TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP2504N Series SP2504N Series 2.5V 20A Diode Array RoHS Pb GREEN Description The SP2504N integrates 4 channels of low capacitance diodes with an additional zener diode to protect sensitive I/O pins against lightning induced surge events and ESD. This robust device can safely absorb up to 20A per IEC61000-4-5 (tP=8/20μs) without performance degradation and a minimum ±30kV ESD per IEC61000-4-2 international standard. The low loading capacitance makes the SP2504N ideal for protecting high-speed signal pins. Features Pinout 1 3 5 • Low capacitance of 3.5pF (TYP) per I/O • EFT, IEC61000-4-4, 40A (tp=5/50ns) • Low leakage current of 1µA (MAX) at 2.5V • Lightning, IEC61000-4-5, 20A (tp=8/20µs) GND 9 • ESD, IEC61000-4-2, ±30kV contact, ±30kV air 7 Applications Functional Block Diagram 9 7 5 • 10/100/1000 Ethernet Interfaces • VoIP Phones • Customer Premise Equipment (CPE) • PBX Systems • Set Top Boxes Application Example RJ-45 Connector *Package is shown as transparent Tx+ J1 1 GND Ethernet PHY 3 Tx- SP2504N Additional Information PHY Rx+ J8 Datasheet Resources Samples Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 Rx- TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP2504N Series Thermal Information Absolute Maximum Ratings Symbol Parameter Value Parameter Units Rating Units –55 to 150 °C IPP Peak Current (tp=8/20μs) 20.0 A Storage Temperature Range PPK Peak Pulse Power (tp=8/20µs) 300 W Maximum Junction Temperature 150 °C TOP Operating Temperature –40 to 125 ºC Maximum Lead Temperature (Soldering 20-40s) 260 °C TSTOR Storage Temperature –55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Snap Back Voltage VSB ISB=50mA Reverse Leakage Current ILEAK VR=2.5V, I/O to GND Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD Diode Capacitance 1 Diode Capacitance 1 Min Typ Max Units 2.5 V 2.0 V 0.5 1.0 µA IPP=1A, tp=8/20µs, Fwd 5.0 V IPP=5A, tp=8/20µs, Fwd 6.3 V IPP=10A, tp=8/20µs, Fwd 8.0 V IPP=20A, tp=8/20µs, Fwd 11.5 V (VC2-VC1)/(IPP2-IPP1) W 0.35 IEC61000-4-2 (Contact) ±30 kV IEC61000-4-2 (Air) ±30 kV CI/O-GND Reverse Bias=0V 3.5 CI/O-I/O Reverse Bias=0V 2.0 5.0 pF pF Note: 1. Parameter is guaranteed by design and/or device characterization. Pulse Waveform Clamping Voltage vs. IPP 110% 12.0 100% 10.0 90% Clamp Voltage (VC) Percent of IPP 80% 70% 60% 50% 40% 30% 8.0 6.0 4.0 2.0 20% 10% 0.0 0% 0.0 5.0 10.0 15.0 Time (μs) 20.0 25.0 30.0 0 5 10 15 20 Peak Pulse Current-IPP (A) © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP2504N Series Ordering Information Capacitance vs. Bias 5.0 Part Number Package Marking Min. Order Qty. SP2504NUTG µDFN-10 TH4 3000 Capacitance (pF) 4.0 3.0 2.0 1.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 DC Bias (V) Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Product Characteristics Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4.. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Part Numbering System SP 2504N U T G G= Green TVS Diode Arrays (SPA® Diodes) T= Tape & Reel Package U= µDFN-10 Series Lead Plating Flammability tP TP Temperature Reflow Condition Part Marking System T* 4 Number of Product Series Channels T = SP2504N Assembly Site TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP2504N Series Package Dimensions — µDFN-10 Top View A D Package µDFN-10 (2.6x2.6mm) JEDEC MO-229 Millimeters Symbol E A Nom Max Min Nom Max 0.45 0.50 0.55 0.018 0.020 0.022 0.130 Ref A3 B Side View 0.10 C Seating Plane 0.17 0.22 0.27 0.006 0.008 0.010 D 2.50 2.60 2.70 0.097 0.101 0.105 0.085 D2 2.10 2.15 2.20 0.081 0.083 E 2.50 2.60 2.70 0.097 0.101 0.105 E2 1.21 1.26 1.31 0.046 0.049 0.051 0.45 0.014 0.50 BSC 0.35 L A 0.005 Ref b e A3 Inches Min 0.020 BSC 0.40 0.016 0.018 Recommended Solder Pads µDFN-10L 2.6x2.6mm 0.05 C C b 0.10 M C B A B Bottom View D2 Z F G C 2X Y C X P Dimension E2 Symbol Millimeters Inches B 2.30 0.091 C 2.20 0.087 F 1.41 0.056 G 1.65 0.065 P 0.50 0.020 X 0.37 0.015 Y 0.55 0.022 Z 2.75 0.108 e Embossed Carrier Tape & Reel Specification — µDFN-10 (2.6x2.6mm) P0 P2 P1 Reel Size:7 inches D0 E A0 F T W D1 5º MAX K0 B0 Pin 1 Location 5º MAX Symbol Millimeters A0 2.82 ± 0.05 B0 2.82 ± 0.05 D0 Ø1.50 + 0.10 D1 Ø 0.50 + 0.05 E 1.75 ± 0.10 F 3.50 ± 0.05 K0 0.76 ± 0.05 P0 4.00 ± 0.10 P1 4.00 ± 0.10 P2 2.00 ± 0.05 T 0.25 ± 0.02 W 8.00 + 0.30 /- 0.10 User Feeding Direction © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13