MAX8796GTJ+ RELIABILITY REPORT FOR MAX8796GTJ+ PLASTIC ENCAPSULATED DEVICES March 18, 2009 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Ken Wendel Quality Assurance Director, Reliability Engineering Maxim Integrated Products. All rights reserved. Page 1/5 MAX8796GTJ+ Conclusion The MAX8796GTJ+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards. Table of Contents I. ........Device Description V. ........Quality Assurance Information II. ........Manufacturing Information VI. .......Reliability Evaluation III. .......Packaging Information IV. .......Die Information .....Attachments I. Device Description A. General na Maxim Integrated Products. All rights reserved. Page 2/5 MAX8796GTJ+ II. Manufacturing Information A. Description/Function: Single-Phase Quick-PWM Intel IMVP6/6+/GMCH Controller B. Process: S4 C. Number of Device Transistors: 10146 D. Fabrication Location: Texas E. Assembly Location: UTL Thailand F. Date of Initial Production: December 19, 2007 III. Packaging Information A. Package Type: 32-pin TQFN 5x5 B. Lead Frame: Copper C. Lead Finish: 100% matte Tin D. Die Attach: Conductive Epoxy E. Bondwire: Gold (1 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: #05-9000-2634 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-C Level 1 J. Single Layer Theta Ja: 47°C/W K. Single Layer Theta Jc: 1.7°C/W L. Multi Layer Theta Ja: 29°C/W M. Multi Layer Theta Jc: 2.7°C/W IV. Die Information A. Dimensions: 77 X 73 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide C. Interconnect: Aluminum/Si (Si = 1%) D. Backside Metallization: None E. Minimum Metal Width: Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn) F. Minimum Metal Spacing: Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw Maxim Integrated Products. All rights reserved. Page 3/5 MAX8796GTJ+ V. Quality Assurance Information A. Quality Assurance Contacts: Ken Wendel (Director, Reliability Engineering) Bryan Preeshl (Managing Director of QA) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows: = 1 MTTF = 1.83 (Chi square value for MTTF upper limit) 192 x 4340 x 192 x 2 (where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV) -9 = 5.6 x 10 = 5.6 F.I.T. (60% confidence level @ 25°C) The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maximic.com/. Current monitor data for the S4 Process results in a FIT Rate of 0.28 @ 25C and 4.85 @ 55C (0.8 eV, 60% UCL) B. Moisture Resistance Tests The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter. C. E.S.D. and Latch-Up Testing The PE11 die type has been found to have all pins able to withstand a HBM transient pulse of +/-300 V per JEDEC JESD22-A114-D. Latch-Up testing has shown that this device withstands a current of +/-250 mA. Maxim Integrated Products. All rights reserved. Page 4/5 MAX8796GTJ+ Table 1 Reliability Evaluation Test Results MAX8796GTJ+ TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 135°C Biased FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES DC Parameters & functionality 192 0 DC Parameters & functionality 77 0 DC Parameters & functionality 77 0 Time = 192 hrs. Moisture Testing (Note 2) 85/85 Ta = 85°C RH = 85% Biased Time = 1000hrs. Mechanical Stress (Note 2) Temperature -65°C/150°C Cycle 1000 Cycles Method 1010 Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data Maxim Integrated Products. All rights reserved. Page 5/5