TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP4060 Series SP4060 Series 2.5V 20A Diode Array RoHS Pb GREEN Description The SP4060 integrates low capacitance diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb up to 20A per IEC61000-4-5 (tp=8/20µs) without performance degradation and a minimum ±30kV ESD per IEC61000-4-2 International Standard. Their low loading capacitance also makes them ideal for protecting high speed signal pins. Features Pinout I/O 1 I/O 8 I/O 2 I/O 7 I/O 3 I/O 6 I/O 4 I/O 5 • Low capacitance of 4.4pF (TYP) per I/O • EFT, IEC61000-4-4, 40A (5/50ns) • Low leakage current of 1µA (MAX) at 2.5V • Lightning, IEC61000-4-5, 20A (8/20µs) Applications GND NC • ESD, IEC61000-4-2, ±30kV contact, ±30kV air • LCD/PD TVs • Set Top Boxes • Desktops • Notebooks • Game Consoles Functional Block Diagram I/O 6 I/O 7 I/O 8 Application Example I/O 5 LVDS Interface LVDS Controller CLK+ CLKA0+ A0- I/O 1 I/O 2 GND I/O 3 I/O 4 Outside World A1+ A1A2+ A2- Additional Information Signal Shield GND Datasheet Resources Samples SP4060-08ATG Shield GND Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP4060 Series Thermal Information Absolute Maximum Ratings Symbol Parameter Value Parameter Units Rating Units –55 to 150 °C IPP Peak Current (tp=8/20μs) 20.0 A Storage Temperature Range PPK Peak Pulse Power (tp=8/20µs) 300 W Maximum Junction Temperature 150 °C TOP Operating Temperature –40 to 125 ºC Maximum Lead Temperature (Soldering 20-40s) 260 °C TSTOR Storage Temperature –55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Min Typ Max Units 2.5 V Snap Back Voltage VSB ISB=50mA Reverse Leakage Current ILEAK VR=2.5V, I/O to GND 0.5 1.0 µA IPP=1A, tp=8/20µs, Fwd 4.5 5.5 V IPP=5A, tp=8/20µs, Fwd 6.0 7.2 V IPP=10A, tp=8/20µs, Fwd 8.0 9.6 V IPP=20A, tp=8/20µs, Fwd 12.5 15.0 V Clamp Voltage1 VC ESD Withstand Voltage1 VESD 2.0 V IEC61000-4-2 (Contact) ±30 kV IEC61000-4-2 (Air) ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V 4.4 Diode Capacitance CI/O-I/O Reverse Bias=0V 2.2 1 5.0 pF pF Note: 1. Parameter is guaranteed by design and/or device characterization. Pulse Waveform Clamping Voltage vs. IPP 110% 14.0 100% 12.0 90% Clamp Voltage (VC) Percent of IPP 80% 70% 60% 50% 40% 30% 20% 10.0 8.0 6.0 4.0 2.0 10% 0.0 0% 0.0 5.0 10.0 15.0 Time (μs) 20.0 25.0 30.0 1.0 3.0 5.0 7.0 9.0 11.0 13.0 15.0 17.0 19.0 21.0 Peak Pulse Current-IPP (A) © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP4060 Series Capacitance vs. Bias Insertion Loss (S21) I/O to GND 5.0 5 0 4.0 Attenuation (dB) Capacitance (pF) -5 3.0 2.0 -10 -15 -20 1.0 -25 -30 0.0 0.0 0.5 1.0 1.5 2.0 10 2.5 100 1000 10000 Frequency (MHz) DC Bias (V) Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 Peak Temperature (TP) tP TP Temperature Reflow Condition tS time to peak temperature Time Package Dimensions — MSOP10 10 2.00 [0.0787] D 0.50 [0.0197] Package MSOP Pins 10 JEDEC MO-187 E 1.04 [0.0409] 4.24 [0.1669] E1 5.28 [0.2079] 3.20 [0.1260] Millimeters 0.32 [0.0126] Solder Pad Layout 1 2 A C DIM e A1 © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 L Max Inches Min Max A - 1.10 - 0.043 A1 0.00 0.15 0.000 0.006 B 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 E 4.67 5.10 0.184 0.200 E1 2.90 3.10 0.114 0.122 0.50 BSC e L B Min 0.40 0.020 BSC 0.80 0.016 0.032 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP4060 Series Product Characteristics Part Numbering System SP 4060 - 08 A T G G= Green TVS Diode Arrays (SPA® Diodes) T= Tape & Reel Package A = MSOP10 Series Number of Channels Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. LF Product Series P = SP4060 5. Package surface matte finish VDI 11-13. YYWWD P*8 YYWW = Date code Number of Channels Assembly Site Ordering Information Part Number Package Marking Min. Order Qty. SP4060-08ATG MSOP10 P*8 4000 Embossed Carrier Tape & Reel Specification — MSOP-10 Millimetres Inches Min Max Min Max E 1.65 1.85 0.065 0.073 F 5.40 5.60 0.213 0.220 D 1.50 1.60 0.059 0.063 1.50 Min D1 P0 10P0 3.90 0.059 Min 4.10 40.0± 0.20 0.154 0.161 1.574±0.008 W 11.90 12.10 0.469 0.476 P 7.90 8.10 0.311 0.319 A0 5.20 5.40 0.205 0.213 B0 3.20 3.40 0.126 0.134 K0 1.20 1.40 0.047 0.055 t 0.30 ± 0.05 0.012± 0.002 Pin 1 Location User Feeding Direction © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13