REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 02-08. Table I changes. 94-10-24 M. A. Frye B Add case outline X. – drw 99-06-02 Raymond Monnin C Update drawing to current requirements. Editorial changes throughout. - drw 04-10-20 Raymond Monnin THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED REV SHEET REV SHEET REV STATUS REV C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Rick C. Officer STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY Charles E. Besore APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE Michael A. Frye MICROCIRCUIT, LINEAR, CMOS, DUAL, RS232, TRANSCEIVER, MONOLITHIC SILICON DRAWING APPROVAL DATE 90-02-10 AMSC N/A REVISION LEVEL C SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 1 OF 5962-89877 9 5962-E013-05 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89877 01 X A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic number 01 02 03 04 05 MAX232 MAX230 MAX231 MAX234 MAX236 06 07 08 MAX237 MAX238 MAX239 Circuit function Dual CMOS transceivers 5 CMOS transceivers with power shutdown 5 V/12 V dual CMOS transceivers Quad CMOS transceivers CMOS RS-232 4 transmitter, 3 receiver with power shutdown and receiver three state enable CMOS RS-232 5 transmitter, 3 receiver CMOS RS-232 4 transmitter, 4 receiver 5 V/12 V CMOS RS-232 3 transmitter, 5 receiver with three state receiver enable 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter C E R J 2 X Descriptive designator GDIP1-T14 or CDIP-T14 GDIP1-T16 or CDIP-T16 GDIP1-T20 or CDIP-T20 GDIP1-T24 or CDIP-T24 CQCC1-N20 CDFP4-F16 Terminals Package style 14 16 20 24 20 16 Dual-in-line Dual-in-line Dual-in-line Dual-in-line Square leadless chip carrier Flatpack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89877 A REVISION LEVEL C SHEET 2 1.3 Absolute maximum ratings. Supply voltage (VCC) -------------------------------------------------------------------- - 0.3 V dc to +6 V dc Positive power supply voltage (+V) ------------------------------------------------- (VCC - 0.3 V dc) to +14 V dc Negative power supply voltage (-V) ------------------------------------------------- +0.3 V dc to -14 V dc Driver input voltage---------------------------------------------------------------------- -0.3 V dc to (VCC + 0.3 V dc) Receiver input voltage------------------------------------------------------------------ -30 V dc to +30 V dc Driver output voltage-------------------------------------------------------------------- (V+ + 0.3 V dc) to (V- - 0.3 V dc) Receiver output voltage ---------------------------------------------------------------- -0.3 V dc to (VCC + 0.3 V dc) Short circuit duration, driver outputs ------------------------------------------------ Continuous Power dissipation at TA = +70°C (PD): 1/ 2/ Case outlines C and 2 ----------------------------------------------------------- 727 mW Case outline E --------------------------------------------------------------------- 800 mW Case outline J --------------------------------------------------------------------- 1000 mW Case outline R -------------------------------------------------------------------- 889 mW Thermal resistance, junction-to-case (θJC)- --------------------------------------- See MIL-STD-1835 Thermal resistance, junction-to-ambient (θJA): Case outlines C and 2 ----------------------------------------------------------- 110°C/W Case outline E --------------------------------------------------------------------- 100°C/W Case outline J---------------------------------------------------------------------- 80°C/W Case outline R --------------------------------------------------------------------- 90°C/W Maximum junction temperature (TJ)------------------------------------------------- +150°C Storage temperature range ----------------------------------------------------------- -65°C to +160°C Lead temperature (soldering, 10 seconds)---------------------------------------- +300°C 1.4 Recommended operating conditions. Supply voltage range (VCC)-----------------------------------------------------------Ambient operating temperature range (TA)---------------------------------------Maximum receiver output enable time 3/ -----------------------------------------Maximum receiver output disable time 3/------------------------------------------ +4.5 V dc to +5.5 V dc -55°C to +125°C 400 ns 250 ns 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) ________ 1/ Must withstand the added PD due to short circuit test; e.g., IOS. 2/ Above TA = +70°C, cases C and 2 derate at 9.09 mW/°C, case E derates at 10 mW/°C, case R derates at 11.11 mW/°C, and case J derates at 12.5 mW/°C. 3/ These typical values for device types 05 and 08 only. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89877 A REVISION LEVEL C SHEET 3 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89877 A REVISION LEVEL C SHEET 4 TABLE I. Electrical performance characteristics. Test Output voltage swing VCC power supply current V+ power supply current Shutdown supply current Symbol VOUT ICC I+ Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups All transmitter outputs loaded with 3kΩ to GND Device type Limits Unit Min Max -5.0 +5.0 V mA 1, 2, 3 All 1 01 10 02, 04, 05, 06, 07 15 03, 08 1 03 5 08 15 1 02, 05 10 µA 1, 2, 3 All 0.8 V EN 05, 08 0.8 SHDN 02, 05 0.8 No load No load 1 ISHDN mA RS-232 TRANSMITTERS Low level input voltage High level input voltage Logic pullup current low Output short circuit current VIL VIH IIL IOST TIN TIN 1, 2, 3 All 2.0 EN 05, 08 2.4 SHDN 02, 05 2.4 TIN = 0 V VOUT = 0 V Sourcing current 1, 2, 3 All 200 µA 1 01 ±25 mA 02, 03, 04, 05, 06, 07, 08 ±45 VOUT = 0 V Sinking current Transmitter output resistance ROUT VCC = V+ = V- = 0 V, VOUT = ±2 V V 1, 2, 3 All 300 Ω See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89877 A REVISION LEVEL C SHEET 5 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit Min Max +30 RS-232 RECEIVERS Receiver input voltage operating range VR RS-232 input threshold low VTL Normal operation, VCC = 5 V RS-232 input threshold high RH VCC = 5 V Receiver input resistance RI VCC = 5 V, TA = +25ºC 01, 03, 05, 06, 07, 08 -30 1 01, 03, 05, 06, 0.8 07, 08 2, 3 VTH Receiver input hysteresis 1, 2, 3 V V 0.4 1 2.4 2, 3 3.0 1, 2, 3 01, 03, 05, 06, 07, 08 0.2 1.0 V 1 01, 03, 05, 06, 07, 08 3.0 7.0 kΩ 3.5 Receiver output high voltage VOH IOUT = -1.0 mA 1, 2, 3 01, 03, 05, 06, 07, 08 Receiver output low voltage VOL IOUT = 3.2 mA 1, 2, 3 01, 03 0.4 05, 06, 07, 08 0.4 1, 2, 3 05, 08 ±10 µA 9, 10, 11 01, 03, 05, 06, 07, 08 10 µs 9 02, 04, 05, 06, 07, 08 3.0 30 V/µs 01, 03 1.5 30 IOUT = 1.6 mA TTL/CMOS output leakage current IL 0 V ≤ ROUT ≤ VCC, EN = VCC V V AC TESTS Propagation delay time tP RS-232 IN to TTL/CMOS OUT, CL = 150 pF Transition region slew rate tSR CL = 50 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, VCC = +5 V Measure from +3.0 V to -3.0 V or -3.0 V to +3.0 V 1/ VCC = +5 V ±10% for device types 01, 02, 04, 05, 06, and 07. VCC = +5 V ±10%, V+ = 9.0 V to 13.2 V for device types 03 and 08. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89877 A REVISION LEVEL C SHEET 6 Device types Case outlines 01 E, X 2 02 03 04 05 06 07 08 R C E J J J J Terminal number Terminal symbol 1 +C1 NC T3OUT +C T1OUT T3OUT T3OUT T2OUT R1OUT 2 +V +C1 T1OUT -C T2OUT T1OUT T1OUT T1OUT R1IN 3 -C1 +V T2OUT -V T2IN T2OUT T2OUT R2IN GND 4 +C2 -C1 T2IN T2OUT T1IN R1IN R1IN R2OUT VCC 5 -C2 +C2 T1IN R2IN GND R1OUT R1OUT T1IN +V 6 -V NC GND R2OUT VCC T2IN T2IN R1OUT +C 7 T2OUT -C2 VCC T2IN +C1 T1IN T1IN R1IN -C 8 R2IN -V +C1 T1IN +V GND GND GND -V 9 R2OUT T2OUT +V R1OUT -C1 VCC VCC VCC R5IN 10 T2IN R2IN -C1 R1IN +C2 +C1 +C1 +C1 R5OUT 11 T1IN NC +C2 T1OUT -C2 +V +V +V R4OUT 12 R1OUT R2OUT -C2 GND -V -C1 -C1 -C1 R4IN 13 R1IN T2IN -V VCC T3IN +C2 +C2 +C2 T3OUT 14 T1OUT T1IN T3IN +V T4IN -C2 -C2 -C2 EN 15 GND R1OUT T4IN --- T4OUT -V -V -V NC 16 VCC NC T5OUT --- T3OUT R3IN R3IN R4IN T3IN 17 --- R1IN SHDN --- --- R3OUT R3OUT R4OUT R3OUT 18 --- T1OUT NC --- --- T3IN T3IN T2IN R3IN 19 --- GND T5IN --- --- T4IN T4IN T3IN T1OUT 20 --- VCC T4OUT --- --- EN T5OUT T4OUT T2OUT 21 --- --- --- --- --- SHDN T5IN T4IN R2IN 22 --- --- --- --- --- R2OUT R2OUT R3OUT R2OUT 23 --- --- --- --- --- R2IN R2IN R3IN T2IN 24 --- --- --- --- --- T4OUT T4OUT T3OUT T1IN FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89877 A REVISION LEVEL C SHEET 7 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Interim electrical parameters (method 5004) Final electrical test parameters (method 5004) Group A test requirements (method 5005) Groups C and D end-point electrical parameters (method 5005) Subgroups (in accordance with MIL-STD-883, method 5005, table I) 1 1*, 2, 3, 9, 10, 11 1, 2, 3, 9, 10, 11 1 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89877 A REVISION LEVEL C SHEET 8 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA = +125°C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MILHDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89877 A REVISION LEVEL C SHEET 9 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 04-10-20 Approved sources of supply for SMD 5962-89877 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8987701XA 0EU86 AS232F16/883C 5962-8987701EA 1ES66 MAX232MJE/883B 5962-89877012C 1ES66 MAX232MLP/883B 5962-8987702RA 1ES66 MAX230MJP/883B 5962-8987703CA 1ES66 MAX231MJD/883B 5962-8987704EA 1ES66 MAX234MJE/883B 5962-8987705JA 1ES66 MAX236MRG/883B 5962-8987706JA 1ES66 MAX237MRG/883B 5962-8987707JA 1ES66 MAX238MRG/883B 5962-8987708JA 1ES66 MAX239MRG/883B 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number Vendor name and address 1ES66 Maxim Integrated Products, Inc. 120 San Gabriel Dr. Sunnyvale, CA 94086 0EU86 Austin Semiconductor, Inc, 8701 Cross Park Dr. Austin, TX 78754-4566 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.