REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change in table I, IOZ parameter. Also changes to footnotes 3 and 4. Editorial changes throughout. 89-05-18 M. A. Frye B Changes in accordance with NOR 5962-R227-92. 92-06-24 M. A. Frye C Update drawing to current requirements. Removed logic diagram. Editorial changes throughout. - gap 01-10-18 Raymond Monnin D Boilerplate update part of 5 year review. ksr 06-08-18 Raymond Monnin THE ORIGINAL FRONT PAGE HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY James E. Jamison STANDARD MICROCIRCUIT DRAWING CHECKED BY DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil Wm. J. Johnson APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE Michael A. Frye DRAWING APPROVAL DATE MICROCIRCUIT, DIGITAL, BIPOLAR, FIELD PROGRAMMABLE, LOGIC ARRAY (FPLA), MONOLITHIC SILICON 88-01-22 AMSC N/A REVISION LEVEL D SIZE CAGE CODE A 67268 5962-88504 SHEET 1 OF DSCC FORM 2233 APR 97 12 5962-E586-06 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88504 01 L X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 02 PLS161 PLS173 Circuit function (12 x 48 x 8) programmable logic array (22 x 42 x 10) programmable logic array 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter L Descriptive designator GDIP3-T24 or CDIP4-T24 Terminals Package style 24 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) ...................................................................................... +7.0 V dc Input voltage (VI): Device 01 .................................................................................................... +5.5 V dc Device 02 .................................................................................................... +10 V dc Storage temperature range ........................................................................... -65°C to +150°C Maximum power dissipation 1/ ..................................................................... 1.0 watt Lead temperature (soldering, 10 seconds) .................................................... +300°C Thermal resistance, junction-to-case (θJC): Case L ........................................................................................................ See MIL-STD-1835 Junction temperature (TJ) .............................................................................. +200°C Output sink current ........................................................................................ +100 mA 1.4 Recommended operating conditions. Supply voltage (VCC) ...................................................................................... +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH) .......................................................... +2.0 V dc Maximum low level input voltage (VIL) ........................................................... +0.8 V dc Case operating temperature range (TC) ........................................................ -55°C to +125°C 1/ Must withstand the added PD due to short circuit test; e.g., IOS. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88504 A REVISION LEVEL D SHEET 2 2.1 Government specification, standards, and handbooks. The following specification, standards and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88504 A REVISION LEVEL D SHEET 3 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result in a wide variety of configurations; two processing options are provided for selection in the contract, using an altered item drawing. 3.10.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 4.3.1c and table II. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program configuration. 3.10.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions herein, including the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to delivery. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. c. All devices processed to an altered item drawing may be programmed either before or after burn-in at the manufacturer's discretion. The required electrical testing shall include, as a minimum, the final electrical tests for programmed devices as specified in table II herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88504 A REVISION LEVEL D SHEET 4 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirement of group A, subgroups 9, 10, and 11. Either of two techniques is acceptable: (1) Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify programmability and ac performance without programming the user array. If this is done, the resulting test patterns shall be verified on all devices during subgroups 9, 10, and 11, group A testing in accordance with the sampling plan specified in MIL-STD-883, method 5005. (2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be submitted to programming. If more than two devices fail to program, the lot shall be rejected. At the manufacturer's option, the sample may be increased to 24 total devices with no more than four total device failures allowable. Ten devices from the programmability sample shall be submitted to the requirements for group A, subgroups 9, 10, and 11. If more than two total devices fail, the lot shall be rejected. At the manufacturer's option, the sample may be increased to 20 total devices with no more than four total device failures allowable. d. Subgroups 7 and 8 must verify input to output logic combinations. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA = +125°C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4 Programming procedures. The programming procedures shall be as specified by the device manufacturer. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88504 A REVISION LEVEL D SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C ≤ TC ≤ +125°C Device types Group A subgroups Limits Low level input voltage VIL unless otherwise specified VCC = 4.5 V All 1, 2, 3 High level input voltage VIH VCC = 5.5 V All 1, 2, 3 Input clamp voltage 2/ VIC VCC = 4.5 V, II = -18 mA All 1, 2, 3 Low level input current IIL VCC = 5.5 V, VI = 0.45 V All 1, 2, 3 -150 µA High level input current IIH VCC = 5.5 V, VI = 5.5 V All 1, 2, 3 50 µA Low level output voltage 4/ VOL VCC = 4.5 V, VIH = 2 V, VIL = 0.8 V IOL = 9.6 mA 01 1, 2, 3 IOL = 12 mA 02 High level output voltage 3/, 9/ Output short circuit current 2/, 5/, 6/ DC supply current 7/ VOH 3-state output current 8/ I/O pins only Functional tests Min Unit V 2 V -1.2 V 0.5 V 0.5 All 1, 2, 3 IOS VCC = 4.5 V, VIL = 0.8 V, VIH = 2 V, IOH = -2 mA VCC = 5.5 V, VO = 0 V All 1, 2, 3 ICC VCC = 5.5 V IOZ VCC = 5.5 V 01 02 01 1, 2, 3 1, 2, 3 1, 2, 3 VOUT Max 0.8 2.4 -15 V -85 mA 180 170 60 mA mA µA = 5.5 V VOUT = 0.45 V VOUT =5.5 V VOUT = 0.45 V See 4.3.1d 01 -60 02 ±110 02 ±210 All 7, 8 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88504 A REVISION LEVEL D SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55°C ≤ TC ≤ +125°C Device types Group A subgroups 01 9, 10, 11 Max 70 ns unless otherwise specified Limits Min VCC = 5.0 V ±10% R1 = 470Ω, R2 = 1 KΩ, See figures 2 and 3 Unit Propagation delay output to input tPD Propagation delay chip enable Propagation delay 9/ output enable Disable time chip disable Disable time 9/ 10/ output disable tCE 02 01 9, 10, 11 9, 10, 11 40 50 ns ns tOE 02 9, 10, 11 35 ns tCD 01 9, 10, 11 50 ns tOD 02 9, 10, 11 35 ns 1/ 2/ All voltage values are with respect to ground. Test one at a time. 3/ For device 01: measured with VIL applied to CE . For device 02: measured with pins 1-5 = 0 V, pins 6-10 = 4.5 V, pin 11 = 10 V and pin 13 = 10 V. For device 01: measured with a programmed logic condition for which the output test is at a low logic level. For device 02: pins 1 - 5 = 0 V, pins 6 -10 = 4.5 V, pin 11 = 0 V, pin 13 = 10 V. 5/ For device 01: on unprogrammed device apply 10 V I0-I11. For device 02: same conditions as listed in note 3 above, except pin 11 = +10 V. 6/ Duration of short circuit should not exceed 1 second. 7/ For device 01: ICC is measured with the chip enable input grounded, all other inputs at 4.5 V and the outputs open. For device 02: ICC is measured with I0 and I1 = 0 V and I2-I11 and B0-B9 = 4.5 V. Part in virgin state. 8/ Leakage values are a combination of input and output leakage. 9/ Not testable on unprogrammed devices. 10/ Measured at VT = VOL + 0.5 V. 4/ STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88504 A REVISION LEVEL D SHEET 7 Device types Case outlines Terminal number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 01 02 L Terminal symbol FE I5 I4 I3 I2 I1 I0 F7 F6 F5 F4 GND F3 F2 F1 F0 CE L Terminal symbol I0 I1 I2 I3 I4 I5 I6 I7 I8 I9 I10 GND I11 B0 B1 B2 B3 I11 I10 I9 I8 I7 I6 VCC B4 B5 B6 B7 B8 B9 VCC FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88504 A REVISION LEVEL D SHEET 8 FIGURE 2. Test load circuits. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88504 A REVISION LEVEL D SHEET 9 Input pulse characteristics VM Rep. rate Pulse width tTLH tTHL 1.5 V 1 MHz 500 ns ≤ 5 ns ≤ 5 ns FIGURE 3. Timing waveforms. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88504 A REVISION LEVEL D SHEET 10 TIMING DEFINITIONS TCE Delay between beginning of Chip Enable low (with input valid) and when Data Output becomes valid. TCD Delay between when Chip Enable becomes high and Data Output is in off state (Hi-Z or high). TPD Delay between beginning of valid input (with Chip Enable low) and when Data Output becomes valid. TIMING DEFINITIONS TPD Propagation delay between input and output. TOD Delay between input change and when output is off (Hi-Z or high). TOE Delay between input change and when output reflects specified output level. FIGURE 3. Timing waveforms Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88504 A REVISION LEVEL D SHEET 11 TABLE II. Electrical test requirements. MIL-STD-883 test requirements 1/, 2/, 3/ Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) for programmed devices Final electrical test parameters (method 5004) for unprogrammed devices 1*, 2, 3, 7*, 8 9 Group A test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10, 11 1*, 2, 3, 7*, 8 1, 2, 3 Groups C and D end-point electrical parameters (method 5005) 1/ * PDA applies to subgroup 1 and 7. 2/ Any or all subgroups may be combined when using high-speed testers. 3/ Subgroups 7 and 8 functional test shall also verify that no fuses are blown for unprogrammed devices or that the altered item drawing pattern exists for programmed devices (see table II). 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone 614692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MILHDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88504 A REVISION LEVEL D SHEET 12 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 06-08-18 Approved sources of supply for SMD 5962-88504 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ 5962-8850401LA Vendor CAGE number Vendor similar PIN 2/ 3/ PLS161/BLX 5962-8850402LA 3/ ASPLS173C24/883C 5962-8850402LA 0C7V7 PLS173/BLA 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number 0C7V7 Vendor name and address QP Semiconductor. 2945 Oakmead Village Court Santa Clara, CA 95051 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.