM Blocks HSSG PIO OUTCLK iCEGATE HOLD HD IN config SPI Latch inhibits switching for power saving INCLK SPI I/O Bank 2 Gxx pins optionally connect directly to an associated GBUF global buffer Bank VCCIO_2 The PIO contains three blocks: an input register block, output register block iCEGate™ and tri-state register block. To save power, the optional iCEGateTM latch can selectively freeze the state of individual, non-registered inputs within an I/O bank. Note that the freeze signal is common to the bank. These blocks can operate in a variety of modes along with the necessary clock and selection logic. Input Register Block The input register blocks for the PIOs on all edges contain registers that can be used to condition high-speed interface signals before they are passed to the device core. Output Register Block The output register block can optionally register signals from the core of the device before they are passed to the sysIO buffers. Figure 2-6 shows the input/output register block for the PIOs. 2-7 Architecture iCE40LM Family Data Sheet Figure 2-6. iCE I/O Register Block Diagram PIO Pair CLOCK_ENABLE OUTPUT_CLK INPUT_CLK (1,0) LATCH_INPUT_VALUE D_IN_1 D_IN_0 Pad D_OUT_1 D_OUT_0 (1,0) 0 1 OUTPUT_ENABLE (1,0) LATCH_INPUT_VALUE D_IN_1 D_IN_0 Pad D_OUT_1 D_OUT_0 (1,0) 0 1 OUTPUT_ENABLE = Statically defined by configuration program. Table 2-6. PIO Signal List Pin Name OUTPUT_CLK I/O Type Input Description Output register clock CLOCK_ENABLE Input Clock enable INPUT_CLK Input Input register clock OUTPUT_ENABLE Input Output enable D_OUT_0/1 Input Data from the core D_IN_0/1 LATCH_INPUT_VALUE Output Data to the core Input Latches/holds the Input Value sysIO Buffer Each I/O is associated with a flexible buffer referred to as a sysIO buffer. These buffers are arranged around the periphery of the device in groups referred to as banks. The sysIO buffers allow users to implement a wide variety of standards that are found in today’s systems with LVCMOS interfaces. 2-8 Architecture iCE40LM Family Data Sheet Typical I/O Behavior During Power-up The internal power-on-reset (POR) signal is deactivated when VCC, VCCIO_0, VCCIO_2 and VCC_SPI (VCC_SPI is connected to VCCIO_2 on the 25-pin WLCSP) reach the level defined in the Power-On-Reset Voltage table in the DC and Switching Characteristics section of this data sheet. After the POR signal is deactivated, the FPGA core logic becomes active. You must ensure that all VCCIO banks are active with valid input logic levels to properly control the output logic states of all the I/O banks that are critical to the application. The default configuration of the I/O pins in a device prior to configuration is tri-stated with a weak pull-up to VCCIO. The I/O pins maintain the pre-configuration state until VCC and VCCIO_2 reach the defined levels. The I/Os take on the software user-configured settings only after VCC_SPI reaches the level and the device performs a proper download/configuration. Unused I/Os are automatically blocked and the pull-up termination is disabled. Supported Standards The iCE40LM sysIO buffer supports all single-ended input and output standards. The buffer supports the LVCMOS 1.8, 2.5, and 3.3 V standards. The buffer has individually configurable options for bus maintenance (weak pull-up or none). Table 2-7 and Table 2-8 show the I/O standards (together with their supply and reference voltages) supported by the iCE40LM devices. Table 2-7. Supported Input Standards Input Standard VCCIO (Typical) 3.3 V 2.5 V 1.8 V Single-Ended Interfaces LVCMOS33 Yes LVCMOS25 Yes LVCMOS18 Yes Table 2-8. Supported Output Standards Output Standard VCCIO (Typical) Single-Ended Interfaces LVCMOS33 3.3 LVCMOS25 2.5 LVCMOS18 1.8 On-Chip Strobe Generators The iCE40LM devices feature two different Strobe Generators. One is tailored for low-power operation (Low Power Strobe Generator – LPSG), and generates periodic strobes in the Microsecond (µs) ranges. The other is tailored for high speed operation (High Speed Strobe Generator – HSSG), and generates periodic strobes in the Nanosecond (ns) ranges.Add a paragraph: The Strobe Generators (HSSG and LPSG) provide fixed periodic strobes, and these strobes can be used as a clock source. When used as a clock source, the HSSG can provide strobe frequency in the range of 5 MHz - 20 MHz. The LPSG can provide strobe frequency in the range of 4 kHz - 20 kHz. For further information on how to use the LPSG and HSSG, please refer to TN1275, iCE40LM On-Chip Strobe Generator Usage Guide. 2-9 Architecture iCE40LM Family Data Sheet User I2C IP The iCE40LM devices have two I2C IP cores. Either of the two cores can be configured either as an I2C master or as an I2C slave. Both I2C cores have preassigned pins, or user can select different pins, when the core is used. When the IP core is configured as master, it will be able to control other devices on the I2C bus through the preassigned pin interface. When the core is configured as the slave, the device will be able to provide I/O expansion to an I2C Master. The I2C cores support the following functionality: • Master and Slave operation • 7-bit and 10-bit addressing • Multi-master arbitration support • Clock stretching • Up to 400 kHz data transfer speed • General Call support For further information on the User I2C, please refer to TN1274, iCE40 I2C and SPI Hardened IP Usage Guide. User SPI IP The iCE40LM devices have two SPI IP cores. Both SPI cores have preassigned pins, or user can select different pins, when the SPI core is used. Both SPI IP core can be configured as a SPI master or as a slave. When the SPI IP core is configured as a master, it controls the other SPI enabled devices connected to the SPI Bus. When SPI IP core is configured as a slave, the device will be able to interface to an external SPI master. The SPI IP core supports the following functions: • Configurable Master and Slave modes • Full-Duplex data transfer • Mode fault error flag with CPU interrupt capability • Double-buffered data register • Serial clock with programmable polarity and phase • LSB First or MSB First Data Transfer For further information on the User SPI, please refer to TN1274, iCE40 I2C and SPI Hardened IP Usage Guide. High Drive I/O Pins The iCE40LM family devices offer 3 High Drive (HD) outputs in each device in the family. The HD outputs are ideal to drive LED signals on mobile application. These HD outputs can be driven in different drive modes. The default is standard drive, which source/sink 8mA current nominally. When HD drive option is selected, these HD outputs can source/sink 24mA current nominally. The pins on the HD I/Os are labeled with HD in it. Power On Reset iCE40LM devices have power-on reset circuitry to monitor VCC, VCCIO_0, VCCIO_2 and VCC_SPI voltage levels during power-up and operation. At power-up, the POR circuitry monitors these voltage levels. It then triggers download from the external Flash memory after reaching the power-up levels specified in the Power-On-Reset Voltage table in the DC and Switching Characteristics section of this data sheet. Before and during configuration, the I/Os are held in tri-state. I/Os are released to user functionality once the device has finished configuration. 2-10 Architecture iCE40LM Family Data Sheet iCE40LM Configuration This section describes the programming and configuration of the iCE40LM family. Device Configuration There are various ways to configure the Configuration RAM (CRAM) including: • From a SPI Flash (Master SPI mode) • System microprocessor to drive a Serial Slave SPI port (SSPI mode) For more details on configuring the iCE40LM, please see TN1248, iCE40 Programming and Configuration. Power Saving Options The iCE40LM devices feature iCEGate and PLL low power mode to allow users to meet the static and dynamic power requirements of their applications. Table 2-9 describes the function of these features. Table 2-9. iCE40LM Power Saving Features Description Device Subsystem Feature Description PLL When LATCHINPUTVALUE is enabled, forces the PLL into low-power mode; PLL output held static at last input clock value. iCEGate To save power, the optional iCEGate latch can selectively freeze the state of individual, non-registered inputs within an I/O bank. Registered inputs are effectively frozen by their associated clock or clock-enable control. 2-11 iCE40LM Family Data Sheet DC and Switching Characteristics March 2015 Data Sheet DS1045 Absolute Maximum Ratings1, 2, 3 Supply Voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 1.42 V Output Supply Voltage VCCIO and VCC_SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 3.60 V PLL Power Supply, VCCPLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 1.3 V I/O Tri-state Voltage Applied. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 3.60 V Dedicated Input Voltage Applied . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 3.60 V Storage Temperature (Ambient). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65 °C to 150 °C Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55 °C to 125°C 1. Stress above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 2. Compliance with the Lattice Thermal Management document is required. 3. All voltages referenced to GND. Recommended Operating Conditions1 Symbol Parameter Min. Max. 1.14 1.26 V 1.71 3.46 V PLL Power Supply Voltage 1.14 1.26 V Config SPI port Power Supply Voltage 1.71 3.46 V Junction Temperature Industrial Operation –40 100 °C VCC1 Core Supply Voltage VCCIO1, 2, 3 I/O Driver Supply Voltage VCCPLL4 VCC_SPI5 tJIND VCCIO_0, VCCIO_2 Units 1. Like power supplies must be tied together. VCCIO_0 to VCCIO_2 if they are at same supply voltage and if they meet the power up sequence requirement. Please refer to Power Up Sequence section. VCC and VCCPLL are not recommended to be tied together. Please refer to TN1252, iCE40 Hardware Checklist. 2. See recommended voltages by I/O standard in subsequent table. 3. VCCIO pins of unused I/O banks should be connected to the VCC power supply on boards. 4. For 25-pin WLCSP, PLL is not supported. 5. For 25-pin WLCSP, VCC_SPI is connected to VCCIO_2 on the package. For all other packages, VCC_SPI is used to power the SPI1 ports in both configuration mode and user mode. Power Supply Ramp Rates1, 2 Symbol tRAMP Parameter Power supply ramp rates for all power supplies. Min. Max. Units 0.01 10 V/ms 1. Assumes monotonic ramp rates. 2. Power up sequence must be followed. Please refer to Power Up Sequence section. © 2015 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 3-1 DS1045 DC and Switching_01.5 DC and Switching Characteristics iCE40LM Family Data Sheet Power-On-Reset Voltage Levels1 Symbol VPORUP VPORDN Parameter Min. Max. Units Power-On-Reset ramp-up trip point (circuit monitoring VCC, VCCIO_2 and VCC_SPI) VCC 0.67 0.99 V VCCIO_2, VCC_SPI 0.70 1.59 V Power-On-Reset ramp-down trip point (circuit monitoring VCC, VCCIO_2 and VCC_SPI) VCC — 0.66 V VCCIO_2, VCC_SPII — 1.59 V 1. These POR trip points are only provided for guidance. Device operation is only characterized for power supply voltages specified under recommended operating conditions. Power Up Sequence For all iCE40LM devices, it is required to have the VCC/VCCPLL power supply powered up before all other power supplies. The VCC/VCCPLL has to be higher than 0.5 V before other supplies are powered from GND. In addition, for all iCE40LM devices, it is required that VCCSPI not be the last power supply to ramp up. The VCCSPI has to be higher than 0.5 V before the last supply is ramped. In the required power up sequence, VCC/VCCPLL should be ramped first. Following VCC/VCCPLL, VCCSPI should be ramped next, followed by the remaining supplies. On the 25-pin WLCSP, VCCPLL is connected to VCC, and is powered up together with VCC. On the 25-pin WLCSP and 36-pin caBGA, VCCIO_2 is connected to VCC_SPI, and should be powered up right after VCC/VCCPLL with VCCSPI. Due to this connection, VCCIO_0 cannot connect to VCCIO_2 even if they are at the same supply voltage. The sequence is defined below: • For 49-pin caBGA: VCC, VCCPLL, VCC_SPI, VCCIO_0 and VCCIO_2; Order of VCCIO_0 and VCCIO_2 is not important. • For 36-pin caBGA: VCC, VCCPLL, VCC_SPI/VCCIO_2, VCCIO_0 • For 25-pin WLCSP: VCC/VCCPLL, VCC_SPI/VCCIO_2, VCCIO_0 There is no power down sequence required. However, when partial power supplies are powered down, it is required that the above sequence is followed when these supplies are powered up again. ESD Performance Please contact Lattice Semiconductor for additional information. DC Electrical Characteristics Over Recommended Operating Conditions Symbol Parameter Min. Typ. Max. Units IIL, IIH1, 3, 4 Input or I/O Leakage 0V < VIN < VCCIO + 0.2 V Condition — — +/–10 µA C1 I/O Capacitance2 VCCIO = 3.3 V, 2.5 V, 1.8 V VCC = Typ., VIO = 0 to VCCIO + 0.2 V — 6 — pf C2 Global Input Buffer Capacitance2 VCCIO = 3.3 V, 2.5 V, 1.8 V VCC = Typ., VIO = 0 to VCCIO + 0.2 V — 6 — pf VHYST Input Hysteresis VCCIO = 1.8 V, 2.5 V, 3.3 V — 200 — mV –31 –72 –128 µA Internal PIO Pull-up Current –3 –8 –11 — IPU VCCIO = 1.8 V, 0=<VIN<=0.65 VCCIO VCCIO = 2.5 V, 0=<VIN<=0.65 VCCIO VCCIO = 3.3 V, 0=<VIN<=0.65 VCCIO — — µA µA 1. Input or I/O leakage current is measured with the pin configured as an input or as an I/O with the output driver tri-stated. It is not measured with the output driver active. Internal pull-up resistors are disabled. 2. TJ 25 °C, f = 1.0 MHz. 3. Please refer to VIL and VIH in the sysIO Single-Ended DC Electrical Characteristics table of this document. 4. Some products are clamped to a diode when VIN is larger than VCCIO. 3-2 DC and Switching Characteristics iCE40LM Family Data Sheet Supply Current 1, 2, 3, 4 Symbol Parameter Typ. VCC4 Units 100 uA ICCSTDBY Core Power Supply Static Current ICCPLLSTDBY PLL Power Supply Static Current 11 uA ICCIOSTDBY, ICC_SPISTDBY VCCIO, VCC_SPI Power Supply Static Current 2.5 uA ICCPEAK Core Power Supply Startup Peak Current 11.2 mA ICCPLLPEAK PLL Power Supply Startup Peak Current 2.8 mA ICCIOPEAK, ICC_SPIPEAK VCCIO, VCC_SPI Power Supply Startup Peak Current 21.4 mA 1. Assumes blank pattern with the following characteristics: all outputs are tri-stated, all inputs are configured as LVCMOS and held at VCCIO or GND, on-chip PLL is off. For more detail with your specific design, use the Power Calculator tool. Power specified with master SPI configuration mode. Other modes may be up to 25% higher. 2. Frequency = 0 MHz. 3. TJ = 25 °C, power supplies at nominal voltage. 4. Does not include pull-up. 5. For 25-pin WLCSP, VCCPLL is tied internally on the package, and VCC_SPI is also connected to VCCIO_2 on the package. User I2C Specifications Parameter Symbol spec (STD Mode) Parameter Description Min Typ Max spec (FAST Mode) Min Typ Max Units kHz fSCL Maximum SCL clock frequency — — 100 — — 400 tHI SCL clock HIGH Time 4 — — 0.6 — — µs tLO SCL clock LOW Time 4.7 — — 1.3 — — µs tSU,DAT Setup time (DATA) 250 — — 100 — — ns tHD,DAT Hold time (DATA) tSU,STA Setup time (START condition) tHD,STA tSU,STO tBUF tCO,DAT 0 — — 0 — — ns 4.7 — — 0.6 — — µs Hold time (START condition) 4 — — 0.6 — — µs Setup time (STOP condition) 4 — — 0.6 — — µs Bus free time between STOP and START 4.7 — — 1.3 — — µs SCL LOW to DATAOUT valid — — 3.4 — — 0.9 µs User SPI Specifications Parameter Symbol fMAX tHI Parameter Description Min Typ Max Units Maximum SCK clock frequency — — 45 MHz HIGH period of SCK clock 9 — — ns tLO LOW period of SCK clock 9 — — ns tSUmaster Setup time (master mode) 2 — — ns tHOLDmaster Hold time (master mode) 5 — — ns tSUslave Setup time (slave mode) 2 — — ns tHOLDslave Hold time (slave mode) 5 — — ns tSCK2OUT SCK to out (slave mode) — — 13.5 ns 3-3 DC and Switching Characteristics iCE40LM Family Data Sheet sysIO Recommended Operating Conditions VCCIO (V) Standard Min. Typ. Max. LVCMOS 3.3 3.14 3.3 3.46 LVCMOS 2.5 2.37 2.5 2.62 LVCMOS 1.8 1.71 1.8 1.89 sysIO Single-Ended DC Electrical Characteristics Input/ Output Standard VIH1 VIL Min. (V) Max. (V) Min. (V) Max. (V) LVCMOS 3.3 –0.3 0.8 2.0 VCCIO + 0.2V LVCMOS 2.5 –0.3 0.7 1.7 VCCIO + 0.2V LVCMOS 1.8 –0.3 0.35VCCIO 0.65VCCIO VCCIO + 0.2V VOL Max. (V) VOH Min. (V) IOL Max. (mA) IOH Max. (mA) 0.4 0.2 VCCIO – 0.4 8 VCCIO – 0.2 0.1 –8 –0.1 –6 –0.1 –4 –0.1 0.4 VCCIO – 0.4 6 0.2 VCCIO – 0.2 0.1 0.4 VCCIO – 0.4 4 0.2 VCCIO – 0.2 0.1 1. Some products are clamped to a diode when VIN is larger than VCCIO. Typical Building Block Function Performance1, 2 Pin-to-Pin Performance (LVCMOS25) Function Timing Units 16.5 ns 4:1 MUX 18.0 ns 16:1 MUX 19.5 ns Timing Units 110 MHz Basic Functions 16-bit decoder Register-to-Register Performance Function Basic Functions 16:1 MUX 16-bit adder 100 MHz 16-bit counter 100 MHz 64-bit counter 40 MHz 150 MHz Embedded Memory Functions 256x16 Pseudo-Dual Port RAM 1. The above timing numbers are generated using the iCECube2 design tool. Exact performance may vary with device and tool version. The tool uses internal parameters that have been characterized but are not tested on every device. 2. Using a VCC of 1.14 V at Junction Temp 85 oC. 3-4 DC and Switching Characteristics iCE40LM Family Data Sheet Derating Logic Timing Logic timing provided in the following sections of the data sheet and the Lattice design tools are worst case numbers in the operating range. Actual delays may be much faster. Lattice design tools can provide logic timing numbers at a particular temperature and voltage. Maximum sysIO Buffer Performance1 I/O Standard Max. Speed Units Inputs LVCMOS33 250 MHz LVCMOS25 250 MHz LVCMOS18 250 MHz LVCMOS33 250 MHz LVCMOS25 250 MHz LVCMOS18 155 MHz Outputs 1. Measured with a toggling pattern. iCE40LM Family Timing Adders Over Recommended Commercial Operating Conditions1, 2, 3 Buffer Type Description Timing (Typ.) Units Input Adjusters LVCMOS33 LVCMOS, VCCIO = 3.3 V 0.18 nS LVCMOS25 LVCMOS, VCCIO = 2.5 V 0.00 nS LVCMOS18 LVCMOS, VCCIO = 1.8 V 0.19 nS Output Adjusters LVCMOS33 LVCMOS, VCCIO = 3.3 V –0.12 nS LVCMOS25 LVCMOS, VCCIO = 2.5 V 0.00 nS LVCMOS18 LVCMOS, VCCIO = 1.8 V 1.32 nS 1. Timing adders are relative to LVCMOS25 and characterized but not tested on every device. 2. LVCMOS timing measured with the load specified in Switching Test Condition table. 3. Commercial timing numbers are shown. 3-5 DC and Switching Characteristics iCE40LM Family Data Sheet iCE40LM External Switching Characteristics Over Recommended Commercial Operating Conditions Parameter Description Device Units Clocks Global Clocks fMAX_GBUF Frequency for Global Buffer Clock network All devices 185 MHz tW_GBUF Clock Pulse Width for Global Buffer All devices 2 — ns tSKEW_GBUF Global Buffer Clock Skew Within a Device All devices — 650 ps All devices — 9.1 ns — 450 ps Pin-LUT-Pin Propagation Delay tPD Best case propagation delay through one LUT logic General I/O Pin Parameters (Using Global Buffer Clock without PLL)1 tSKEW_IO Data bus skew across a bank of IOs tCO All devices Clock to Output - PIO Output Register All devices — 11.5 ns tSU Clock to Data Setup - PIO Input Register All devices –0.23 — ns tH Clock to Data Hold - PIO Input Register All devices 5.55 — ns 1. 25-pin WLCSP package does not support PLL. 3-6 DC and Switching Characteristics iCE40LM Family Data Sheet sysCLOCK PLL Timing – Preliminary Over Recommended Operating Conditions Parameter Min. Max. Units fIN Input Clock Frequency (REFERENCECLK, EXTFEEDBACK) Descriptions Conditions 10 133 MHz fOUT Output Clock Frequency (PLLOUT) 16 275 MHz fVCO PLL VCO Frequency 533 1066 MHz fPFD Phase Detector Input Frequency 10 133 MHz AC Characteristics tDT Output Clock Duty Cycle 40 60 % tPH Output Phase Accuracy — +/–12 deg fOUT <= 100 MHz — 450 ps p-p fOUT > 100 MHz — 0.5 UIPP fOUT <= 100 MHz — 750 ps p-p fOUT > 100 MHz — 0.10 UIPP Output Clock Period Jitter tOPJIT1, 5, 6 Output Clock Cycle-to-cycle Jitter Output Clock Phase Jitter tW Output Clock Pulse Width 2, 3 tLOCK PLL Lock-in Time tUNLOCK PLL Unlock Time fPFD <= 25 MHz — 275 ps p-p fPFD > 25 MHz — 0.05 UIPP At 90% or 10% 1.33 — ns — 50 us fPFD 20 MHz — 50 ns — 1000 ps p-p tIPJIT4 Input Clock Period Jitter — 0.02 UIPP tFDTAP Fine Delay adjustment, per Tap 98 226 ps tSTABLE3 LATCHINPUTVALUE LOW to PLL Stable — 500 ns 100 — ns tSTABLE_PW 3 fPFD < 20 MHz LATCHINPUTVALUE Pulse Width tRST RESET Pulse Width 10 — ns tRSTREC RESET Recovery Time 10 — us tDYNAMIC_WD DYNAMICDELAY Pulse Width 100 — VCO Cycles 1. Period jitter sample is taken over 10,000 samples of the primary PLL output with a clean reference clock. Cycle-to-cycle jitter is taken over 1000 cycles. Phase jitter is taken over 2000 cycles. All values per JESD65B. 2. Output clock is valid after tLOCK for PLL reset and dynamic delay adjustment. 3. At minimum fPFD. As the fPFD increases the time will decrease to approximately 60% the value listed. 4. Maximum limit to prevent PLL unlock from occurring. Does not imply the PLL will operate within the output specifications listed in this table. 5. The jitter values will increase with loading of the PLD fabric and in the presence of SSO noise. 6. PLL jitter and lock time measurements are based on an external clean clock source. With different clock source, these values maybe different. 3-7 DC and Switching Characteristics iCE40LM Family Data Sheet SPI Master Configuration Time1 Symbol Parameter Conditions All devices - Low Frequency (Default) tCONFIG POR/CRESET_B to Device I/O Active Max. Units 95 ms All devices - Medium frequency 35 ms All devices - High frequency 18 ms 1. Assumes sysMEM Block is initialized to an all zero pattern if they are used. sysCONFIG Port Timing Specifications Symbol Parameter Conditions Min. Typ. Max. Units All Configuration Modes Minimum CRESET_B LOW pulse width required to restart configuration, from falling edge to rising edge 200 — — ns tCRESET_B Number of configuration clock cycles after CDONE goes HIGH before the PIO pins are activated 49 — — Cycles tDONE_IO 1200 — — µs Slave SPI tCR_SCK Minimum time from a rising edge on CRESET_B until the first SPI WRITE operation, first SPI_XCK clock. During this time, the iCE40LM device is clearing its internal configuration memory fMAX CCLK clock frequency tCCLKH tCCLKL Write 1 — 25 MHz Read1 — 15 — MHz CCLK clock pulsewidth HIGH 20 — — ns CCLK clock pulsewidth LOW 20 — — ns tSTSU CCLK setup time 12 — — ns tSTH CCLK hold time 12 — — ns tSTCO CCLK falling edge to valid output 13 — — ns 13 MHz Master SPI fMCLK tMCLK MCLK clock frequency Low Frequency (Default) 6.5 Medium Frequency 19.5 38 MHz High Frequency 33 66 MHz — µs CRESET_B HIGH to first MCLK edge 1200 1. Supported with 1.2 V Vcc and at 25 oC. 3-8 — DC and Switching Characteristics iCE40LM Family Data Sheet Switching Test Conditions Figure 3-1 shows the output test load used for AC testing. The specific values for resistance, capacitance, voltage, and other test conditions are shown in Table 3-1. Figure 3-1. Output Test Load, LVCMOS Standards VT R1 DUT Test Poi nt CL Table 3-1. Test Fixture Required Components, Non-Terminated Interfaces Test Condition LVCMOS settings (L -> H, H -> L) R1 CL 0 pF Timing Reference VT LVCMOS 3.3 = 1.5 V — LVCMOS 2.5 = VCCIO/2 — LVCMOS 1.8 = VCCIO/2 — LVCMOS 3.3 (Z -> H) 1.5 VOL LVCMOS 3.3 (Z -> L) 1.5 VOH Other LVCMOS (Z -> H) Other LVCMOS (Z -> L) 188 0 pF VCCIO/2 VOL VCCIO/2 VOH LVCMOS (H -> Z) VOH - 0.15 VOL LVCMOS (L -> Z) VOL - 0.15 VOH Note: Output test conditions for all other interfaces are determined by the respective standards. 3-9 iCE40LM Family Data Sheet Pinout Information January 2014 Data Sheet DS1045 Signal Descriptions Signal Name Function I/O Description Power Supplies VCC Power — Core Power Supply VCCIO_0 Power — Power Supply for I/Os in Bank 0 VCCIO_2 Power — Power Supply for I/Os in Bank 2 VCC_SPI Power — Power supply for SPI1 ports. For 25-pin WLCSP, this signal is connected to VCCIO_2 VCCPLL Power — Power supply for PLL. For 25-pin WLCSP, this is connected internally to VCC GND/GNDPLL GROUND — Ground Dedicated Configuration Signals CRESETB Configuration I Configuration Reset, active LOW. No internal pull-up resistor. Either actively driven externally or connect an 10K-ohm pull-up resistor to VCCIO_2. CDONE Configuration I/O Configuration Done. Includes a weak pull-up resistor to VCCIO_2. User SPI1 I/O In user mode, used as CLK signal on SPI interface for sensor management function. Configuration I/O This pin is shared with device configuration. During configuration: In Master SPI mode: This pin outputs the clock to external SPI memory. In Slave SPI mode: This pin inputs the clock from external processor. General I/O I/O In user mode, when the SPI interface is not used, user can program this pin as general I/O pin for user functions. (x represents ball on the package) [T/B]: T=Vccio_0 bank, B=Vccio_2 bank. [HD]=High Drive I/O User SPI1 I/O In user mode, used as Input (Master Mode) or Output (Slave Mode) signal on SPI interface for sensor management function. Output This pin is shared with device configuration. During configuration: In Master SPI mode: This pin outputs the command data to external SPI memory. In Slave SPI mode: This pin connects to the MISO pin of the external processor. I/O In user mode, when the SPI interface is not used, user can program this pin as general I/O pin for user functions. (x represents ball on the package) [T/B]: T=Vccio_0 bank, B=Vccio_2 bank. [HD]=High Drive I/O SPI and Config SPI Ports SPI1_SCK/PIO[T/B]_x[HD] SPI1_MISO/SDO/IO[T/B]_x[HD] Configuration General I/O © 2014 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 4-1 DS1045 Pinout Information_01.3 Pinout Information iCE40LM Family Data Sheet Signal Name SPI1_MOSI/SDI/PIO[T/B]_x[HD] Function I/O Description I/O In user mode, used as Output (Master Mode) or Input (Slave Mode) signal on SPI interface for sensor management function. Input This pin is shared with device configuration. During configuration: In Master SPI mode: This pin receives data from the external SPI memory. In Slave SPI mode: This pin connects to the MOSI pin of the external processor. General I/O I/O In user mode, when the SPI interface is not used, user can program this pin as general I/O pin for user functions. (x represents ball on the package) [T/B]: T=Vccio_0 bank, B=Vccio_2 bank. [HD]=High Drive I/O User SPI1 I/O In user mode, used as CSN signal on SPI interface for sensor management function. This pin is output pin in Master Mode, and input in in Slave Mode. Configuration I/O This pin is shared with device configuration. During configuration: In Master SPI mode: This pin outputs to the external SPI memory. In Slave SPI mode: This pin inputs CSN from the external processor. General I/O I/O In user mode, when the SPI interface is not used, user can program this pin as general I/O pin for user functions. (x represents ball on the package) [T/B]: T=Vccio_0 bank, B=Vccio_2 bank. [HD]=High Drive I/O User SPI2 I/O In user mode, used as CLK signal on SPI interface for sensor management function. General I/O I/O In user mode, when the SPI interface is not used, user can program this pin as general I/O pin for user functions. (x represents ball on the package) [T/B]: T=Vccio_0 bank, B=Vccio_2 bank. [HD]=High Drive I/O User SPI2 I/O In user mode, used as Input (Master Mode) or Output (Slave Mode) signal on SPI interface for sensor management function. General I/O I/O In user mode, when the SPI interface is not used, user can program this pin as general I/O pin for user functions. (x represents ball on the package) [T/B]: T=Vccio_0 bank, B=Vccio_2 bank. [HD]=High Drive I/O User SPI2 I/O In user mode, used as Output (Master Mode) or Input (Slave Mode) signal on SPI interface for sensor management function. General I/O I/O In user mode, when the SPI interface is not used, user can program this pin as general I/O pin for user functions. (x represents ball on the package) [T/B]: T=Vccio_0 bank, B=Vccio_2 bank. [HD]=High Drive I/O User SPI1 Configuration SPI1_CSN/PIO[T/B]_x[HD] SPI2_SCK/PIO[T/B]_x[HD] SPI2_MISO/PIO[T/B]_x[HD] SPI2_MOSI/PIO[T/B]_x[HD] 4-2 Pinout Information iCE40LM Family Data Sheet Signal Name SPI2_CSN/PIO[T/B]_x[HD] Function I/O Description User SPI2 I/O In user mode, used as CSN signal on SPI interface for sensor management function. This pin is output pin in Master Mode, and input in in Slave Mode. General I/O I/O In user mode, when the SPI interface is not used, user can program this pin as general I/O pin for user functions. (x represents ball on the package) [T/B]: T=Vccio_0 bank, B=Vccio_2 bank. [HD]=High Drive I/O User I2C1 I/O Used as CLK signal on I2C interface for sensor management function. General I/O I/O When the I2C interface is not used, user can program this pin as general I/O pin for user functions. (x represents ball on the package) [T/B]: T=Vccio_0 bank, B=Vccio_2 bank. [HD]=High Drive I/O User I2C1 I/O Used as Data signal on I2C interface for sensor management function. General I/O I/O When the I2C interface is not used, user can program this pin as general I/O pin for user functions. (x represents ball on the package) [T/B]: T=Vccio_0 bank, B=Vccio_2 bank. [HD]=High Drive I/O User I2C2 I/O Used as CLK signal on I2C interface for sensor management function. General I/O I/O When the I2C interface is not used, user can program this pin as general I/O pin for user functions. (x represents ball on the package) [T/B]: T=Vccio_0 bank, B=Vccio_2 bank. [HD]=High Drive I/O User I2C2 I/O Used as Data signal on I2C interface for sensor management function. General I/O I/O When the I2C interface is not used, user can program this pin as general I/O pin for user functions. (x represents ball on the package) [T/B]: T=Vccio_0 bank, B=Vccio_2 bank. [HD]=High Drive I/O General I/O I/O User can program this pin as general I/O pin for user functions. (x represents ball on the package) [T/B]: T=Vccio_0 bank, B=Vccio_2 bank. [HD]=High Drive I/O I Global input used for high fanout, or clock/reset net. n=0,1,2,3,6,7. The Gn Global input pin can drive the corresponding GBUFn global buffer. I/O User can program this pin as general I/O pin for user functions. (x represents ball on the package) I2C Ports I2C1_SCL/PIO[T/B]_x[HD] I2C1_SDA/PIO[T/B]_x[HD] I2C2_SCL/PIO[T/B]_x[HD] I2C2_SDA/PIO[T/B]_x[HD] Global Signals PIO[T/B]_x[HD]/Gn Global Signal General Purpose I/O PIO[T/B]_x[HD] General I/O 4-3 Pinout Information iCE40LM Family Data Sheet Pin Information Summary iCE40LM-1K Pin Type General Purpose I/O Per Bank SWG25 CM36 iCE40LM-2K CM49 SWG25 CM36 iCE40LM-4K CM49 SWG25 CM36 CM49 Bank 0 7 15 20 7 15 20 7 15 20 Bank 21 11 13 17 11 13 17 11 13 17 Total General Purpose I/Os 18 28 37 18 28 37 18 28 37 Vcc 1 1 2 1 1 2 1 1 2 Bank 0 1 1 1 1 1 1 1 1 1 Bank 2 1 1 1 1 1 1 1 1 1 VCC_SPI 0 0 1 0 0 1 0 0 1 VCCPLL 0 1 1 0 1 1 0 1 1 Miscellaneous Dedicated Pins 2 2 2 2 2 2 2 2 2 GND 2 2 4 2 2 4 2 2 4 Vccio NC 0 0 0 0 0 0 0 0 0 Reserved 0 0 0 0 0 0 0 0 0 25 36 49 25 36 49 25 36 49 0 0 0 0 0 0 0 0 0 Total Balls SPI Interfaces Bank 0 Bank 2 1 1 1 2 2 2 2 2 2 I2C Interfaces Bank 0 1 1 1 2 2 2 2 2 2 Bank 2 0 0 0 0 0 0 0 0 0 1. Including General Purpose I/Os powered by VCC_SPI and VCCPLL. 4-4 iCE40LM Family Data Sheet Ordering Information March 2014 Data Sheet DS1045 iCE40LM Part Number Description iCE40LMXXX - XXXXXXX Device Family iCE40LM FPGA Shipping Method TR = Tape and Reel TR1K = Tape and Reel 1,000 units Logic Cells 1K = 1,100 Logic Cells 2K = 2,048 Logic Cells 4K = 3,520 Logic Cells Package SWG25 = 25-Ball WLCSP (0.35 mm Ball Pitch) SWG25TR1K = 25-Ball WLCSP (0.35 mm Ball Pitch) in tape and reel 1,000 units CM36 = 36-Ball ucBGA (0.4mm Ball Pitch) CM36TR1K = 36-Ball ucBGA (0.4mm Ball Pitch) in tape and reel 1,000 units CM49 = 49-Ball ucBGA (0.4mm Ball Pitch) CM49TR1K = 49-Ball ucBGA (0.4mm Ball Pitch) in tape and reel 1,000 units All parts are shipped in tape-and-reel. Ordering Part Numbers Part Number LUTs Supply Voltage Package Leads Temp. iCE40LM1K-SWG25TR 1100 1.2 V Halogen-Free caBGA 25 IND iCE40LM1K-SWG25TR1K 1100 1.2 V Halogen-Free caBGA 25 IND iCE40LM1K-CM36TR 1100 1.2 V Halogen-Free ucBGA 36 IND iCE40LM1K-CM36TR1K 1100 1.2 V Halogen-Free ucBGA 36 IND iCE40LM1K-CM49TR 1100 1.2 V Halogen-Free ucBGA 49 IND iCE40LM1K-CM49TR1K 1100 1.2 V Halogen-Free ucBGA 49 IND iCE40LM2K-SWG25TR 2048 1.2 V Halogen-Free caBGA 25 IND iCE40LM2K-SWG25TR1K 2048 1.2 V Halogen-Free caBGA 25 IND iCE40LM2K-CM36TR 2048 1.2 V Halogen-Free ucBGA 36 IND iCE40LM2K-CM36TR1K 2048 1.2 V Halogen-Free ucBGA 36 IND iCE40LM2K-CM49TR 2048 1.2 V Halogen-Free ucBGA 49 IND iCE40LM2K-CM49TR1K 2048 1.2 V Halogen-Free ucBGA 49 IND iCE40LM4K-SWG25TR 3520 1.2 V Halogen-Free caBGA 25 IND iCE40LM4K-SWG25TR1K 3520 1.2 V Halogen-Free caBGA 25 IND iCE40LM4K-CM36TR 3520 1.2 V Halogen-Free ucBGA 36 IND iCE40LM4K-CM36TR1K 3520 1.2 V Halogen-Free ucBGA 36 IND iCE40LM4K-CM49TR 3520 1.2 V Halogen-Free ucBGA 49 IND iCE40LM4K-CM49TR1K 3520 1.2 V Halogen-Free ucBGA 49 IND © 2014 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 5-1 DS1045 Order Info_01.4 iCE40LM Family Data Sheet Supplemental Information January 2014 Data Sheet DS1045 For Further Information A variety of technical notes for the iCE40 family are available on the Lattice web site. • TN1248, iCE40 Programming and Configuration • TN1274, iCE40 I2C and SPI Hardened IP Usage Guide • TN1275, iCE40LM On-Chip Strobe Generator Usage Guide • TN1276, Advanced iCE40 I2C and SPI Hardened IP Usage Guide • TN1250, Memory Usage Guide for iCE40 Devices • TN1251, iCE40 sysCLOCK PLL Design and Usage Guide • iCE40LM Pinout Files • iCE40LM Pin Migration Files • Thermal Management document • Lattice design tools • Schematic Symbols © 2014 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 6-1 DS1045 Further Info_01.1 iCE40LM Family Data Sheet Revision History March 2014 Data Sheet DS1045 Date Version Section Change Summary March 2015 1.5 DC and Switching Characteristics Updated sysIO Single-Ended DC Electrical Characteristics section. Changed LVCMOS 3.3 and LVCMOS 2. 5 VOH Min. (V) from 0.5 to 0.4. August 2014 1.4 DC and Switching Characteristics Updated the Recommended Operating Conditions section. Added VCC and VCCPLL information to footnote 1. Updated Power Up Sequence section.Revised and added information on required power up sequence. March 2014 1.3 Ordering Information 01.2 Architecture Updated Ordering Part Numbers section. Changed packages from csBGA to ucBGA. Updated Typical I/O Behavior During Power-up section. Added VCCIO_0 to the first statement. Updated Power On Reset section. Added VCCIO_0 to the first statement. Ordering Information Updated iCE40LM Part Number Description section. Added shipping method and packages. Added part numbers in Ordering Part Numbers section. January 2014 01.1 All Introduction October 2013 01.0 September 2013 00.2 EAP August 2013 00.1 EAP Updated document status from Advance. Updated device features. DC and Switching Characteristics Updated the following tables: — sysCLOCK PLL Timing – Preliminary — Supply Current — sysCONFIG Port Timing Specifications. Pinout Information Updated SPI and Config SPI Ports information in Signal Descriptions table. All General updates for product launch. Pinout Information Updated ball map to 25-pin WLCSP. All General updates to all sections. All Initial release. © 2015 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. www.latticesemi.com 7-1 DS1045 Revision History