5962-88504

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Change in table I, IOZ parameter. Also changes to footnotes 3 and 4.
Editorial changes throughout.
89-05-18
M. A. Frye
B
Changes in accordance with NOR 5962-R227-92.
92-06-24
M. A. Frye
C
Update drawing to current requirements. Removed logic diagram.
Editorial changes throughout. - gap
01-10-18
Raymond Monnin
D
Boilerplate update part of 5 year review. ksr
06-08-18
Raymond Monnin
THE ORIGINAL FRONT PAGE HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
REV
D
D
D
D
D
D
D
D
D
D
D
D
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
PMIC N/A
PREPARED BY
James E. Jamison
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
Wm. J. Johnson
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
Michael A. Frye
DRAWING APPROVAL DATE
MICROCIRCUIT, DIGITAL, BIPOLAR,
FIELD PROGRAMMABLE, LOGIC
ARRAY (FPLA), MONOLITHIC SILICON
88-01-22
AMSC N/A
REVISION LEVEL
D
SIZE
CAGE CODE
A
67268
5962-88504
SHEET
1 OF
DSCC FORM 2233
APR 97
12
5962-E586-06
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-88504
01
L
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
01
02
PLS161
PLS173
Circuit function
(12 x 48 x 8) programmable logic array
(22 x 42 x 10) programmable logic array
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
L
Descriptive designator
GDIP3-T24 or CDIP4-T24
Terminals
Package style
24
Dual-in-line
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage (VCC) ...................................................................................... +7.0 V dc
Input voltage (VI):
Device 01 .................................................................................................... +5.5 V dc
Device 02 .................................................................................................... +10 V dc
Storage temperature range ........................................................................... -65°C to +150°C
Maximum power dissipation 1/ ..................................................................... 1.0 watt
Lead temperature (soldering, 10 seconds) .................................................... +300°C
Thermal resistance, junction-to-case (θJC):
Case L ........................................................................................................ See MIL-STD-1835
Junction temperature (TJ) .............................................................................. +200°C
Output sink current ........................................................................................ +100 mA
1.4 Recommended operating conditions.
Supply voltage (VCC) ...................................................................................... +4.5 V dc to +5.5 V dc
Minimum high level input voltage (VIH) .......................................................... +2.0 V dc
Maximum low level input voltage (VIL) ........................................................... +0.8 V dc
Case operating temperature range (TC) ........................................................ -55°C to +125°C
1/ Must withstand the added PD due to short circuit test; e.g., IOS.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-88504
A
REVISION LEVEL
D
SHEET
2
2.1 Government specification, standards, and handbooks. The following specification, standards and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where the entire SMD PIN number is not
feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-88504
A
REVISION LEVEL
D
SHEET
3
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
3.10 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result
in a wide variety of configurations; two processing options are provided for selection in the contract, using an altered item
drawing.
3.10.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 4.3.1c
and table II. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program
configuration.
3.10.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions
herein, including the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to delivery.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
c. All devices processed to an altered item drawing may be programmed either before or after burn-in at the
manufacturer's discretion. The required electrical testing shall include, as a minimum, the final electrical tests for
programmed devices as specified in table II herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-88504
A
REVISION LEVEL
D
SHEET
4
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a.
Tests shall be as specified in table II herein.
b.
Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c.
Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirement of
group A, subgroups 9, 10, and 11. Either of two techniques is acceptable:
(1) Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify programmability
and ac performance without programming the user array. If this is done, the resulting test patterns shall be verified
on all devices during subgroups 9, 10, and 11, group A testing in accordance with the sampling plan specified in
MIL-STD-883, method 5005.
(2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy
programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be submitted to
programming. If more than two devices fail to program, the lot shall be rejected. At the manufacturer's option, the
sample may be increased to 24 total devices with no more than four total device failures allowable.
Ten devices from the programmability sample shall be submitted to the requirements for group A, subgroups 9, 10,
and 11. If more than two total devices fail, the lot shall be rejected. At the manufacturer's option, the sample may
be increased to 20 total devices with no more than four total device failures allowable.
d.
Subgroups 7 and 8 must verify input to output logic combinations.
4.3.2 Groups C and D inspections.
a.
End-point electrical parameters shall be as specified in table II herein.
b.
Steady-state life test conditions, method 1005 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1005 of MIL-STD-883.
(2)
TA = +125°C, minimum.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4 Programming procedures. The programming procedures shall be as specified by the device manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-88504
A
REVISION LEVEL
D
SHEET
5
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55°C ≤ TC ≤ +125°C
Device
types
Group A
subgroups
Limits
Low level input voltage
VIL
unless otherwise specified
VCC = 4.5 V
All
1, 2, 3
High level input voltage
VIH
VCC = 5.5 V
All
1, 2, 3
Input clamp voltage 2/
VIC
VCC = 4.5 V, II = -18 mA
All
1, 2, 3
Low level input current
IIL
VCC = 5.5 V, VI = 0.45 V
All
1, 2, 3
-150
µA
High level input current
IIH
VCC = 5.5 V, VI = 5.5 V
All
1, 2, 3
50
µA
Low level output
voltage 4/
VOL
VCC = 4.5 V,
VIH = 2 V,
VIL = 0.8 V
IOL = 9.6 mA
01
1, 2, 3
IOL = 12 mA
02
High level output
voltage 3/, 9/
Output short circuit
current 2/, 5/, 6/
DC supply current 7/
VOH
3-state output
current 8/
I/O pins only
Functional tests
Min
Unit
V
2
V
-1.2
V
0.5
V
0.5
All
1, 2, 3
IOS
VCC = 4.5 V, VIL = 0.8 V,
VIH = 2 V, IOH = -2 mA
VCC = 5.5 V, VO = 0 V
All
1, 2, 3
ICC
VCC = 5.5 V
IOZ
VCC = 5.5 V
01
02
01
1, 2, 3
1, 2, 3
1, 2, 3
VOUT
Max
0.8
2.4
-15
V
-85
mA
180
170
60
mA
mA
µA
= 5.5 V
VOUT
= 0.45 V
VOUT
=5.5 V
VOUT
= 0.45 V
See 4.3.1d
01
-60
02
±110
02
±210
All
7, 8
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-88504
A
REVISION LEVEL
D
SHEET
6
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions
-55°C ≤ TC ≤ +125°C
Device
types
Group A
subgroups
01
9, 10, 11
Max
70
ns
unless otherwise specified
Limits
Min
VCC = 5.0 V ±10%
R1 = 470Ω, R2 = 1 KΩ,
See figures 2 and 3
Unit
Propagation delay
output to input
tPD
Propagation delay
chip enable
Propagation delay 9/
output enable
Disable time
chip disable
Disable time 9/ 10/
output disable
tCE
02
01
9, 10, 11
9, 10, 11
40
50
ns
ns
tOE
02
9, 10, 11
35
ns
tCD
01
9, 10, 11
50
ns
tOD
02
9, 10, 11
35
ns
1/
2/
All voltage values are with respect to ground.
Test one at a time.
3/
For device 01: measured with VIL applied to CE . For device 02: measured with pins 1-5 = 0 V, pins 6-10 = 4.5 V,
pin 11 = 10 V and pin 13 = 10 V.
For device 01: measured with a programmed logic condition for which the output test is at a low logic level. For device 02:
pins 1 - 5 = 0 V, pins 6 -10 = 4.5 V, pin 11 = 0 V, pin 13 = 10 V.
5/ For device 01: on unprogrammed device apply 10 V I0-I11. For device 02: same conditions as listed in note 3 above,
except pin 11 = +10 V.
6/ Duration of short circuit should not exceed 1 second.
7/ For device 01: ICC is measured with the chip enable input grounded, all other inputs at 4.5 V and the outputs open. For
device 02: ICC is measured with I0 and I1 = 0 V and I2-I11 and B0-B9 = 4.5 V. Part in virgin state.
8/ Leakage values are a combination of input and output leakage.
9/ Not testable on unprogrammed devices.
10/ Measured at VT = VOL + 0.5 V.
4/
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-88504
A
REVISION LEVEL
D
SHEET
7
Device
types
Case
outlines
Terminal
number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
01
02
L
Terminal
symbol
FE
I5
I4
I3
I2
I1
I0
F7
F6
F5
F4
GND
F3
F2
F1
F0
CE
L
Terminal
symbol
I0
I1
I2
I3
I4
I5
I6
I7
I8
I9
I10
GND
I11
B0
B1
B2
B3
I11
I10
I9
I8
I7
I6
VCC
B4
B5
B6
B7
B8
B9
VCC
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-88504
A
REVISION LEVEL
D
SHEET
8
FIGURE 2. Test load circuits.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-88504
A
REVISION LEVEL
D
SHEET
9
Input pulse characteristics
VM
Rep. rate
Pulse width
tTLH
tTHL
1.5 V
1 MHz
500 ns
≤ 5 ns
≤ 5 ns
FIGURE 3. Timing waveforms.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-88504
A
REVISION LEVEL
D
SHEET
10
TIMING DEFINITIONS
TCE Delay between beginning of Chip Enable low (with input valid) and when Data Output becomes valid.
TCD Delay between when Chip Enable becomes high and Data Output is in off state (Hi-Z or high).
TPD Delay between beginning of valid input (with Chip Enable low) and when Data Output becomes valid.
TIMING DEFINITIONS
TPD Propagation delay between input and output.
TOD Delay between input change and when output is off (Hi-Z or high).
TOE Delay between input change and when output reflects specified output level.
FIGURE 3. Timing waveforms Continued.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-88504
A
REVISION LEVEL
D
SHEET
11
TABLE II. Electrical test requirements.
MIL-STD-883 test requirements
1/, 2/, 3/
Subgroups
(in accordance with
MIL-STD-883,
method 5005,
table I)
Interim electrical parameters
(method 5004)
1
Final electrical test parameters
(method 5004) for programmed devices
Final electrical test parameters
(method 5004) for unprogrammed devices
1*, 2, 3, 7*, 8
9
Group A test requirements
(method 5005)
1, 2, 3, 7, 8, 9,
10, 11
1*, 2, 3, 7*, 8
1, 2, 3
Groups C and D end-point
electrical parameters
(method 5005)
1/ * PDA applies to subgroup 1 and 7.
2/ Any or all subgroups may be combined when using high-speed testers.
3/ Subgroups 7 and 8 functional test shall also verify that no fuses are
blown for unprogrammed devices or that the altered item drawing
pattern exists for programmed devices (see table II).
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the
individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone 614692-0547.
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MILHDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by
DSCC-VA.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-88504
A
REVISION LEVEL
D
SHEET
12
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 06-08-18
Approved sources of supply for SMD 5962-88504 are listed below for immediate acquisition information only and shall
be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate
of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of
supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
5962-8850401LA
Vendor
CAGE
number
Vendor
similar
PIN 2/
3/
PLS161/BLX
5962-8850402LA
3/
ASPLS173C24/883C
5962-8850402LA
0C7V7
PLS173/BLA
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE
number
0C7V7
Vendor name
and address
QP Semiconductor.
2945 Oakmead Village Court
Santa Clara, CA 95051
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.