MAX2021 RELIABILITY REPORT FOR MAX2021ETX+T PLASTIC ENCAPSULATED DEVICES June 7, 2012 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Richard Aburano Quality Assurance Manager, Reliability Engineering Maxim Integrated Products. All rights reserved. Page 1 MAX2021 Conclusion The MAX2021ETX+T successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description V. ........Quality Assurance Information II. ........Manufacturing Information VI. .......Reliability Evaluation III. .......Packaging Information IV. .......Die Information .....Attachments I. Device Description A. General The MAX2021 low-noise, high-linearity, direct upconversion/downconversion quadrature modulator/demodulator is designed for RFID handheld and portal readers, as well as single and multicarrier 750MHz to 1200MHz GSM/EDGE, cdma2000®, WCDMA, and iDEN® base-station applications. Direct conversion architectures are advantageous since they significantly reduce transmitter or receiver cost, part count, and power consumption as compared to traditional IF-based double conversion systems. In addition to offering excellent linearity and noise performance, the MAX2021 also yields a high level of component integration. This device includes two matched passive mixers for modulating or demodulating in-phase and quadrature signals, two LO mixer amplifier drivers, and an LO quadrature splitter. On-chip baluns are also integrated to allow for single-ended RF and LO connections. As an added feature, the baseband inputs have been matched to allow for direct interfacing to the transmit DAC, thereby eliminating the need for costly I/Q buffer amplifiers. The MAX2021 operates from a single +5V supply. It is available in a compact 36-pin thin QFN package (6mm x 6mm) with an exposed paddle. Electrical performance is guaranteed over the extended -40°C to +85°C temperature range. Maxim Integrated Products. All rights reserved. Page 2 MAX2021 II. Manufacturing Information A. Description/Function: High-Dynamic-Range, Direct Up-/Downconversion, 750MHz to 1200MHz Quadrature Modulator/Demodulator B. Process: G4 C. Number of Device Transistors: D. Fabrication Location: USA E. Assembly Location: China, Taiwan and Thailand F. Date of Initial Production: January 21, 2006 III. Packaging Information A. Package Type: 36-pin TQFN 6x6 B. Lead Frame: Copper C. Lead Finish: 100% matte Tin D. Die Attach: Conductive E. Bondwire: Au (1 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: #05-9000-1942 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-C Level 1 J. Single Layer Theta Ja: 38°C/W K. Single Layer Theta Jc: 1°C/W L. Multi Layer Theta Ja: 28°C/W M. Multi Layer Theta Jc: 1°C/W IV. Die Information A. Dimensions: 131 X 131 mils B. Passivation: Si3N4 C. Interconnect: Au D. Backside Metallization: None E. Minimum Metal Width: Metal1-3 = 1.2 / Metal 4 = 5.6 microns (as drawn) F. Minimum Metal Spacing: Metal1-3 = 1.6 / Metal 4 = 4.2 microns (as drawn) G. Bondpad Dimensions: H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw Maxim Integrated Products. All rights reserved. Page 3 MAX2021 V. Quality Assurance Information A. Quality Assurance Contacts: Richard Aburano (Manager, Reliability Engineering) Don Lipps (Manager, Reliability Engineering) Bryan Preeshl (Vice President of QA) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( = 1 MTTF = = 22.9 x 10 ) is calculated as follows: 1.83 (Chi square value for MTTF upper limit) 192 x 4340 x 48 x 2 (where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV) -9 = 22.9 F.I.T. (60% confidence level @ 25°C) The following failure rate represents data collected from Maxim's reliability monitor program. Maxim performs quarterly life test monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor. Cumulative monitor data for the G4 Process results in a FIT Rate of 0.02 @ 25C and 0.37 @ 55C (0.8 eV, 60% UCL) B. E.S.D. and Latch-Up Testing The CR34 die type has been found to have all pins able to withstand a HBM transient pulse of +/- 2000V, except the BBI-/BBI+/BBQ-/BBQ+ pins (pins 20, 21, 25, 26) which only pass +/- 150V per JEDEC JESD22-A114 (lot NZF0AA063C, D/C 1206). Latch-Up testing has shown that this device withstands a current of 250mA (lot NZF0AQ001B, D/C 0529). Maxim Integrated Products. All rights reserved. Page 4 MAX2021 Table 1 Reliability Evaluation Test Results MAX2021ETX+T TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 135C Biased Time = 192 hrs. Moisture Testing (Note 2) HAST Ta = 130°C RH = 85% Biased Time = 96hrs. Mechanical Stress (Note 2) Temperature -65°C/150°C Cycle 1000 Cycles Method 1010 FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES COMMENTS DC Parameters & functionality 48 0 NZF0AQ001B, D/C 0529 DC Parameters & functionality 77 0 DC Parameters & functionality 77 0 Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data Maxim Integrated Products. All rights reserved. Page 5