MAX16046

 MAX16046
RELIABILITY REPORT
FOR
MAX16046CETN+T
PLASTIC ENCAPSULATED DEVICES
September 25, 2014
MAXIM INTEGRATED
160 RIO ROBLES
SAN JOSE, CA 95134
Approved by
Eric Wright
Quality Assurance
Reliability Engineering
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MAX16046
Conclusion
The MAX16046CETN+T successfully meets the quality and reliability standards required of all Maxim Integrated products. In addition,
Maxim Integrated's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim Integrated's quality
and reliability standards.
Table of Contents
I. ........Device Description
IV. .......Die Information
II. ........Manufacturing Information
V. ........Quality Assurance Information
III. .......Packaging Information
VI. .......Reliability Evaluation
.....Attachments
I. Device Description
A. General
The MAX16046C EEPROM-configurable system managers monitor, sequence, track, and margin multiple system voltages. The device manages up to 12
system voltages simultaneously, and integrates an analog-to-digital converter (ADC) for monitoring supply voltages, digital-to analog converters (DAC) for
adjusting supply voltages, and configurable outputs for sequencing and tracking supplies (during power-up and power-down). Nonvolatile EEPROM
registers are configurable for storing upper and lower voltage limits, setting timing and sequencing requirements, and for storing critical fault data for
readback following failures. An internal 1% accurate 10-bit ADC measures each input and compares the result to one upper, one lower, and one
selectable upper or lower limit. A fault signal asserts when a monitored voltage falls outside the set limits. Up to three independent fault output signals are
configurable to assert under various fault conditions. The integrated sequencer/tracker allows precise control over the power-up and power-down order of
up to 12 power supplies. Four channels (EN_OUT1–EN_OUT4) support closed-loop tracking using external series MOSFETs. Six outputs (EN_OUT1–
EN_OUT6) are configurable with charge-pump outputs to directly drive MOSFETs without closed-loop tracking. The device includes 12 integrated 8-bit
DAC outputs for margining power supplies when connected to the trim input of a point-of-load (POL) module. The device includes six programmable
general-purpose inputs/outputs (GPIOs). GPIOs are EEPROM configurable as dedicated fault outputs, as a watchdog input or output (WDI/WDO), as a
manual reset (MR), or as margin control inputs. The device features two methods of fault management for recording information during system shutdown
2
events. The fault logger records a failure in the internal EEPROM and sets a lock bit protecting the stored fault data from accidental erasure. An I C or a
JTAG serial interface configures the MAX16046C, which is offered in a 56-pin 8mm x 8mm TQFN package and is fully specified from -40°C to +85°C.
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MAX16046
II. Manufacturing Information
A. Description/Function:
12-/8-Channel EEPROM-Programmable System Managers with Nonvolatile
Fault Registers
B. Process:
EB8
C. Number of Device Transistors:
153726
D. Fabrication Location:
USA
E. Assembly Location:
USA, Taiwan, China, Thailand
F. Date of Initial Production:
September 17, 2014
III. Packaging Information
A. Package Type:
56-pin TQFN 8x8
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive
E. Bondwire:
Au (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-2780
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard J-STD-020-C
Level 3
J. Single Layer Theta Ja:
35°C/W
K. Single Layer Theta Jc:
1°C/W
L. Multi Layer Theta Ja:
21°C/W
M. Multi Layer Theta Jc:
1°C/W
IV. Die Information
A. Dimensions:
258 X 235 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
3.0 microns (as drawn)
F. Minimum Metal Spacing:
3.0 microns (as drawn)
G. Bondpad Dimensions:
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX16046
V. Quality Assurance Information
A. Quality Assurance Contacts:
Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Vice President of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% for all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:
=
1
MTTF
= 1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 48 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.9 x 10
= 22.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim Integrated's reliability monitor program. Maxim Integrated
performs quarterly life test monitors on its processes. This data is published in the Reliability Report found at
http://www.maximintegrated.com/qa/reliability/monitor. Cumulative monitor data for the EB8 Process results in a FIT Rate of 0.09 @
25°C and 1.58 @ 55°C (0.8 eV, 60% UCL)
B. E.S.D. and Latch-Up Testing (lot TATU5A080G, D/C 1423)
The MT07-1 die type has been found to have all pins able to withstand a transient pulse of:
ESD-HBM:
ESD-CDM:
+/-2500V per JEDEC JESD22-A114
+/- 750V per JEDEC JESD22-C101
Latch-Up testing has shown that this device withstands a current of +/- 100mA and overvoltage per JEDEC JESD78.
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MAX16046
Table 1
Reliability Evaluation Test Results
MAX16046CETN+T
TEST ITEM
TEST CONDITION
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
COMMENTS
DC Parameters
& functionality
48
0
TATU5A080F, D/C 1423
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Note 1: Life Test Data may represent plastic DIP qualification lots.
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